CN109845055A - 机械隔离的光泵浦半导体激光器 - Google Patents

机械隔离的光泵浦半导体激光器 Download PDF

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CN109845055A
CN109845055A CN201780045247.7A CN201780045247A CN109845055A CN 109845055 A CN109845055 A CN 109845055A CN 201780045247 A CN201780045247 A CN 201780045247A CN 109845055 A CN109845055 A CN 109845055A
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J·A·威斯德姆
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Abstract

用于光泵浦半导体(OPS)激光谐振器的外壳在其一端通过OPS芯片端接。激光谐振器组装在平台上，OPS芯片位于平台的一端。该平台在平台的OPS芯片端处固定附接到底板。平台的其余部分在底板上延伸，平台和底板之间有间隙。泵浦激光器直接安装在底板上并将泵浦辐射输送到OPS芯片。

Description

机械隔离的光泵浦半导体激光器
优先权要求
本申请要求于2016年7月20日提交的美国临时申请第62/364,516号和2017年7月12日提交的美国非临时专利申请第15/648,317号的优先权，这两个申请转让给本发明的受让人并且它们完整的公开内容通过引用方式合并于本文中。
技术领域
本发明一般涉及光泵浦半导体(OPS)激光器。本发明特别涉及这种激光器的包装和外壳。
背景技术
OPS激光器可以在单纵向模式下振荡时提供几瓦特(W)的连续波(CW)辐射输出。OPS激光器通常包括在其一端通过OPS芯片的镜面结构并且在其相对端通过输出耦合镜端接的激光谐振器。OPS芯片的镜面结构由周期性多层半导体增益结构覆盖，该周期性多层半导体增益结构通过聚焦到增益结构上的泵浦点的泵浦辐射来激励。泵浦辐射通常由二极管激光器封装提供。激光器的单模操作受到谐振器一端的增益结构的位置和增益结构的周期性的影响。OPS激光器的光学方面的详细描述在美国专利号6,097,742中给出，其完整公开内容通过引用结合于此。该专利详细描述了具有基本和倍频输出的直线和折叠谐振器。
OPS激光器通常是封装的，独立的，OPS激光谐振器和泵浦辐射源在单个外壳中。这种包装的问题在于诸如热产生的应力或机械应力之类的因素可能至少暂时地使外壳变形。这种失真会导致泵浦辐射点的不对准和激光谐振器的振荡模式。这种不对准可能导致诸如模式跳变(从一种可能的单振荡模式到另一种振荡模式)和输出噪声之类的问题。需要这样一种OPS-激光器封装装置，其中如果不完全消除，则可以减少在热或机械应力下泵浦辐射点和振荡模式的不对准。
发明内容
在一个方面，根据本发明的激光装置包括具有第一和第二相对端的悬臂平台和具有第一和第二相对表面的底板。端接的光泵浦半导体(OPS)激光谐振器在其一端通过OPS芯片端接。OPS激光谐振器组装在悬臂平台上，OPS芯片结合到散热器，散热器附接到悬臂平台的第一端。悬臂平台的第一端支撑在底板上，并且包括其第二端的悬臂平台的其余部分在底板上延伸，在悬臂平台的其余部分与底板之间具有间隙。泵辐射源安装在底板的第一表面上，并设置成将光泵浦辐射传送到OPS芯片，以激励OPS激光谐振器。
附图说明
图1A是从上面示意性地示出根据本发明的机械隔离的OPS激光谐振器的优选实施方案的平面图，包括保持在悬臂板上的OPS激光谐振器，悬臂板的一端附接到底板上，悬臂板的其余部分悬挂在底板的切口部分上，并且光泵激光器直接安装在底板上。
图1B是沿图1A的1B-1B方向看的截面图，示意性地示出了悬臂板和底板的进一步细节。
发明详述
现在转向附图，图1A和图1B示意性地示出了根据本发明的机械隔离的OPS激光器的优选实施方案10。激光器10包括由镜面结构14端接的激光谐振器12、OPS芯片18和输出耦合(部分透射)端镜20。这里，谐振器12被镜子22和24两次折叠。半导体增益结构16置于OPS芯片18中的镜面结构14之上。OPS芯片安装在导热基座(散热器)23上。
泵浦辐射P由泵浦辐射源30提供，泵浦辐射源30包括结合到导热基座34的二极管激光器32。泵浦辐射P通过透镜26聚焦到OPS芯片14的增益结构16上。聚焦泵辐射到增益结构14上导致基波波长激光辐射在激光谐振器12中沿着谐振器的振荡模式15循环，如箭头F所示。
基波波长是增益结构16的组成的特征。通常，OPS激光谐振器包括双折射滤波器(BRF)，用于从增益结构的增益带宽中选择基波波长。为了简化说明，这未在附图中示出。
这里应该注意，为了理解本发明的原理，仅提供谐振器12的足够细节和用于增益结构14的光泵浦装置。在上面引用的美国专利号6,097,742中提供了几种基本和频率转换的OPS激光谐振器的详细描述。本发明适用于任何OPS激光谐振器，包括腔内频率转换谐振器。
现在转向本发明的OPS激光器的热和机械方面，激光谐振器12的所有部件，包括安装在基座23上的OPS芯片14，安装在细长的悬臂平台36上。基座36安装在平台36的端部36A上。
其上具有激光谐振器12的悬臂平台36安装在底板40上，底板40具有机加工到其上表面44A中的细长矩形槽42。悬臂平台安装成其端部36A附接到底板40的上表面40A，使得支撑OPS芯片14的基座23与底板40中的槽42的端部42A大致齐平。悬臂平台的端部36B悬挂在槽42上，与槽40的端部42B靠近但不与槽40的端部42B重叠。
泵浦辐射源30和透镜26安装在底板40的上表面40A上。由于安装在悬臂板36的未悬挂于槽42上的部分上，其上具有OPS芯片14的基座23有效地(间接地)固定地安装在底板40上。激光谐振器12与底板40有效地机械隔离，对于任何预期的弯曲，谐振器的振荡模式15将保持在增益结构14上的大约相同的点上。
机械领域的技术人员将认识到，通常，槽42的尺寸优选地恰好充分大于悬臂板36的相应尺寸，以允许悬臂板在必要时弯曲到槽中。槽的深度优选地恰好足以适应悬臂板的最大预期弯曲。这使得槽42对底板40刚度的任何不利影响最小化。机械领域的技术人员将认识到，虽然悬臂平台36在上面被描述为具有矩形形状，但是平台和相应的槽可以具有任何其他形状，规则的或不规则的，而不脱离本发明的精神和范围发明。
合适的尺寸将取决于为底板40和悬臂平台36选择的材料。从上面给出的本发明的描述中，本领域技术人员使用商业上可获得的诸如SOLIDWORKS(可从马萨诸塞州沃尔瑟姆的Dassault Systèmes SolidWorks公司获得)之类的机械设计软件确定合适的尺寸。
底板40的主要功能是为悬臂平台36上的谐振器12提供机械支撑，同时允许激光谐振器与底板的机械隔离。用于底板和平台36的优选材料是铝(A1)。虽然这将在操作期间提供从OPS芯片14传走热量，但是它不会提供该热量的快速消散。激光器10包括位于底板下表面40B上的单独的散热器44，用于辅助散热。散热器44可以是诸如铜(Cu)的高导电材料的简单板，或者可以是更复杂的结构，包括用于水冷却或空气冷却的布置。
总之，以上参考优选实施方案描述了本发明。然而，本发明不限于这里描述和描绘的实施方案。相反，本发明仅受所附权利要求的限制。

Claims (7)

1.激光装置，包括：
悬臂平台，具有第一和第二相对端；
具有第一和第二相对表面的底板；
光泵浦半导体(OPS)激光谐振器，包括OPS芯片，所述OPS激光谐振器组装在所述悬臂平台上，所述OPS芯片结合到散热器，该散热器附接到所述悬臂平台的第一端；
其中所述悬臂平台的第一端支撑在所述底板上，悬臂平台的包括其第二端的其余部分在底板上延伸，所述悬臂平台的其余部分与所述底板之间有间隙；并且
其中泵浦辐射源安装在所述底板的第一表面上，并设置成将光泵浦辐射传送到所述OPS芯片以用于激励所述OPS激光谐振器。
2.根据权利要求1所述的装置，其中，所述悬臂平台的其余部分与底板之间的间隙由形成在所述底板的第一表面中的槽提供。
3.根据权利要求2所述的装置，其中，所述悬臂平台是矩形的，并且所述槽是矩形的。
4.根据权利要求1所述的装置，其中，所述泵浦辐射源包括二极管激光器。
5.根据权利要求1所述的装置，其中，所述激光谐振器是折叠式激光谐振器。
6.根据权利要求1所述的装置，还包括附接到所述底板的第二表面的散热器。
7.根据权利要求1所述的装置，其中，所述激光谐振器的一端终接于所述OPS芯片中。
CN201780045247.7A 2016-07-20 2017-07-13 机械隔离的光泵浦半导体激光器 Pending CN109845055A (zh)

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US201662364516P 2016-07-20 2016-07-20
US62/364,516 2016-07-20
US15/648,317 US10056732B2 (en) 2016-07-20 2017-07-12 Mechanically isolated optically pumped semiconductor laser
US15/648,317 2017-07-12
PCT/US2017/042014 WO2018017397A1 (en) 2016-07-20 2017-07-13 Mechanically isolated optically pumped semiconductor laser

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