CN103785920A - Solder loading method for electronic elements - Google Patents

Solder loading method for electronic elements Download PDF

Info

Publication number
CN103785920A
CN103785920A CN201210418308.9A CN201210418308A CN103785920A CN 103785920 A CN103785920 A CN 103785920A CN 201210418308 A CN201210418308 A CN 201210418308A CN 103785920 A CN103785920 A CN 103785920A
Authority
CN
China
Prior art keywords
electronic component
scolder
support plate
scolders
welding end
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201210418308.9A
Other languages
Chinese (zh)
Inventor
李训发
李昀聪
邱俊吉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HUANXU ELECTRONICS CO Ltd
Universal Scientific Industrial Co Ltd
Universal Global Scientific Industrial Co Ltd
Original Assignee
HUANXU ELECTRONICS CO Ltd
Universal Global Scientific Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HUANXU ELECTRONICS CO Ltd, Universal Global Scientific Industrial Co Ltd filed Critical HUANXU ELECTRONICS CO Ltd
Priority to CN201210418308.9A priority Critical patent/CN103785920A/en
Publication of CN103785920A publication Critical patent/CN103785920A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention provides a solder loading method for electronic elements. The solder loading method for electronic elements comprises the steps of providing a support plate which is provided with an upper surface, next, forming a plurality of solders on the upper surface, placing at least one electronic element which is provided with at least two weldable ends corresponding to the solders on the solders, and then heating the solders so that the solders are melted and attached on the weldable ends of the electronic elements. The method is characterized in that the solders are transferred to the weldable ends of the electronic elements by virtue of the support plate, and the solder receiving amount of each electronic element can be controlled so that appropriate solders are attached on the weldable ends of the electronic elements.

Description

The upper scolder method of electronic component
Technical field
The present invention is about a kind of method of welding, and relates to especially a kind of upper scolder method of electronic component.
Background technology
In recent years, along with electronic product, for example mobile phone, mobile computer and tablet PC, pursue compact trend, wiring (layout) density of circuit board also and then increases, and it is also more and more less to install (mount) electronic component dimensions on circuit board, for example specification is that 0201(length and width are respectively 20mils and 10mils) and 01005(length and width be respectively 10mils and 5mils) passive element (Passive components).
Hold above-mentionedly, for example, due to above-mentioned electronic component (electronic component that specification is 0201) small-sized, is therefore not easy to control the tin amount of eating of this class small size electronic component.So, may cause the tin amount of the eating difference of electronic component two electricity connection ends large, cause wherein one end perk of electronic component, and then the phenomenon (tombstoning) of may setting up a monument.Secondly, also likely can cause electronic component to eat tin too much, cause short circuit, even may have electronic component and eat tin deficiency, cause the situations such as the empty weldering of electronic component to occur.
Summary of the invention
The invention provides a kind of upper scolder method of electronic component, and this upper scolder method can be controlled the amount of solder of electronic component.
The invention provides a kind of upper scolder method of electronic component.First, provide a support plate, this support plate has a upper surface.Afterwards, form multiple scolders on upper surface.Come again, place at least one electronic component on these scolders.This at least one electronic component has at least all right one way or the other welding end, and respectively can the corresponding scolder of welding end.Afterwards, heat these scolders so that these solder fusings, and be attached to these can welding end on.
In sum, the invention provides a kind of upper scolder method of electronic component, and this method can utilize support plate by solder transfer to electronic component can welding end, and can control the amount of solder of eating of electronic component, so that the scolder that can welding end be attached with suitable deal of electronic component.
For enabling further to understand feature of the present invention and technology contents, refer to following about detailed description of the present invention and accompanying drawing, but these explanations are only used for illustrating the present invention with accompanying drawing, but not interest field of the present invention are done to any restriction.
Accompanying drawing explanation
Figure 1A to Fig. 1 E is the upper scolder method flow schematic diagram of the electronic component of one embodiment of the invention.
Fig. 1 F is the schematic diagram of scolder on the electronic component of another embodiment of the present invention.
Fig. 2 A to Fig. 2 B is the method flow schematic diagram that the electronic component of having gone up scolder in Fig. 1 E is installed in circuit board.
Wherein, description of reference numerals is as follows:
10,10 ' support plate
12,12 ' upper surface
14 plate bodys
16 retes
20 templates
22 holes
30 solder materials
30 ' scolder
32 scaling powders
34 weldments
40 scrapers
50 electronic components
52 can welding end
60 vacuum slots
70 circuit boards
72 replace district
74 circuit board connection pads
The specific embodiment
Figure 1A to Fig. 1 E is the upper scolder method flow schematic diagram of the electronic component of one embodiment of the invention.Refer to Figure 1A, first, provide a support plate 10, and support plate 10 has a upper surface 12.As shown in Figure 1A, in the present embodiment, support plate 10 can be ceramic wafer or non-metal board.But the present invention does not limit structure and the constituent material of support plate 10.
Refer to Figure 1B and Fig. 1 C, next, form multiple scolders 30 ' on upper surface 12, and the material of scolder 30 ' can be ashbury metal or other metal alloy, the present invention is not limited.These scolders 30 ' are separated from each other, so have spacing between these scolders 30 '.In the present embodiment, form these scolders 30 ' and can utilize in the method for upper surface 12 method of mould printing, and the method for mould printing comprises the following steps.
Please first consult Figure 1B, first, provide a template 20, and place template 20 on upper surface 12, wherein this template 20 has multiple holes 22, and these holes 22 can local exposed upper surface 12.In addition, template 20 can be metallic plate, plastic plate or ceramic wafer, and above-mentioned metallic plate is for example steel plate.Come, using template 20 as mask, coating solder material 30 is on upper surface 12 again, and wherein solder material 30 can fill in these holes 22, and then coats on upper surface 12, to form these scolders 30 '.In addition, in the process of upper surface 12, can utilize scraper 40 that solder material 30 is advanced in these holes 22, to help the formation of these scolders 30 ' at coating solder material 30.Afterwards, refer to Fig. 1 C, remove template 20, these scolders 30 ' are retained on upper surface 12.
What must emphasize is, although the present embodiment is to utilize the mode of mould printing to form multiple scolders 30 ' in upper surface 12, but in other embodiments, can not form these scolders 30 ' by the method for mould printing, therefore the present invention does not limit and forms these scolders 30 ' in the method for upper surface 12 yet.
Refer to Fig. 1 D, next, place at least one electronic component 50 upper in these scolders 30 ', and in the embodiment shown in Fig. 1 D, each electronic component 50 have a pair of can welding end 52, its material is for example the metal such as copper or silver.Can welding end 52 can be the input/output end (Input/Output terminal, I/O terminal) of electronic component 50, electronic component 50 can be from this to can welding end 52 exporting and input electrical signal.But, some electronic component has three or three above input/output ends at present, so in other embodiments, what single electronic component 50 had can welding end 52 quantity can be more than three or three, and the present embodiment do not limit that electronic component 50 has can welding end 52 quantity.
In addition, these electronic components 50 in Fig. 1 D can be mutually the same, can be the electronic component of one species or same size.Certainly, these electronic components 50 wherein at least the two also can differ from one another.For example, the kind of one of them electronic component 50 and size are different from kind and the size of another electronic component 50, so that the present embodiment does not limit kind and the size of these electronic components 50 is yet mutually the same.
Electronic component 50 can be passive element, its specification is for example 0201 or 01005, and the size of electronic component 50 can be identical or to be less than specification be 0201 passive element size, that is to say, the length of these electronic components 50 can be equal to or less than 20mils, and width can be equal to or less than 10 mils (mils).But the present invention does not limit the size of electronic component 50, and electronic component 50 can be also larger-size electronic component, for example, be that square plane is without pin package (Quad-flat-no-leads package, QFN).In addition, except passive element, electronic component 50 can be also active component (active component), and for example transistor, so the present invention does not limit electronic component 50 for passive element or active component.
Each can welding end 52 can be corresponding to these scolders 30 ', so after these electronic components 50 are positioned on upper surface 12, each can welding end 52 can be positioned on these scolders 30 '.So, these can welding end 52 can contact respectively these scolders 30 '.In addition, these scolder 30 ' quality of corresponding same electronic component 50 can be mutually the same.In detail, for same electronic component 50, this of this electronic component 50 is to can all having roughly the same quality by corresponding these scolders 30 ' of welding end 52.
In addition, these electronic components 50 can be utilize board and be placed on the upper surface 12 of support plate 10, and wherein this board is for example the loader with vacuum slot 60.Vacuum slot 60 can be drawn electronic component 50 in the mode of vacuum suction, and these electronic components 50 are placed on support plate 10, so that these electronic components 50 contact respectively these scolders 30 '.But the present invention does not limit these electronic components 50 and can only place with vacuum slot 60.
Refer to Fig. 1 E, then, heat these scolders 30 ' so that these scolders 30 ' fusings and be attached to respectively these can welding end 52 on.Because the material of scolder 30 ' is metal material, and material that can welding end 52 is also metal (being for example copper or silver), therefore scolder 30 ' to can welding end 52 the two material behaviors similar.So, the scolder 30 ' of fusing can be attached to can welding end 52 on.
Because support plate 10 can be ceramic wafer or non-metal board, therefore scolder 30 ' is not easy to be attached on upper surface 12, but be easily attached to can welding end 52 on.
Because scolder 30 ' is not easy to be attached on upper surface 12, but be easily attached to can welding end 52 on, therefore in the time of heating scolder 30 ', these scolders 30 ' of fusing can transfer to completely haply these can welding end 52 on, and can remain in hardly on upper surface 12.So the quality that can be formed at the scolder 30 ' of upper surface 12 by control is controlled the quality that is formed at scolder 30 ' that can welding end 52.So, the amount of solder of eating of these electronic components 50 can be controlled, so that can adhere to the scolder 30 ' of suitable deal on respectively can welding end 52.In addition, because the quality of these scolders 30 ' of the same electronic component 50 of correspondence can be mutually the same, be also mutually the same haply so be attached to the quality of these scolders 30 ' on this electronic component 50.
Fig. 1 F is the schematic diagram of scolder on the electronic component of another embodiment of the present invention.Refer to Fig. 1 F, the support plate 10 ' of the present embodiment and the support plate 10 of last embodiment structurally have difference.Support plate 10 ' has a upper surface 12 ', and support plate 10 ' can comprise a plate body 14 and a rete 16, and wherein rete 16 is configured on plate body 14.And upper surface 12 ' is positioned on rete 16, rete 16 has upper surface 12 '.The material of plate body 14 can be metal material or nonmetallic materials, and for example plate body 14 can be existing circuit board, metallic plate, ceramic wafer or non-metal board.The material of rete 16 is nonmetal, and for example rete 16 can be anti-welding adhesive tape or anti-welding paint.
Should be noted that, although the support plate 10 ' shown in Fig. 1 F is double-decker sheet material, in other embodiments, support plate 10 ' can be also that the number of plies is three layers or three layers of above sandwich construction sheet material.The structure that the present invention does not limit support plate 10 ' with and constituent material.
Next, form multiple scolders 30 ' upper in upper surface 12 ', for example, can utilize the method for mould printing.After scolder 30 ' forms, heat these scolders 30 ', can then scolder 30 ' be transferred to electronic component 50.In addition, because rete 16 can be anti-welding adhesive tape or anti-welding paint, it is upper that therefore scolder 30 ' is not easy to be attached to upper surface 12 ', and be easier to transfer on electronic component 50.Other flow process that scolder 30 ' is transferred to electronic component 50, as described in prior figures 1C to Fig. 1 E, does not repeat at this.
The above discloses the upper scolder method of the electronic component of one embodiment of the invention, and the upper scolder method of the present embodiment can be applied to soldering of electronic components.For example, the upper scolder method of the present embodiment can be used at least one normally functioning electronic component to be assembled on circuit board, to manufacture printed circuit board (PCB) assembly (Printed Circuit Board Assembly, PCBA) or Electronic Packaging module; Or be used for the electronic component of fault on replacement circuit plate, as shown in Fig. 2 A to Fig. 2 B.
Fig. 2 A to Fig. 2 B is in Fig. 1 E, the electronic component 50 of having gone up scolder is installed in the method flow schematic diagram of circuit board 70, and Fig. 2 A to Fig. 2 B exposure utilizes above-mentioned upper scolder method that the electronic component of fault on circuit board 70 is replaced to the normal electronic component 50 of function.Specifically, please first consult Fig. 2 A, first, removing fault electronic component (not illustrating) on circuit board 70 afterwards, on circuit board 70, there will be and replace district 72, the method that wherein removes fault electronic component be for example to this fault electronic component with and at least one circuit board connection pad 74(pad of being connected) heat, and the method for this heating is for example to adopt welding gun or heat gun to heat.
Afterwards, on each circuit board connection pad 74 of replacing in district 72, coat scaling powder 32, and the electronic component of first-class scolder 30 ' 50 is moved on the circuit board 70 of replacing in district 72, wherein be attached to these scolders 30 ' meeting difference positions at electronic component 50 two ends on these scaling powders 32, and all contact with these scaling powders 32.It should be noted that, in other embodiment, also can not need to coat scaling powder 32, the present invention is not limited.
Refer to Fig. 2 B, next, heating is positioned at these scolders 30 ' and these scaling powders 32 at electronic component 50 two ends, for example, be to adopt welding gun or heat gun to heat.In the process of these scolders 30 ' of heating and these scaling powders 32, these scolders 30 ' can fusing and form the weldment 34 (fillet) of multiple connecting electronic components 50 and circuit board 70, and these scaling powders 32 can help the formation of these weldments 34.So, electronic component 50 is welded on circuit board 70
Due to the present embodiment upper scolder method can allow these of electronic component 50 welding end 52 adhere to the scolder 30 ' of suitable deal, therefore when electronic component 50 is soldered to circuit board 70, can reduce the empty weldering (Open) because eating tin deficiency occurs, or because eat the defects such as too much the caused short circuit of tin.In addition, the present embodiment upper scolder method also can allow to be attached to the quality of these scolders 30 ' on same electronic component 50 mutually the same haply, therefore also can reduce the phenomenon of setting up a monument.
What must emphasize is, in the present embodiment, the upper scolder method of electronic component not only can be used for the electronic component of fault on replacement circuit plate 70, and in other embodiments, the upper scolder method of this kind also can be used at least one normally functioning electronic component to be assembled on printed circuit board (PCB), to manufacture printed circuit board (PCB) assembly or Electronic Packaging module.Therefore, the present invention does not limit the purposes of scolder method on this.
The foregoing is only embodiments of the invention, it is not in order to limit scope of patent protection of the present invention.Any those of ordinary skills, not departing from spirit of the present invention and scope, the change of doing and the equivalence of retouching are replaced, and are still in claim protection domain of the present invention.

Claims (10)

1. a upper scolder method for electronic component, is characterized in that, comprising:
One support plate is provided, and this support plate has a upper surface;
Form multiple scolders on this upper surface;
Place at least one electronic component on described scolder, each electronic component has at least all right one way or the other welding end, and respectively can welding end corresponding described scolder; And
Heat described scolder, to make described solder fusing, and can welding end described in being attached to.
2. the upper scolder method of electronic component as claimed in claim 1, is characterized in that, the quality of the described scolder of corresponding same electronic component is mutually the same.
3. the upper scolder method of electronic component as claimed in claim 1, is characterized in that, the length of each electronic component is equal to or less than 20 mils, and the width of each electronic component is equal to or less than 10 mils.
4. the upper scolder method of electronic component as claimed in claim 1, is characterized in that, the material of described scolder is ashbury metal.
5. the upper scolder method of electronic component as claimed in claim 1, is characterized in that, forms the step of described scolder on the upper surface of this support plate and comprises:
Place a template in this upper surface, this template has multiple holes;
Using this template as mask, coating one solder material is on this upper surface, and this solder material fills in described hole.
6. the upper scolder method of electronic component as claimed in claim 1, is characterized in that, the material of this support plate comprises pottery or polymer.
7. the upper scolder method of electronic component as claimed in claim 1, is characterized in that, this support plate comprises a plate body and a rete, and this rete is configured on this plate body, and this upper surface is positioned on this rete.
8. the upper scolder method of electronic component as claimed in claim 7, is characterized in that, the material of this plate body comprises metal.
9. the upper scolder method of electronic component as claimed in claim 7, is characterized in that, this rete is anti-welding adhesive tape or anti-welding paint.
10. the upper scolder method of electronic component as claimed in claim 1, is characterized in that, places described electronic component and comprises and use a loader that described electronic component is moved on this upper surface in the step of this upper surface.
CN201210418308.9A 2012-10-26 2012-10-26 Solder loading method for electronic elements Pending CN103785920A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210418308.9A CN103785920A (en) 2012-10-26 2012-10-26 Solder loading method for electronic elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210418308.9A CN103785920A (en) 2012-10-26 2012-10-26 Solder loading method for electronic elements

Publications (1)

Publication Number Publication Date
CN103785920A true CN103785920A (en) 2014-05-14

Family

ID=50662206

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210418308.9A Pending CN103785920A (en) 2012-10-26 2012-10-26 Solder loading method for electronic elements

Country Status (1)

Country Link
CN (1) CN103785920A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104735922A (en) * 2015-03-19 2015-06-24 广东小天才科技有限公司 Circuit board welding method
CN114256711A (en) * 2021-12-23 2022-03-29 深圳市航连通连接器科技有限公司 Welding system for electronic connector solder paste packaging

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05258986A (en) * 1992-03-13 1993-10-08 Hitachi Ltd Electronic component provided with solder chip, device and method of providing solder chip to component lead
JPH0745943A (en) * 1993-07-29 1995-02-14 Matsushita Electric Ind Co Ltd Method of mounting electronic component
JPH0969680A (en) * 1995-08-31 1997-03-11 Matsushita Electric Ind Co Ltd Mounting of electronic component
CN1282122A (en) * 1999-07-23 2001-01-31 广濑电机株式会社 Electric connector and manufacturing method threrof
CN102509990A (en) * 2011-10-19 2012-06-20 番禺得意精密电子工业有限公司 Forming method of electric connector

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05258986A (en) * 1992-03-13 1993-10-08 Hitachi Ltd Electronic component provided with solder chip, device and method of providing solder chip to component lead
JPH0745943A (en) * 1993-07-29 1995-02-14 Matsushita Electric Ind Co Ltd Method of mounting electronic component
JPH0969680A (en) * 1995-08-31 1997-03-11 Matsushita Electric Ind Co Ltd Mounting of electronic component
CN1282122A (en) * 1999-07-23 2001-01-31 广濑电机株式会社 Electric connector and manufacturing method threrof
CN102509990A (en) * 2011-10-19 2012-06-20 番禺得意精密电子工业有限公司 Forming method of electric connector

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104735922A (en) * 2015-03-19 2015-06-24 广东小天才科技有限公司 Circuit board welding method
CN114256711A (en) * 2021-12-23 2022-03-29 深圳市航连通连接器科技有限公司 Welding system for electronic connector solder paste packaging
CN114256711B (en) * 2021-12-23 2024-02-09 深圳市航连通连接器科技有限公司 Welding system for electronic connector solder paste packaging

Similar Documents

Publication Publication Date Title
US20170280565A1 (en) Jumpers for pcb design and assembly
JP6318638B2 (en) Printed wiring board and information processing apparatus
CN105307419A (en) Manufacturing method for effectively reducing manufacturing cost of PCBA
EP2533617B1 (en) Printed circuit board with chip package component
US9439288B2 (en) Mounting structure of chip component and electronic module using the same
CN202488872U (en) Anti-oxidation PCB (printed circuit board)
CN103785920A (en) Solder loading method for electronic elements
CN108347829B (en) Tin-connection-preventing circuit board and manufacturing method thereof
CN108990266A (en) A kind of pcb board
US8986555B2 (en) Method of manufacturing printed circuit board having bump
US7410093B2 (en) Solder wave process for solder shunts for printed circuit board
CN110519918B (en) Circuit board and electronic equipment
JP2004311926A (en) Multilayer printed wiring board, electronic equipment and manufacturing method and manufacturing device for multilayer printed wiring board
TWI530239B (en) Method for depositing solders on electronic component
KR101987314B1 (en) Device Mounting of Printed Circuit Board
JP2012124397A (en) Multilayer printed wiring board with built-in component
US10257923B2 (en) Resin substrate and electronic device
CN110351962A (en) A kind of secondary via hole reflow method
JP2009123872A (en) Circuit board and its mounting method
JP2007305904A (en) Fixing structure and fixing method of electrode terminal
US11324125B2 (en) Diversified assembly printed circuit board and method for making the same
CN105792511B (en) Pad compatible structure and PCB
CN219660041U (en) Printing steel mesh
JP2020047799A (en) Printed circuit board structure
CN102271458A (en) Printed circuit board (PCB), implementing method of PCB and method for removing electronic component by adopting PCB

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140514