CN109890130A - A kind of printed circuit board - Google Patents

A kind of printed circuit board Download PDF

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Publication number
CN109890130A
CN109890130A CN201910249228.7A CN201910249228A CN109890130A CN 109890130 A CN109890130 A CN 109890130A CN 201910249228 A CN201910249228 A CN 201910249228A CN 109890130 A CN109890130 A CN 109890130A
Authority
CN
China
Prior art keywords
hole
difference device
default
printed circuit
interstitital texture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910249228.7A
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Chinese (zh)
Inventor
吕信宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Wave Intelligent Technology Co Ltd
Original Assignee
Suzhou Wave Intelligent Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Wave Intelligent Technology Co Ltd filed Critical Suzhou Wave Intelligent Technology Co Ltd
Priority to CN201910249228.7A priority Critical patent/CN109890130A/en
Publication of CN109890130A publication Critical patent/CN109890130A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a kind of printed circuit boards, comprising: default difference device to hole;Further include: the interstitital texture of the preset quantity between each pair of default difference device to hole is set, for filling corresponding default medium;The default medium being filled in interstitital texture, for changing the impedance of the corresponding default difference device to hole of interstitital texture at place according to respective dielectric constant;The present invention utilizes the default medium being filled in the interstitital texture between difference device to hole, adjust the through hole impedance of difference device to hole, can to avoid to difference device to hole itself via hole aperture, between weld tabs and signal via hole distance adjustment, influence of the through hole impedance design of difference device to hole to layout area can be reduced, keeps the circuit layout on printed circuit board more flexible.

Description

A kind of printed circuit board
Technical field
The present invention relates to PCB design field, in particular to a kind of printed circuit board.
Background technique
With the development of modern society's science and technology, design of electronic products trend is particular about high-effect now, speed transmission year by year at Long, so that the circuit design on printed circuit board (Printed circuit board, PCB) also more becomes complicated, signal is in addition to base Outside this transmission line, there are also other kinds of transmission structures, such as are responsible for the signal via hole (signal wears a layer via hole) that signal wears layer, Four signal via holes as shown in figure 1.When having good through hole impedance due to signal via hole, the reflection of signal can be greatly decreased, Therefore the impedance design of signal via hole, is a considerable job.
In the prior art, the via hole resistance of the difference device to hole on printed circuit board (two intermediate signal via holes as shown in figure 1) Anti- design method is often by distance between adjustment via hole aperture, weld tabs and signal via hole, to adjust difference device to hole Through hole impedance often wastes the layout area on printed circuit board, so that in the case where high speed design is limited by space, Configuration on printed circuit board is more difficult.Therefore, the through hole impedance for how reducing difference device to hole is designed to layout The influence of area keeps the circuit layout on printed circuit board more flexible, is urgent problem now.
Summary of the invention
The object of the present invention is to provide a kind of printed circuit boards, are designed with reducing the through hole impedance of difference device to hole to range of distribution Long-pending influence keeps the circuit layout on printed circuit board more flexible.
In order to solve the above technical problems, the present invention provides a kind of printed circuit board, comprising: default difference device to hole;Further include:
The interstitital texture of preset quantity between each pair of default difference device to hole is set, it is corresponding default for filling Medium;
The default medium being filled in the interstitital texture, for changing place according to respective dielectric constant The impedance of the corresponding default difference device to hole of interstitital texture.
Optionally, the interstitital texture is through-hole or groove.
Optionally, the interstitital texture is arranged on the circle center line connecting of each pair of default difference device to hole.
Optionally, the preset quantity is 1.
Optionally, the center of the circle center line connecting of each pair of default difference device to hole is arranged in the interstitital texture.
Optionally, the interstitital texture is specially using the center of the circle center line connecting of each pair of default difference device to hole as the center of circle Circular hole.
A kind of printed circuit board provided by the present invention, comprising: default difference device to hole;Further include: setting is each pair of default The interstitital texture of preset quantity between difference device to hole, for filling corresponding default medium;It is filled in pre- in interstitital texture If medium, for changing the impedance of the corresponding default difference device to hole of interstitital texture at place according to respective dielectric constant;
As it can be seen that the present invention adjusts difference device to hole using the default medium being filled in the interstitital texture between difference device to hole Through hole impedance, can to avoid to difference device to hole itself via hole aperture, between weld tabs and signal via hole distance adjustment, energy Influence of the through hole impedance design of difference device to hole to layout area is enough reduced, the circuit layout on printed circuit board is made more to have bullet Property.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis The attached drawing of offer obtains other attached drawings.
Fig. 1 is the structural schematic diagram of the signal via hole of printed circuit board in the prior art;
Fig. 2 is a kind of structural schematic diagram of printed circuit board provided by the embodiment of the present invention;
Fig. 3 is the structural schematic diagram of another kind printed circuit board provided by the embodiment of the present invention.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art Every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
Referring to FIG. 2, Fig. 2 is a kind of structural schematic diagram of printed circuit board provided by the embodiment of the present invention.The circuit Plate may include: default difference device to hole 10;Can also include:
The interstitital texture 20 of preset quantity between each pair of default difference device to hole 10 is set, it is corresponding default for filling Medium 30;
The default medium 30 being filled in interstitital texture 20, for the filling according to respective dielectric constant, where changing The impedance of the corresponding default difference device to hole 10 of structure 20.
Wherein, the default difference device to hole 10 in this implementation can be that respective two signal via holes are utilized in printed circuit board Between the default medium 30 filled of the interstitital texture 20 that is arranged, adjust the difference device to hole of impedance (through hole impedance).Specifically, for The particular number of default difference device to hole 10 in the present embodiment, i.e., adjust the difference of impedance through the above way in printed circuit board The specific logarithm of device to hole, can be by designer according to practical scene and user demand self-setting, and the present embodiment does not do this Any restrictions.
Likewise, to the specific structure of default difference device to hole 10 in this present embodiment, it can be by designer according to reality With scene and user demand self-setting, can such as use and difference device to hole (such as Fig. 1 in printed circuit board in the prior art A pair of of difference device to hole of centre) the same or similar structure, it is filled with as long as being provided between each pair of default difference device to hole 10 The interstitital texture 20 of corresponding default medium 30, the present embodiment does not do any restrictions to this.
It is understood that the purpose of the present embodiment can be to pass through the preset quantity between each pair of default difference device to hole 10 Interstitital texture 20 in the corresponding default medium 30 filled, so that the impedance of each pair of default difference device to hole 10 is met user demand. Interstitital texture specifically, the specific setting to preset quantity in this present embodiment, i.e., between each pair of default difference device to hole 10 20 particular number such as can be arranged one between each pair of default difference device to hole 10 and be filled out by designer's self-setting Structure 20 is filled, that is, preset quantity can be 1, as shown in figure 3, can be in the circle center line connecting of each pair of default difference device to hole 10 The circular hole (interstitital texture 20) of center setting, i.e. interstitital texture 20 can be the center to preset the circle center line connecting of difference device to hole 10 For the circular through hole of dot;Multiple interstitital textures 20 can also be set between each pair of default difference device to hole 10, it such as can be every To the multiple interstitital textures 20 of the upper setting of the circle center line connecting of default difference device to hole 10, or in the circle of each pair of default difference device to hole 10 The two sides of heart line are correspondingly arranged multiple interstitital textures 20, such as can be in the two sides of the circle center line connecting of each pair of default difference device to hole 10 A circular hole (interstitital texture 20) is respectively set.As long as after filling corresponding default medium 30 in interstitital texture 20, thus it is possible to vary The impedance of default difference device to hole 10, the present embodiment do not do any restrictions to this.
Likewise, the concrete type for interstitital texture 20 is arranged, can such as be can be set by designer's self-setting For through-hole, it can the drilling of multi-layer board between default difference device to hole 10 in the printed circuit boards, by by default medium 30 It is filled into corresponding through-hole, changes the impedance of default difference device to hole 10;It may be set to be groove, it can in printed circuit board In default difference device to hole 10 between multi-layer board grooving changed default by the way that default medium 30 is filled into corresponding groove The impedance of difference device to hole 10.The present embodiment does not do any restrictions to this.
It is corresponding, the specific structure of interstitital texture 20 is arranged, i.e., the through-hole or groove between default difference device to hole 10 Concrete shape setting, can by designer's self-setting, such as can be set to circular through hole shown in Fig. 3 (circular hole) or circle Connected in star, i.e., the default medium 30 after corresponding filling can be cylinder;It may be set to be such as square through hole or rectangular recessed The other structures of slot, the present embodiment do not do any restrictions to this.
It should be noted that the specific setting of the interstitital texture 20 between each pair of default difference device to hole 10 in the present embodiment The concrete type of the default medium 30 of position and corresponding filling, can by designer according to practical scene and user demand from Row setting such as needs the impedance value changed correspondence to be configured, as long as each pair of default difference according to each pair of default difference device to hole 10 Divide in the interstitital texture 20 between device to hole 10 and fill by corresponding default medium 30, the present embodiment does not do any restrictions to this.Such as Shown in Fig. 3, can the intermediate multi-layer board drilling of a pair of of difference device to hole (default difference device to hole 10) among Fig. 1, be arranged with this Center to the circle center line connecting of difference device to hole is the circular hole (interstitital texture 20) in the center of circle, and in Jie of this circular hole filling impedance adjustment Matter (default medium 30, such as medium with low dielectric constant or high dielectric constant substance), with using the dielectric constant of the medium, changing should Impedance to difference device to hole.
Specifically, can also include in the prior art as shown in Figure 1 in printed circuit board provided by the present embodiment Difference device to hole and other signal vias, the present embodiment do not do any restrictions to this.
In the present embodiment, the embodiment of the present invention utilizes the default medium being filled in the interstitital texture 20 between difference device to hole 30, adjust difference device to hole through hole impedance, can to avoid via hole aperture, weld tabs and the signal via hole to difference device to hole itself it Between distance adjustment, the through hole impedance that can reduce difference device to hole designs influence to layout area, makes on printed circuit board Circuit layout is more flexible.
A kind of printed circuit board provided by the present invention is described in detail above.Specific case used herein Principle and implementation of the present invention are described, the above embodiments are only used to help understand side of the invention Method and its core concept.It should be pointed out that for those skilled in the art, not departing from the principle of the invention Under the premise of, it can be with several improvements and modifications are made to the present invention, these improvement and modification also fall into the claims in the present invention In protection scope.

Claims (6)

1. a kind of printed circuit board, comprising: default difference device to hole;It is characterized by further comprising:
The interstitital texture of preset quantity between each pair of default difference device to hole is set, for filling corresponding default Jie Matter;
The default medium being filled in the interstitital texture, for the filling according to respective dielectric constant, where changing The impedance of the corresponding default difference device to hole of structure.
2. printed circuit board according to claim 1, which is characterized in that the interstitital texture is through-hole or groove.
3. printed circuit board according to claim 1, which is characterized in that the interstitital texture setting is each pair of described default On the circle center line connecting of difference device to hole.
4. printed circuit board according to claim 3, which is characterized in that the preset quantity is 1.
5. printed circuit board according to claim 4, which is characterized in that the interstitital texture setting is each pair of described default The center of the circle center line connecting of difference device to hole.
6. printed circuit board according to claim 5, which is characterized in that the interstitital texture is specially with each pair of described pre- If the center of the circle center line connecting of difference device to hole is the circular hole in the center of circle.
CN201910249228.7A 2019-03-29 2019-03-29 A kind of printed circuit board Pending CN109890130A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910249228.7A CN109890130A (en) 2019-03-29 2019-03-29 A kind of printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910249228.7A CN109890130A (en) 2019-03-29 2019-03-29 A kind of printed circuit board

Publications (1)

Publication Number Publication Date
CN109890130A true CN109890130A (en) 2019-06-14

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CN201910249228.7A Pending CN109890130A (en) 2019-03-29 2019-03-29 A kind of printed circuit board

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CN (1) CN109890130A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113163624A (en) * 2021-04-28 2021-07-23 恒为科技(上海)股份有限公司 Reverse pad design method for differential via hole and printed circuit board

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020027020A1 (en) * 2000-09-07 2002-03-07 International Business Machines Corporation Through-hole structure and printed circuit board including the through-hole structure
CN2886982Y (en) * 2006-04-26 2007-04-04 华为技术有限公司 Pcb
US20110267783A1 (en) * 2010-04-29 2011-11-03 Mutnury Bhyrav M Circuit board having holes to increase resonant frequency of via stubs
CN102291929A (en) * 2011-06-24 2011-12-21 福建星网锐捷网络有限公司 Printed circuit board and method for controlling impedance of through hole structure on same
CN102986307A (en) * 2010-06-29 2013-03-20 Fci公司 Structured circuit board and method
US20130098671A1 (en) * 2011-10-24 2013-04-25 Aritharan Thurairajaratnam Multiple layer printed circuit board
US20170181270A1 (en) * 2013-10-10 2017-06-22 Curtiss-Wright Controls, Inc. Circuit board via configurations for high frequency signaling

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020027020A1 (en) * 2000-09-07 2002-03-07 International Business Machines Corporation Through-hole structure and printed circuit board including the through-hole structure
CN2886982Y (en) * 2006-04-26 2007-04-04 华为技术有限公司 Pcb
US20110267783A1 (en) * 2010-04-29 2011-11-03 Mutnury Bhyrav M Circuit board having holes to increase resonant frequency of via stubs
CN102986307A (en) * 2010-06-29 2013-03-20 Fci公司 Structured circuit board and method
CN102291929A (en) * 2011-06-24 2011-12-21 福建星网锐捷网络有限公司 Printed circuit board and method for controlling impedance of through hole structure on same
US20130098671A1 (en) * 2011-10-24 2013-04-25 Aritharan Thurairajaratnam Multiple layer printed circuit board
US20170181270A1 (en) * 2013-10-10 2017-06-22 Curtiss-Wright Controls, Inc. Circuit board via configurations for high frequency signaling

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113163624A (en) * 2021-04-28 2021-07-23 恒为科技(上海)股份有限公司 Reverse pad design method for differential via hole and printed circuit board

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Application publication date: 20190614

RJ01 Rejection of invention patent application after publication