CN109830518A - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN109830518A CN109830518A CN201910149204.4A CN201910149204A CN109830518A CN 109830518 A CN109830518 A CN 109830518A CN 201910149204 A CN201910149204 A CN 201910149204A CN 109830518 A CN109830518 A CN 109830518A
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- array film
- film layer
- packaging area
- display panel
- packaging
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 248
- 239000002184 metal Substances 0.000 claims abstract description 88
- 229910052751 metal Inorganic materials 0.000 claims abstract description 88
- 239000000758 substrate Substances 0.000 claims abstract description 75
- 238000005538 encapsulation Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 183
- 238000005520 cutting process Methods 0.000 description 12
- 230000003068 static effect Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 239000003292 glue Substances 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 208000037656 Respiratory Sounds Diseases 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 230000004446 light reflex Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The embodiment of the invention provides a kind of display panel and display devices, are related to field of display technology, the compactness of the packaging plastic of the edge for improving display panel, and then improve the antistatic effect of edge.The first substrate of the display panel includes display area and packaging area, and packaging area surrounds display area；On the direction perpendicular to display panel, packaging area includes the buffer layer for being set in turn in first substrate side, metal layer, array film layer and packaging plastic, packaging area includes the first packaging area and the second packaging area, second packaging area extends from the edge of the first substrate to center, first packaging area is between the second packaging area and display area, and on the direction perpendicular to display panel, array film layer is more than or equal to array film layer in the thickness of first packaging area in the thickness of the second packaging area.
Description
[technical field]
The present invention relates to field of display technology more particularly to a kind of display panel and display devices.
[background technique]
Organic light emission (Organic Light-Emitting Diode, hereinafter referred to as OLED) display panel has master because of it
It is dynamic to shine, high contrast, no angle limit, many advantages, such as Flexible Displays can be achieved and be widely used in display technology neck
Domain.
Currently, in order to improve the water resistant oxygen characteristic of each OLED device in flexible OLED display panel, it will usually using envelope
Dress glue (frit) is packaged display panel.In specific production, need that reflection is arranged at position corresponding with packaging plastic
Metal layer is melt packaging plastic for laser reflection to packaging plastic.Also, due to the design of flexible OLED display panel narrow frame
Demand carries out being cut to required size usually at packaging plastic at present when making the display panel of target size
Display panel, the influence in order to avoid cutting stress to reflective metal layer, it will usually by the relatively narrow of the width setting of metal layer, such as
There is segment difference between this packaging plastic and reflective metal layer to result in the edge of display panel, the encapsulation after leading to melting
Compactness of the glue in edge is poor, influences the antistatic effect of edge.
[summary of the invention]
In view of this, the embodiment of the invention provides a kind of display panel and display devices, to improve display panel
The compactness of the packaging plastic of edge, and then improve the antistatic effect of edge.
On the one hand, the embodiment of the invention provides a kind of display panel, which includes first substrate；Described first
Substrate includes display area and packaging area, wherein the packaging area surrounds the display area；
On the direction perpendicular to the display panel, the packaging area includes being set in turn in the first substrate one
The buffer layer of side, metal layer, array film layer and packaging plastic；
The packaging area includes the first packaging area and the second packaging area, and second packaging area is from described first
The edge of substrate to center extend, first packaging area between second packaging area and the display area,
And on the direction perpendicular to the display panel, the array film layer is greater than or waits in the thickness of second packaging area
In the array film layer first packaging area thickness.
On the other hand, the embodiment of the invention provides a kind of display devices, including above-mentioned display panel.
Display panel provided in an embodiment of the present invention and display device, by by the array film layer in display panel second
The thickness of packaging area is set greater than or equal to array film layer in the thickness of the first packaging area, then packaging plastic is in the second envelope
The thickness for filling region is less than or equal to packaging plastic in the thickness of the first packaging area, can make packaging plastic in the second encapsulation in this way
The consistency in region is greater than or equal to packaging plastic in the consistency of the first packaging area, in this way can be to avoid close to first substrate side
The lower formation defect of the consistency of packaging plastic at edge, thus the ability that the packaging plastic preventing outside electrostatic for improving edge destroys,
Electrostatic is avoided to further extend into display panel internal sabotage device architecture.
[Detailed description of the invention]
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for this field
For those of ordinary skill, without creative efforts, it can also be obtained according to these attached drawings other attached drawings.
Fig. 1 is a kind of schematic cross-section of the rim area of display panel in the prior art；
Fig. 2 is the schematic cross-section of the rim area of another display panel in the prior art；
Fig. 3 is the schematic diagram after being melted the packaging plastic in Fig. 2；
Fig. 4 is a kind of schematic diagram of display panel provided in an embodiment of the present invention；
Fig. 5 is a kind of schematic cross-section of the Fig. 4 along AA '；
Fig. 6 is another schematic cross-section of the Fig. 4 along AA '；
Fig. 7 is another schematic cross-section of Fig. 4 along AA '；
Fig. 8 is another schematic cross-section of Fig. 4 along AA '；
Fig. 9 is a kind of schematic top plan view of metal layer in Fig. 8；
Figure 10 is another schematic cross-section of Fig. 4 along AA '；
Figure 11 is another schematic cross-section of Fig. 4 along AA '；
Figure 12 is another schematic cross-section of Fig. 4 along AA '；
Figure 13 is a kind of schematic diagram of display device provided in an embodiment of the present invention.
[specific embodiment]
For a better understanding of the technical solution of the present invention, being retouched in detail to the embodiment of the present invention with reference to the accompanying drawing
It states.
It will be appreciated that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts it is all its
Its embodiment, shall fall within the protection scope of the present invention.
The term used in embodiments of the present invention is only to be not intended to be limiting merely for for the purpose of describing particular embodiments
The present invention.In the embodiment of the present invention and the "an" of singular used in the attached claims, " described " and "the"
It is also intended to including most forms, unless the context clearly indicates other meaning.
It should be appreciated that term "and/or" used herein is only a kind of incidence relation for describing affiliated partner, indicate
There may be three kinds of relationships, for example, A and/or B, can indicate: individualism A, exist simultaneously A and B, individualism B these three
Situation.In addition, character "/" herein, typicallys represent the relationship that forward-backward correlation object is a kind of "or".
It will be appreciated that though packaging area may be described in embodiments of the present invention using term first, second etc., but
These packaging areas should not necessarily be limited by these terms.These terms are only used to for packaging area being distinguished from each other out.For example, not departing from
In the case where range of embodiment of the invention, the first packaging area can also be referred to as the second packaging area, similarly, the second encapsulation
Region can also be referred to as the first packaging area.
Currently, usually first gelatinous packaging plastic is applied when being packaged using packaging plastic (frit) to display panel
It overlays at the bezel locations of display panel, then uses laser irradiation by gelatinous packaging plastic high-temperature fusion.In order to improve laser
Utilization rate, it will usually reflective metal layer is set in the lower section of packaging plastic, by incident laser reflection to packaging plastic, accelerates envelope
Fill the melting rate of glue.Due to after the completion of the encapsulation of display panel, it will usually as needed by the biggish display panel of area
It is cut into the display panel of required shape, as shown in FIG. 1, FIG. 1 is a kind of sections of the rim area of display panel in the prior art
Schematic diagram, wherein packaging plastic 2 ' is coated in upper substrate 3 ' and is bonded with lower substrate 4 '.In packaging plastic 2 ' by upper substrate 3 ' and lower substrate
After 4 ' are bonded together, it will usually which cutting line 10 ' cuts the display panel of larger size to obtain required ruler along Fig. 1
Very little display panel.But the rim area that will lead to display panel in this way further includes the area of not formed packaging plastic 2 '
Domain 6 ' causes the size of the rim area of display panel larger, is unfavorable for the narrow frame design of display panel.
In order to reduce display panel rim area size, as shown in Fig. 2, Fig. 2 is another display surface in the prior art
The schematic cross-section of the rim area of plate, wherein in the display panel, cut on packaging plastic 2 ', that is, use cut on
The cutting mode of frit is to form the display panel of required size.Specifically, as shown in Fig. 2, packaging plastic 2 ' is coated in upper substrate
3 ' are bonded with lower substrate 4 ', and packaging plastic 2 ' not yet carries out laser melting at this time.The edge of packaging plastic 2 ' and the weight of cut edge 10 '
It closes, in order to reduce influence of the reflective metal layer 1 ' by cutting stress, it will usually cut the setting of reflective metal layer 1 ' in distance
The edge at edge 10 ', i.e. display panel has at the position of certain distance, that is to say, that makes cut edge 10 ' without reflection gold
Belong to layer 1 '.In this way, for Fig. 1, although the region in no setting is required in the rim area of display panel Fig. 1
6 ', but lead to the thinner thickness of the film layer close to the edge of display panel, the film layer with the edge far from display panel
Between be formed with segment difference.
Further, as shown in figure 3, Fig. 3 is the schematic diagram after being melted the packaging plastic 2 ' in Fig. 2, at this point, due to
In the position at the edge 10 ' close to display panel, i.e. 21 ' place of region is not provided with reflective metal layer 1 ', also will lead in region 21 '
Locate formed packaging plastic compactness be less than at region 22 ' formed packaging plastic compactness, cause extraneous static be easy by
Enter at this, influences the normal work of the various electronic devices in display panel.Moreover, because the envelope that 21 ' place of region is formed
A possibility that compactness for filling glue is smaller, increases the invasion of extraneous water oxygen, also will affect the package reliability of the display panel.It removes
Except this, since the compactness of the packaging plastic formed at region 21 ' is less than the densification of the packaging plastic formed at region 22 '
Property, the interface binding power that also will lead between the packaging plastic and the film layer 5 ' that is in contact with it in region 21 ' is weaker, causes to be located at
The packaging plastic in region 21 ' is easy to be detached from film layer 5 ', further influences the package reliability of the display panel.
Based on this, the embodiment of the invention provides a kind of display panels, as shown in figure 4, Fig. 4 provides for the embodiment of the present invention
A kind of display panel schematic diagram, wherein the display panel includes first substrate 1, and first substrate 1 includes 11 He of display area
Packaging area 12, wherein packaging area 12 surrounds display area 11.Optionally, as shown in Figure 5 and Figure 6, Fig. 5 and Fig. 6 is Fig. 4
Along two kinds of schematic cross-sections of AA ', on the direction perpendicular to display panel, packaging area 12 includes being set in turn in the first base
The buffer layer 2 of 1 side of plate, metal layer 3, array film layer 4 and packaging plastic 5；Packaging area 12 includes 121 He of the first packaging area
Second packaging area 122, the second packaging area 122 extend from the edge of first substrate 1 10 to center, the first packaging area 121
Between the second packaging area 122 and display area 11.Specifically, as shown in figure 5, in the direction perpendicular to display panel
On, array film layer 4 is greater than array film layer 4 in the thickness of the first packaging area 121 in the thickness H42 of the second packaging area 122
H41.Alternatively, as shown in fig. 6, array film layer 4 is equal to array film layer 4 in the first encapsulation in the thickness H42 of the second packaging area 122
The thickness H41 in region 121.
It should be noted that above-mentioned array film layer 4 includes the metal interlamination medium layer IMD for extending to display area 11
(Inter Metal Dielectric, hereinafter referred to as IMD) and interlayer dielectric layer ILD (Inter Layer
Dielectric, hereinafter referred to as ILD), it is used for metal material layer and metal material layer and semiconductor material layer and metal
Material layer is kept apart, and the formation such as materials such as oxide or the nitride of silicon can be used.
The embodiment of the present invention is set greater than or is waited by the thickness H42 by array film layer 4 in the second packaging area 122
In array film layer 4 the first packaging area 121 thickness H41, when being packaged using packaging plastic 5 to the display panel, such as
Shown in Fig. 5, by the way that the second substrate 6 being oppositely arranged with first substrate 1 is arranged in the display panel, packaging plastic 5 is applied first
The side of the second substrate 6 is overlayed on, then, the second substrate 6 for being coated with packaging plastic 5 is bonded with first substrate, and is made after fitting
Two substrates 6 are located at side of the packaging plastic 5 far from first substrate 1.Due in embodiments of the present invention by array film layer 4 in the second envelope
Dress region 122 thickness H42 be set greater than or equal to array film layer 4 the first packaging area 121 thickness H41, therefore
The space for leaving packaging plastic 5 in the second packaging area 122 is less than or leaves packaging plastic for equal in the first packaging area 121
5 space.Therefore, after carrying out laser melting to packaging plastic 5, packaging plastic 5 be less than in the thickness of the second packaging area 122 or
Equal to packaging plastic 5 in the thickness of the first packaging area 121, packaging plastic 5 can be made in the consistency of the second packaging area 122 in this way
More than or equal to packaging plastic 5 the first packaging area 121 consistency, that is, packaging plastic 5 close to first substrate 1 edge 10
Position at consistency be more than or equal to packaging plastic 5 far from first substrate 1 edge 10 position at consistency, from
And it can be to avoid the lower formation defect of consistency of the packaging plastic 5 at the position at the edge 10 of first substrate 1, to improve
The ability of the preventing outside electrostatic of packaging plastic 5 at edge 10, prevents extraneous static from further extending into display panel internal sabotage
Device architecture.Also, the embodiment of the present invention is so set, also can preferably obstruct extraneous water oxygen from the edge of first substrate 1
Enter inside the display panel at 10, reduces a possibility that each device being located inside the display panel is invaded and harassed by water oxygen.
Illustratively, as shown in figure 5, above-mentioned array film layer 4 includes the first surface 40 far from first substrate 1, packaging plastic 5
Including the second surface 50 far from the second substrate 6, first surface 40 is contacted with second surface 50.By packaging plastic 5 in first substrate 1
Projection of the projection of place plane with metal layer 3 in 1 place plane of first substrate is set as overlapping, will be swashed using metal layer 3
The energy of light reflexes to packaging plastic 5, improves the capacity usage ratio of laser, improves the melting rate of packaging plastic 5.
It should be understood that above-mentioned first surface 40 contacts with second surface 50 and means first surface 40 and second surface 50
Fitting, does not include other film layers therebetween.
Also, the embodiment of the present invention is set greater than by the thickness H42 by array film layer 4 in the second packaging area 122
Or the first table positioned at the second packaging area 122 can be made in the thickness H41 of the first packaging area 121 equal to array film layer 4
Interface binding power between face 40 and second surface 50 is greater than or equal to first surface 40 and the positioned at the first packaging area 121
Interface binding power between two surfaces 50 is located between the packaging plastic 5 and array film layer 4 of the second packaging area 122 to reduce
A possibility that peeling-off, further decreases extraneous water oxygen and enters inside the display panel from the edge of first substrate 1 10
Possibility.
Illustratively, in embodiments of the present invention, the set-up mode of above-mentioned array film layer 4 and metal layer 3 can there are many,
It is illustrated individually below:
As shown in Figure 5, wherein above-mentioned array film layer 4 covers the first packaging area 121 and the second packaging area 122；And
In second packaging area 122, the orthographic projection of array film layer 4 and metal layer 3 in the plane perpendicular to display panel is not overlapped.?
That is array film layer 4 is respectively provided in the first packaging area 121 and the second packaging area 122, on the side close to first substrate 1
Second packaging area 122 of edge 10 is not provided with metal layer 3, only in first packaging area 121 at the edge 10 far from first substrate 1
Metal layer 3 is set.Being arranged such can make when the cutting of edge 10 along first substrate 1 forms the display panel, and reduction is cut
Influence of the stress to metal layer 3 is cut, a possibility that cracking in metal layer 3 is reduced.
Also, as shown in figure 5, making array film layer 4 in the second packaging area on along the direction perpendicular to display panel
122 thickness H42 is greater than or equal to array film layer 4 and encapsulates in the thickness H41 and metal layer 3 of the first packaging area 121 first
The sum of the thickness H3 in region 121.On the basis of reducing influence of the cutting stress to metal layer 3, improves and be located at the second encapsulation region
The consistency of the packaging plastic 5 in domain 122 preferably stops extraneous static to enter the display surface from 10 side of the edge of first substrate 1
Intralamellar part.
Alternatively, metal layer 3 can also be arranged in the second packaging area 122 in the embodiment of the present invention.Specifically, such as Fig. 6 and Fig. 7
Shown, Fig. 7 is another schematic cross-section of the Fig. 4 along AA ', unlike embodiment illustrated in fig. 5, in figure 6 and figure 7,
First packaging area 121 and the second packaging area 122 are respectively provided with metal layer 3.And array film layer 4 and metal layer 3 cover first
Packaging area 121 and the second packaging area 122, array film layer 4 flush at the edge of first substrate 1 10 with metal layer 3；Metal
Layer 3 include the first sub- metal layer 31 set gradually along the edge 10 of first substrate 1 on the extending direction of center, groove 30 with
And the second sub- metal layer 32, groove 30 separate the first sub- metal layer 31 and the second sub- metal layer 32.Even if so set, on edge
The cutting of edge 10 when forming the display panel of first substrate 1, produced in the first sub- metal layer 31 by proximal edge 10
Crackle, the setting of the groove 30 between the first sub- metal layer 31 and the second sub- metal layer 32 can stop crack growth to
Two sub- metal layers 32 improve the mechanical strength of the display panel to avoid cracking in the inside of display panel.
Optionally, in Fig. 6 and embodiment illustrated in fig. 7, the first sub- metal layer 31 can be arranged in the second packaging area
122, the second sub- metal layer 32 is arranged in the first packaging area 121, also, on along the direction perpendicular to display panel,
As shown in fig. 6, by array film layer 4 the sub- metal layer 31 of thickness H42 and first of the second packaging area 122 the sum of thickness H31
Array film layer 4 is equal in the sum of the thickness H32 of the sub- metal layer 32 of the thickness H41 and second of the first packaging area 121, or
Person, as shown in fig. 7, by array film layer 4 the thickness H31 of the sub- metal layer 31 of thickness H42 and first of the second packaging area 122 it
Be set greater than array film layer 4 in the sum of the thickness H32 of the sub- metal layer 32 of thickness H41 and second of the first packaging area 121,
Preferably to stop extraneous static from first substrate 1 on the basis of reducing influence of the cutting stress to the second sub- metal layer 32
10 side of edge enter the display panel inside, and improve be located at the second packaging area 122 packaging plastic 5 consistency, mention
A high position is in the packaging plastic 5 of the second packaging area 122 and the interface binding power of array film layer 4.
On the basis of the second packaging area 122 is also provided with metal layer 3, illustratively, as shown in Figure 8 and Figure 9, Fig. 8 is
Fig. 4 is along another schematic cross-section of AA ', and Fig. 9 is the schematic top plan view of metal layer in Fig. 8, wherein the embodiment of the present invention can also
Hole 300 to be arranged in metal layer 3, even if so set, forming the display surface in the cutting of edge 10 along first substrate 1
When plate, crackle is produced in the metal layer 3 by proximal edge 10, the setting of the hole 300 in metal layer 3 can be played pair
The barrier effect of crack propagation reduces a possibility that crack propagation extends to inside display panel.Also, along first substrate
On the direction that 1 edge 10 extends to center, the embodiment of the present invention is made by the way that the density of hole 300 to be set as being gradually increased
The density of hole 300 at the position at the center of display panel is more, can not only further decrease crack growth to display
A possibility that face plate center, to further increase the mechanical performance of the display panel, and reduces extraneous water oxygen and generates along crackle
Gap a possibility that entering inside display panel, the package reliability of the display panel is improved, moreover, with close to display panel
Center position at the density of hole 300 compare, the embodiment of the present invention will be by that will lean on the position of proximal edge 10 in metal layer 3
The density of the hole 300 at place is arranged smaller, in this way when forming array film layer 4 on metal layer 3, in the second packaging area 122
In be filled into hole 300 the amount of array film layer 4 will be less than being filled into the array of hole 300 in the first packaging area 121
The amount of film layer 4, that is, and then array film layer 4 can be made to be greater than array film layer 4 in the first envelope in the thickness of the second packaging area 122
The thickness in region 121 is filled, thus it is subsequent when being packaged using packaging plastic 5 to the display panel, envelope can be further increased
Glue 5 is filled in the consistency of the second packaging area 122.
In addition to this, the embodiment of the present invention in metal layer 3 by being arranged hole 300, additionally it is possible to increase metal layer 3 and battle array
The contact area of column film layer 4 reduces metal layer 3 so as to increase the interface binding power between metal layer 3 and array film layer 4
A possibility that peeling-off between array film layer 4, reduces package failure.
On the basis of the second packaging area 122 is not provided with metal layer 3, the embodiment of the invention provides a variety of different sides
Case is illustrated individually below:
Illustratively, the present invention can make above-mentioned array in the first packaging area 121 and the second packaging area 122 respectively
Film layer 4.Specifically, as shown in Figure 10, Figure 10 is another schematic cross-section of Fig. 4 along AA ', wherein can be by array film layer 4
It is set as the first array film layer 41 positioned at the first packaging area 121, and the second array film positioned at the second packaging area 122
Layer 42.On along the direction perpendicular to display panel, the thickness H42 of second array film layer is set greater than or equal to first
The sum of thickness H41 and the thickness H3 of metal layer 3 of array film layer 41, in the base for reducing influence of the cutting stress to metal layer 3
On plinth, the consistency for being located at the packaging plastic 5 of the second packaging area 122 is improved, and then preferably stop extraneous static from the first base
10 side of edge of plate 1 enters inside the display panel, and improves the packaging plastic 5 and array films for being located at the second packaging area 122
The interface binding power of layer 4.
Illustratively, for the display panel with Figure 10 structure, specifically in production, different works can be used
Sequence makes above-mentioned first array film layer 41 and second array film layer 42 respectively, in the first packaging area 121 and the second encapsulation region
The display panel for meeting above-mentioned thickness requirement is produced respectively in domain 122.
Alternatively, as shown in figure 11, Figure 11 is another schematic cross-section of Fig. 4 along AA ', wherein is implemented with shown in Figure 10
Unlike example, in Fig. 9, the first packaging area 121 of covering and the second packaging area are set by second array film layer 42
122.Specifically, as shown in figure 11, the first array film layer 41 is provided only in the second packaging area 122 buffer layer 2 far from first
The side of substrate 1 sets second array film layer 42 to the first packaging area 121 and the second packaging area 122 is completely covered, and
Second array film layer 42 is set to be located at the first side of the array film layer 41 far from first substrate 1.That is, with direction shown in Figure 11
For, make the lower surface of the first array film layer 41 and metal layer 3 and the contact of the upper surface of buffer layer 2, and use one of work
Sequence forms the second array film layer 42 of covering the first packaging area 121 and the second packaging area 122, that is, along perpendicular to aobvious
Show on the direction of panel, positioned at the thickness H421 of the second array film layer 42 of the first packaging area 121 and positioned at the second encapsulation region
The thickness of the thickness H422 of the second array film layer 42 in domain 122 is equal.And the thickness H41 of the first array film layer 41 is made to be greater than or wait
In the thickness H3 of metal layer 3, to improve and be located at the second encapsulation region on the basis of reducing influence of the cutting stress to metal layer 3
The consistency of the packaging plastic 5 in domain 122, and then preferably stop extraneous static aobvious from 10 side of the edge of first substrate 1 into this
Show panel itself, and improves the interface binding power of the packaging plastic 5 and array film layer 4 that are located at the second packaging area 122.
Illustratively, for the display panel with structure shown in Figure 11, specifically in production, in first substrate 1
After the upper buffer layer 2 for forming the first packaging area 121 of covering and the second packaging area 122, it is being located at the first packaging area 121
Buffer layer 2 forms metal layer 3 far from the side of first substrate 1, is being located at the buffer layer 2 of the second packaging area 122 far from first
The side of substrate 1 forms the first array film layer 41, and the thickness H41 for controlling the first array film layer 41 is greater than or equal to metal layer 3
Thickness H3, then form second gust far from the side of buffer layer 2 in the first array film layer 41 and metal layer 3 using a procedure
Column film layer 42, and second array film layer 42 is made to cover the first packaging area 121 and the second packaging area 122.So first
Packaging area 121 and the second packaging area 122 produce the display panel for meeting above-mentioned thickness requirement respectively, improve and are located at second
The consistency of the packaging plastic 5 of packaging area 122 is realized and stops extraneous static aobvious from 10 side of the edge of first substrate 1 into this
Show panel itself, and improves the effect of the interface binding power of the packaging plastic 5 and array film layer 4 that are located at the second packaging area 122.
Alternatively, as shown in figure 12, Figure 12 is another schematic cross-section of Fig. 4 along AA ', wherein is implemented with shown in Figure 10
Unlike example, in Figure 12, the first packaging area 121 of covering and the second packaging area are set by the first array film layer 41
122.Specifically, as shown in figure 12, array film layer 4 includes that the first packaging area 121 and the second packaging area 122 is completely covered
First array film layer 41, and only cover the second array film layer 42 of the second packaging area 122, wherein the first array film layer 41
Side positioned at metal layer 3 far from first substrate 1, second array film layer 42 are located at the first array film layer 41 far from metal layer 3
Side.That is, making the lower surface of the first array film layer 41 and metal layer 3 and buffer layer 2 for the direction shown in Fig. 9
Upper surface contact, and the first packaging area 121 of covering and first gust of the second packaging area 122 are formed using a procedure
Column film layer 41, that is, on along the direction perpendicular to display panel, positioned at the first array film layer 41 of the first packaging area 121
Thickness H411 it is equal with the thickness of thickness H412 of the first array film layer 41 positioned at the second packaging area 122.And make second
The thickness H42 of array film layer is greater than or equal to the thickness H3 of metal layer, in the base for reducing influence of the cutting stress to metal layer 3
On plinth, preferably extraneous static is stopped to enter inside the display panel from 10 side of the edge of first substrate 1, and improves and be located at the
The consistency of the packaging plastic 5 of two packaging areas 122 improves the packaging plastic 5 and array film layer 4 for being located at the second packaging area 122
Interface binding power.
Illustratively, for the display panel with structure shown in Figure 12, specifically in production, in first substrate 1
After the upper buffer layer 2 for forming the first packaging area 121 of covering and the second packaging area 122, it is being located at the first packaging area 121
Buffer layer 2 forms metal layer 3 far from the side of first substrate 1, then using a procedure in place in the first packaging area 121
Side of the metal layer 3 far from buffer layer 2, and positioned at side of the buffer layer 2 far from first substrate 1 of the second packaging area 122
The first array film layer 41 is formed, then in the first side of the array film layer 41 far from buffer layer 2 for being located at the second packaging area 122
Second array film layer 42 is formed, and makes the thickness H42 of second array film layer more than or equal to the thickness H3 of metal layer.So with
First packaging area 121 and the second packaging area 122 produce the display panel for meeting above-mentioned thickness requirement respectively, and raising is located at
The consistency of the packaging plastic 5 of second packaging area 122 is realized and extraneous static is stopped to enter from 10 side of the edge of first substrate 1
Inside the display panel, and improve the effect of the interface binding power of the packaging plastic 5 and array film layer 4 that are located at the second packaging area 122
Fruit.
Illustratively, above-mentioned buffer layer 2 and array film layer 4 can select the inorganic material such as nitride of the oxide of silicon, silicon
Material is made.
The embodiment of the invention also provides a kind of display devices, and as shown in figure 13, Figure 13 is provided in an embodiment of the present invention
A kind of schematic diagram of display device, the display device include above-mentioned display panel 100.Wherein, the specific knot of display panel 100
Structure is described in detail in the above-described embodiments, and details are not described herein again.Certainly, display device shown in Figure 13 is only
Schematically illustrate, which can be any such as mobile phone, tablet computer, laptop, electric paper book or television set
Electronic equipment having a display function.
Display device provided in an embodiment of the present invention, by by the array film layer 4 in display panel in the second packaging area
122 thickness H42 is set greater than or equal to array film layer 4 in the thickness H41 of the first packaging area 121, is utilizing encapsulation
When glue 5 is packaged the display panel, packaging plastic 5 is less than or equal to packaging plastic 5 in the thickness of the second packaging area 122 and exists
The thickness of first packaging area 121 can make packaging plastic 5 be greater than or equal to envelope in the consistency of the second packaging area 122 in this way
Dress glue 5, in this way can be to avoid the cause of the packaging plastic 5 at 1 edge 10 of first substrate in the consistency of the first packaging area 121
The lower formation defect of density avoids electrostatic further to improve the ability that 5 preventing outside electrostatic of packaging plastic at edge 10 destroys
Extend to display panel internal sabotage device architecture.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent substitution, improvement and etc. done be should be included within the scope of the present invention.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (11)
1. a kind of display panel characterized by comprising first substrate；The first substrate includes display area and encapsulation region
Domain, wherein the packaging area surrounds the display area；
On the direction perpendicular to the display panel, the packaging area includes being set in turn in the first substrate side
Buffer layer, metal layer, array film layer and packaging plastic；
The packaging area includes the first packaging area and the second packaging area, and second packaging area is from the first substrate
Edge to center extend, first packaging area between second packaging area and the display area, and
Perpendicular on the direction of the display panel, the array film layer is more than or equal to institute in the thickness of second packaging area
Array film layer is stated in the thickness of first packaging area.
2. display panel according to claim 1, which is characterized in that
The array film layer covers first packaging area and second packaging area, and in second packaging area
In, the orthographic projection of the array film layer and the metal layer on the plane perpendicular to the display panel does not overlap；
Wherein, on along the direction perpendicular to the display panel, thickness of the array film layer in second packaging area
Degree is greater than or equal to the array film layer and the metal layer in the sum of the thickness of first packaging area.
3. display panel according to claim 2, which is characterized in that the array film layer includes the first array film layer and the
Two array film layers, wherein the first array film layer is located at first packaging area, and the second array film layer is located at described
Second packaging area；
The first array film layer and the second array film layer are formed by different processes；Along perpendicular to the display surface
On the direction of plate, the thickness of the second array film layer is greater than or equal to the thickness of the first array film layer and the metal layer
The sum of.
4. display panel according to claim 2, which is characterized in that the array film layer includes the first array film layer and the
Two array film layers, the first array film layer are provided only on second packaging area, and are located at the buffer layer far from described
The side of the first array film layer far from the first substrate is arranged in the side of first substrate, the second array film layer,
And first packaging area and second packaging area is completely covered；
On along the direction perpendicular to the display panel, the thickness of the first array film layer is greater than or equal to the metal
The thickness of layer.
5. display panel according to claim 2, which is characterized in that
The array film layer includes the first array film layer and second array film layer, and the first array film layer is located at the metal layer
Side far from the first substrate, second array film layer are located at the side of the first array film layer far from the metal layer,
And
First packaging area and second packaging area, the second array film is completely covered in the first array film layer
Layer is provided only on second packaging area；
On along the direction perpendicular to the display panel, the thickness of the second array film layer is greater than or equal to the metal
The thickness of layer.
6. display panel according to claim 1, which is characterized in that the array film layer and the metal layer cover institute
The first packaging area and second packaging area are stated,
The array film layer is flushed with the metal layer in the edge of the first substrate；
The metal layer includes the first interest category set gradually along the edge of the first substrate on the extending direction of center
Layer, groove and the second sub- metal layer, the groove separate the described first sub- metal layer and the second sub- metal layer.
7. display panel according to claim 6, which is characterized in that it include hole in the metal layer, described hole
Density is gradually increased along the edge of the first substrate on the extending direction of center.
8. display panel according to claim 1, which is characterized in that the display panel further includes and the first substrate
Side of the packaging plastic far from the first substrate is arranged in the second substrate being oppositely arranged, the second substrate；
The array film layer includes the first surface far from the first substrate, and the packaging plastic includes far from the second substrate
Second surface, the first surface contacts with the second surface, and the packaging plastic is in plane where the first substrate
Projection is overlapping in the projection of plane where the first substrate with the metal layer.
9. display panel according to claim 8, which is characterized in that
The packaging plastic is greater than or equal to the packaging plastic in first encapsulation region in the consistency of second packaging area
The consistency in domain.
10. display panel according to claim 9, which is characterized in that positioned at described the first of second packaging area
Interface binding power between surface and the second surface is greater than or equal to first table positioned at first packaging area
Interface binding power between face and the second surface.
11. a kind of display device, which is characterized in that including the described in any item display panels of claim 1-10.
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| CN201910149204.4A CN109830518B (en) | 2019-02-28 | 2019-02-28 | Display panel and display device |
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| CN109830518B (en) | 2021-09-14 |
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Effective date of registration: 20211026 Address after: No.8, liufangyuan Henglu, Donghu New Technology Development Zone, Wuhan City, Hubei Province Patentee after: WUHAN TIANMA MICROELECTRONICS Co.,Ltd. Address before: Room 509, building 1, No. 6111, Longdong Avenue, Pudong New Area, Shanghai, 201201 Patentee before: SHANGHAI TIANMA AM-OLED Co.,Ltd. |