CN109841585A - It is a kind of meter and operating condition high-power IGBT module wind-cooling heat dissipating piece - Google Patents
It is a kind of meter and operating condition high-power IGBT module wind-cooling heat dissipating piece Download PDFInfo
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- CN109841585A CN109841585A CN201910242621.3A CN201910242621A CN109841585A CN 109841585 A CN109841585 A CN 109841585A CN 201910242621 A CN201910242621 A CN 201910242621A CN 109841585 A CN109841585 A CN 109841585A
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- copper
- cooling
- radiator
- igbt module
- fin
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Abstract
The present invention disclose it is a kind of meter and operating condition high-power IGBT module wind-cooling heat dissipating piece, including be mounted on the back side on the copper base of IGBT module copper cooling base, vertically be welded on copper cooling base lateral surface heat dissipation fin, be arranged in radiate fin side radiator fan；One recess is set in the corresponding copper cooling base outer fix of igbt chip, or a recess is set in the corresponding copper cooling base outer fix of diode chip for backlight unit；Copper pipe heat exchanger is welded in recess；The copper pipe heat exchanger is made of the cold liquid inlet tube of radiator, radiator hydrothermal solution outlet, heat dissipation SAPMAC method pump, copper pipe radiator fin, and it to be a closed interior radiating circulating fluid system that it is filled with cooling liquid.The present invention fully considers IGBT module inconsistent feature of local pyrexia amount under different operating conditions, designs copper pipe heat exchanger system at the big position of IGBT module local pyrexia amount, realizes copper-based plate temperature Homogeneouslly-radiating.
Description
Technical field
The present invention relates to technical field of heat dissipation, the high-power IGBT module wind-cooling heat dissipating of specifically a kind of meter and operating condition
Piece.
Background technique
IGBT module (Insulated Gate Bipolar Transistor, insulated gate bipolar transistor), be by
The compound full-control type voltage driven type power semiconductor of BJT (double pole triode) and MOS (insulating gate type field effect tube) composition
Device has advantage of both the high input impedance of MOSFET and the low conduction voltage drop of GTR concurrently.It is adaptable in engineering at present
High-power IGBT module (individual module) withstanding voltage reaches as high as 6.5kV, and current load reaches as high as kiloampere, cut-offs speed
Degree is fast, and switching frequency is high.High-power IGBT module is widely used in D.C. high voltage transmission, communications and transportation and renewable energy at present
The fields such as source power generation are the core components of rectification and inversion system power electronic equipment.
High-power IGBT inside modules generally use the series-parallel technology of multi-chip, and IGBT core is distributed with inside IGBT module
Piece, diode chip for backlight unit and electrode etc., igbt chip and diode chip for backlight unit are pyrotoxins, other positions do not generate heat substantially.IGBT
Module is made of multiple layers of different materials, and thermal expansion coefficient is inconsistent between layers of material, under operating condition, each layer of module
Structure bears the huge thermal stress generated in process of expansion and contraction, and long-term duplicate temperature fluctuation is to influence system core device
The main reason for IGBT working life, the height of reliability and then the safe and reliable operation for influencing system.Flexible direct current is defeated
Modular multilevel converter valve in electricity, when in rectification or inverter operation operating condition, each device power loss in half-bridge submodule
It is unevenly distributed weighing apparatus with junction temperature, down tube IGBT module bears biggish cyclic thermal stres than upper tube IGBT module, and in IGBT module
Chip fever source temperature in portion's is seriously unbalanced.In wind electric converter, under rectification operating condition, diode in same bridge arm
Chip temperature is higher than igbt chip temperature, and when being in inverter operation operating condition, igbt chip temperature is higher than diode in same bridge arm
Chip temperature.Some researches show that in normal working range, the internal temperature of IGBT module is every to rise 10 DEG C, IGBT module
Crash rate is increased by one times, and the internal high temperature of transient state IGBT module is the major incentive of device exterior failure.Therefore by effective
Radiator design, reduce the mild local temperature inhomogeneities of internal junction of IGBT module, be improve IGBT module reliability
One of with the main method of service life.
General composition electric bridge line structure uses inside IGBT module, divides single tube IGBT module, half-bridge IGBT module, full-bridge
The several types such as IGBT module and three-phase bridge IGBT module.IGBT module can be divided into solder type according to the difference of packing forms
Two kinds of forms of IGBT module and crimp type IGBT module.Regardless of the IGBT module of type, all there are following characteristics: inverse
Under variable working condition, the igbt chip power consumption inside IGBT module is big, and calorific value is big, igbt chip temperature highest；In rectification work
Under condition, the diode chip for backlight unit power consumption inside IGBT module is big, and calorific value is big, diode chip for backlight unit temperature highest.
This patent is with Infineon welded type Infineon FF300R17ME4 (300A/1.7kV/150 DEG C) model IGBT mould
The relevant design with air-cooled radiator is illustrated for block, the IGBT module of the model is applied in MMC system (Modular
Multilevel Convert, Modular multilevel converter) it (is handed in inversion operating condition (direct current change alternating current) and rectification respectively
Galvanic electricity straightens galvanic electricity) under operating condition, it is the alternating current with direct current biasing characteristic, chip structure model that module, which applies power current,
And junction temperature emulation is referring to figure 1, figure 2 and figure 3.The model IGBT module is half-bridge structure (referring to Fig. 1), wherein 1 is upper bridge arm
Three diode chip for backlight unit in parallel, 2 be three igbt chips in parallel of upper bridge arm, and 3 be the copper base of IGBT module, and 4 be lower bridge
Three diode chip for backlight unit in parallel of arm, 5 be three igbt chips in parallel of lower bridge arm, and 6 be thermally conductive upper layer copper sheet.
By taking the lower bridge arm of the IGBT module of Infineon FF300R17ME4 model as an example, (see Fig. 2) under inversion operating condition,
Three igbt chips 51,52 of half-bridge and 53 temperature are relatively high under IGBT module, hence it is evident that projecting thermally conductive upper layer copper sheet and
The temperature of diode chip for backlight unit 41,42 and 43.It is in an intermediate position since three igbt chips 51,52 and 53 thermal couplings act on
The maximum temperature of igbt chip 52 is 106.1 DEG C, which differs about 36 with the temperature difference of the temperature minimum point of IGBT module
℃；In the case where rectifying operating condition (see Fig. 3), three diode chip for backlight unit 41,42 of half-bridge and 43 temperature are higher under IGBT module, hence it is evident that high
In the thermally conductive upper layer copper sheet of surrounding and the temperature of igbt chip 51,52 and 53, due to three diode chip for backlight unit 41,42 and 43 thermal couplings
Cooperation is used, the maximum temperature of diode chip for backlight unit 42, is 120.6 DEG C, is differed about 51 DEG C with the temperature difference of entire module temperature minimum point.
IGBT module internal structure cell schematics are shown in Figure 4, and it is entire that the copper base 3 of IGBT module plays support
The effect of IGBT module, in addition copper base or the heat sink of entire IGBT module, solidifying due to being filled with silicon inside IGBT module
Glue, the heat that IGBT module generates can only be transmitted downwards by copper base, then be exported outside IGBT module.Underlying solder layer 7,
Lower layers of copper 8, ceramic layer 15 and upper layers of copper 6 are integral structures, are known as covering copper ceramic substrate, effect be conduction igbt chip or
The heat that diode chip for backlight unit generates is to copper base 3；Copper ceramic substrate or extraordinary insulating layer are covered, igbt chip can be provided
Or the electric insulation functions between diode chip for backlight unit, igbt chip 10 can be effectively prevented and diode chip for backlight unit 13 is high to copper base
Voltage breakdown or electric leakage.The lower layers of copper 8 for covering copper ceramic substrate is welded together by lower solder layer 7 and copper base 3, upper layers of copper 6
It is welded together by upper solder layer 9 with igbt chip 10 and diode chip for backlight unit 13.In order to improve igbt chip 10 and diode
The soldering reliability of chip 13 has been covered each by one layer of aluminium foil layer 11 and 14, key in igbt chip 10 and diode chip for backlight unit 13 again
Zygonema 12 has been welded on the aluminium foil layer of igbt chip 10 and diode chip for backlight unit 13, has been then subsequently welded in upper layers of copper 6, bonding
The effect conducting connection chip and electrode of line, provide conducting electric current and voltage.
By above description, it can be seen that, an IGBT module includes two layers of solder layer and bonding line pad.Copper base
3, copper ceramic substrate (including 8,15 and 6), igbt chip 10, diode chip for backlight unit 13, bonding line 12, lower solder layer 7 and upper weldering are covered
The bed of material 9 is just to form IGBT module by welding together.The thermal expansion coefficient of the above material is different, if
Igbt chip 10 or 13 local pyrexia of diode chip for backlight unit cannot quickly shed, and will result in igbt chip 10 or diode chip for backlight unit
13 localized heats gather heating, igbt chip 10 or diode chip for backlight unit 13 and weld these chip materials due to thermal expansion coefficient not
Together, internal stress is generated in their weld, is easy to appear welding layer and tilts, snaps or the defects of crack, influence IGBT module
Reliability and service life.Under the action of cyclic thermal stres, IGBT module failure speed is accelerated.
Now widely used IGBT module cooling fin is traditional wind-cooling heat dissipating piece or traditional water-cooling piece.Traditional wind
Cold cooling fin can generally reduce by 5~20 DEG C of IGBT module temperature, can reduce IGBT module temperature using air blast cooling cooling fin
Degree is 10~30 DEG C.Traditional wind-cooling heat dissipating piece apply generally to the little occasion of IGBT module calorific value, outdoor application occasion or
Using the occasion of water-cooling piece inconvenience, wind-cooling heat dissipating piece occupied area is small, requires simple, wind-cooling heat dissipating system to equipment control
System design is simple.The air-cooled fin 23 of tradition has been mounted on the copper base 3 of IGBT module, just constitutes traditional wind-cooling heat dissipating
Piece, the heat dissipation area (increasing the contact area with air) that traditional wind-cooling heat dissipating piece passes through increase copper base.Tradition is air-cooled
Cooling fin can integrally reduce the temperature of IGBT module, and the temperature gradient of wind-cooling heat dissipating piece is uncontrollable.Traditional is air-cooled scattered
Backing has only supplied an air-cooled radiating device to go cooling IGBT module, do not account for igbt chip need strengthening local cooling and
It can not go to mention that air-cooled (such as IGBT module is generated heat problem of non-uniform, traditional for cooling fin according to IGBT module heat generation characteristic
Wind-cooling heat dissipating piece has no idea to solve the problems, such as Homogeneouslly-radiating).
Summary of the invention
In order to overcome the deficiencies of the prior art, the present invention provide it is a kind of meter and operating condition high-power IGBT module it is air-cooled dissipate
Backing.The wind-cooling heat dissipating piece is able to solve under inversion operating condition or rectifies under operating condition, junction temperature or shell temperature point inside IGBT module
The non-uniform problem of cloth, solve current transformer or other power electronic equipments due to field installs, with water it is inconvenient, water cooling cannot be used
Mode reinforce heat dissipation the problem of problem.
The present invention solve the technical problem technical solution be design it is a kind of meter and operating condition high-power IGBT mould
Block wind-cooling heat dissipating piece, which is characterized in that including being mounted on the copper cooling base at the back side on the copper base of IGBT module, vertical welding
Heat dissipation fin on copper cooling base lateral surface, the radiator fan that heat dissipation fin side is set；It is corresponding in igbt chip
One recess is set in copper cooling base outer fix, or is arranged in the corresponding copper cooling base outer fix of diode chip for backlight unit
One recess；Copper pipe heat exchanger is welded in recess；The copper pipe heat exchanger is by the cold liquid inlet tube of radiator, radiator hydrothermal solution
Outlet, heat dissipation SAPMAC method pump, copper pipe radiator fin composition, it to be a closed interior circulation that it is filled with cooling liquid
Liquid cooling system；Pipeline in the cooling liquid outlet end of heat dissipation SAPMAC method pump is the cold liquid inlet tube of radiator, with radiator
The pipeline that cold liquid inlet tube is connected and is partially welded in recess and extends to the cooling fluid inlet end of heat dissipation SAPMAC method pump is scattered
Hot device hydrothermal solution outlet；It is welded in cooling fluid inlet end and on the radiator hydrothermal solution outlet of cooling fluid inlet end
There is copper pipe radiator fin.
Compared with prior art, the beneficial effects of the invention are that: wind-cooling heat dissipating piece of the present invention fully considers that IGBT module exists
The inconsistent feature of local pyrexia amount under different operating conditions realizes and designs copper at the big position of IGBT module local pyrexia amount
Heat exchange of heat pipe system may be implemented 3 temperature Homogeneouslly-radiating of copper base, reduce the thermal stress inside IGBT module, especially when
Converter system is under low-frequency operation operating condition, can to avoid IGBT module junction temperature because be more than maximum allowable junction temperature caused by forever
Long property damage, to improve the reliability and service life of IGBT module.Wind-cooling heat dissipating piece of the present invention can be with effective solution
The heat dissipation problem of IGBT module, and the producer that can be applied as IGBT module provides the heat dissipation solution of standard, facilitates big face
Product uses.
Detailed description of the invention
Fig. 1 is Infineon FF300R17ME4 model IGBT module schematic diagram of internal structure.
Fig. 2 is stable state junction temperature cloud charts under Infineon FF300R17ME4 model IGBT module inversion operating condition.
Fig. 3 is that Infineon FF300R17ME4 model IGBT module rectifies stable state junction temperature cloud charts under operating condition.
Fig. 4 is a kind of IGBT module internal cell structure schematic diagram of embodiment.
Fig. 5 is a kind of detailed design flow chart of embodiment of wind-cooling heat dissipating piece of the present invention.
Fig. 6 is a kind of wind-cooling heat dissipating piece of the present invention structural schematic diagram of embodiment (part under IGBT module inversion operating condition
Section view).
Fig. 7 is a kind of wind-cooling heat dissipating piece of the present invention structural schematic diagram of embodiment (part in the case where IGBT module rectifies operating condition
Section view).
Specific embodiment
The present invention is described in detail below with reference to examples and drawings.Embodiment is premised on technical solution of the present invention
The specific implementation of progress gives detailed embodiment and process.But claims hereof protection scope is not limited to down
The embodiment description stated.
The present invention provide it is a kind of meter and operating condition high-power IGBT module wind-cooling heat dissipating piece (abbreviation wind-cooling heat dissipating piece,
Referring to Fig. 5-7), including being mounted on the copper cooling base 22 at the back side on the copper base 3 of IGBT module, being welded on copper heat dissipation base vertically
Seat 22 lateral surfaces on heat dissipation fin 23, be arranged in radiate 23 side of fin radiator fan 27；In the corresponding copper of igbt chip 5
One recess 310 is set in 22 outer fix of cooling base, or in corresponding 22 outer fix of copper cooling base of diode chip for backlight unit 4
One recess 313 of upper setting；Copper pipe heat exchanger is welded at recess (for recess 310 or recess 313, the two is not existed simultaneously)
21；The copper pipe heat exchanger 21 pumps 25, copper by the cold liquid inlet tube 24 of radiator, radiator hydrothermal solution outlet 32, heat dissipation SAPMAC method
Tube radiator fin 29 forms, and it to be a closed interior radiating circulating fluid system that it is filled with cooling liquid.It is cold radiating
The pipeline of the cooling liquid outlet end of circulating pump 25 is the cold liquid inlet tube 24 of radiator, is connected simultaneously with the cold liquid inlet tube 24 of radiator
Part is welded in recess and extends to the pipeline of the cooling fluid inlet end 28 of heat dissipation SAPMAC method pump 25 as the outlet of radiator hydrothermal solution
Pipe 32.Copper is welded in cooling fluid inlet end 28 and on the radiator hydrothermal solution outlet 32 of cooling fluid inlet end 28
Tube radiator fin 29.
The heat dissipation fin 23 and copper pipe radiator fin 29 are that muti-piece is parallel and discontiguous heat-radiating substrate is constituted
Structure.
Even heat on copper base 3 is transmitted to copper cooling base 22, and heat dissipation fin 23 is welded on copper cooling base 22,
The fin 23 that radiates can transmit copper cooling base 22 heat transfer come to atmosphere.Radiator fan in heat dissipation 23 side of fin
27 can blow to heat dissipation fin 23 according to wind direction 26 cold air, the heat transfer of heat dissipation fin 23 to air.
Under IGBT module inversion operating condition, the calorific value of igbt chip 5 is maximum, the corresponding copper-based Board position of igbt chip 5
Temperature highest at 30, the recess 310 on copper cooling base 22 reduce the thermal capacity at this.Upper copper pipe heat exchanger is welded at this
21, copper pipe heat exchanger 21 is a closed interior radiating circulating fluid system, and copper pipe radiator 21 is one by the cold liquid of radiator
Inlet tube 24, radiator hydrothermal solution outlet 32, heat dissipation SAPMAC method pump 25, copper pipe radiator fin 29 and cooling liquid composition.?
Copper pipe heat dissipation is welded in cooling fluid inlet end 28 and on the radiator hydrothermal solution outlet 32 of cooling fluid inlet end 28
Device fin 29.Radiator fan 27 can also blow to cold air copper pipe radiator fin 29 and radiate.Copper pipe radiator 21 is logical
The high fever heat of copper cooling base 22 can be exchanged in coolant liquid by crossing heat exchange, then by heat dissipation SAPMAC method pump 25 heat
Coolant pump cooling, the hot coolant liquid base at the cooling fluid inlet end 28 of circulating pump 25 that is sent to copper pipe radiator fin 29
Cooling is finished on this, the cooling coolant liquid finished is sent to copper cooling base 22 in circulating pump 25 by coolant liquid again and carries out again
Heat exchange.
Under this kind of regime mode, first according to the size for simulating calorific value under IGBT module inversion operating condition, selects and close
Suitable 21 system of copper pipe heat exchanger, then suitable copper cooling base 22 and heat dissipation fin 23 are selected, it is combined into after a model again
It is secondary to be simulated, check whether wind-cooling heat dissipating model is able to satisfy wanting substantially for uniformity of temperature profile on the copper base 3 of IGBT module
It asks, if being unsatisfactory for modifying each selection device of model again, Iterative Design again, until can obtain satisfied model.
Shown in optimization design flow chart 5.
In the case where IGBT module rectifies operating condition, the heat that diode chip for backlight unit 4 generates is most, and diode chip for backlight unit 4 is corresponding copper-based
Temperature highest at Board position 33, corresponding copper cooling base 22 goes out to do a recess 313 at copper-based Board position 33, is being recessed
Copper pipe heat exchanger 21 is welded at 313, remaining part assembly and radiating principle are the same as IGBT module inversion operating condition.In this kind of regime mode
Under, first according to the size for simulating power loss under IGBT module rectification operating condition, suitable copper pipe heat exchanger 21 is selected, then select
It with suitable copper cooling base 22 and heat dissipation fin 23, is simulated again after being combined into a model, checks lower wind-cooling heat dissipating
Whether model is able to satisfy the basic demand of uniformity of temperature profile on the copper base 3 of IGBT module, if being unsatisfactory for modifying model again
Each selection device, Iterative Design again, until can obtain satisfied model.
Above-described embodiment is only described with IGBT module inside one unit, can also be according to IGBT module difference
Design feature, using increasing wind-cooling heat dissipating chip size or assembled using by the way of multiple wind-cooling heat dissipating piece serial or parallel connections
To reach maximum heat dissipation effect.
The present invention does not address place and is suitable for the prior art.
Claims (2)
1. the high-power IGBT module wind-cooling heat dissipating piece of a kind of meter and operating condition, which is characterized in that including being mounted on IGBT mould
The copper cooling base at the back side, the heat dissipation fin being welded on copper cooling base lateral surface vertically, setting are dissipating on the copper base of block
The radiator fan of hot fin side；One recess is set in the corresponding copper cooling base outer fix of igbt chip, or two
One recess is set in the corresponding copper cooling base outer fix of pole pipe chip；Copper pipe heat exchanger is welded in recess；It is described
Copper pipe heat exchanger is by the cold liquid inlet tube of radiator, radiator hydrothermal solution outlet, heat dissipation SAPMAC method pump, copper pipe radiator fin group
At it to be a closed interior radiating circulating fluid system that it is filled with cooling liquid；In the cooling liquid of heat dissipation SAPMAC method pump
The pipeline of outlet end is the cold liquid inlet tube of radiator, is connected with the cold liquid inlet tube of radiator and is partially welded in recess and extends to
The pipeline of the cooling fluid inlet end of heat dissipation SAPMAC method pump is radiator hydrothermal solution outlet；It is in cooling fluid inlet end and close
Copper pipe radiator fin is welded on the radiator hydrothermal solution outlet of cooling fluid inlet end.
2. the high-power IGBT module wind-cooling heat dissipating piece of a kind of meter according to claim 1 and operating condition, feature exist
In heat dissipation fin and the copper pipe radiator fin are that muti-piece is parallel and the structure of discontiguous heat-radiating substrate composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910242621.3A CN109841585B (en) | 2019-03-28 | 2019-03-28 | High-power IGBT module air-cooled radiating fin considering operation conditions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910242621.3A CN109841585B (en) | 2019-03-28 | 2019-03-28 | High-power IGBT module air-cooled radiating fin considering operation conditions |
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| Publication Number | Publication Date |
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| CN109841585A true CN109841585A (en) | 2019-06-04 |
| CN109841585B CN109841585B (en) | 2021-03-30 |
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