CN111129351A - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN111129351A CN111129351A CN202010000977.9A CN202010000977A CN111129351A CN 111129351 A CN111129351 A CN 111129351A CN 202010000977 A CN202010000977 A CN 202010000977A CN 111129351 A CN111129351 A CN 111129351A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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Abstract
The invention relates to the technical field of display, and discloses a display panel and a display device, wherein the display panel comprises a display area, a hole digging area surrounded by the display area, and a first non-display area positioned between the display area and the hole digging area; the array substrate comprises a retaining wall positioned between a display area and a first non-display area; the thin film packaging layer covers the array substrate and comprises an inorganic layer and an organic layer which are stacked, the organic layer extends from the display area to the first non-display area and is stopped at the retaining wall, and the inorganic layer extends across the retaining wall; the display panel further comprises a first bonding layer, the first bonding layer is located between the retaining wall and the hole digging area, and the first bonding layer bonds the array substrate and the inorganic layer through viscosity. The display panel can enhance the adhesion between the array substrate and the film packaging layer near the hole digging area, and the film packaging layer is prevented from being peeled off from the array substrate, so that a sealed space is formed between the film packaging layer and the array substrate, and water and oxygen are prevented from invading the display panel from the hole digging area.
Description
Technical Field
The invention relates to the technical field of display equipment, in particular to a display panel and a display device.
Background
Organic electroluminescent (OLED) display panels have the advantages of self-luminescence, wide viewing angle, low power consumption, and very high response speed, and have become an important display device in the display field. The organic electroluminescent display panel comprises an array substrate, organic electroluminescent units formed on the array substrate and a thin film packaging layer covering the organic electroluminescent units, wherein the organic electroluminescent units are easy to be invaded by water and oxygen in the outside air, so that the service life of the display panel is influenced, and in order to avoid the invasion of the organic electroluminescent units in the display panel by the water and oxygen, the thin film packaging layer is arranged to block the invasion of the water and oxygen.
At present, in order to realize the design of the full screen and simultaneously keep the design of a front camera, designers provide a structure of a special-shaped screen, namely, a cutting hole is arranged in a display area of a display panel, the front camera is arranged in the cutting hole, the width of the frame area around the display screen is reduced, and the screen occupation ratio of the display device is improved. However, after the laser cutting forms the cut holes in the display area, water and oxygen in the air may intrude into the display panel from the cut holes.
Disclosure of Invention
The invention provides a display panel and a display device, wherein the display panel can prevent a film packaging layer from being stripped from an array substrate near a hole digging area, so that a sealed space is formed between the film packaging layer and the array substrate, and water and oxygen are prevented from invading into the display panel from the hole digging area.
In order to achieve the purpose, the invention provides the following technical scheme:
a display panel, comprising:
the display area, the hole digging area surrounded by the display area and the first non-display area located between the display area and the hole digging area;
the array substrate comprises a retaining wall, and the retaining wall is positioned between the display area and the first non-display area;
the thin film packaging layer covers the array substrate and comprises an inorganic layer and an organic layer which are stacked, the organic layer extends from the display area to the first non-display area and is stopped at the retaining wall, and the inorganic layer spans the retaining wall to extend; wherein the content of the first and second substances,
the display panel further comprises a first bonding layer, the first bonding layer is located between the retaining wall and the hole digging region, and the first bonding layer is bonded with the array substrate and the inorganic layer through viscosity.
The invention further provides a display device which comprises the display panel provided by the embodiment of the invention.
The invention has the following beneficial effects:
the display panel and the display device provided by the embodiment of the invention comprise an array substrate, a film packaging layer and a first bonding layer, wherein the array substrate is provided with a retaining wall positioned between a display area and a first non-display area, the film packaging layer covers the array substrate and comprises an inorganic layer and an organic layer which are stacked, the organic layer extends from the display area to the first non-display area and is stopped at the retaining wall, the inorganic layer extends across the retaining wall, the first bonding layer is positioned between the retaining wall and a hole digging area, and the first bonding layer bonds the array substrate and the inorganic layer through viscosity. In the structure, the first bonding layer near the hole digging area can bond the array substrate and the inorganic layer through viscosity, so that the adhesion between the array substrate and the film packaging layer is enhanced, the inorganic layer of the film packaging layer is prevented from being peeled off from the array substrate, a sealed space is formed between the inorganic layer of the film packaging layer and the array substrate near the cutting hole, and water and oxygen are prevented from invading the display panel from the cutting hole.
Drawings
FIG. 1a is a schematic structural diagram of a display panel provided in the prior art;
FIG. 1b is a schematic diagram of a display panel provided in the prior art;
fig. 2 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view of a display panel according to an embodiment of the present invention;
fig. 4 is a flowchart illustrating a manufacturing process of a display panel according to an embodiment of the present invention;
fig. 5 is a diagram illustrating a manufacturing process of a display panel according to an embodiment of the present invention;
FIG. 6a is a cross-sectional view of a display panel according to an embodiment of the present invention;
FIG. 6b is a cross-sectional view of a display panel according to an embodiment of the present invention;
FIG. 7a is a cross-sectional view of a display panel according to an embodiment of the present invention;
FIG. 7b is a cross-sectional view of a display panel according to an embodiment of the present invention;
FIG. 7c is a cross-sectional view of a display panel according to an embodiment of the present invention;
FIG. 8 is a cross-sectional view of a display panel according to an embodiment of the present invention;
FIG. 9a is a cross-sectional view of a display panel according to an embodiment of the present invention;
FIG. 9b is a cross-sectional view of a display panel according to an embodiment of the present invention;
FIG. 9c is a cross-sectional view of a display panel according to an embodiment of the present invention;
FIG. 10a is a cross-sectional view of a display panel according to an embodiment of the present invention;
FIG. 10b is a cross-sectional view of a display panel according to an embodiment of the present invention;
fig. 11 is a cross-sectional view of a display panel according to an embodiment of the invention;
fig. 12a is a schematic structural diagram of a display panel according to an embodiment of the present invention;
fig. 12b is a schematic structural diagram of a display panel according to an embodiment of the present invention;
fig. 13 is a cross-sectional view of a display panel according to an embodiment of the invention.
Icon:
a-a display area; b-a first non-display area; c-digging a hole area; d-a frame region;
1-an array substrate; 11-a substrate; 111-a first substrate; 112-a second substrate; 12-a first insulating layer; 2-retaining wall; 3-a first adhesive layer; 31-a light absorbing material; 32-a light reflective material; 33-groove structure; 4-an organic electroluminescent unit; 51-an inorganic layer; 511 — a first inorganic layer; 512-a second inorganic layer; 52-organic layer; 6-cutting holes; 7-organic crack prevention layer; 71-a crack prevention portion; 8-ring partition structure.
Detailed Description
At present, in order to realize the design of comprehensive screen in display panel, the designer proposes to set up the structure of a cutting hole in display panel's display area, and leading camera sets up in cutting the hole, can reduce the size of display screen frame all around, improves display device's screen and accounts for the ratio. The display panel with such a structure needs to be manufactured first, as shown in fig. 1a, the complete display panel includes an array substrate 01, an organic electroluminescent unit 02 located on the array substrate, and a thin film encapsulation layer 03 covering the organic electroluminescent unit, wherein some film layers of the organic electroluminescent unit cannot be patterned, and need to be completely evaporated on the array substrate. When laser cutting is performed on the complete display panel to form a cutting hole, as shown in fig. 1b, the array substrate 01, the organic electroluminescent unit 02, and the thin film encapsulation layer 03 in the preset hole digging region C need to be integrally cut to form a cutting hole 04. However, the heat generated by the laser cutting may vaporize the organic electroluminescent unit 02 near the cut hole 04, which may cause a void between the array substrate 01 and the thin film encapsulation layer 03, which may cause the thin film encapsulation layer 03 and the array substrate 01 to be peeled off, and water and oxygen in the air may intrude into the display panel from the peeled area between the thin film encapsulation layer and the array substrate, which may affect the lifetime of the display panel.
The embodiment of the invention provides a display panel and a display device, aiming at the problem that water and oxygen invade the interior of the display panel due to the peeling of an array substrate and a thin film packaging layer in the related art. In order to make the objects, technical solutions and advantages of the present invention clearer, specific embodiments of a display panel and a display device according to an embodiment of the present invention are described in detail below with reference to the accompanying drawings. It should be understood that the preferred embodiments described below are only for illustrating and explaining the present invention and are not to be used for limiting the present invention. And the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
The shapes and sizes of the various elements in the drawings are not to scale and are merely intended to illustrate the invention.
As shown in fig. 2, the present invention provides a display panel including: the display area A, a hole digging area C surrounded by the display area A and a first non-display area B positioned between the display area A and the hole digging area C;
specifically, as shown in fig. 3, fig. 3 is a cross-sectional view of a display panel at a cut-out region C provided in an embodiment of the present invention, wherein the cut-out region C has a cut hole 6 penetrating through the display panel. Dig hole region C in the display area A sets up, places the cutting hole 6 of district digging hole region with the camera in, can reduce the width that shows panel frame district D, improves the screen and accounts for the ratio.
Further, referring to fig. 3, the display panel has:
the array substrate 1 comprises a retaining wall 2, and the retaining wall 2 is positioned between a display area A and a first non-display area B;
the thin film packaging layer covers the array substrate 1 and comprises an inorganic layer 51 and an organic layer 52 which are stacked, the organic layer 52 extends from the display area A to the first non-display area B and is stopped at the retaining wall 2, and the inorganic layer 51 extends across the retaining wall 2; wherein the content of the first and second substances,
the display panel further includes a first adhesive layer 3, the first adhesive layer 3 is located between the retaining wall 2 and the hole digging region C, and the first adhesive layer 3 adheres the array substrate 1 and the inorganic layer 51 by adhesion.
The display panel provided by the embodiment of the invention comprises an array substrate 1, a film packaging layer and a first adhesive layer 3, wherein the array substrate 1 is provided with a retaining wall 2 positioned between a display area A and a first non-display area B, the film packaging layer covers the array substrate 1 and comprises an inorganic layer 51 and an organic layer 52 which are stacked, the organic layer 52 extends from the display area A to the first non-display area B and is stopped at the retaining wall 2, the inorganic layer 51 extends across the retaining wall 2, the first adhesive layer 3 is positioned between the retaining wall 2 and a hole digging area C, and the first adhesive layer 3 is adhered to the array substrate 1 and the inorganic layer 51 through viscosity. In the above structure, the first adhesive layer 3 can adhere the array substrate 1 and the inorganic layer 51 through the viscosity near the hole digging region C, so that the adhesion between the array substrate 1 and the film packaging layer is enhanced, the inorganic layer 51 of the film packaging layer is prevented from being peeled off from the array substrate 1, a sealed space is formed between the inorganic layer 51 of the film packaging layer and the array substrate 1 near the cutting hole 6, and water and oxygen are prevented from invading into the display panel from the cutting hole 6.
In the display panel provided in the above embodiment of the present invention, the organic electroluminescent unit 4 is disposed between the array substrate 1 and the inorganic layer 51, and the organic electroluminescent unit 4 may include an anode layer, an organic light emitting layer, and a cathode layer sequentially disposed on the array substrate 1, where the cathode layer needs to be deposited on the whole surface and cannot be patterned, and the specific steps of manufacturing the display panel may include, as shown in fig. 4 and 5:
s401: forming an array substrate 1, wherein the array substrate 1 comprises a retaining wall 2 positioned between a display area A and a first non-display area B;
s402: forming a first bonding layer 3 between the retaining wall 2 and the hole digging area C;
s403: forming an organic electroluminescent unit 4 on the array substrate 1;
s404: forming a thin film encapsulation layer on the organic electroluminescent unit 4, wherein the thin film encapsulation layer comprises an inorganic layer 51 and an organic layer 52 which are stacked, the organic layer 52 extends from the display area a to the first non-display area B and is stopped at the retaining wall 2, and the inorganic layer 51 extends across the retaining wall 2, as shown in fig. 5;
s405: and laser cutting is carried out on the digging hole area C, in the cutting process, the part of the organic electroluminescent unit 4 adjacent to the digging hole area C is heated and gasified, so that part or all of the surface of the first bonding layer 3 is exposed to the outer side of the organic electroluminescent unit 4, and the first bonding layer 3 is bonded with the array substrate 1 and the inorganic layer 51 through viscosity.
In the manufacturing method of the display panel, when the hole digging region C is cut, in the cutting process, the part of the organic electroluminescent unit 4 close to the hole digging region C is heated and gasified, so that part or all of the surface of the first bonding layer 3 is exposed to the outer side of the organic electroluminescent unit 4, and further the inorganic layer 51 is bonded with the surface of the first bonding layer 3, the first bonding layer 3 is bonded with the array substrate 1 and the inorganic layer 51 through viscosity, even if the organic electroluminescent unit 4 is heated and gasified to form a cavity, the first bonding layer 3 has the bonding effect, the inorganic layer 51 cannot be peeled from the array substrate 1, a closed space is formed between the inorganic layer 51 and the array substrate 1, water and oxygen are prevented from invading the organic electroluminescent unit 4 from the cut hole 6, and the service life of the display panel is prolonged.
Specifically, after the cutting holes 6 are formed by laser cutting, the orthographic projection of the organic electroluminescent unit 4 on the array substrate 1 is configured with a first boundary close to the hole digging area C, the first boundary is positioned between the orthographic projection of the retaining wall 2 on the substrate and the orthographic projection of the first adhesive layer 3 on the substrate, as shown in fig. 3, or the first boundary is positioned in an area of the orthographic projection of the first adhesive layer 3 on the substrate far from the hole digging area C, as shown in fig. 6 a.
Specifically, in the above manufacturing process, when the first adhesive layer 3 is formed on the array substrate 1, the first adhesive layer 3 may be formed outside the preset cutting line of the laser cutting, that is, the first adhesive layer 3 may have a space from the edge of the hole digging region C, as shown in fig. 5, in this case, after the cutting hole 6 is formed by the laser cutting, the first adhesive layer 3 may have a space from the cutting hole 6, and the edge of the inorganic layer 51 may coincide with the edge of the cutting hole 6, as shown in fig. 6 a.
In another case, when the first adhesive layer 3 is formed on the array substrate 1, the end of the first adhesive layer 3 may be located on a predetermined cutting line, and the laser cutting is located adjacent to the first adhesive layer 3, which may result in cutting off a portion of the inorganic layer 51 on the first adhesive layer 3, as shown in fig. 6 b. In this case, the inorganic layer 51 may be peeled off from the first adhesive layer 3 due to an excessively short bonding length of the inorganic layer 51 to the first adhesive layer 3, in order to avoid this problem, a low pressure air blowing process may be added to the inorganic layer 51 after the cutting is completed to bond the inorganic layer 51 to the first adhesive layer 3 more tightly, and in order to bond the inorganic layer 51 to the first adhesive layer 3 better, an inorganic layer 51 encapsulation process may be added after the low pressure air blowing process is completed to increase a contact area between the inorganic layer 51 and the first adhesive layer 3, thereby increasing the adhesion between the inorganic layer 51 and the first adhesive layer 3.
In the display panel provided by the above embodiment of the invention, the material of the first adhesive layer 3 may be frit, and the inorganic layer 51 and the array substrate 1 are bonded by the frit, so that the sealing effect and the water and oxygen barrier capability can be enhanced. The first adhesive layer 3 may be made of other materials, and is not limited herein.
Specifically, the process of making the first adhesive layer 3 may include: firstly, liquid glass frit is coated between the hole digging area C and the retaining wall 2, then the liquid glass frit is solidified to form the first bonding layer 3, and the manufacturing mode of coating the liquid material can improve the accuracy of the arrangement position of the first bonding layer 3.
In the display panel provided in the embodiment of the present invention, the light in the display area a may be emitted from the first adhesive layer 3, which causes light leakage at the cut holes 6 on the display panel, and in order to avoid the light leakage phenomenon caused by the light emitted from the display area a passing through the first adhesive layer 3, a light absorbing material 31 may be disposed on a side surface of the first adhesive layer 3 facing the display area a, as shown in fig. 7a, the light absorbing material 31 is used for absorbing the light emitted from the display area a, which prevents the light from passing through the first adhesive layer 3; alternatively, the side of the first adhesive layer 3 facing away from the display area a is provided with a light absorbing material 31, as shown in fig. 7 b; or, the side of the first adhesive layer 3 facing the display area a and the side facing away from the display area a both have the light absorbing material 31, as shown in fig. 7c, it is better that both sides of the first adhesive layer 3 are provided with the light absorbing material for absorbing light. Specifically, the light absorbing material needs to have an absorption rate of visible light of more than 80%, so that light emitted from the display can be well prevented from being emitted from the first adhesive layer 3.
Specifically, in order to avoid light leakage caused by light passing through the first adhesive layer 3, the light absorbing material 31 may be replaced with a light reflecting material 32. For example, the side of the first adhesive layer 3 facing the display area a is provided with the reflective material 32, as shown in fig. 7a, the reflective material reflects light emitted from the display area a to the first adhesive layer 3, so as to avoid light leakage caused by light of the display area a passing through the first adhesive layer; optionally, the side of the first adhesive layer 3 facing away from the display area a is provided with a reflective material 32, as shown in fig. 7 b; or, the side of the first adhesive layer 3 facing the display area a and the side facing away from the display area a both have the reflective material 32, as shown in fig. 7c, both sides of the first adhesive layer 3 are provided with the reflective material to have better reflective effect on the light emitted by the display area a. Specifically, the reflective material needs to have a reflectivity of more than 60% for visible light, so as to well prevent the light emitted from the display area a from being emitted from the first adhesive layer 3.
It should be noted that, no light absorbing material or light reflecting material is disposed on the surface of the first adhesive layer 3 away from the array substrate 1, so as to avoid a decrease in viscosity caused by the light absorbing material and the light reflecting material disposed between the surface of the first adhesive layer 3 away from the array substrate 1 and the inorganic layer 51 of the thin film encapsulation layer.
Specifically, in order to avoid light leakage caused by light passing through the first adhesive layer 3, a light absorbing material may be provided in the material for manufacturing the first adhesive layer 3, and the absorption rate of the manufactured first adhesive layer 3 for visible light is required to be greater than 80%, so as to better avoid light of the display area a from being emitted from the first adhesive layer 3.
In the display panel provided in the above embodiment of the invention, specifically, as shown in fig. 8, the inorganic layer 51 may include a first inorganic layer 511 and a second inorganic layer 512, the organic layer 52 is located between the first inorganic layer 511 and the second inorganic layer 512, the first inorganic layer 511 is located on one side of the second inorganic layer 512 close to the array substrate 1, and the first adhesive layer 3 adheres the array substrate 1 and the first inorganic layer 511.
In the display panel provided by the above embodiment of the invention, as shown in fig. 9a, the array substrate 1 may include a substrate 11 and a first insulating layer 12 on the substrate, and the viscosity between the first adhesive layer 3 and the inorganic layer 51 is greater than the viscosity between the substrate 11 or between the first insulating layer 12 and the inorganic layer 51, so that the adhesion between the inorganic layer 51 and the array substrate 1 bonded by the first adhesive layer 3 is greater than the adhesion between the inorganic layer 51 and the array substrate 1 in direct contact with the array substrate 1, thereby preventing the inorganic layer 51 from peeling off from the array substrate 1, and preventing water and oxygen from entering the inside of the display panel from the cut hole 6. Specifically, the first insulating layer 12 may be formed by stacking one or more layers of a first buffer layer, a gate insulating layer, an inter-metal dielectric layer, and an interlayer dielectric layer on the substrate 11.
Specifically, as shown in fig. 9a, the first adhesive layer 3 may be disposed on the first insulating layer 12, and the first adhesive layer 3 adheres the first insulating layer 12 and the inorganic layer 51, so as to achieve adhesion between the array substrate 1 and the thin film encapsulation layer.
Alternatively, as shown in fig. 9b, the first adhesive layer 3 may also be in contact with the substrate 11, the first insulating layer 12 has a first through hole, the first adhesive layer 3 may be in contact with the substrate 11 through the first through hole, the substrate 1 is adhered to the inorganic layer 51, adhesion between the array substrate 1 and the thin film encapsulation layer is achieved, adhesion between the first adhesive layer 3 and the array substrate 1 is increased, and the first adhesive layer 3 is prevented from being peeled off from the array substrate 1.
Specifically, as shown in fig. 9c, the substrate 11 may include a first substrate 111 and a second substrate 112 stacked in a stacked manner, the first substrate 111 is located on a side of the second substrate 112 close to the thin film encapsulation layer, a second through hole is provided on the first substrate 111, the first adhesive layer 3 contacts the second substrate 112 through the second through hole, the second substrate 112 is adhered to the inorganic layer 51, adhesion between the first adhesive layer 3 and the array substrate 1 is increased, and the first adhesive layer 3 is prevented from being peeled off from the array substrate 1. Optionally, another film layer is further disposed between the first substrate 111 and the second substrate 112, for example, a second buffer layer, a third through hole opposite to the second through hole is formed on the second buffer layer, and the first adhesive layer 3 is in contact with the second substrate 112 through the second through hole and the third through hole. The second buffer layer is provided between the first substrate 111 and the second substrate 112, and flexibility of the substrate 11 can be increased.
In the display panel provided by the embodiment of the invention, specifically, the surface of the first adhesive layer 3 facing the inorganic layer 51 may form the groove structure 33, the inorganic layer 51 covers the groove structure 33, the groove structure can increase a path through which water and oxygen invade the inside of the display panel, which is beneficial for the display panel to block water and oxygen, and the groove structure 33 can be beneficial for increasing a contact area between the first adhesive layer 3 and the inorganic layer 51, which is beneficial for better improving the viscosity between the first adhesive layer 3 and the inorganic layer 51, and avoiding the first adhesive layer 3 and the inorganic layer 51 from peeling off.
Specifically, the groove structure 33 may be a structure with a cross section of a single groove, and the cross section of the single groove may be rectangular, circular arc, or the like, as shown in fig. 10a, the cross section of the single groove is rectangular; the groove structure 33 may also be a groove with a sawtooth-shaped cross section, as shown in fig. 10b, which can increase the path of water and oxygen intruding into the display panel, is beneficial to the display panel to block water and oxygen, and is beneficial to increasing the contact area between the first adhesive layer 3 and the inorganic layer 51, and is further beneficial to better improving the viscosity between the first adhesive layer 3 and the inorganic layer 51, and thus the first adhesive layer 3 and the inorganic layer 51 are prevented from being peeled off.
Specifically, the surface of the first adhesive layer 3 facing the inorganic layer 51 may also be provided with an inclined surface 34, as shown in fig. 11, the inorganic layer 51 covers the inclined surface, which not only can increase the path of water and oxygen invading into the display panel, which is beneficial to the display panel to block water and oxygen, but also can be beneficial to increase the contact area between the first adhesive layer 3 and the inorganic layer 51, which is beneficial to better improving the viscosity between the first adhesive layer 3 and the inorganic layer 51, and avoiding the first adhesive layer 3 and the inorganic layer 51 from peeling off.
In the display panel provided by the above embodiment of the invention, the first adhesive layer 3 may be an annular structure disposed around the hole digging region C, as shown in fig. 12a, so that the inorganic layer 51 around the hole digging region C is hermetically adhered to the substrate, and when the hole digging region C is cut to form the cutting hole 6, the film encapsulation layer near the cutting hole 6 can be prevented from being peeled off from the array substrate, so that a closed space is formed between the film encapsulation layer and the array substrate, and water and oxygen can be prevented from invading into the display panel.
Specifically, the first adhesive layer 3 may also be a plurality of annular structures coaxially disposed around the hole digging region C, as shown in fig. 12b, the contact area between the first adhesive layer 3 and the inorganic layer 51 can be increased, which is beneficial to better improving the viscosity between the first adhesive layer 3 and the inorganic layer 51, and the water and oxygen invasion path can be increased, which is beneficial to blocking water and oxygen of the display panel.
Specifically, the first adhesive layer 3 may also have a segmented structure provided around the cored-out area C.
In the display panel provided in the above embodiment of the invention, as shown in fig. 13, the array substrate 1 further has an organic crack-preventing layer 7 located between the retaining wall 2 and the first adhesive layer 3 and disposed around the excavated region C, the first insulating layer 12 is an inorganic insulating layer, a region of the first insulating layer 12 located between the retaining wall 2 and the first adhesive layer 3 has at least one excavated groove around the excavated region C, the organic crack-preventing layer has a crack-preventing portion 71 filled in the excavated groove, and since the crack-preventing portion 71 is made of an organic material, the organic material has good flexibility, and when laser cutting is performed, the crack-preventing portion 71 can prevent cracks on the inorganic insulating layer from extending to the display region a, and further prevent water and oxygen from invading into the display panel.
Specifically, the array substrate 1 is further provided with at least one annular partition structure 8 which is arranged around the hole digging region C and used for partitioning the organic electroluminescent unit 4, so that the organic electroluminescent unit 4 can be partitioned, water and oxygen are prevented from invading the display panel along the organic electroluminescent unit 4 from the cutting hole 6, and the service life of the display panel is prolonged. Specifically, the annular partition structure 8 may be located between the display area a and the retaining wall 2, as shown in fig. 13.
The invention further provides a display device which comprises the display panel provided by the embodiment of the invention. The display device may be: any product or component with a display function, such as a mobile phone, a tablet computer, a notebook computer and the like. Other essential components of the display device are understood by those skilled in the art, and are not described herein or should not be construed as limiting the invention.
The display panel and the display device provided by the embodiment of the invention comprise an array substrate, a film packaging layer and a first bonding layer, wherein the array substrate is provided with a retaining wall positioned between a display area and a first non-display area, the film packaging layer covers the array substrate and comprises an inorganic layer and an organic layer which are stacked, the organic layer extends from the display area to the first non-display area and is stopped at the retaining wall, the inorganic layer extends across the retaining wall, the first bonding layer is positioned between the retaining wall and a hole digging area, and the first bonding layer bonds the array substrate and the inorganic layer through viscosity. In the structure, the first bonding layer near the hole digging area can bond the array substrate and the inorganic layer through viscosity, so that the adhesion between the array substrate and the film packaging layer is enhanced, the inorganic layer of the film packaging layer is prevented from being peeled off from the array substrate, a sealed space is formed between the inorganic layer of the film packaging layer and the array substrate near the cutting hole, and water and oxygen are prevented from invading the display panel from the cutting hole.
It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (16)
1. A display panel, comprising:
the display area, the hole digging area surrounded by the display area and the first non-display area located between the display area and the hole digging area;
the array substrate comprises a retaining wall, and the retaining wall is positioned between the display area and the first non-display area;
the thin film packaging layer covers the array substrate and comprises an inorganic layer and an organic layer which are stacked, the organic layer extends from the display area to the first non-display area and is stopped at the retaining wall, and the inorganic layer spans the retaining wall to extend; wherein the content of the first and second substances,
the display panel further comprises a first bonding layer, the first bonding layer is located between the retaining wall and the hole digging region, and the first bonding layer is bonded with the array substrate and the inorganic layer through viscosity.
2. The display panel according to claim 1, wherein the side of the first adhesive layer facing the display area comprises a light absorbing material and/or the side of the first adhesive layer facing away from the display area comprises a light absorbing material, wherein the light absorbing material has an absorption of visible light of more than 80%.
3. The display panel according to claim 1, wherein the side of the first adhesive layer facing the display area comprises a light reflecting material and/or the side of the first adhesive layer facing away from the display area comprises a light reflecting material, wherein the reflectivity of the light reflecting material for visible light is greater than 60%.
4. The display panel according to claim 1, wherein the first adhesive layer is a light absorbing material, and an absorption rate of the first adhesive layer to visible light is greater than 80%.
5. The display panel according to claim 1, wherein the inorganic layers include a first inorganic layer and a second inorganic layer, the organic layer is located between the first inorganic layer and the second inorganic layer, and the first inorganic layer is located on a side of the second inorganic layer close to the array substrate, and the first adhesive layer adheres the array substrate and the first inorganic layer.
6. The display panel according to claim 1, wherein the array substrate comprises a substrate and a first insulating layer on the substrate, and wherein the adhesion between the first adhesive layer and the inorganic layer is greater than the adhesion between the substrate or the first insulating layer and the inorganic layer.
7. The display panel according to claim 6, wherein the first adhesive layer is located on the first insulating layer, and the first adhesive layer adheres the first insulating layer and the inorganic layer.
8. The display panel according to claim 6, wherein the first insulating layer includes a first through hole, and wherein the first adhesive layer is in contact with a substrate through the first through hole, and adheres the substrate to the inorganic layer.
9. The display panel according to claim 6, wherein the substrate comprises a first substrate and a second substrate stacked on each other, the first substrate is located on a side of the second substrate close to the thin film encapsulation layer, the first substrate comprises a second through hole, and the first adhesive layer is in contact with the second substrate through the second through hole to adhere the second substrate to the inorganic layer.
10. The display panel according to claim 1, wherein the material of the first adhesive layer is a frit.
11. The display panel according to claim 1, wherein the first adhesive layer is an annular structure provided around the cutout region.
12. The display panel of claim 1, wherein the first adhesive layer is a plurality of ring structures coaxially disposed around the dug-hole region.
13. The display panel according to claim 1, wherein a surface of the first adhesive layer facing the inorganic layer comprises a groove structure, and the inorganic layer covers the groove structure.
14. The display panel according to claim 13, wherein the groove structure is a groove having a saw-toothed cross section.
15. The display panel according to claim 1, wherein a surface of the first adhesive layer facing the inorganic layer is a slope, and the inorganic layer covers the slope.
16. A display device characterized by comprising the display panel according to any one of claims 1 to 15.
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