CN109831869A - A kind of paster technique, pcb board and mobile terminal - Google Patents
A kind of paster technique, pcb board and mobile terminal Download PDFInfo
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- CN109831869A CN109831869A CN201910138711.8A CN201910138711A CN109831869A CN 109831869 A CN109831869 A CN 109831869A CN 201910138711 A CN201910138711 A CN 201910138711A CN 109831869 A CN109831869 A CN 109831869A
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- pcb board
- microstrip line
- sheet metal
- mobile terminal
- thickness
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Abstract
The embodiment of the invention provides a kind of paster technique, pcb board and mobile terminals, wherein the paster technique, comprising: according to predetermined width and preset thickness, makes sheet metal；The sheet metal is mounted on the microstrip line of pcb board.The embodiment of the present invention is by making sheet metal, sheet metal being mounted on the microstrip line of pcb board according to predetermined width and preset thickness, the microstrip line thickness of pcb board is set to become larger, to make to change the impedance of microstrip line in the limited situation of the cabling space of pcb board, guarantee the performance of mobile terminal.
Description
Technical field
The present invention relates to manufacturing process technology field more particularly to a kind of paster techniques, pcb board and mobile terminal.
Background technique
With the development of network technology and electronic technology, mobile phone is increasingly becoming a part indispensable in daily life,
More stringent requirements are proposed to mobile phone by user.Cell-phone function becomes complicated, and the device that cell phone mainboard needs to stack is more and more,
And user to the continuation of the journey of mobile phone, take pictures etc. that it is higher and higher to require, the remaining space for leaving mainboard for is fewer and fewer.
Currently, the frequency range that mobile phone needs to cover is also more and more, and since the remaining space of mainboard is fewer and fewer, it leaves for and penetrates
The space of frequency device layout and cabling just more aobvious anxiety, in the case where other conditions are constant, when cabling space narrows, cabling
Impedance can become larger, and influence handset capability.
Therefore, in the urgent need to address how to be limited in scope in the change in dielectric constant for fixing layer structure, medium, and cabling
The problem of space is but in the case where very little, reduces the impedance of cabling.
Summary of the invention
In view of the above problems, propose the embodiment of the present invention provide a kind of paster technique, a kind of pcb board and it is a kind of it is mobile eventually
End, to solve the problem of to reduce the impedance of cabling in the case where cabling space very little.
In order to solve the above-mentioned technical problem, the present invention is implemented as follows:
In a first aspect, the embodiment of the invention provides a kind of paster techniques, comprising:
According to predetermined width and preset thickness, sheet metal is made；
The sheet metal is mounted on the microstrip line of pcb board.
Second aspect, the embodiment of the invention also provides it is a kind of using paster technique preparation method as described above preparation
Pcb board is pasted with the sheet metal of predetermined width and preset thickness on the microstrip line of the pcb board.
The third aspect, the embodiment of the invention also provides a kind of mobile terminal,
The mobile terminal includes pcb board as described in the embodiments of the present invention；
The pcb board includes the mobile terminal case, plate, the Mobile terminal main board upper cover in the mobile terminal,
And at least one of described Mobile terminal main board lower cover.
In embodiments of the present invention, by making sheet metal, sheet metal being mounted on according to predetermined width and preset thickness
On the microstrip line of pcb board, the microstrip line thickness of pcb board is made to become larger, to make to change in the limited situation of the cabling space of pcb board
The impedance for becoming microstrip line, guarantees the performance of mobile terminal.
Detailed description of the invention
Fig. 1 is a kind of step flow chart of paster technique embodiment of the invention；
Fig. 2 is a kind of structural schematic diagram of the microstrip line of pcb board；
Fig. 3 is impedance schematic diagram when a kind of simulation software calculates microstrip line difference line width and different-thickness；
Fig. 4 is that the microstrip line line width W of pcb board is the schematic diagram of 2.9mm；
Fig. 5 is that the microstrip line line width W of pcb board is reduced into the schematic diagram of 2.5mm；
Fig. 6 is the schematic diagram of affixed metal piece on the microstrip line of pcb board.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing and specific real
Applying mode, the present invention is described in further detail.
Referring to Fig.1, a kind of step flow chart of paster technique embodiment of the invention is shown, can specifically include as follows
Step:
Step 101, according to predetermined width and preset thickness, sheet metal is made；
Sheet metal can be made according to predetermined width and preset thickness, so that the sheet metal produced meets certain rule
Lattice.
In a preferred embodiment of an embodiment of the present invention, the predetermined width can be the width of the microstrip line,
The preset thickness can be the thickness for making the microstrip line meet nominal impedance condition.
Step 102, the sheet metal is mounted on the microstrip line of pcb board；The sheet metal is for making the pcb board
Microstrip line meets certain impedance conditions.
By the way that the sheet metal for meeting certain specification produced is mounted on the microstrip line of pcb board, thus it is possible to vary pcb board
Microstrip line thickness so that the micro-strip line impedance of pcb board becomes smaller.
Such as Fig. 2, the structural schematic diagram of the microstrip line of pcb board is shown.According to the formula of impedance of microstrip line:
Wherein, W is line width, and T is the copper sheet thickness of cabling, and H is cabling to the distance of reference planes, and Er is pcb board material
Dielectric constant (Dielectric Constant).
In general, layer structure is substantially fixed, that is, H is fixed when making the microstrip line of pcb board.
The OZ of each layer cabling of pcb board is also substantially stationary.Wherein, it is about 36um that 1OZ (Ounce, ounce), which represents the copper thickness of PCB, is
By being formed by the fine copper tiling to the area of 1 square feet (=144inches) the 8.9g/cm^3 density of 1OZ weight
Thickness.Therefore, the thickness T of each layer cabling of pcb board is substantially stationary.
Further, the common material dielectric constant of producer is generally also fixed, even if being different material, dielectric is normal
Number variation range is also very limited.
Therefore, Er and H is fixed, and the thickness T of cabling is also fixed.At this point, if the line width W of microstrip line reduces, basis
Above-mentioned formula is it is found that the impedance of microstrip line can become larger.In embodiments of the present invention, in order to guarantee the impedance of microstrip line, Ke Yi
Affixed metal piece on the microstrip line of pcb board, changes the thickness of the microstrip line of pcb board.
Such as Fig. 3, impedance when simulation software calculates microstrip line difference line width and different-thickness is shown.
In Fig. 3, when the line width W of the microstrip line of pcb board is 2.9mm, thickness T is 0.1mm, and dielectric thickness H is 1.7mm,
When the dielectric constant Er of medium is 4.7, the characteristic impedance of microstrip line is 50.85R.And if be situated between to save cabling space
Matter thickness and the constant situation of dielectric constant, if trace width is reduced to 2.5mm, micro-strip line impedance increases 55.13R.
At this point, if sticking on the sheet metal of 1mm on the microstrip line, so that it may the characteristic impedance of microstrip line be effectively reduced to 51.2R, approach
In original 50.85R.
Specifically, the microstrip line of pcb board as Figure 4-Figure 6, it is assumed that the thickness T of the microstrip line of pcb board is 0.1mm, is situated between
Matter thickness H is 1.7mm, and the dielectric constant Er of medium is 4.7.
When implementing the scheme of the embodiment of the present invention, can the microstrip line of pcb board determine according to actual needs thickness T,
The dielectric constant Er of dielectric thickness H and medium, the embodiment of the present invention do not limit this.
Such as Fig. 4, the microstrip line line width W for showing pcb board is the schematic diagram of 2.9mm.In Fig. 4, microstrip line 1, micro-strip
The line width W1 of line is 2.9mm.Be calculated by simulation software: when the line width W1 of the microstrip line of pcb board is 2.9mm, thickness T is
0.1mm, dielectric thickness H are 1.7mm, and when the dielectric constant Er of medium is 4.7, the characteristic impedance of microstrip line is 50.85R.
As Fig. 5, the microstrip line line width W for showing pcb board are reduced into the schematic diagram of 2.5mm.In Fig. 5, microstrip line 1,
The line width W2 of microstrip line is 2.5mm.It is calculated by simulation software: when the line width W2 of the microstrip line of pcb board is 2.5mm, thickness
Degree T is 0.1mm, and dielectric thickness H is 1.7mm, and when the dielectric constant Er of medium is 4.7, the characteristic impedance of microstrip line is 55.13R.
Such as Fig. 6, the schematic diagram of affixed metal piece on the microstrip line of pcb board is shown.In Fig. 6, microstrip line 1, metal
Piece is 2, and the line width W2 of microstrip line is 2.5mm, and sheet metal is mounted on the microstrip line of pcb board.It is calculated by simulation software:
When the line width W2 of the microstrip line of pcb board is 2.5mm, thickness T is 1.1mm, and dielectric thickness H is 1.7mm, the dielectric constant Er of medium
When being 4.7, the characteristic impedance of microstrip line is 51.23R.
In the concrete realization, when the thickness T of microstrip line is fixed as 0.1mm, to make the microstrip line overall thickness of pcb board
T is 1.1mm, it can be deduced that sheet metal with a thickness of 1mm.
In a preferred embodiment of an embodiment of the present invention, the sheet metal can be copper material, alternatively, can also be
With other the same or similar metals of the material of microstrip line.
In a preferred embodiment of an embodiment of the present invention, the step 101 may include following sub-step:
According to the predetermined width and preset thickness, the first mold is made；
Using first mold, sheet metal is made.
In the concrete realization, the first mold can be made according to predetermined width and preset thickness, then uses first mould
Tool production sheet metal.For example, predetermined width is 2.5mm, preset thickness 1.1mm, then wide 2.5mm can be made, the of high 1mm
One mold.
Wherein, the first mold can be a hollow container, can be by the way that the solution of metal material is poured into the first mold
Interior carry out die casting, so that sheet metal be made.
In a preferred embodiment of an embodiment of the present invention, the step 102 may include following sub-step:
Preset adhesive is coated on the microstrip line of the pcb board；
The sheet metal is attached on the microstrip line of the pcb board；
Baking and curing is carried out to described adhesive；
Weld the microstrip line of the sheet metal Yu the pcb board.
In embodiments of the present invention, it can be pasted by SMT (Surface Mount Technology, surface installation technique)
Sheet metal is mounted on the microstrip line of pcb board by dress technique, to increase the thickness of microstrip line, so that the impedance of microstrip line becomes smaller.
In the concrete realization, preset adhesive can be coated on the microstrip line of pcb board by dispenser, passes through patch
Sheet metal is attached on the microstrip line of pcb board by piece machine, is carried out baking and curing to adhesive by curing oven, is welded by reflow soldering
Connect the microstrip line of sheet metal and pcb board.
Wherein, when carrying out baking and curing to adhesive by curing oven, drying temperature can be 110 DEG C to 150 DEG C, drying
Time can be 1 to 6 minute.
In a preferred embodiment of an embodiment of the present invention, in the micro- of the welding sheet metal and the pcb board
After the step of band line, it can also include the following steps:
The pcb board after cleaning welding；
Quality testing is carried out to the pcb board after welding.
In the concrete realization, the pcb board after welding can be cleaned by cleaning machine, and matter is carried out to the pcb board after welding
Amount detection, to ensure that the pcb board after welding can work normally.
In a preferred embodiment of an embodiment of the present invention, in the micro-strip that the sheet metal is mounted on to pcb board
Before on line, further includes:
Predeterminable area grooving according to the predetermined width and preset thickness, on the pcb board surface；Wherein, described pre-
If region is the region relative to the microstrip line on pcb board surface；
The predeterminable area on the pcb board surface after the sheet metal to be placed in grooving.
By according to predetermined width and preset thickness, it is recessed on the region relative to microstrip line on pcb board surface to dig out one
Slot fills the groove with sheet metal.To which further sheet metal is mounted on the microstrip line of pcb board, it can also change microstrip line
Thickness, so that the impedance of microstrip line is become smaller.
It should be noted that pcb board can leak out metal after filling sheet metal, the gold leaked out can be covered with megohmite insulant
Belong to, the component on pcb board is avoided to generate the risk of short circuit.It, can be according to reality when implementing the scheme of the embodiment of the present invention
Need to select the megohmite insulant of covering, for example, the metal leaked out using insulating cement covering, the embodiment of the present invention to this and it is unlimited
It is fixed.
In embodiments of the present invention, by making sheet metal, sheet metal being mounted on according to predetermined width and preset thickness
On the microstrip line of pcb board, the microstrip line thickness of pcb board is made to become larger, to make to change in the limited situation of the cabling space of pcb board
The impedance for becoming microstrip line, guarantees the performance of mobile terminal.
The embodiment of the invention also provides a kind of pcb board prepared using paster technique preparation method as described above, institutes
State the sheet metal that predetermined width and preset thickness are pasted on the microstrip line of pcb board.
The embodiment of the invention also provides a kind of mobile terminal,
The mobile terminal includes pcb board as described in the embodiments of the present invention；
The pcb board includes the mobile terminal case, plate, the Mobile terminal main board upper cover in the mobile terminal,
And at least one of described Mobile terminal main board lower cover.
All the embodiments in this specification are described in a progressive manner, the highlights of each of the examples are with
The difference of other embodiments, the same or similar parts between the embodiments can be referred to each other.
It should be understood by those skilled in the art that, the embodiment of the embodiment of the present invention can provide as method, apparatus or calculate
Machine program product.Therefore, the embodiment of the present invention can be used complete hardware embodiment, complete software embodiment or combine software and
The form of the embodiment of hardware aspect.Moreover, the embodiment of the present invention can be used one or more wherein include computer can
With in the computer-usable storage medium (including but not limited to magnetic disk storage, CD-ROM, optical memory etc.) of program code
The form of the computer program product of implementation.
The embodiment of the present invention be referring to according to the method for the embodiment of the present invention, terminal device (system) and computer program
The flowchart and/or the block diagram of product describes.It should be understood that flowchart and/or the block diagram can be realized by computer program instructions
In each flow and/or block and flowchart and/or the block diagram in process and/or box combination.It can provide these
Computer program instructions are set to general purpose computer, special purpose computer, Embedded Processor or other programmable data processing terminals
Standby processor is to generate a machine, so that being held by the processor of computer or other programmable data processing terminal devices
Capable instruction generates for realizing in one or more flows of the flowchart and/or one or more blocks of the block diagram
The device of specified function.
These computer program instructions, which may also be stored in, is able to guide computer or other programmable data processing terminal devices
In computer-readable memory operate in a specific manner, so that instruction stored in the computer readable memory generates packet
The manufacture of command device is included, which realizes in one side of one or more flows of the flowchart and/or block diagram
The function of being specified in frame or multiple boxes.
These computer program instructions can also be loaded into computer or other programmable data processing terminal devices, so that
Series of operation steps are executed on computer or other programmable terminal equipments to generate computer implemented processing, thus
The instruction executed on computer or other programmable terminal equipments is provided for realizing in one or more flows of the flowchart
And/or in one or more blocks of the block diagram specify function the step of.
Although the preferred embodiment of the embodiment of the present invention has been described, once a person skilled in the art knows bases
This creative concept, then additional changes and modifications can be made to these embodiments.So the following claims are intended to be interpreted as
Including preferred embodiment and fall into all change and modification of range of embodiment of the invention.
Finally, it is to be noted that, herein, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant meaning
Covering non-exclusive inclusion, so that process, method, article or terminal device including a series of elements not only wrap
Those elements are included, but also including other elements that are not explicitly listed, or further includes for this process, method, article
Or the element that terminal device is intrinsic.In the absence of more restrictions, being wanted by what sentence "including a ..." limited
Element, it is not excluded that there is also other identical elements in process, method, article or the terminal device for including the element.
Above to a kind of paster technique provided by the present invention, a kind of pcb board and a kind of mobile terminal, detailed Jie has been carried out
It continues, used herein a specific example illustrates the principle and implementation of the invention, and the explanation of above embodiments is only
It is to be used to help understand method and its core concept of the invention；At the same time, for those skilled in the art, according to this hair
Bright thought, there will be changes in the specific implementation manner and application range, in conclusion the content of the present specification should not manage
Solution is limitation of the present invention.
Claims (11)
1. a kind of paster technique characterized by comprising
According to predetermined width and preset thickness, sheet metal is made；
The sheet metal is mounted on the microstrip line of pcb board.
2. the method according to claim 1, wherein described according to predetermined width and preset thickness, production metal
Piece, comprising:
According to the predetermined width and preset thickness, the first mold is made；
Using first mold, sheet metal is made.
3. the method according to claim 1, wherein width of the predetermined width for the microstrip line, described
Preset thickness is the thickness for making the microstrip line meet nominal impedance condition.
4. the method according to claim 1, wherein the microstrip line that the sheet metal is mounted on to pcb board
On, comprising:
Preset adhesive is coated on the microstrip line of the pcb board；
The sheet metal is attached on the microstrip line of the pcb board；
Baking and curing is carried out to described adhesive；
Weld the microstrip line of the sheet metal Yu the pcb board.
5. according to the method described in claim 4, it is characterized in that, the drying temperature of the baking and curing is 110 DEG C to 150
DEG C, drying time is 1 to 6 minute.
6. according to the method described in claim 4, it is characterized in that, in the micro- of the welding sheet metal and the pcb board
After the step of band line, further includes:
The pcb board after cleaning welding；
Quality testing is carried out to the pcb board after welding.
7. the method according to claim 1, wherein in the micro-strip that the sheet metal is mounted on to pcb board
Before on line, further includes:
Predeterminable area grooving according to the predetermined width and preset thickness, on the pcb board surface；Wherein, the preset areas
Domain is the region relative to the microstrip line on pcb board surface；
The predeterminable area on the pcb board surface after the sheet metal to be placed in grooving.
8. the method according to claim 1, wherein the sheet metal is copper material.
9. the method according to claim 1, wherein the material phase of the material of the sheet metal and the microstrip line
Together.
10. a kind of pcb board using such as the described in any item paster technique preparation method preparations of claim 1-9, feature exist
In being pasted with the sheet metal of predetermined width and preset thickness on the microstrip line of the pcb board.
11. a kind of mobile terminal, which is characterized in that
The mobile terminal includes pcb board as claimed in claim 10；
The pcb board includes the mobile terminal case, plate, the Mobile terminal main board upper cover in the mobile terminal, and
At least one of described Mobile terminal main board lower cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910138711.8A CN109831869A (en) | 2019-02-25 | 2019-02-25 | A kind of paster technique, pcb board and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910138711.8A CN109831869A (en) | 2019-02-25 | 2019-02-25 | A kind of paster technique, pcb board and mobile terminal |
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| CN109831869A true CN109831869A (en) | 2019-05-31 |
Family
ID=66864311
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| CN201910138711.8A Pending CN109831869A (en) | 2019-02-25 | 2019-02-25 | A kind of paster technique, pcb board and mobile terminal |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112004307A (en) * | 2020-07-30 | 2020-11-27 | 北京浪潮数据技术有限公司 | Differential line wiring structure and differential line wiring structure generation method |
| CN112291933A (en) * | 2020-10-10 | 2021-01-29 | 苏州浪潮智能科技有限公司 | Compensation method for keeping impedance continuity of routing layer |
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| WO1993002485A1 (en) * | 1991-07-19 | 1993-02-04 | Fujitsu Limited | Microstrip line and manufacturing method therefor |
| US5493263A (en) * | 1991-07-19 | 1996-02-20 | Fujitsu Limited | Microstrip which is able to supply DC bias current |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112004307A (en) * | 2020-07-30 | 2020-11-27 | 北京浪潮数据技术有限公司 | Differential line wiring structure and differential line wiring structure generation method |
| CN112291933A (en) * | 2020-10-10 | 2021-01-29 | 苏州浪潮智能科技有限公司 | Compensation method for keeping impedance continuity of routing layer |
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Application publication date: 20190531 |