CN1689189A - Strip line device, member to be mounted on printed wiring board, circuit board, semiconductor package, and its fabricating method - Google Patents

Strip line device, member to be mounted on printed wiring board, circuit board, semiconductor package, and its fabricating method Download PDF

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Publication number
CN1689189A
CN1689189A CNA03824229XA CN03824229A CN1689189A CN 1689189 A CN1689189 A CN 1689189A CN A03824229X A CNA03824229X A CN A03824229XA CN 03824229 A CN03824229 A CN 03824229A CN 1689189 A CN1689189 A CN 1689189A
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CN
China
Prior art keywords
line device
strip line
metal
body component
wiring board
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Pending
Application number
CNA03824229XA
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Chinese (zh)
Inventor
远矢弘和
增田幸一郎
清水秀树
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NEC Corp
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NEC Corp
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Publication of CN1689189A publication Critical patent/CN1689189A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

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  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

The purpose of the present invention is to restrain the leakage of electromagnetic waves via a power distribution circuit positioned on a printed wiring board or a semiconductor package and prevent the degeneration of signal waves activated by a high-speed digital circuit. The present invention provides a metal, the surface of which is provided with a dielectric medium coating (20), besides the metal (10) is shaped like a long plate with a valve function, and via the dielectric medium coating (20), an electro-conductive layer (30) is coated on the valve metal, so that the natural impedance in respect to an input terminal can be reduced on the broad band.

Description

Strip line device, printed wiring board mounted member, circuit board, semiconductor packages and forming method thereof
Technical field
The present invention relates to be used to suppress by being positioned at the electromagnetic wave that power distribution circuit that printed wiring board or semiconductor package load onto leaks and preventing that the signal waveform that is encouraged by high-speed digital circuit from the technology of degenerating taking place, be particularly related to the strip line device that is connected between high-speed digital circuit and the power distribution circuit, this strip line device is from the angle of high-speed digital circuit, reducing characteristic impedance on power distribution circuit one side on the broadband to suppress electromagnetic-wave leakage, and be suitable for preventing that the signal waveform that is encouraged by high-speed digital circuit from degenerating, and the circuit board that uses this device, the method of semiconductor packages and formation strip line device.
Background technology
In recent years, be starting point with the mobile phone, small-sized and high-speed electronic device there are heavy demand.This demand is that the speed by Switching Power Supply that for example increases digital signal processing circuit and the clock signal in the assembly satisfies.Therefore, the circuit particularly high-frequency current in the power circuit increases, and makes electromagnetic radiation increase, and signal quality is degenerated greatly.Therefore, there is ever-increasing demand to the superior performance of the equipment that is used for the decoupling power supply.
Because the high-performance digital device comprises that therefore the electromagnetic spectrum that is leaked to recently in the power distribution circuit is distributed on the utmost point wideband section of hundreds of kHz to tens GHz with the high speed circuit of high speed operation with the low-speed circuits of tick-over.The electric current that is mounted on the DC power supply of on the circuit board, relatively large semiconductor integrated circuit reaches a high level that surpasses tens amperes.As shown in Figure 1, power distribution circuit is the circuit that includes power circuit and be used for the power supply from power circuit is offered the distribution wiring of other circuit.
The electromagnetic wave that leaks propagates into power circuit by distribution wiring and other circuit, and causes that feedback is subjected to break down from the circuit of the power supply of power circuit.Usually, there are a large amount of signal routings to be positioned near the distribution wiring of wiring plate.Therefore, easily leakage electromagnetic wave is coupled to a large amount of signal routings.The leakage electromagnetic wave that is coupled to signal routing makes signal quality that degeneration take place, and propagates into the external signal cable of digital device by signal routing as high-frequency current.Then, the external signal cable plays antenna, with high level to the useless electromagnetic wave of aerial radiation.
And then some leakage electromagnetic waves of propagating by distribution wiring pass power circuit and propagate by the commercial AC power line.The commercial AC power line plays antenna, with high level to the useless electromagnetic wave of aerial radiation.Simultaneously, leakage electromagnetic wave is propagated by the distribution wiring, and repeats reflection at some intermediate points of distribution wiring.Therefore, some leakage electromagnetic waves are also propagated by signal routing, and signal waveform is degenerated.
As shown in Figure 1, the strong measure that is used to address the above problem is to prevent to be leaked in the distribution wiring by the electromagnetic wave that circuit operation (for example, the handover operation of switch element) is generated.In order to address this problem,, must significantly reduce the impedance in all included in electromagnetic wave frequency ranges with respect to high frequency when when generating electromagnetic circuit power distribution circuit.
When the impedance from the power distribution circuit of transistor becomes when more and more approaching 0, reflect in the porch of distribution wiring by the electromagnetic wave that transistor encouraged, and do not enter power distribution circuit.
Under the existing situation, use capacitor to reduce the impedance of distribution wiring.As the assembly that is used for electronics and electromagnetic equipment, capacitor has long historical, has various capacitors to drop into actual the use so far.At present, developed such as capacitors such as ceramic capacitor and solid electrolytic capacitors.In ceramic capacitor, build up multilayer by the ceramic material tegillum of metallic film deposit.In solid electrolytic capacitor, the porous briquetting that use such as tantalum and aluminium etc. has the metal of valve effect is used as anode, uses oxide-film as dielectric, and uses conducting polymer as solid electrolyte.
As solid electrolytic capacitor, known at present have following: (for example have polypyrrole (polypyrrole) or its alkyl substitute as the solid electrolytic capacitor of the solid electrolyte on the dielectric oxide film, patent documentation 1), perhaps have the Solid electrolytic capacitor And Manufacturing approach (for example, patent documentation 2) of polyaniline (polyaniline) as the solid electrolyte on the dielectric oxide film.Compare with existing capacitor, used high double figures of conductance or more conducting polymer as solid electrolyte, and therefore these capacitors have low equivalent series resistance.These capacitors can play a role at big double figures of resistance or the more high-frequency region than existing capacitor with same electric capacity.
But, these capacitors have the both-end minor structure that is used for the charge/discharge function, make the impedance of these capacitors between the terminal of the high-frequency region that surpasses 10MHz increase sharply.Like this, these capacitors become and are not suitable for the power distribution circuit of digital circuit.Reason has for this reason been developed the multilayer feedthrough capacitor and the array of capacitors of the great quantity of small multilayer ceramic chip capacitor that is used to be connected in parallel.But, it is difficult to effectively reduce the impedance in surpassing the high-frequency region of 10MHz.
In order to handle higher frequency, also studied Filter Structures.For example, proposed by being inserted in the surface mount noise filter (for example, patent documentation 3) that tortuous conductor between the ceramic dielectric sheet and earthing conductor are formed.Fig. 2 is a sectional view, shows by the structure that is inserted in the surface mount noise filter that tortuous conductor between the ceramic dielectric sheet and earthing conductor form.
As shown in Figure 2, in existing surface mount Filter Structures, first dielectric piece 110, second dielectric piece 120 and the 3rd dielectric piece 130 are stacked together.First inner conductor 111, tortuous conductor 115 and second inner conductor 112 interface between first dielectric piece 110 and second dielectric piece 120 that is used for transmission signals.Earthing conductor 125 is formed on the interface between second dielectric piece 120 and the 3rd dielectric piece 130, with towards tortuous conductor 115.
One end of first inner conductor 111 links to each other with first signal electrode 151, one end of second inner conductor 112 links to each other with secondary signal electrode 152, and tortuous conductor 115 is connected between the other end of the other end of first inner conductor 111 and second inner conductor 112.Noise filter by this structure obtains is being better than the noise filter that is combined by existing inductance element and capacity cell aspect the high-frequency noise absorbent properties.
In this surface mount filter, to from one of electrode, for example the electrically conductive signal of first signal electrode, 115 inputs carries out filtering, and the electrically conductive signal of filtering is outputed to another electrode (secondary signal electrode 152).But, in the surface mount filter, the electric capacity that forms as distributed constant is made up of earthing conductor 125, tortuous conductor 115 and the dielectric piece that is layered between the conductor.Only be difficult to effectively reduce the impedance that surpasses in the high-frequency region of 10MHz by distributed capacitance.Therefore, use the partial interior conductor, so that strengthen the effect of deamplification in conjunction with electric capacity and series inductance as tortuous conductor.
And then, more and more approach 0 in order to make from impedance such as the power distribution circuit of switches such as transistor, following technology is disclosed: use power distribution circuit as the technology of low-impedance line (for example, patent documentation 4) and form the technology (for example, patent documentation 5) of low-impedance line by the technology that use is used to make solid electrolyte electric capacity.
The structure of disclosed multilayer board is as follows in the patent documentation 4:
The feature of multi-sheet printed version is that ground plane is layered on the upside and downside of the bus plane with power-supply wiring via insulation material layer respectively.And then, the signals layer with signal routing via second insulating material be layered in/one of following ground plane or both on.Use this structure, can be the same with the situation that low-impedance independent current source is provided respectively, direct current power supply is given such as being mounted on circuit elements such as semiconducter IC on the multilayer board and LSI.And, can under situation about not disturbing, suppress the electronic equipment radiated electromagnetic wave such as high speed that is mounted on circuit elements such as IC on the printed panel and LSI and high-frequency operation.
In patent documentation 5 in the structure of disclosed transmission line assembly, the cylindrical outer conductor that comes coaxial placement to make greater than the electric conducting material of inner conductor via the insulating material of high-k by diameter, to cover the surface of the inner conductor of making by electric conducting material, so that form the coaxial line of extremely low characteristic impedance.This assembly is connected to be inserted between the power line and the power port such as the contour rapid fire frequency circuit of LSI element of printed circuit board (PCB), so that with for each the high-speed radio-frequency circuit element that is mounted on the printed circuit board (PCB) provides the situation of low-impedance independent current source the same respectively, DC power supply can be provided.In addition, caused the high frequency electric source electric current that generates by the high-speed radio-frequency circuit element by the high speed handover operation, in transmission line assembly, to have dielectric loss, thereby can suppress the power supply coupling between power line and the holding wire, and suppress high frequency electric source electric current from the power line of printed circuit board (PCB) and flow to feed cable in the equipment.
[patent documentation 1]
Japan Patent discloses 4-56445 (the unsettled 60-37114 that discloses of Japan Patent)
[patent documentation 2]
The unsettled 3-35516 that discloses of Japan Patent
[patent documentation 3]
The unsettled 6-53046 that discloses of Japan Patent
[patent documentation 4]
The unsettled 2001-53449 that discloses of Japan Patent
[patent documentation 5]
The unsettled 2002-335107 that discloses of Japan Patent
As mentioned above, developed such as capacitors such as ceramic capacitor or solid electrolytic capacitors.In ceramic capacitor, build up multilayer by the ceramic material tegillum of metallic film deposit.In solid electrolytic capacitor, the metal that use such as tantalum and aluminium etc. has the porous compacting of valve effect is used as anode, uses oxide-film as dielectric, and uses conducting polymer as solid electrolyte.The same with the capacitor that uses in high-frequency region, these capacitors are used for various uses.But, these capacitors are seen and can not be seen as line facility from transmitting electromagnetic angle, and have only for obtaining the both-end minor structure of charge/discharge function.Therefore, very fast in the high-frequency region middle impedance increase that surpasses 10MHz.
Therefore, in the operation of the clock frequency that surpasses hundreds of MHz,, just can not reduce the supposition characteristic that appears in the signal generator circuit effectively, just be in the internal driving of the power supply of high frequency as long as used capacitor with this function.
Remove noise though developed the surface mount filter, be difficult to effectively reduce impedance.Therefore, use surface mount capacitor as an alternative thing just be restricted.Particularly in 100MHz or higher high-frequency region, be difficult to obtain Low ESR.
Considered to have designed the present invention under the above-mentioned condition.The objective of the invention is to propose a kind of bypass device that is used for noise filter and decoupling device and be applicable to more speed and the strip line device of higher frequency, the integrated printed wiring board and the semiconductor packages of strip line device.
Summary of the invention
In order to realize this purpose, feature of the present invention is to comprise: have the metal of valve effect, it has the surface area of increase; Dielectric coating is formed on the metallic surface with valve effect; And conductive material layer, be formed at via dielectric coating metal with valve effect around.
According to the invention described above, feature of the present invention also is to comprise metal parts, the DC power supply that it contacts with conductive material layer and places and transmit input, input/output terminal is positioned on the two ends of the two ends of the metal with valve effect and metal parts, and the frequency electromagnetic waves of input is imported into the transmission line of being made up of dielectric coating.
According to the invention described above, it is rectangular on cross section that feature of the present invention also is to have the metal of valve effect.
According to the invention described above, it is rounded or oval on cross section that feature of the present invention also is to have the metal of valve effect.
According to the invention described above, the metal that feature of the present invention also is to have the valve effect on cross section ringwise.
According to the invention described above, feature of the present invention is that also the metal with valve effect forms flat board or thin slice.
According to the invention described above, feature of the present invention is that also the metal with valve effect bends or bending in the same direction near the first type surface the metal two ends.
According to the invention described above, the metal that feature of the present invention also is to have the valve effect is bigger than sectional dimension at radial dimension.
According to the invention described above, feature of the present invention is that also the metal with valve effect comprises a pair of first contact conductor terminal, is positioned on the two ends of metal longitudinal direction, to be connected to the through hole of printed wiring board; And a pair of second contact conductor terminal, be positioned on the diverse location of metal parts, to be connected to the through hole of printed wiring board.
According to the invention described above, feature of the present invention also is: with printed wiring board electrode in contact lead terminal have than not with the big area of cross-sectional area of printed wiring board electrode in contact lead terminal.
According to the invention described above, feature of the present invention also is to comprise: the first contact conductor terminal, and it links to each other with the end that strip line device on being arranged in metal parts has a metal of valve effect and is connected electrically to printed wiring board; Be used to be connected to the second contact conductor terminal of printed wiring board, integral body is formed on the metal parts; And the whole first contact conductor terminal that is formed at the second contact conductor terminal on the metal parts and is connected to the metal two ends with valve effect has formed four terminals of strip line device.
According to the invention described above, feature of the present invention also is: the first contact conductor terminal has link, is used for being connected to the metal that the strip line device that is positioned on the metal parts has the valve effect; First support foot part is used to be connected to the wiring on the printed wiring board; And first body component, be used for link and support foot part are coupled together, be connected to the link of first body component and first support foot part as first body component vertically on two ends, and almost vertically be connected to first body component, the second contact conductor terminal that integral body is formed on the metal parts has second body component that is directly connected to metal parts and second support foot part that is used to be connected to the wiring on the printed wiring board, second body component as the metal parts that is used to mount the strip line device mount the surface vertically on two ends, and be connected to the end on the same long limit that mounts the surface, second support foot part with mount the surface and almost be connected to body component abreast.
According to the invention described above, feature of the present invention is that also the first contact conductor terminal has: link is used for being connected to the metal that the strip line device that is positioned on the metallic plate has the valve effect; First support foot part is used to be connected to the wiring on the printed wiring board; And first body component, be used for link and support foot part are coupled together, be connected to the link of first body component and first support foot part and be first body component vertically on two ends, and almost vertically be connected to first body component, so that the link and first support foot part are positioned at the opposite side of first body component, the second contact conductor terminal that integral body is formed on the metal parts has second support foot part, it be used to mount the strip line device metal parts mount the surface vertically on two ends, and almost with mount the surface and be connected to end on the same long limit that mounts the surface with paralleling.
According to the invention described above, feature of the present invention is that also the first contact conductor terminal has: link is used for being connected to the metal that the strip line device that is positioned on the metallic plate has the valve effect; And first body component, be used to be connected to the wiring on the printed wiring board, link almost with first body component be connected to perpendicularly first body component vertically on the end, the second contact conductor terminal that integral body is formed on the metal parts has second body component, it be used to mount the strip line device metal parts mount the surface vertically on two ends, and almost with mount the surface and be connected to end on the same long limit that mounts the surface perpendicularly.
According to the invention described above, feature of the present invention is that also the first contact conductor terminal has: link is used for being connected to the metal that the strip line device that places on the metallic plate has the valve effect; And first body component, be used to be connected to the wiring on the printed wiring board, link almost with first body component be connected to perpendicularly body component vertically on the end, the second contact conductor terminal that integral body is formed on the metal parts has second body component, its be used to mount the strip line device metal parts mount the surface vertically on the end, and almost be connected to the zone at intimate center of the minor face that mounts the surface with mounting the surface with paralleling, the first contact conductor terminal and the second contact conductor terminal be arranged as metal parts mount the surface vertically on almost in line.
According to the invention described above, feature of the present invention also is: the area that has with contacted first support foot part of printed wiring board and second support foot part greater than not with the cross-sectional area of contacted first body component of printed wiring board and second body component.
According to the invention described above, feature of the present invention is that also conductive material layer comprises conductive polymer coating.
According to the invention described above, feature of the present invention also is: conducting polymer is one or more compounds of selecting from the derivative of the group of being made up of polypyrrole, polythiophene and polyaniline or this compound.
According to the invention described above, feature of the present invention also is: conductive material layer has conductive polymer coating that is positioned on the dielectric coating side and the conductive paste layer that is formed on the conductive polymer coating.
According to the invention described above, feature of the present invention is that also metal parts is fixed on the conductive paste layer.
According to the invention described above, feature of the present invention also is: the metal with valve effect is the metal of selecting from the group of being made up of aluminium, tantalum and niobium.
According to the invention described above, feature of the present invention also is: use molded metal, dielectric coating and the conductive material layer with valve effect of resin.
Having the feature of the present invention that dielectric coating is inserted into the stepped construction between the conductor is to have comprised the low-impedance line device, and it has dielectric loss in dielectric coating; The first contact conductor terminal, it is positioned on the two ends of one of conductor, and is connected electrically to printed wiring board; And the second contact conductor terminal, it is positioned at the two ends of the metal parts that is used to mount the low-impedance line device, and is connected electrically to printed wiring board.The first contact conductor terminal has link, is used to be connected to first conductor; First support foot part is used to be connected to the wiring on the printed wiring board; And first body component, be used for link and support foot part are coupled together, be connected to the link of first body component and first support foot part and be first body component vertically on two ends, and almost vertically be connected to first body component, the second contact conductor terminal has second body component that is directly connected to metal parts and is used to be connected to second support foot part of the wiring on the printed wiring board, second body component be used to mount the low-impedance line device metal parts mount the surface vertically on two ends, and be connected to end on the same long limit that mounts the surface.Second support foot part almost with mount the surface and be connected to body component with paralleling.
Having the feature of the present invention that dielectric coating is inserted into the stepped construction between the conductor is to have comprised the low-impedance line device, and it has dielectric loss in dielectric coating; The first contact conductor terminal, it is positioned on the two ends of one of conductor, and is connected electrically to printed wiring board; And the second contact conductor terminal, it is positioned at the two ends of the metal parts that is used to mount the low-impedance line device, and is connected electrically to printed wiring board.The first contact conductor terminal has link, is used to be connected to first conductor; First support foot part is used to be connected to the wiring on the printed wiring board; And first body component, be used for link and support foot part are coupled together, the link and first support foot part that are connected to first body component are first body component two ends in the vertical, and almost vertically be connected to first body component, so that the link and first support foot part are positioned at the opposite side of first body component, the second contact conductor terminal has second support foot part, it be used to mount the low-impedance line device metal parts mount two ends in the vertical, surface, and almost with mount the surface and be connected to end on the same long limit that mounts the surface with paralleling.
Having the feature of the present invention that dielectric coating is inserted into the stepped construction between the conductor is to have comprised the low-impedance line device, and it has dielectric loss in dielectric coating; The first contact conductor terminal, it is positioned on the two ends of one of conductor, and is connected electrically to printed wiring board; And the second contact conductor terminal, it is positioned at the two ends of the metal parts that is used to mount the low-impedance line device, and is connected electrically to printed wiring board, and the first contact conductor terminal has link, is used to be connected to first conductor; And first body component, be used to be connected to the wiring on the printed wiring board, link almost with first body component be connected to perpendicularly first body component vertically on the end, the second contact conductor terminal has second body component, it be used to mount the low-impedance line device metal parts mount two ends in the vertical, surface, and almost with mount the surface and be connected to end on the same long limit that mounts the surface perpendicularly.
Having the feature of the present invention that dielectric coating is inserted into the stepped construction between the conductor is to have comprised the low-impedance line device, and it has dielectric loss in dielectric coating; The first contact conductor terminal, it is positioned on the two ends of one of conductor, and is connected electrically to printed wiring board; And the second contact conductor terminal, it is positioned at the two ends of the metal parts that is used to mount the low-impedance line device, and is connected electrically to printed wiring board, and the first contact conductor terminal has link, is used to be connected to first conductor; And first body component, be used to be connected to the wiring on the printed wiring board, link almost with first body component be connected to perpendicularly first body component vertically on the end, the second contact conductor terminal has second body component, it be used to mount the low-impedance line device metal parts mount the surface vertically on the end, and almost be connected to the zone at intimate center of the minor face that mounts the surface perpendicularly with mounting the surface, the placement location of the first contact conductor terminal and the second contact conductor terminal metal parts mount the surface vertically on almost in line.
According to the invention described above, feature of the present invention also is: the area that has with contacted first support foot part of printed wiring board and second support foot part greater than not with the cross-sectional area of contacted first body component of printed wiring board and second body component.
According to the invention described above, feature of the present invention also is to use the molded low-impedance line device of resin.
The present invention includes the metal with valve effect, it has the surface area of increase; Dielectric coating is formed on the metallic surface with valve effect; Conductive material layer, be formed at via dielectric coating metal with valve effect around; And metal parts, be used to transmit the DC power supply of input.Feature of the present invention is to have comprised the strip line device, and it has input/output terminal on the two ends of metal two ends with valve effect and metal parts; Plate; First power-supply wiring and second source wiring are formed on the plate; Second input/output terminal that is positioned at first input/output terminal on the metal two ends with valve effect and is positioned on the two ends of metal parts is connected respectively to first power-supply wiring and second source wiring.
According to the invention described above, feature of the present invention also is: the circuit element that is used to voltage sources such as receiving is positioned at circuit board in integrated mode, and provides equivalent source by bus.
The present invention includes the metal with valve effect, it has the surface area of increase; Dielectric coating is formed on the metallic surface with valve effect; Conductive material layer, be formed at via dielectric coating metal with valve effect around; And metal parts, be used to transmit the DC power supply of input.Feature of the present invention is to have comprised the strip line device, its have on the metal two ends of valve effect and the two ends of metal parts on have input/output terminal; Substrate is made by insulating material; And semiconductor chip, be mounted on the substrate, substrate has the first connection pin that is used to be connected to the device that is mounted on the plate and is connected pin with second, semiconductor chip has the wiring of first power-supply wiring and second source, and is positioned on the metal two ends with valve effect the power-supply wiring that is connected pin and semiconductor chip that input/output terminal on the two ends with metal parts is connected respectively to substrate.
Feature of the present invention also is to comprise the steps: to form the metal with valve effect, and this metal has the surface area of increase; On metallic surface, form dielectric coating with valve effect; Around metal, form conductive material layer via dielectric coating with valve effect; The location and in conjunction with strip line device and a plurality of substrate, integrally formed metal parts on it and as the lead frame of the first contact conductor terminal with second contact conductor terminal, so that conductive material layer and metal parts are in contact with one another, lead frame is in contact with one another with the metal with valve effect, obtains the strip line device in the step before the step that forms conductive material layer; And from substrate, cut second contact conductor terminal and the lead frame, to finish the strip line device with preset distance.
Description of drawings
Fig. 1 has explained the influence of the power supply that is generated by the switch element of having formed the LSI in the distribution wiring.
Fig. 2 is a sectional view, shows the example of existing surface mount filter.
Fig. 3 is a perspective view, shows the profile according to the strip line device of the embodiment of the invention.
Fig. 4 is the sectional view along the line A-A ' of Fig. 3.
Fig. 5 has explained the figure of the method for the electric capacity of measuring aluminium flake.
Fig. 6 is a sectional view, shows the strip line device according to second embodiment of the invention.
Fig. 7 is a sectional view, shows the strip line device according to third embodiment of the invention.
Fig. 8 is a sectional view, shows the strip line device according to fourth embodiment of the invention.
Fig. 9 is a sectional view, shows the strip line device according to fifth embodiment of the invention.
Figure 10 is a sectional view, shows the strip line device according to sixth embodiment of the invention.
Figure 11 is a sectional view, shows the strip line device according to seventh embodiment of the invention.
Figure 12 is a sectional view, shows the strip line device according to eighth embodiment of the invention.
Figure 13 is a sectional view, shows the strip line device according to ninth embodiment of the invention.
Figure 14 is the sectional view along the line B-B ' of Figure 13.
Figure 15 is a perspective view, shows the structure when strip line device of the present invention is mounted on the multilayer printed-wiring board.
Figure 16 shows the figure of the structure when bus being provided and being mounted on the strip line device on the multilayer printed-wiring board.
Figure 17 is a sectional view, shows multilayer printed-wiring board shown in Figure 16.
Figure 18 is a structure chart, shows the structure of bus.
Figure 19 shows the figure of first pattern of the contact conductor terminal that forms when being mounted on the strip line device on the multilayer printed-wiring board.
Figure 20 shows the strip line device of Figure 19 along the length direction of device and the side view of Width.
Figure 21 shows the figure of the profile of the strip line device that uses the molded Figure 19 of resin.
Figure 22 shows the figure of second pattern of the contact conductor terminal that forms when being mounted on the strip line device on the multilayer printed-wiring board.
Figure 23 shows the strip line device of Figure 22 along the length direction of device and the side view of Width.
Figure 24 shows the figure of the three-mode of the contact conductor terminal that forms when being mounted on the strip line device on the multilayer printed-wiring board.
Figure 25 shows the strip line device of Figure 24 along the length direction of device and the side view of Width.
Figure 26 shows the figure of the four-mode of the contact conductor terminal that forms when being mounted on the strip line device on the multilayer printed-wiring board.
Figure 27 shows the strip line device of Figure 26 along the length direction of device and the side view of Width.
Figure 28 shows the figure of the strip line device that a plurality of metallic plates and lead frame be connected to form continuously on substrate.
Figure 29 show when on the substrate that the strip line device is combined in Figure 28 and use resin molded it the time the figure of profile.
Figure 30 shows metallic plate wherein and lead frame interconnects and cut the figure of profile of the strip line device of leg with predetermined length.
Figure 31 shows the structure of strip line device of Figure 30 along the length direction of device and the side view of Width.
Figure 32 shows the figure of the structure of the strip line device that includes a plurality of second contact conductor terminals.
Figure 33 shows the figure of the structure of the strip line device that includes a plurality of first and second contact conductor terminals.
Figure 34 shows the figure of the structure of the strip line device of drawing with second contact conductor terminal on Width.
Figure 35 shows the figure of the structure of the strip line device of drawing with first and second contact conductor terminals on Width.
Figure 36 is an equivalent circuit diagram, is used for reflection coefficient Γ and carry-over factor T on the computational scheme.
Figure 37 shows the frequency of decoupling equipment and the relation between the carry-over factor.
Figure 38 is a perspective view, shows strip line device of the present invention is mounted on the situation that semiconductor package is loaded onto.
In the accompanying drawings, label 1 expression strip line device.Label 2 (2A, 2B) the expression first contact conductor terminal (terminal).Label 3 (3A, 3B) the expression second contact conductor terminal (terminal).Label 10 expression valve metal.Label 11 and 12 expressions, the first contact conductor terminal.Label 20 expression dielectric coatings.Label 30 expression conductive material layers.Label 31 expression conductive polymer coatings.Label 32 expression conduction carbon paste layers.Label 33 expression silver paste.Label 40 expression metallic plates.Label 41 and 42 expressions, the second contact conductor terminal.Label 60 expression insulating material.Label 70 expression printed wiring boards.Label 71a and 71b represent the positive supply wiring.Label 74a and 74b represent the negative supply wiring.Label 79 expression insulating barriers.Label 80 expression semiconductor packages.Label 81a and 78b represent the positive supply wiring.Label 84a and 84b represent the negative supply wiring.Label 85 expression semiconductor chips.Label 86 expressions connect pin.Label 89 expression insulating barriers.Label 110 expressions first dielectric piece.Label 111 expressions first inner conductor.Label 112 expressions second inner conductor.The tortuous conductor of label 115 expressions.Label 120 expressions second dielectric piece.The interval of label 123 and 124 expression dielectric insulation.Label 125 expression earthing conductors.Label 130 expressions the 3rd dielectric piece.Label 151 expressions first signal electrode.Label 152 expression secondary signal electrodes.
Embodiment
Tell about preferred embodiment with reference to the accompanying drawings.But, the present invention embodiment of being not limited to discuss below.
(first embodiment)
Fig. 3 is a perspective view, shows the profile according to the strip line device of the embodiment of the invention.Fig. 4 is a sectional view, shows along the strip line device of the line A-A ' of Fig. 3.
Shown in Fig. 3 and 4, strip line device of the present invention comprises metal (below be referred to as valve metal) 10, has dielectric coating 20 on its surface, and likeness in form has the long slab of valve effect; And conductive material layer 30, be covered with valve metal 10 via dielectric coating 20.In this structure, as shown in Figure 3, strip line device 1 comprises the valve metal 10 of almost flat.Valve metal 10 in the vertical two ends and the two ends of strip line device 1 almost in line.
For example, valve metal 10 is made of aluminum.In the example of Fig. 3, valve metal 10 is a rectangle, and for example thickness is 110mm, and length is 30mm, and width is 10mm.The cross sectional shape of valve metal 10 is not limited to rectangle, can also be oval or annular.By the electrolytic etching in electrolytic solution, the surface of valve metal 10, just the surface area of the end face of front, back and valve metal 10 has increased about 200 times.On valve metal 10, formed the sponge hole.
Form conductive material layer 30, to cover valve metal 10, except valve metal 10 two ends via dielectric coating 20.As long as material conducts electricity, the material of conductive material layer 30 etc. are not special to be limited.For example, can utilize various metals, such as semiconductors such as manganese dioxide, indium oxides, perhaps such as the organic conductors such as charge transfer compound of tetracyano-p-quinodimethane (tetracyanoquinodimethane) and tetrathiafulvalene (tetrathiafulvalene).
Specifically, for conductive material layer 30, conducting polymer is preferred, and example comprises polypyrrole, polythiophene, polyethylene dioxo thiophene (polyethylene dioxythiophene), polyaniline, polyphenylene (polypheylene), poly-furans, polythiazole base (polythiazyl), polyphenylene vinylene (polyphenylenevinylene), polyacetylene and poly-azulenes (polyazulene).Especially, polypyrrole, polythiophene, polyaniline and derivative thereof see it is preferred from stable angle.In the present invention, the derivative of polypyrrole, polythiophene and polyaniline for example comprises by adding various substituting groups (substituent) to obtain in these compounds derivative, and by carrying out the derivative that the symbiosis polymerization obtains with other high polymers.
In the present invention, with after the dopant that formed by main (electron-withdrawing) compound combines, generally use these conducting polymers.In the present invention, the dopant that combines with conducting polymer is not particularly limited.Existing known dopant is used for conducting polymer.For example, such dopant comprises the dopant as the halogen compound of iodine, chlorine, anion perchlorate etc., as the dopant of the lewis acid (Lewis acid) of aromatics sulphonyl (aromatic sulfonic acid) compound etc., perhaps as dopant such as Lewis's bases such as lithium and etamon (Lewis acid).
In order further to reduce impedance, placement is by copper, silver, gold, aluminium or have the metallic plate 40 that low-resistance other materials is made, with the one or both sides towards valve metal.Conductive material layer 30 is inserted between metallic plate 40 and the valve metal.In the present embodiment of Fig. 3, placed metal plate 40 contacts with the one side of cuboid.Place metallic plate 40, to surround (or part is surrounded) cuboid.Because conductive material layer 30 is a film as thin as a wafer, therefore in order to obtain mechanical strength and minimizing resistance, the outside that metallic plate is placed conductive material layer 30 is to surround conductive material layer 30.
In the present invention, there is no particular limitation to the formation method of these conducting polymers of constituting conductive material layer 30.The formation of conducting polymer is as follows: the solution that generates and evaporate conducting polymer on the surface of the valve metal 10 that has formed dielectric coating 20 (just on the dielectric coating), introduce the monomer and oligomer and the polymerization catalyst that form conducting polymer, directly on the surface of valve metal, to carry out the polymerization of conducting polymer, perhaps form the high polymer layer of forming by the intermediate of conducting polymer and change into conducting polymer.
And then, by directly mounting onboard, can be implemented to being connected of wiring plate and circuit board.Under the optional situation, can extraction electrode and wait with resin, can and to seal.As example of structure with contact conductor terminal, in the present embodiment, the first contact conductor terminal 2A and 2B be positioned at valve metal 10 vertically on two ends on, and the second contact conductor terminal 3A and 3B be positioned at metallic plate 40 vertically on two ends on.For example, the first contact conductor terminal 2 can form by valve metal 10 is projected into both sides, perhaps connects by welding or crimping.Similarly, the second contact conductor terminal 3A and 3B can form by metallic plate 40 is projected into both sides, perhaps connect by welding or crimping.The shape of contact conductor terminal is to determine according to the pattern of mounting on the analogs such as printed wiring board.
As shown in Figure 1, terminal 2A and 3A be used to receive feedback be subjected to from the terminal of the DC power supply of power circuit right, terminal 2B and 3B be used for the DC power supply feedback is subjected to the terminal of LSI right.
And dielectric coating 20 is greatly to make in the material of the line inductance that forms between the first contact conductor terminal 2A and 2B and the second contact conductor terminal 3A and 3B by being used to form its line capacitance, so that line impedance has minimum.Therefore, according to the strip line device of Fig. 3 of the embodiment of the invention, the frequency electromagnetic waves of the signal component that can generate by the transistor switch in the LSI circuit etc. almost completely, and, reflex to LSI from the redundant electromagnetic wave of power circuit.
In an embodiment of the present invention, the feature from the strip line device of terminal 2A and 3A is quite analogous to from the feature of terminal 2B and 3B.Therefore, when DC power supply is when receiving by terminal 2B and 3B, the effect of strip line device is also similar to the above.
In the present invention, the kind of valve metal is not particularly limited.The same with valve metal 10, can utilize the material that is used to form face coat that includes tantalum, aluminium, niobium, titanium, zirconium, silicon and magnesium.Use these metals with forms such as roll film, fine-powder sintered compact.Particularly, the same with valve metal 10, the preferred metal of from the group of forming by tantalum, aluminium and niobium, selecting that uses.
And then, the method that forms dielectric coating 20 on the surface of valve metal is not particularly limited.For example, dielectric coating 20 can form by the electrolysis of using electrolytic solution, perhaps by using suitable oxidant to form.Alternatively, the oxide-film that forms by air oxidation directly is used as dielectric coating 20 of the present invention.But, the general dielectric coating that forms by electrolysis that uses.
Shape to valve metal 10 is not particularly limited.From the calculating of characteristic impedance and work, use flat shape (with the rectangle in the vertical perpendicular cross section of valve metal) under the preferable case, but also can use shape curved and the part bending.Cylindricality or cylindrically also be suitable for.
The surface of valve metal 10 can do more in the present invention.Valve metal with big surface comprises fine-powder sintered compact that forms plate and the etch slide that has carried out electrolytic etching in electrolytic solution.
As mentioned above, in the present invention, conductive material layer 30 is made up of conducting polymer under the preferable case.Can use following structure: form by conducting polymer with dielectric coating 20 contacted layers, and the another kind of type of conductive material layer forms on conductive polymer coating.The solid electrolyte of electric conducting material and metallic plate can be in contact with one another as it is, perhaps can interconnect by using conduction carbon paste and silver paste.
For example, conductive material layer 30 can have three-decker, comprises conductive polymer coating, directly contacts with dielectric coating 20; The conduction carbon paste places on the conductive polymer coating; And silver paste, place on the conduction carbon paste.Metallic plate mounts by silver paste.
The strip line device of present embodiment is by the valve metal 10 with dielectric coating 20, place conductive material layer 30 around the valve metal 10, place pair of electrodes lead terminal 2A and the 2B on the diverse location of valve metal 10 and place pair of electrodes lead terminal 3A and 3B on the diverse location of conductive material layer to form via dielectric coating 20.This structure has increased apparent (apparent) dielectric loss, therefore can effectively reduce the impedance of strip line Devices Characteristics, thereby prevents to enter power distribution circuit by the electromagnetic wave that noise source generates.
Come specifically to tell about the example of manufacturing below according to the strip line device of first embodiment.The fabrication schedule that the present invention is not limited to discuss below.
In the strip line device shown in Fig. 3 and 4, use aluminium flake to be used as valve metal 10.By etching the surface area of aluminium flake is increased about 200 times, and thickness is 110 μ m.The width of aluminium flake is 10mm, and length is 30mm.On the two ends of aluminium flake (valve metal 10), formed the mask (not shown) by the fluorocarbon polymer of using hexafluoropropylene.Then, in mass ratio is the aqueous solution of 5% amine borate, under 10V, aluminium flake is carried out anodization, and clean and oven dry, so that can obtain to have the aluminium flake of the dielectric coating 20 that constitutes by the burning coating.This thin slice is immersed in the sulfuric acid solution of 0.05mol/L, and measure the electric capacity that is about 380 μ F.As shown in Figure 5, when being immersed sulfuric acid solution, measures thin slice electric capacity.Sulfuric acid solution has high conductivity, and is impregnated in the slot of dielectric coating, therefore can measure exactly and the proportional electric capacity of the area of dielectric coating.In this case, though need consider the low reaction speed of sulfuric acid solution, sulfuric acid solution has the low measuring frequency of about 120Hz, so reaction speed can not cause any problem.And then solution is not limited to sulfuric acid solution, therefore as long as solution has conductivity, can use any solution.
Subsequently, in glass container, prepared to include mass ratio and be 10% p-methyl benzenesulfonic acid and mass ratio and be the aqueous solution of 5% aniline, the valve metal 10 that has dielectric coating 20 and mask on it has been immersed in the aqueous solution, taken out then.In air at room temperature, at room temperature allow dry 30 minutes of valve metal 10.Then, valve metal 10 is immersed in to include mass ratio be 10% cross in the aqueous solution that ammonium disulphide (ammonium peroxodisulfate) and mass ratio are 10% p-methyl benzenesulfonic acid, take out then, and placed air nearly 20 minutes, so that aniline carries out polymerization.
Afterwards, water and methyl alcohol come wash-out valve metal 10, and dry in 80 ℃ environment.Repeat these operations four times.Use conduction carbon paste and silver paste successively, finishing conductive material layer 30, and will be fixed to the conductive material layer 30 that has silver paste by the metallic plate 40 that the copper sheet that is about 100 μ m is formed.Then, oxolane is immersed at the two ends of valve metal 10, and dissolve and remove the hexafluoropropylene (hexafluoropropylene) of the resin that is used as the composition mask.
(second embodiment)
With reference to Fig. 6, tell about the second embodiment of the present invention below.The difference of the structure of the strip line device of present embodiment and the strip line device of first embodiment is the shape approximation square of valve metal 10 in the cross section.The structure similar of other structures of the strip line device of present embodiment and the strip line device of first embodiment.
(the 3rd embodiment)
With reference to Fig. 7, tell about the third embodiment of the present invention below.The difference of the structure of the strip line device of present embodiment and the strip line device of first embodiment is that valve metal 10 is circular or oval at the shape approximation of cross section.The structure similar of other structures of the strip line device of present embodiment and the strip line device of first embodiment.
(the 4th embodiment)
With reference to Fig. 8, tell about the fourth embodiment of the present invention below.The difference of the structure of the strip line device of present embodiment and the strip line device of first embodiment is the shape approximation annular of valve metal 10 in the cross section.That is to say, used columniform valve metal 10.The structure similar of other structures of the strip line device of present embodiment and the strip line device of first embodiment.
(the 5th embodiment)
With reference to Fig. 9, tell about the fifth embodiment of the present invention below.The longitudinal size L that the difference of the structure of the strip line device of present embodiment and the strip line device of first embodiment is valve metal 10 is bigger four times or more than cross sectional dimensions.That is to say that because length is greater than width on cross section, so valve metal 10 can be used as circuit.As valve metal 10, use length to form two types strip line device as the metal of 1.8mm as 16mm and 32mm and width.Conductive material layer 30 is made up of polythiophene, carbon paste and silver paste.Dielectric coating 20 is to form under the formation voltage of 8V.
The two ends of two types of strip line devices obtaining like this are connected to network analyser, and measure power delivery attribute S21.When not considering internal loss, resistance value is to be determined by the value of real part and imaginary part.Length is that the resistance value that the type of 16mm has is 0.2m Ω～0.8m Ω, and this is smooth slightly in the frequency field of 20MHz～200MHz.Even the frequency field middle impedance value at 1MHz～1GHz also is 10m Ω or lower.Simultaneously, length is that the type of 32mm has more preferred result.Resistance value is about 0.1m Ω, and this is smooth slightly in the frequency field of 7MHz～150MHz.Even the frequency field middle impedance value at 2MHz～1GHz also is 10m Ω or lower.
As a result, find to compare with 0.1 μ F multilayer chiop ceramic capacitor as the most frequently used high frequency capacitor, these the two types impedances on several kHz～several GHz will be hanged down 2～3 figure places.Like this, can think and compare to have fabulous impedance characteristic according to the strip line device of the embodiment of the invention, particularly for advanced digital equipment with existing capacitor.
(the 6th embodiment)
With reference to Figure 10, tell about the sixth embodiment of the present invention below.The structure of strip line device of the present invention is, the paired electrode lead terminal 11 and 12 that is shaped to be mounted in the through hole of printed wiring board is positioned on valve metal 10 two ends in the vertical, and the paired electrode lead terminal 41 and 42 that is shaped to be mounted in the through hole of printed wiring board is positioned on the diverse location of metallic plate 40.This structure can obtain to be suitable for being mounted on the strip line device on the printed wiring board.
(the 7th embodiment)
With reference to Figure 11, tell about the seventh embodiment of the present invention below.In the structure of strip line device of the present invention, the contact conductor terminal 11,12,41 and 42 that is suitable for the L shaped shape of surface-pasted letter is positioned on valve metal 10 two ends in the vertical.If do not need surface mount, then the shape of contact conductor terminal need not be confined to alphabetical L shaped shape.Can also use the cross section to be polygon, semicircle and circular simple shape.
(the 8th embodiment)
With reference to Figure 12, tell about the eighth embodiment of the present invention below.The conductive material layer 30 that the structure of the strip line device of present embodiment and the difference of first embodiment are Fig. 4 is made up of conductive polymer coating 31, conduction carbon paste layer 32 and silver paste layer 33.The structure similar of other structures of the strip line device of present embodiment and the strip line device of first embodiment.
(the 9th embodiment)
Tell about the ninth embodiment of the present invention below.The strip line device of present embodiment and the difference of the 8th embodiment are what conductive polymer coating shown in Figure 12 31 was made up of one or more compounds of selecting from the derivative of the group be made of polypyrrole, polythiophene and polyaniline or this compound.Other structures of the strip line device of present embodiment and the strip line device of the 8th embodiment similar.
(the tenth embodiment)
Tell about the tenth embodiment of the present invention below.The structure of the strip line device of present embodiment and the difference of the 8th and the 9th embodiment are that the strip line device is made up of conductive paste layer rather than conduction carbon paste layer 32 and silver paste layer 33.The strip line device of other structures of the strip line device of present embodiment and the 8th and the 9th embodiment similar.
(the 11 embodiment)
Tell about the 11st embodiment of the present invention below.The structure of the strip line device of present embodiment and the difference of the tenth embodiment are that metallic plate 40 is fixed on the conductive paste layer of strip line device in the tenth embodiment.Other structures of the strip line device of present embodiment and the strip line device of the tenth embodiment similar.
(the 12 embodiment)
Tell about the 12nd embodiment of the present invention below.The structure of the strip line device of present embodiment and the difference of the first to the 11 embodiment are that valve metal 10 is metal by what select from the group of being made of aluminium, tantalum and niobium.Other structures of the strip line device of present embodiment and the strip line device of the first to the 11 embodiment similar.
(the 13 embodiment)
With reference to Figure 13 and 14, tell about the 13rd embodiment of the present invention below.As shown in figure 14, the strip line device of present embodiment has dielectric coating 20, and it forms valve metal 10 is clipped in the middle, and conductive material layer 30, and it forms dielectric coating 20 is clipped in the middle.Metallic plate 40 is attached to a surface of the duplexer that wherein stacks gradually valve metal 10, dielectric coating 20 and conductive material layer 30.And then insulating material 60 places on the two ends of front and back of valve metal 10, and surrounds the two ends of dielectric coating 20 and conductive material layer 30.The first contact conductor terminal 11 and 12 is positioned at outside the end that has insulating material on the valve metal 10.The second contact conductor terminal 41 and 42 be positioned at the surface of surperficial opposite metal plates 40 with valve metal 10, dielectric coating 20 and conductive material layer 30 on.
With equidirectional bending or crooked, valve metal 10, dielectric coating 20 and conductive material layer 30 so are layered on the metallic plate 40 the strip line device of present embodiment in this device near the first type surface the two ends of device.When parts in like this bending or when crooked in unidirectional plane, can carry out making at an easy rate by dipping, and can shorten the strip line device in the vertical, so that when mounting, avoid other assemblies.And, in the present embodiment, the strip line device with the perpendicular plane bending in the mounted substrate surface that is used for mounting the strip line device or crooked.This equipment can be with respect to the Surface Vertical ground bending that parallels with the mounted substrate surface or crooked.
With reference to Figure 15, tell about the circuit structure of the strip line device that is used on multilayer printed-wiring board, mounting the first to the 13 embodiment below.
Circuit board as shown in figure 15 comprises multilayer board 303, is mounted on the lip-deep strip line device of multilayer board 303, is connected respectively to the anode lead terminal 11 of strip line device and the power-supply wiring 301a and the 301b of 12 (not shown)s, and is connected respectively to the cathode lead terminal 41 of strip line device and the ground connection wiring 302a and the 302b of 42 (not shown)s.By using materials such as copper on multilayer board 303, to form each power-supply wiring 301a and 301b and ground connection wiring 302a and 302b such as high conductivity.
A plurality of circuit unit (not shown)s are mounted on the multilayer board 303.High-frequency noise from circuit unit is added to power-supply wiring 301a and 301b and ground connection wiring 302a and 302b, propagates by these wirings, and causes circuit unit generation dysfunction.By filter noise in the strip line device, the possibility that the malfunction that is caused by high-frequency noise takes place on the circuit board of Figure 15 is less, thereby finishes stable circuit operation on high-frequency.
And then when being mounted on a plurality of circuit units on the circuit board, the circuit unit of placement is close mutually, so that noise source and to be subjected to the position that the circuit unit of noise source influence places close mutually.Equally in this case, be inserted in the power-supply wiring and ground connection wiring between the strip line device effectively the noise that is added in the wiring of power-supply wiring and ground connection is carried out filtering.Therefore, use the circuit board of strip line device of the present invention can be implemented in and carry out high-density packages on the circuit board that works in high frequency.
As shown in figure 16, the multilayer printed-wiring board with strip line device can be supplied to power supply each circuit element by using bus.When not having pin under a plurality of signal pins are located immediately at the LSI that mounts or in the central area of plate, the reception pad that provides is connected to plate with bus.For example, in the embodiment of Figure 16, circuit element is mounted on the plate, corresponding to such as service voltages such as 3.3V, 2.5V and 1.8V, and by bus power supply is offered plate.In addition, the printed wiring board of use bus can be stacked, as shown in figure 17.Under the optional situation, the circuit element that is used to supply different electrical power can be mounted on single plate, and provides bus to supply corresponding power supply.
Via insulator the bus in the layer is fixed on the equipment, and the rack earth stube cable couples together the body rack earth of rack earth layer and bus.Figure 18 is a perspective view, shows the example of bus.In Figure 18, label 700 expression buses, label 701 expression buses are the ethene band fixedly, and label 702 expression buses support (support section), label 703 indication equipment body ground connection frames, and label 704 expression rack earth stube cables.That is to say, by use as the bus of insulator fixedly ethene band 701 bus 700 is fixed in the bus support 702, and rack earth stube cable 704 couples together the rack earth layer and the body rack earth 703 of bus 700.
In above telling about, the wiring paired with power-supply wiring is the ground connection wiring.The negative supply wiring can be paired with power-supply wiring.And then in above telling about, the strip line device is mounted on the surface of multilayer board 303.By strip line device of the present invention being mounted on multiple-plate inner panel surface of forming multilayer board 303, can obtain same effect.
Come below further to tell about and be used for the strip line device is mounted on structure on the multilayer printed-wiring board 303.In the present embodiment, as shown in figure 19, strip line device 1 is mounted on the metallic plate 40, and by being used as first contact conductor terminal that the wiring on valve metal 10 and the stacked printed panel 303 is coupled together and the lead frame 500 that is positioned at the second contact conductor terminal 520 on the metallic plate 40, strip line device and multilayer wiring printed panel 303 are electrically connected mutually.
Come specifically to tell about the shape of the first and second contact conductor terminals below and mount the position.
At first, in first pattern of contact conductor terminal, the lead frame 500 that is used to be electrically connected valve metal 10 and multilayer printed-wiring board 303 has the joint 501 that is used to be connected to valve metal 10, as first body 502 of the leg of lead frame and first leg 503 that is used to be connected to the wiring on the multilayer printed-wiring board.On first body 502 two ends in the vertical, the joint 501 and first leg 503 almost vertically mount first body 502, to have the reciprocal surface about first body 502.And metallic plate 40 has the second contact conductor terminal 520, and each is all by second body 521 that is connected to the body 510 that is used to mount the strip line device be connected to that second leg 522 of the wiring on the multilayer printed-wiring board forms.A pair of second body 521 that is connected to the body 510 of metallic plate 40 is positioned on metallic plate 40 two ends in the vertical, and is positioned at the same long limit of the upper surface of the body 510 that is used to mount the strip line device.Second body 521 is not vertically to be connected to metallic plate 40, but it is mounted, and makes to separate with the vertical of metallic plate from vertical direction with the distance of distance metallic plate 40 joints.That is to say that when as shown in figure 19 from the minor face metallic plate 40 of metallic plate ((1) direction of Figure 19), the 521 pairs of metallic plates 40 of a pair of second body by as shown in figure 20 mount, and make its likeness in form " eight ".Second leg 522 is mounted on second body 522 that parallels with metallic plate 40.
Place the strip line device and it be attached to the metallic plate 40 of structure like this, with lead frame be attached to be positioned at metallic plate vertically on the other end on valve metal 10.The other end does not have the contact conductor terminal of metallic plate 40.The strip line device is mounted on the metallic plate, and lead frame 500 and be positioned at the strip line device that the second contact conductor terminal 520 on the metallic plate end has been formed four terminal structures.As shown in figure 21, use the molded strip line device of resin, and be placed on the printed wiring board.Diagonal angle dash area is as shown in figure 21 represented moulding part.The joint that is connected to the leg of printed wiring board all comes out from the bottom-exposed of molded assembly.And then, have bigger area as the joint of foot, that is to say, be greater than not area of section with printed wiring board electrode in contact lead terminal with the area of printed wiring board electrode in contact lead terminal.Therefore, the contact area between printed wiring board and the contact conductor terminal has increased, thereby has preferably kept being electrically connected.And, after such as technologies such as solder reflow, can obtain preferred electrical characteristic (ohm property).When the strip line device with contact conductor terminal by when being pressed onto printed wiring board, the leg that provides on diagonal has reduced pressure.Figure 20 (A) is a side view, shows the strip line device of seeing from (1) direction of Figure 19.Figure 20 (B) is a side view, shows the strip line device of seeing from (2) direction of Figure 19.In first embodiment, the leg 503 and 522 of the first contact conductor terminal 500 and the second contact conductor terminal 520 is expanded to the outside.Leg can be narrowed down to inside (on the direction identical) with first junction 501.Use this structure can improve the packaging density of equipment on the circuit board.
In second pattern of contact conductor terminal, shown in Figure 22 (A), second leg 522 that is mounted on the second contact conductor terminal 520 on the metallic plate 40 directly links to each other with the body 510 of metallic plate 40.Second leg 522 distributes along the parallel longitudinal that mounts the surface of the metallic plate 40 that is used to mount the strip line device.In first embodiment, the second contact conductor terminal 520 expands to the outside on diagonal, and second leg, 522 metallic plates 40 direct and in the present embodiment link to each other, so that be reduced to outside width and increase packaging density.And then, in the present embodiment, with the contacted leg of the wiring on the printed wiring board directly place as much as possible metallic plate 40 below, thereby improved the packaging density of encapsulation.Figure 23 (A) is a side view, shows to carry out molded and strip line device that look up from Figure 22 (B) (1) side with the state among Figure 22 (B).Figure 23 (B) is a side view, shows to carry out molded and strip line device that look up from Figure 22 (B) (2) side with the state among Figure 22 (B).As shown in figure 23, in the present embodiment, the bottom of leg is the same with the bottom of mould high, perhaps is higher than (being longer than) mould a little, thereby design has almost arrived the limit on the short transverse.That is to say that this structure is to obtain under the situation of considering less thickness.
The three-mode of contact conductor terminal is discussed below.In three-mode, shown in Figure 24 (A), first body 502 and second body 521 almost vertically mount joint 501 and metallic plate 40.And then the leg 503 and 522 that provides in first pattern of Figure 19 is not provided three-mode.This shape helps the formation of assembly, and then has reduced the area of metallic plate and lead frame.Owing to removed leg, therefore reduced to the width of outside and increased packaging density.And then, in the present embodiment, with the contacted leg of the wiring on the printed wiring board directly place as much as possible metallic plate 40 below, thereby improved the packaging density of assembly.Figure 25 (A) is a side view, shows with the state among Figure 24 (B) to carry out molded strip line device, and looks up from Figure 24 (B) (1) side.Figure 25 (B) is a side view, shows with the state among Figure 24 (B) to carry out molded strip line device, and looks up from Figure 24 (B) (2) side.As shown in figure 25, the bottom of leg is the same with the bottom of mould high, perhaps is higher than (being longer than) mould a little, makes design almost arrive the limit on the short transverse.That is to say that this structure is to obtain under the situation of considering less thickness.
The four-mode of contact conductor terminal is discussed below.In four-mode, shown in Figure 26 (A), second body 521 that is mounted on the second contact conductor terminal on the metallic plate 40 metallic plate vertically on have the leg that is positioned on the two ends and almost is positioned at the center of the minor face that mounts the surface that is used to mount the strip line device.This pattern can realize having the small-sized four terminal strip line devices of less width.Like this, in the present embodiment, even when almost being not used in mount components regional onboard, in SIP (single-row straight cutting encapsulation) structure, the strip line device being mounted and make and vertically raise, thereby realize high-density packages.Figure 27 (A) is a side view, shows to carry out molded and strip line device that look up from Figure 26 (B) (1) side with the state among Figure 26 (B).Figure 27 (B) is a side view, shows to carry out molded and strip line device that look up from Figure 26 (B) (2) side with the state among Figure 26 (B).
Discuss below to make and be used for the strip line device is mounted on the metallic plate 40 on the multilayer printed-wiring board and the step of lead frame, thus simplified manufacturing technique.
As shown in figure 28, metallic plate is connected to substrate by placing the leg on the metallic plate two ends.As shown in figure 28, a plurality of metallic plates are connected to substrate.And, metallic plate vertically on two ends on, lead frame is placed with the common interval of distance end.
As shown in figure 29, the strip line device is attached to the metallic plate that is mounted on the substrate, and uses the metallic plate of the molded institute of resin combination.Then, with the predetermined length of distance substrate cut the leg of molded strip line device so that finish the strip line device of Figure 30.After cutting, remove the surface that adheres to contact conductor terminal 500 and 520 or the resin burr in the slot between contact conductor terminal 500 and 520.The technology of assembled semiconductor also is applicable to these steps.Like this, the strip line device is attached to the substrate that links to each other with lead frame with two or more groups metallic plate 40, and the leg of cutting electrode lead terminal.Therefore, can simplify the manufacturing process of strip line device, and increase the ability of producing in batches.Figure 31 (A) is a side view, shows to carry out molded and strip line device that look up from Figure 30 (1) side with the state among Figure 30.Figure 31 (B) is a side view, shows to carry out molded and strip line device that look up from Figure 30 (2) side with the state among Figure 30.
More than explain and to have told about the first and second contact conductor terminals wherein each all places example on the two ends of strip line device.Two or more contact conductor terminals 500 and 520 can be positioned on the two ends of strip line device.For example, shown in figure 32, contact conductor terminal 500 can lay respectively at valve metal vertically on two ends on, and second body 521 of the second contact conductor terminal can be positioned at metallic plate 40 on the two ends on length and the Width (four angles just).
And then as shown in figure 33, second body 521 of the second contact conductor terminal can be positioned on four angles of metallic plate 40, and contact conductor terminal 500 can be positioned at formed strip line device 1 metallic plate on the two ends on length and the Width.
Shown in Figure 34 and 35, when two or more contact conductor terminals were provided, the contact conductor terminal can be placed in horizontal (Width) of strip line device and go up outstanding.At the transversely placement contact conductor terminal of strip line device, thus the package strength of raising plate.More than explain some structures of having told about on the end that wherein two contact conductor terminals is placed the strip line device.Much less, can place three or more contact conductor terminals.
And then, more than explain and to have told about the example that the line parallel in the strip line device wherein mounts in plate.By changing the shape of the first and second contact conductor terminals 500 and 520, present embodiment is applicable to that also the line in the strip line device wherein mounts the structure of (just vertically mounting) perpendicular to plate.
In addition, explain that more than told about the strip line device of the first to the 13 embodiment wherein is mounted on the metallic plate 40 and is mounted on structure on the printed wiring board 303 then.The strip line device that mounts is not limited to said structure, as long as the strip line device is the Low ESR strip line device with following feature:
(1) from being in the electromagnetic wave that will carry out the frequency range of decoupling, length is enough to be looked at as line (fundamental length (=active line length) that the parts that allow electromagnetic wave to pass through have in the preferred case be equal to or greater than the electromagnetic wavelength that is in target frequency 1/4).
(2) circuit from generating electromagnetic waves is enough low with respect to the impedance of the line device of high frequency.
About (1), we can say that transmission line has the constant characteristic impedance at wide frequency range usually.Formula (1) expression strip line Devices Characteristics impedance Z y.Lead the negligible zone of G in resistance R and electricity, characteristic impedance is definite by L and C, and and frequency-independent.Therefore, by the transmission line that design has low inductance L of per unit length and the big capacitor C of per unit length, can be implemented in the interior device of wide frequency range to the lower low characteristic impedance of the dependence of frequency.
Z Y = R + jωL G + jωC ≈ L C . . . ( 1 )
Investigate characteristic (2) below.As shown in figure 36, has the impedance that the circuit of constant characteristic impedance Z 0 comes the evaluation line device by use.As shown in figure 36, the line Devices Characteristics be by from port one to port 2 transmission property represent.The reflection coefficient Γ and the carry-over factor T that are used for evaluation circuits are the factor S 11 and the S21 of collision matrix [S], and represent by following formula:
[ S ] = 1 2 Z ^ Y + 1 - 1 2 Z ^ Y 2 Z ^ Y - 1
Here, Z ^ Y = Z Y Z 0 . . . ( 2 )
Here Z0 represents the characteristic impedance of the input/output line of line device, and Zy represents the impedance of line device.Therefore, Z0＞＞situation of Zy under, can get Γ ≈-1 and T ≈ 0, and the frequency electromagnetic waves of input can be reflected around the inlet of transmission line.
As mentioned above, the characteristic impedance of line is calculated by (L/C) 1/2, is therefore only determined by capacity cell and inductance element.Because characteristic impedance has constant value with respect to frequency, so the decoupling attribute is can not take place to degenerate by frequency in theory.
Figure 37 shows the factor S 21 (seeing formula (4)) of the sequence [S] of the carry-over factor T that is used to represent decoupling device.In other words, Figure 37 shows the figure of the frequency and the relation between the carry-over factor of decoupling device.In Figure 37, dotted line is represented the carry-over factor when capacitor is connected to the circuit of power distribution circuit and uses as decoupling device.Solid line is represented the carry-over factor when the circuit of power distribution circuit has wiring capacitance and is used as decoupling device.The longitudinal axis is represented carry-over factor (dB), and transverse axis is represented frequency (GHz).
When comparing between the carry-over factor when the circuit of carry-over factor when capacitor being connected to the circuit of power distribution circuit and power distribution circuit has wiring capacitance, carry-over factor when circuit has wiring capacitance is less (to be that is to say, the cut-out rate is higher), thus realized good decoupling attribute.
Like this, the decoupling of the power distribution circuit of carrying out with existing use capacitor is different, can be by line structure being provided and inserting device and carry out decoupling, and wherein L (inductance), C (electric capacity) and R (resistance) is set at desired value and line has the decoupling attribute.
Be used to obtain to expect that the parameter of decoupling attribute comprises L, C and R.When L and R increased, the problem of generation was included in that supply voltage exists huge fluctuation between transfer period of logical circuit.Therefore, must adjust the decoupling attribute by adjusting C.
Tell about strip line device as the first to the 13 embodiment below and be mounted on the structure of semiconductor package when loading onto.
As shown in figure 38, strip line device and semiconductor chip 403 are distributed on the substrate of being made by insulating material 405.The strip line device of the first to the 13 embodiment places the power-supply wiring 401b of semiconductor chip and ground connection wiring 402b and connects up between the 402a with ground connection at the power-supply wiring 401a of the plug on the substrate 405.The power-supply wiring 401b of semiconductor chip and the power-supply wiring 401a of plug are connected to the anode lead terminal 11 and 12 of strip line device.The ground connection wiring 402a of the ground connection wiring 402b of semiconductor chip and plug is connected to the cathode lead terminal 41 and 42 of strip line device.
Be added on power-supply wiring 401b and the ground connection wiring 402b from the high-frequency noise that is mounted on the semiconductor chip 403 on the substrate 405, propagate by these wirings, and cause element generation malfunction.By in the strip line device in being included in semiconductor packages noise being carried out filtering, the malfunction by the high-frequency noise initiation unlikely takes place on the semiconductor device of Figure 38, thereby be implemented in the stable circuit operation on the high frequency.More than explanation told about with the paired wiring of power-supply wiring be the ground connection wiring.The negative supply wiring can be paired with power-supply wiring.
The foregoing description is the preferred embodiments of the present invention.Present embodiment is not limited to above embodiment, and can carry out various changes within the scope of the invention.
Industrial usability
As mentioned above, according to the present invention, the strip line device be by the valve metal with dielectric coating, via dielectric coating place valve metal around conductive material layer, place the contact conductor terminal of diverse location of valve metal right, and place contact conductor terminal on the diverse location of conductive material layer to forming.This structure has increased the apparent dielectric loss, therefore can reduce the impedance of strip line Devices Characteristics fully, thereby prevents to enter power distribution circuit by the electromagnetic wave that noise source generates.
And then, when using its length to be used as valve metal, can bring into play the effect of noise minimizing more effectively than cross sectional dimensions big four times or more long metal.
And the two ends of valve metal bend in one direction or are crooked.Therefore, only be used for the solution of anodization or be used to form the solution of conductive material layer, just can make the strip line device at an easy rate, and obtain to avoid the shape that is used to carry out encapsulation of other assembly easily by immersion.
With substrate and strip line device location and be bonded to each other, so that conductive material layer and metal parts are in contact with one another and lead frame and valve metal are in contact with one another.On substrate, integral body has formed a plurality of metal partss with first contact conductor terminal and a plurality of lead frames that are used as the second contact conductor terminal, and has obtained the strip line device in the technology before forming conductive material layer.Cut first contact conductor terminal and the lead frame from substrate with preset distance, so that obtain the strip line device.These steps can be made the strip line device of four terminal structures at an easy rate.

Claims (32)

1. strip line device comprises:
Metal with valve effect, it has the surface area of increase;
Dielectric coating is formed on the metallic surface with valve effect; And
Conductive material layer, be formed at via dielectric coating metal with valve effect around.
2. strip line device as claimed in claim 1, further comprise metal parts, the DC power supply of input is arranged and transmitted to itself and conductive material layer in contact, wherein input/output terminal is positioned on the two ends of the two ends of the metal with valve effect and metal parts, and frequency electromagnetic waves is imported into the transmission line of being made up of dielectric coating.
3. strip line device as claimed in claim 1 or 2, the metal that wherein has the valve effect is rectangular in the cross section.
4. strip line device as claimed in claim 1 or 2, the metal that wherein has the valve effect is rounded or oval in the cross section.
5. strip line device as claimed in claim 1 or 2, the metal that wherein has a valve effect in the cross section ringwise.
6. strip line device as claimed in claim 1 or 2, the metal that wherein has the valve effect forms plate or thin slice.
7. as any one described strip line device in the claim 1～6, near the first type surface of the metal metal two ends that wherein has the valve effect bends or bending in the same direction.
8. as any one described strip line device in the claim 1～7, the longitudinal size of metal that wherein has the valve effect is greater than sectional dimension.
9. as any one described strip line device in the claim 1～8, the metal that wherein has the valve effect has a pair of first contact conductor terminal, and it is positioned at metal longitudinally on the two ends, to be connected to the through hole of printed wiring board; And a pair of second contact conductor terminal, it is positioned on the diverse location of metal parts, to be connected to the through hole of printed wiring board.
10. strip line device as claimed in claim 9, wherein with printed wiring board electrode in contact lead terminal have than not with the big area of area of section of printed wiring board electrode in contact lead terminal.
11. strip line device as claimed in claim 2 further comprises the first contact conductor terminal, it links to each other with the end that strip line device on placing metal parts has a metal of valve effect and is connected electrically to printed wiring board, wherein:
The second contact conductor terminal integral body that is used to be connected to printed wiring board is formed at metal parts; And
The first contact conductor terminal that integral body is formed at the second contact conductor terminal on the metal parts and is connected to the metal two ends with valve effect has formed four terminals of strip line device.
12. strip line device as claimed in claim 11, wherein:
The first contact conductor terminal comprises: link is used for being connected to the metal that the strip line device that places on the metal parts has the valve effect; First support foot part is used to be connected to the wiring on the printed wiring board; And first body component, be used for link and support foot part are coupled together;
Be connected to the link of first body component and first support foot part as first body component vertically on two ends, and almost vertically be connected to first body component;
The second contact conductor terminal that integral body is formed on the metal parts comprises: second body component that is directly connected to metal parts; And second support foot part that is used to be connected to the wiring on the printed wiring board;
Second body component be used to mount the strip line device metal parts mount the surface vertically on two ends, and be connected to end on the same long limit that mounts the surface; And
Second support foot part almost with mount the surface and be connected to body component with paralleling.
13. strip line device as claimed in claim 11, wherein:
The first contact conductor terminal comprises: link is used for being connected to the metal that the strip line device that is positioned on the metal parts has the valve effect; First support foot part is used to be connected to the wiring on the printed wiring board; And first body component, be used for link and support foot part are coupled together;
Be connected to the link of first body component and first support foot part as first body component vertically on two ends, and almost vertically be connected to first body component, so that the link and first support foot part are positioned at the opposite side of first body component; And
The second contact conductor terminal that integral body is formed on the metal parts comprises: second support foot part, its be used to mount the strip line device metal parts mount the surface vertically on two ends, and almost with mount the surface and be connected to end on the same long limit that mounts the surface with paralleling.
14. strip line device as claimed in claim 11, wherein:
The first contact conductor terminal comprises: link is used for being connected to the metal that the strip line device that places on the metallic plate has the valve effect; And first body component, be used to be connected to the wiring on the printed wiring board;
Link almost with first body component be connected to perpendicularly first body component vertically on the end; And
The second contact conductor terminal that integral body is formed on the metal parts comprises: second body component, its be used to mount the strip line device metal parts mount the surface vertically on two ends, and almost with mount the surface and be connected to end on the same long limit that mounts the surface perpendicularly.
15. strip line device as claimed in claim 11, wherein:
The first contact conductor terminal comprises: link is used for being connected to the metal that the strip line device that is positioned on the metallic plate has the valve effect; And first body component, be used to be connected to the wiring on the printed wiring board;
Link almost with first body component be connected to perpendicularly body component vertically on the end;
The second contact conductor terminal that integral body is formed on the metal parts comprises: second body component, its be used to mount the strip line device metal parts mount the surface vertically on the end, and almost with mount the surface and be connected to the zone at the intimate center of the minor face that mounts the surface with paralleling; And
The first contact conductor terminal and the second contact conductor terminal be arranged as metal parts mount the surface vertically on each other almost in line.
16. as any one described strip line device in the claim 11～13, wherein the area that has with contacted first support foot part of printed wiring board and second support foot part greater than not with the area of section of contacted first body component of printed wiring board and second body component.
17. as any one described strip line device in the claim 1～16, wherein conductive material layer comprises conductive polymer coating.
18. strip line device as claimed in claim 17, wherein conducting polymer is one or more compounds of selecting from the derivative of the group be made up of polypyrrole, polythiophene and polyaniline or this compound.
19. as claim 17 or 18 described strip line devices, wherein conductive material layer has conductive polymer coating that is positioned on the dielectric coating side and the conductive paste layer that is formed on the conductive polymer coating.
20. strip line device as claimed in claim 19, wherein metal parts is fixed on the conductive paste layer.
21. as any one described strip line device in the claim 1～20, the metal that wherein has the valve effect is the metal of selecting from the group of being made up of aluminium, tantalum and niobium.
22., wherein use molded metal, dielectric coating and the conductive material layer of resin with valve effect as any one the described strip line device in the claim 1～21.
23. one kind has the printed wiring board mounted member that dielectric coating is inserted into the stepped construction between the conductor, these parts comprise:
The low-impedance line device, it has dielectric loss in dielectric coating;
The first contact conductor terminal places on the two ends of one of conductor, and is connected electrically to printed wiring board; And
The second contact conductor terminal places the two ends of the metal parts that is used to mount the low-impedance line device, and is connected electrically to printed wiring board; Wherein:
The first contact conductor terminal comprises: link is used to be connected to first conductor; First support foot part is used to be connected to the wiring on the printed wiring board; And first body component, be used for link and support foot part are coupled together;
Be connected to the link of first body component and first support foot part as first body component vertically on two ends, and almost vertically be connected to first body component;
The second contact conductor terminal comprises: second body component that is directly connected to metal parts; And second support foot part that is used to be connected to the wiring on the printed wiring board;
Second body component be used to mount the low-impedance line device metal parts mount the surface vertically on two ends, and be connected to end on the same long limit that mounts the surface; And
Second support foot part almost with mount the surface and be connected to body component with paralleling.
24. one kind has the printed wiring board mounted member that dielectric coating is inserted into the stepped construction between the conductor, these parts comprise:
The low-impedance line device, it has dielectric loss in dielectric coating;
The first contact conductor terminal is positioned on the two ends of one of conductor, and is connected electrically to printed wiring board; And
The second contact conductor terminal is positioned at the two ends of the metal parts that is used to mount the low-impedance line device, and is connected electrically to printed wiring board;
The first contact conductor terminal comprises: link is used to be connected to first conductor; First support foot part is used to be connected to the wiring on the printed wiring board; And first body component, be used for link and support foot part are coupled together;
Be connected to the link of first body component and first support foot part as first body component vertically on two ends, and almost vertically be connected to first body component, so that the link and first support foot part are positioned at the opposite side of first body component; And
The second contact conductor terminal comprises: second support foot part, its be used to mount the low-impedance line device metal parts mount the surface vertically on two ends, and almost with mount the surface and be connected to end on the same long limit that mounts the surface with paralleling.
25. one kind has the printed wiring board mounted member that dielectric coating is inserted into the stepped construction between the conductor, these parts comprise:
The low-impedance line device, it has dielectric loss in dielectric coating;
The first contact conductor terminal is positioned on the two ends of one of conductor, and is connected electrically to printed wiring board; And
The second contact conductor terminal is positioned at the two ends of the metal parts that is used to mount the low-impedance line device, and is connected electrically to printed wiring board;
The first contact conductor terminal comprises: link is used to be connected to first conductor; And first body component, be used to be connected to the wiring on the printed wiring board;
Link almost with first body component be connected to perpendicularly first body component vertically on the end; And
The second contact conductor terminal comprises: second body component, it is the two ends that are used to mount on the longitudinal direction that mounts the surface of metal parts of low-impedance line device, and almost with mount the surface and be connected to end on the same long limit that mounts the surface perpendicularly.
26. one kind has the printed wiring board mounted member that dielectric coating is inserted into the stepped construction between the conductor, these parts comprise:
The low-impedance line device, it has dielectric loss in dielectric coating;
The first contact conductor terminal is positioned on the two ends of one of conductor, and is connected electrically to printed wiring board; And
The second contact conductor terminal is positioned at the two ends of the metal parts that is used to mount low-impedance line equipment, and is connected electrically to printed wiring board;
The first contact conductor terminal comprises: link is used to be connected to first conductor; And first body component, be used to be connected to the wiring on the printed wiring board;
Link almost with first body component be connected to perpendicularly first body component vertically on the end;
The second contact conductor terminal comprises: second body component, it be used to mount the low-impedance line device metal parts mount the surface vertically on the end, and almost with mount the surface and be connected to the zone at the intimate center of the minor face that mounts the surface perpendicularly; And
The first contact conductor terminal and the second contact conductor terminal be arranged as metal parts mount the surface vertically on each other almost in line.
27. as claim 23 or 24 described printed wiring board mounted members, wherein the area that has with contacted first support foot part of printed wiring board and second support foot part greater than not with the area of section of contacted first body component of printed wiring board and second body component.
28., wherein use the molded low-impedance line equipment of resin as any one described printed wiring board mounted member in the claim 23～27.
29. a circuit board, it has: the valve effect is arranged and have the metal of the surface area of increase; Be formed at the dielectric coating on the metallic surface with valve effect; Be formed at the conductive material layer on every side of metal with valve effect via dielectric coating; And the metal parts that is used to transmit the DC power supply of input, this circuit board comprises:
The strip line device, it has input/output terminal on the two ends of the two ends of the metal with valve effect and metal parts;
Plate;
Be formed at first power-supply wiring and second source wiring on the plate; And
Be positioned at first input/output terminal on the two ends of the metal with valve effect and be positioned at second input/output terminal on the two ends of metal parts, it is connected respectively to first power-supply wiring and second source wiring.
30. circuit board as claimed in claim 29, the circuit element that wherein is used to voltage sources such as receiving places circuit board in integrated mode, and power supply such as provides by bus.
31. a semiconductor packages, it has: the valve effect is arranged and have the metal of the surface area of increase; Be formed at the dielectric coating on the metallic surface with valve effect; Be formed at the conductive material layer on every side of metal with valve effect via dielectric coating; And the metal parts that is used to transmit the DC power supply of input, this semiconductor packages comprises:
The strip line device, its have on the metal two ends of valve effect and the two ends of metal parts on have input/output terminal;
Substrate is made by insulating material; And
Semiconductor chip is mounted on the substrate; Wherein:
Substrate has the first connection pin that is used to be connected to the device that is mounted on the plate and is connected pin with second;
Semiconductor chip has first power-supply wiring and second source wiring; And
Be positioned at the power-supply wiring that is connected pin and semiconductor chip that input/output terminal on the two ends of the two ends of the metal with valve effect and metal parts is connected respectively to substrate.
32. a method that forms the strip line device comprises the steps:
Formation has the metal of valve effect, and this metal has the surface area of increase;
On metallic surface, form dielectric coating with valve effect;
Around metal, form conductive material layer via dielectric coating with valve effect;
The location and in conjunction with strip line device and a plurality of substrate, metal parts with second contact conductor terminal and the lead frame that is used as the first contact conductor terminal have integrally been formed on it, so that conductive material layer and metal parts are in contact with one another, and lead frame is in contact with one another with the metal with valve effect, obtains the strip line device in the step before the step that forms conductive material layer; And
Cut second contact conductor terminal and the lead frame from substrate with preset distance, to finish the strip line device.
CNA03824229XA 2002-09-04 2003-09-02 Strip line device, member to be mounted on printed wiring board, circuit board, semiconductor package, and its fabricating method Pending CN1689189A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP259309/2002 2002-09-04
JP2002259309 2002-09-04
JP45089/2003 2003-02-21

Publications (1)

Publication Number Publication Date
CN1689189A true CN1689189A (en) 2005-10-26

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109716469A (en) * 2016-09-16 2019-05-03 日本蓄电器工业株式会社 Electrolytic capacitor electrod assembly and electrolytic capacitor
CN109831869A (en) * 2019-02-25 2019-05-31 维沃移动通信有限公司 A kind of paster technique, pcb board and mobile terminal

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109716469A (en) * 2016-09-16 2019-05-03 日本蓄电器工业株式会社 Electrolytic capacitor electrod assembly and electrolytic capacitor
US10923290B2 (en) 2016-09-16 2021-02-16 Japan Capacitor Industrial Co., Ltd. Electrolytic capacitor-specific electrode member and electrolytic capacitor
CN109716469B (en) * 2016-09-16 2021-06-04 日本蓄电器工业株式会社 Electrode member for electrolytic capacitor and electrolytic capacitor
CN109831869A (en) * 2019-02-25 2019-05-31 维沃移动通信有限公司 A kind of paster technique, pcb board and mobile terminal

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