JP2006032056A - Light emitting device and manufacturing method of light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device which is improved in airtightness for suppressing deterioration of an organic luminous layer or the like caused by gas or moisture or the like easily entering from the jointing portion of the electrode layer and the sealing body, since the end part of first and second electrode layers interposing the organic luminous layer is led out to the outside and used as a terminal for external connection in the development of a light emitting device for a display device using an organic EL element, and a manufacturing method of the light emitting device. <P>SOLUTION: A pair of through holes 12, 13 are provided at the glass substrate 11 and external connectors 14, 15 are provided inserted into these through holes 12, 13, and first and second electrode layers 19, 21 interposing an organic luminous layer 20 are connected to these external connectors 14, 15. A protective plate 23 and a sealing agent 22 are sealed airtightly on the glass substrate 11 in order to protect these electrode layers 19, 21 and the organic luminous layer 20. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a light emitting device using an organic electroluminescence element, and more particularly to a light emitting device in which an organic electroluminescence layer is securely sealed with a glass substrate and a protective plate, and a method for manufacturing the light emitting device.

  Conventionally, a large display screen with a large number of light bulbs arranged in a flat shape is used to display image data that informs a large number of spectators about the players participating, odds, scores, etc. in a wide area such as a racetrack or baseball field. Has been. In addition to such a large display screen, a liquid crystal display device has recently been frequently used in place of a light bulb display on a display screen for notifying a destination display at a station or airport, a departure time, an arrival time, etc. It is becoming.

  Advantages of using this liquid crystal display device include that it consumes less power than a light bulb display and is excellent in miniaturization. On the other hand, as a liquid crystal display device, a liquid crystal display panel, a backlight for illuminating the display panel, and a large number of component parts are included. Due to the large number of component parts, the display device is expensive. There is a problem that the thickness of the device itself increases.

  However, the biggest problem with this liquid crystal display device is that the viewing angle is narrow, so that the visibility from the side of the display device is extremely high even though the visibility from the front is excellent. bad. Improvements are currently being made to remedy this problem, but it has not yet been realized as a display device with sufficient visibility.

  On the other hand, in order to improve the problems of the liquid crystal display device, recently, an organic electroluminescence (organic EL) element has been developed, and its application to such a display device is being studied. Since this organic EL element is a light emitting element that emits light by itself, it does not require a light source such as a backlight unlike a liquid crystal display device, so that not only the number of components is reduced, but also the thickness of the device. Further, it can be made thin, can be reduced in weight, and can have a wide viewing angle. Therefore, it is suitable for use in a display device.

  As shown in FIGS. 31 and 32, the light-emitting device including the organic EL element forms a first electrode layer 82 made of a transparent conductive film made of ITO (Indium Tin Oxide) on a transparent glass substrate 81. An organic light emitting layer 83 such as α-NPD or Alq3 is laminated on the electrode layer 82, and a second electrode layer 84 such as lithium fluoride or aluminum is formed on the organic light emitting layer 83. One end of each of the first and second electrode layers 82 and 84 is led out to the end of the glass substrate 81 along the surface of the glass substrate 81 to be connected to the external connection terminal portions 85 and 86. It is used as.

  Since these electrode layers 82 and 84 and the organic light emitting layer 83 are vulnerable to moisture and oxygen in the outside air, these first and second electrode layers 82 and 84 and the organic light emitting layer 83 are made of glass or Sealing is performed using a protective plate 87 such as stainless steel. For this sealing, a UV curable adhesive 88 is applied to the peripheral edge of the protective plate 87, and the surface of the glass substrate 81 is attached so as to cover the organic light emitting layer 83, and this attached UV curable adhesive is attached. The adhesive 88 is UV-exposed in a state where it is shielded from being irradiated with UV so that the internal organic light-emitting layer 83 is not irradiated with the adhesive, and the adhesive 88 is cured and hermetically sealed.

  However, in order to utilize the end portions of the first and second electrode layers 82 and 84 as the external connection terminal portions 85 and 86 in this way, the UV curable adhesive 88 is used. In the sealing configuration, the first and second electrode layers 82 and 84 that are originally vulnerable to gas, moisture, and the like are used. Therefore, the internal space of the sealed protective plate 87 has an internal structure. In order to adsorb the gas and moisture released in the above, or the gas and moisture that penetrates the sealing portion of the adhesive 88 and each of the electrode layers 82 and 84 and enters the internal space of the container, a desiccant ( (Not shown).

  Further, the end portions of the first and second electrode layers 82 and 84 are also used as the external connection terminal portions 85 and 86. However, the terminal portions 85 and 86 also deteriorate in airtightness and light up. There are major problems such as reduction in luminous efficiency, generation of dark spots, or enlargement of the dark spots due to oxygen and moisture entering the inside.

  The present invention has been made in view of the above-described conventional problems, and a pair of external connection terminals connected to the first and second electrode layers are substantially penetrated through the glass substrate. Thus, a light-emitting device with sufficiently improved hermeticity and a method for manufacturing the light-emitting device are provided. A problem to be solved is that a reliable hermetic sealing configuration can be achieved. is there.

  As a first means for solving the above-mentioned problems, the present invention provides a transparent glass substrate, a first electrode layer formed on the glass substrate, and an organic light emitting layer formed on the electrode layer. And a second electrode layer formed on the organic light-emitting layer and a glass substrate connected to the first and second electrode layers, respectively, and spaced apart from each other so as to protrude on the side opposite to the electrode layer. A pair of external connection terminals provided, a protective plate disposed to face the glass substrate so as to protect the electrode layer and the organic light emitting layer, and a seal interposed between the protective plate and the glass substrate so as to seal between them The external connection terminal is arranged in a direction intersecting with the glass substrate.

  As a second means for solving the above-mentioned problems, the present invention is characterized in that an external connection terminal is connected to each electrode layer directly or via a conductor on the electrode layer side of the glass substrate.

  As a third means for solving the above-mentioned problems, the present invention is characterized in that the external connection terminal is fixed to a through hole formed in a concave portion or a convex portion formed in the glass substrate.

  As a fourth means for solving the above-mentioned problems, the present invention is characterized in that an external connection terminal is fixed through a conductor in a through hole formed in a glass substrate.

  According to the present invention, as a fifth means for solving the above-described problems, the glass substrate is formed in a hemispherical shape so as to hold each electrode layer and the organic light emitting layer inside, and the end of the hemispherical glass substrate is protected. It is characterized by being sealed with a plate.

  As a sixth means for solving the above-described problems, the present invention provides a step of drilling a pair of spaced through holes penetrating the glass substrate in the glass substrate, and implanting an external connection terminal in the through hole. A step of forming a first electrode layer on the glass substrate so as to be electrically connected to one of the external connection terminals, and a step of forming an organic light emitting layer on the first electrode layer. A step of laminating and forming a second electrode layer located on the organic light emitting layer and electrically connected to the other of the external connection terminals, and a protective plate facing the glass layer and the electrode layer and the organic light emitting layer And a step of sealing in an airtight state with a sealing material, wherein one end of the external connection terminal protrudes in an outward direction intersecting the glass substrate.

  As a seventh means for solving the above-mentioned problems, the present invention is characterized in that a conductive thin film is formed around one end of an external connection terminal, and each electrode layer and the external connection terminal are connected via this thin film. And

  According to the present invention, as an eighth means for solving the above-described problem, when the first electrode layer is formed on one side of the through hole, a conductive thin film is simultaneously formed on the other through hole portion. It is characterized by that.

  As a ninth means for solving the above-mentioned problems, the present invention is characterized in that a concave portion or a convex portion is formed in a glass substrate and a through hole is formed in the concave portion or the convex portion.

  As a tenth means for solving the above-mentioned problems, the present invention is characterized by using a glass substrate that is previously molded into a hemispherical shape as a glass substrate.

  According to the present invention, since an organic EL light emitting element is employed as a light emitting device, not only can a light emitting device with a wide viewing angle and excellent visibility be formed on a flat surface of a glass substrate. A protective plate that protects the first and second electrode layers and the organic light emitting layer is bonded via a sealing material, and the first and second electrode layers are paired with a pair of external terminals implanted on the glass substrate; By electrically connecting, the inside of the container composed of the glass substrate, the protective plate and the sealing material can be reliably kept in an airtight state, so that intrusion of gas, oxygen, moisture, etc. from the outside is ensured. Therefore, it is possible to obtain a display device and a method for manufacturing the display device that can suppress the decrease in light emission efficiency and the generation / expansion of dark spots caused by the penetration.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  First, as shown in FIG. 1, a light emitting device according to the present invention is a pair of non-moisture permeable and transparent rectangular glass substrates 11 mounted in a pair of through holes 12 and 13 penetrating the glass substrate 11. External connection terminals 14 and 15 are provided. Conductive thin film portions 16 and 17 are formed around the through holes 12 and 13, and the thin film portions 16 and 17 and the external connection terminals 14 and 15 are made of a conductor 18 such as a conductive adhesive. Are electrically connected. A first electrode layer 19 made of a transparent conductive film such as ITO is formed so as to be connected to the thin film portion 16 on the one external connection terminal 14. Further, an organic light emitting layer 20 such as α-NPD or Alq3 is laminated on the electrode layer 19. One end of the organic light emitting layer 20 extends on the surface of the glass substrate 11 along the side surface of the first electrode layer 19 so as to cover the end of the first electrode layer 19.

  Further, a conductive film such as lithium fluoride or aluminum is formed on the organic light emitting layer 20 in the same direction in which the organic light emitting layer 20 extends so that one end portion thereof extends to the surface of the glass substrate 11. The second electrode layer 21 made of is formed and formed, and the second electrode layer 21 is connected to the thin film portion 17 of the other external connection terminal 15.

  A sealing material 22 for sealing is arranged on the peripheral portion of the glass substrate 11 on which the electrode layers 19 and 21 and the organic light emitting layer 20 are formed in this way, and a protective plate 23 is provided on the sealing material 22. Is arranged to face the glass substrate 11. The glass substrate 11 and the protective plate 23 are hermetically bonded by a sealing material 22.

  According to the light emitting device configured as described above, the glass substrate 11 and the protective plate 23 are firmly fixed via the sealing material 22, so that the effect of blocking the outside and the inside is remarkably improved. Then, it is possible to suppress a decrease in light emission efficiency during lighting and generation and expansion of dark spots.

  This light-emitting device can be manufactured by a method as shown in FIG.

  That is, a transparent glass substrate 11 is prepared (see FIG. 2A), and a pair of through holes 12 and 13 are formed in the glass substrate 11 at positions spaced apart from each other by a laser or a water jet method (see (b) of FIG. )reference). Conductive thin film portions 16 and 17 are formed around the through holes 12 and 13 on one side of the glass substrate 11 (see (c)). Then, the external connection terminals 14 and 15 are press-fitted into the through holes 12 and 13 from the conductive thin film portions 16 and 17 side by the jig 24, and the other ends of the external connection terminals 14 and 15 penetrate the glass substrate 11. The glass substrate 11 and the external connection terminals 14 and 15 are welded by melting the glass substrate 11 (see (d)).

  A conductor 18 made of a conductive adhesive, silver paste or the like is attached to one end side of the external connection terminals 14 and 15 to electrically connect the conductive thin film portions 16 and 17 and the external connection terminals 14 and 15. (See (e)). Then, a first electrode layer 19 made of ITO or the like is connected to the one conductive thin film portion 16 by a sputtering method (see (f)). Next, an organic light emitting layer 20 such as α-NPD or Alq3 is formed on the first electrode layer 19 by a vacuum deposition method (see (g)), and further LiF, Al on the organic light emitting layer 20. The second electrode layer 21 is formed by a vacuum deposition method, and the second electrode layer 21 is also connected to the other conductive thin film portion 17, whereby the second electrode layer 21 is It is electrically connected to the other external connection terminal 15 (see (h)).

  Finally, in order to hermetically cut off each of the electrode layers 19 and 21 and the organic light emitting layer 20 from the outside, a sealing material 22 is applied to the peripheral portion of the glass substrate 11, and the glass substrate is in contact with the sealing material 22 A protective plate 23 made of glass, aluminum, or the like is disposed so as to face 11, and the sealing material 22 is solidified to adhere and fix the glass substrate 11 and the protective plate 23 (see (i)). .

  By manufacturing the light-emitting device in this way, the external connection terminals 14 and 15 are fixed to the glass substrate 11 while maintaining sufficient airtightness. Therefore, the first and second electrode layers 19 and 21 and the organic terminals The light emitting layer 20 can be reliably held in an airtight state in a container composed of the glass substrate 11, the protective plate 23, and the sealing material 22.

  In the description of the above-described embodiment, the conductive thin film portions 16 and 17 are formed in advance around the through holes 11 and 12, and the external connection terminals 14 and 15 are connected to the first through the conductive thin film portions 16 and 17. And the second electrode layers 19 and 21 are connected. As shown in FIG. 3, the conductive thin film portion 16 on the side to which the first electrode layer 19 is connected is connected to the first electrode layer 19. It is also possible to use the conductive thin film portion 16 and the first electrode layer 19 together by extending the hole to the periphery of the through-hole 12 where the conductive thin film portion 16 is provided.

  In this case, as shown in FIG. 4, a transparent glass substrate 11 is prepared (see FIG. 4A), and a pair of through holes 12 and 13 are formed in the glass substrate 11 at positions separated from each other. (See (b)). A first electrode layer 19 made of ITO or the like is formed over the one through hole 12 on the one surface side of the glass substrate 11 by a sputtering method, and the other material is also conductive around the other through hole 13 by the same material. The thin film portion 17 is formed (see (c)).

  Then, the external connection terminals 14 and 15 are press-fitted into the through holes 12 and 13 from the first electrode portion 19 and the conductive thin film portion 17 side by the jig 24, and the other ends of the external connection terminals 14 and 15 are attached to the glass substrate 11. It penetrates and is made to protrude outward of the glass substrate 11 (see (d)). A conductor 18 made of a conductive adhesive, silver paste, or the like is attached to one end side of the external connection terminals 14 and 15, and the conductive thin film portion 17 and the first electrode layer 19 and the external connection terminals 14 and 15. Are electrically connected to each other (see (e)).

  Next, an organic light emitting layer 20 such as α-NPD or Alq3 is formed on the first electrode layer 19 by a vacuum deposition method (see (f)), and further, LiF, Al on the organic light emitting layer 20. The second electrode layer 21 is formed by a vacuum deposition method, and the second electrode layer 21 is also connected to the conductive thin film portion 17, so that the second electrode layer 21 is connected to the other external side. It is electrically connected to the connection terminal 15 (see (g)).

  Finally, in order to hermetically cut off each of the electrode layers 19 and 21 and the organic light emitting layer 20 from the outside, a sealing material 22 is applied to the peripheral portion of the glass substrate 11, and the glass substrate is in contact with the sealing material 22 A protective plate 23 made of glass, aluminum, or the like is disposed so as to face the substrate 11, and the sealing material 22 is solidified to bond and fix the glass substrate 11 and the protective plate 23 (see (h)). .

  By adopting such a configuration and manufacturing method, the first electrode layer 19 and the conductive thin film portion 17 around the external connection terminal 15 on the other side are formed together without providing a separate material and process. Therefore, the configuration is simplified, and the manufacturing process can be omitted correspondingly, so that the labor can be saved.

  It is also possible to attach the conductor 18 directly on the external connection terminals 14 and 15 without forming the conductive thin film portions 16 and 17 around the through holes 12 and 13.

  That is, as shown in FIG. 5, a transparent glass substrate 11 is prepared (see FIG. 5A), and a pair of through holes 12 and 13 are formed in the glass substrate 11 at positions spaced from each other (the same ( b)). Then, the external connection terminals 14 and 15 are press-fitted into the through holes 12 and 13 with a jig 24, and the other ends of the external connection terminals 14 and 15 penetrate the glass substrate 11 and protrude outward of the glass substrate 11 ( (See (c)). A conductor 18 made of a conductive adhesive, silver paste or the like is attached to one end side of the external connection terminals 14 and 15 and is electrically connected to the external connection terminals 14 and 15 ((d)). reference). A first electrode layer 19 made of ITO or the like is formed by sputtering so as to be connected to the conductor 18 on the one external connection terminal 14 side (see (e) of the same).

  Next, an organic light emitting layer 20 such as α-NPD or Alq3 is formed on the first electrode layer 19 by a vacuum deposition method (see (f)), and further, LiF, Al on the organic light emitting layer 20. The second electrode layer 21 is formed by a vacuum evaporation method, and the second electrode layer 21 is also connected to the conductor 18 on the other external connection terminal 15 side. The electrode layer 21 is electrically connected to the other external connection terminal 15 (see (g)).

  Finally, in order to hermetically cut off each of the electrode layers 19 and 21 and the organic light emitting layer 20 from the outside, a sealing material 22 is applied to the peripheral portion of the glass substrate 11, and the glass substrate is in contact with the sealing material 22 A protective plate 23 made of glass, aluminum, or the like is disposed so as to face the substrate 11, and the sealing material 22 is solidified to bond and fix the glass substrate 11 and the protective plate 23 (see (h)). .

  When the light emitting device is manufactured by such a configuration and manufacturing method, the conductive thin film portions 16 and 17 provided around the through holes 12 and 13 are not required, so that the configuration is further simplified and the manufacturing process is saved. Can be achieved.

  In the above description, the conductor 18 is deposited on one end of the upper surface of the glass substrate 11 of the external connection terminals 14 and 15, and the conductor 18 is connected to the first and second electrode layers 19 and 21. In this case, as shown in FIG. 6, the first and second electrode layers 19 and 21 are configured to be connected so as to directly cover these conductors 18. Is also possible. In this case, the thickness of the conductor 18 protrudes from the electrode layers 19 and 21 by the subsequent film formation, but by disposing the protruding portion, It is possible to configure so as not to adversely affect other components.

  Also in this case, as shown in FIG. 7, a transparent glass substrate 11 is prepared (see FIG. 7A), and a pair of through-holes 12 and 13 are formed at positions spaced apart from each other on the glass substrate 11 (see FIG. 7A). (See (b)). Then, the external connection terminals 14 and 15 are press-fitted into the through holes 12 and 13, and the other ends of the external connection terminals 14 and 15 penetrate the glass substrate 11 and protrude outward of the glass substrate 11 (same as above). (See (c)). A conductor 18 made of a conductive adhesive, silver paste or the like is attached to one end side of the external connection terminals 14 and 15 and is electrically connected to the external connection terminals 14 and 15 ((d)). reference). A first electrode layer 19 made of ITO or the like is formed by sputtering so as to cover the conductor 18 on the one external connection terminal 14 side (see (e) of the same).

  Next, an organic light emitting layer 20 such as α-NPD or Alq3 is formed on the first electrode layer 19 by a vacuum deposition method (see (f)), and further, LiF, Al on the organic light emitting layer 20. The second electrode layer 21 is formed by vacuum deposition, and the second electrode layer 21 is formed so as to cover the other conductor 18, thereby the second electrode layer 21 is electrically connected to the other external connection terminal 15 (see (g)).

  Finally, in order to hermetically cut off each of the electrode layers 19 and 21 and the organic light emitting layer 20 from the outside, a sealing material 22 is applied to the peripheral portion of the glass substrate 11, and the glass substrate is in contact with the sealing material 22 A protective plate 23 made of glass, aluminum, or the like is disposed so as to face the substrate 11, and the sealing material 22 is solidified to bond and fix the glass substrate 11 and the protective plate 23 (see (h)). .

  According to this configuration and the manufacturing method, it is only necessary to form the first and second electrode layers 19 and 21 so as to cover the external connection terminals 14 and 15, so that the configuration and manufacturing can be simplified. .

  Further, the conductor 18 provided at one end of the external connection terminals 14 and 15 is omitted, and the first and second electrode layers 19 are directly connected to one end of the pair of external connection terminals 14 and 15 as shown in FIG. , 21 can be provided. In this case, the configuration and manufacturing can be further simplified.

  Further, the external connection terminals 14 and 15 implanted in the glass substrate 11 have an inner diameter larger than the outer diameter of the external connection terminals 14 and 15 as shown in FIG. Through holes 12 and 13 in the glass substrate 11, and the through holes 12 and 13 are filled with a non-moisture permeable adhesive 25 and the external connection terminals 14 and 15 are inserted. 14 and 15 and the glass substrate 11 may be hermetically sealed.

  Further, as shown in FIG. 10, a conductor 18 is deposited on one end of the external connection terminals 14 and 15 in the same manner as described above, and the first and second electrode layers 19 and 21 are formed thereon. A film may be formed.

  In any case, when the adhesive 25 is filled in the through holes 12 and 13 and the external connection terminals 14 and 15 and the glass substrate 11 are hermetically sealed, the glass substrate 11 has nothing to do with it. Since deformation due to heat for welding does not occur, the structure and the manufacturing method are suitable for ensuring the flatness of the glass substrate 11.

  In the above embodiment, the protective plate 23 is formed of a non-moisture permeable material such as flat glass, and the protective plate 23 and the glass substrate 11 are bonded together by the sealing material 22 to form an airtight container. However, as shown in FIGS. 11 and 12, it is also possible to form a shape having a recess 26 that is recessed so that the central portion of the protective plate 23 is recessed. When the protective plate 23 having the recess 26 is used in this way, the use area of the sealing material 22 used for airtight connection with the glass substrate 11 is reduced, so that airtightness can be secured. It becomes easy.

  Furthermore, if the through-hole structure is formed in which the conductive layer 27 is formed also on the inner surfaces of the through holes 12 and 13 formed in the glass substrate 11, the external connection terminals 14 and 15 and the first and second electrode layers 19 and 21 are formed. It is possible to further ensure the connection with.

  That is, as shown in FIG. 13, a transparent glass substrate 11 is prepared (see FIG. 13A), and a pair of through-holes 12 and 13 are formed in the glass substrate 11 at positions spaced apart from each other (the same ( b)). A first electrode layer 19 made of ITO or the like is formed over one through hole 12 on the one surface side of the glass substrate 11 by sputtering, and this electrode layer 19 is also formed as a conductive layer 27 on the inner wall of the through hole 12. The conductive thin film portion 17 and the conductive layer 27 are formed around the other through-hole 13 and the inner wall surface of the through-hole 13 by the same material, and both the through-holes 12 and 13 are conductive inside. A through-hole configuration including the layer 27 is adopted (see (c)).

  Then, the external connection terminals 14 and 15 are press-fitted into the through holes 12 and 13 from the first electrode layer 19 and the conductive thin film portion 17 side, and the other ends of the external connection terminals 14 and 15 penetrate the glass substrate 11. The glass substrate 11 is projected outward (see (d)). One end of the external connection terminals 14 and 15 protruding from the glass substrate 11 is coated with a low melting point glass 28 to hold the through holes 12 and 13 and the external connection terminals 14 and 15 in an airtight manner (same as above). (See (e)).

  Next, an organic light emitting layer 20 such as α-NPD or Alq3 is formed on the first electrode layer 19 by a vacuum deposition method (see (f)), and further, LiF, Al on the organic light emitting layer 20. The second electrode layer 21 is formed by a vacuum deposition method, and the second electrode layer 21 is also connected to the other conductive thin film portion 17, whereby the second electrode layer 21 is The other external connection terminal 15 is connected (see (g)).

  Finally, in order to hermetically cut off each of the electrode layers 19 and 21 and the organic light emitting layer 20 from the outside, a sealing material 22 is applied to the peripheral portion of the glass substrate 11, and the glass substrate is in contact with the sealing material 22 A protective plate 23 made of glass, aluminum, or the like is disposed so as to face the substrate 11, and the sealing material 22 is solidified to bond and fix the glass substrate 11 and the protective plate 23 (see (h)). ).

  With this configuration, not only can the electrical connection between the external connection terminals 14 and 15 and the electrode layers 19 and 21 be reliably performed, but also the through holes 12 and 13 provided in the glass substrate 11. The airtightness can be reliably maintained.

  As a method of airtightly fixing the external connection terminals 14 and 15 to the glass substrate 11, an uneven portion can be formed on the glass substrate 11, and the external connection terminals 14 and 15 can be implanted in the uneven portion.

  That is, as shown in FIG. 14, a convex portion 29 that protrudes downward is provided in a portion where the through holes 12 and 13 for penetrating the external connection terminals 14 and 15 are formed, and above the convex portion 29, A recess 30 is formed in accordance with this deformation. By applying the conductor 18 such as silver paste using the recess 30, the conductor 18 can be applied without protruding from the surface of the glass substrate 11, so that the first electrode layer 19 and the like are flattened. In addition to being formed in a wide area by the flat conductor 18, the connection to the external connection terminals 14 and 15 can be reliably performed.

  The light emitting device having such a configuration can be manufactured as shown in FIG.

  That is, a transparent glass substrate 11 is prepared (see FIG. 15A), and a pair of convex portions 29 protruding downward are formed on the glass substrate 11 at positions spaced apart from each other. The through holes 12 and 13 are drilled (see (b)). The external connection terminals 14 and 15 are press-fitted into the through holes 12 and 13, and the other ends of the external connection terminals 14 and 15 penetrate the glass substrate 11 and protrude outward of the glass substrate 11 (see (c)). ).

  On the glass substrate 11 side opposite to the external connection terminals 14 and 15, the recesses 30 are formed around the through holes 12 and 13 corresponding to the protrusions 29. Or the like is filled (see (d)). On the one surface side of the glass substrate 11, a first electrode layer 19 made of ITO or the like is formed across the one conductor 18 by a sputtering method (see (e)).

  Next, an organic light emitting layer 20 such as α-NPD or Alq3 is formed on the first electrode layer 19 by a vacuum deposition method (see (f)), and further, LiF, Al on the organic light emitting layer 20. The second electrode layer 21 is formed by a vacuum vapor deposition method, and the second electrode layer 21 is also formed on the conductor 18 on the other external connection terminal 15. The second electrode layer 21 is electrically connected to the other external connection terminal 15 (see (g)).

  Finally, in order to hermetically cut off each of the electrode layers 19 and 21 and the organic light emitting layer 20 from the outside, a sealing material 22 is applied to the peripheral portion of the glass substrate 11, and the glass substrate is in contact with the sealing material 22 A protective plate 23 made of glass, aluminum, or the like is disposed so as to face the substrate 11, and the sealing material 22 is solidified to bond and fix the glass substrate 11 and the protective plate 23 (see (h)). ).

  By adopting such a manufacturing method, the first and second electrode layers 19 and 21 are formed on the conductor 18 formed to be the same plane as the plane of the glass substrate 11. Thus, the electrode layers 19 and 21 having a stable film thickness can be obtained.

  Further, as shown in FIG. 16, the end portions of the external connection terminals 14 and 15 are protruded outward from the recess 30, and silver is formed around the external connection terminals 14 and 15 planted in the recess 30. The first electrode layer 19 and the second electrode layer 21 may be formed so as to cover the protruding external connection terminals 14 and 15 by arranging a conductor 18 such as a paste. 15 and the electrode layers 19 and 21 can be reliably connected.

  Further, as shown in FIG. 17, the structure is such that a non-moisture permeable adhesive 25 is applied in the through holes 12 and 13 including the concave portion 30 and the external connection terminals 14 and 15 are arranged in the adhesive 25. However, the same effect can be exhibited, and further, as shown in FIG. 18, a conductor 18 such as a silver paste may be disposed at the end of the recess 30 of the moisture-impermeable adhesive 25. .

  Further, as shown in FIG. 19, the arrangement relationship of the concave and convex portions 30 and 29 is reversed so that the side on which the electrode layers 19 and 21 are formed becomes the convex portion 29 and the outer surface side of the glass substrate 11 becomes the concave portion 30. The external connection terminals 14 and 15 are arranged so that one end of the external connection terminals 14 and 15 is aligned with the tip of the convex portion 29 of the glass substrate 11 or the tip is projected from the convex portion 29 as shown in FIG. Furthermore, as shown in FIG. 21, a conductor 18 such as silver paste is disposed on the outer periphery of the protruding external connection terminals 14 and 15 including the outer periphery of the convex portion 29, Even if the first and second electrode layers 19 and 21 are formed, the same effect can be achieved. At that time, if the low melting point glass 28 is filled in the recess 30 located on the outer surface side of the glass substrate 11, the outer surface of the glass substrate 11 can be configured to be flat, and the external connection terminals 14 and 15 and the glass substrate. 11 can be hermetically sealed.

  Moreover, these light emitting devices can be formed not only in a planar shape but also as a spherical light emitting device with improved light emission luminance in the same occupied area.

  That is, as shown in FIG. 22, the glass substrate 11 is molded into a hemispherical shape, and a pair of through holes 12 and 13 are formed in the vicinity of the open end of the glass substrate 11. A moisture permeable adhesive 25 is applied. A first electrode layer 19 is disposed so as to cover one of the through holes 12 and 13, and a conductive thin film portion 17 is formed around the other through hole 13. In these through holes 12 and 13, external connection terminals 14 and 15 are implanted so as to penetrate the first electrode layer 19 and the conductive thin film portion 17, and one end of the external connection terminals 14 and 15 is outward from the glass substrate 11. The conductor 18 is attached to the inner end of the glass substrate 11 to electrically connect each of them. An organic light emitting layer 20 and a second electrode layer 21 are sequentially stacked on the upper side of the first electrode layer 19. The second electrode layer 21 is a conductive layer provided with the other external connection terminal 15. It is electrically connected to the body 18. A flat protective plate 23 is fixed to the open end side of the spherical glass substrate 11 through a sealing material 22 to form a spherical light emitting device.

  Thus, by forming the glass substrate 11 into a spherical shape, the area of the glass substrate 11 corresponding to the protective plate 23 can be relatively increased, and accordingly, the first and second electrode layers 19 are formed. , 21 and the organic light emitting layer 20 can be enlarged, so that the light emission luminance can be greatly improved. In other words, not only can the amount of light be increased with respect to the installation area, but also visibility from all directions can be greatly improved.

  This spherical light emitting device can be manufactured as shown in FIG. This figure shows a longitudinal section of the light-emitting device, and the figure with a '(dash) in the figure is viewed from the direction of the arrow in FIG. 23 (b) inside the spherical glass substrate of the light-emitting device. The cross section in the direction orthogonal to the cross section is shown.

  That is, first, a concave and hemispherical glass substrate 11 is formed (see FIG. 23A). A pair of opposed through holes 12 and 13 are formed near the open end of the glass substrate 11 (see (b) and (b ′)). A first electrode layer 19 made of ITO or the like is formed over the one through-hole 12 inside the glass substrate 11 by a sputtering method, and the other material is also conductive around the other through-hole 13 by the same material. The thin film portion 17 is formed (see (c) and (c ′)). Then, the external connection terminals 14 and 15 are fixed to the through holes 12 and 13 from the first electrode layer 19 and the conductive thin film portion 17 side by the moisture-impermeable adhesive 25, and the fixed external connection terminals 14 and 15 are connected. The other end penetrates the glass substrate 11 and protrudes outward from the glass substrate 11 (see (d) and (d ′)). A conductor 18 made of a conductive adhesive, silver paste or the like is attached to one end side of the external connection terminals 14 and 15 located inside the glass substrate 11, and the first electrode layer 19 and the conductive thin film portion 17. And the external connection terminals 14 and 15 are electrically connected (see (e) and (e ′)).

  Then, an organic light emitting layer 20 such as α-NPD or Alq3 is formed on the first electrode layer 19 by a vacuum deposition method (see (f) and (f ′)), and further on the organic light emitting layer 20. A second electrode layer 21 made of LiF, Al or the like is formed by a vacuum vapor deposition method and is also connected to the other conductive thin film portion 17, whereby the second electrode layer 21 is connected to the other outside. It is electrically connected to the connection terminal 15 (see (g) and (g ′)).

  Next, in order to hermetically block these electrode layers 19 and 21 and the organic light emitting layer 20 from the outside, a sealing material 22 is applied to the peripheral edge surface portion of the glass substrate 11, and the glass substrate is in contact with the sealing material 22 A flat plate-shaped protection plate 23 made of glass, aluminum material or the like is disposed so as to face the substrate 11, and the sealing material 22 is solidified to bond and fix the glass substrate 11 and the protection plate 23, thereby forming a spherical shape. A light emitting device is formed (see (h)).

  Further, as shown in FIG. 24, the spherical light emitting device is formed so that the conductive thin film portions 16 and 17 are formed in the portions of the through holes 12 and 13, respectively, and is in contact with the conductive thin film portions 16 and 17. The external connection terminals 14 and 15 are provided on one end, and one end of the external connection terminals 14 and 15 and the conductive thin film portions 16 and 17 are connected by a conductor 18 such as silver paste or a conductive adhesive. It is also possible to connect the first and second electrode layers 19 and 21 to each other.

  The same parts as those shown in FIG. 22 are denoted by the same reference numerals, and detailed description thereof is omitted.

  This spherical light emitting device can be manufactured as shown in FIG. FIG. 25 shows a longitudinal section of the light emitting device, as in the case shown in FIG. 23, and the figure with a dash in the drawing shows the inside of the spherical glass substrate of the light emitting device. It shows a cross section in a direction orthogonal to the cross section seen from the arrow direction in FIG.

  That is, first, a concave and hemispherical glass substrate 11 is formed (see FIG. 25A). A pair of opposed through holes 12 and 13 are formed near the open end of the glass substrate 11 (see (b) and (b ′)). Conductive thin film portions 16 and 17 are formed around the through holes 12 and 13 on the inner side of the glass substrate 11 (see (c) and (c ′)). Next, the external connection terminals 14 and 15 are fixed in the through holes 12 and 13 by the non-moisture permeable adhesive 25, and the other ends of the fixed external connection terminals 14 and 15 penetrate the glass substrate 11. 11 is projected outward (see (d) and (d ′)). A conductor 18 made of a conductive adhesive, silver paste or the like is attached to one end side of the external connection terminals 14 and 15 located on the inner side of the glass substrate 11, and the conductive thin film portions 16 and 17 and the external connection terminals 14. , 15 are electrically connected (see (e) and (e ′)).

  Thereafter, a first electrode layer 19 made of ITO or the like is formed by sputtering so as to be connected to the one conductive thin film portion 16 (see (f) and (f ′)). Then, an organic light emitting layer 20 such as α-NPD or Alq3 is formed on the first electrode layer 19 by a vacuum deposition method (see (g) and (g ′)), and further on the organic light emitting layer 20. A second electrode layer 21 made of LiF, Al or the like is formed by a vacuum vapor deposition method, and this second electrode layer 21 is also connected to the other conductive thin film portion 17, thereby the second electrode layer 21. The electrode layer 21 is connected to the other external connection terminal 15 (see (h) and (h ′)).

  Finally, in order to hermetically block these electrode layers 19 and 21 and the organic light emitting layer 20 from the outside, a sealing material 22 is applied to the peripheral edge surface portion of the glass substrate 11, and the glass 22 is in contact with the sealing material 22. A flat plate-shaped protective plate 23 made of glass, aluminum, or the like is disposed so as to face the substrate 11, the sealing material 22 is solidified, and the glass substrate 11 and the protective plate 23 are bonded and fixed to form a spherical shape. The light emitting device is formed (see (i)).

  Even if comprised in this way, it is possible to exhibit the same effect as said embodiment.

  Further, as in the flat light emitting device, in the hemispherical light emitting device, as shown in FIG. 26, the external connection terminals 14 and 15 are fixed in the through holes 12 and 13 by the non-moisture permeable adhesive 25, It is also possible to form the first and second electrode layers 19 and 21 so as to be directly connected to the fixed external connection terminals 14 and 15.

  The same parts as those shown in FIG. 22 are denoted by the same reference numerals, and detailed description thereof is omitted.

  Further, as shown in FIG. 27, through holes 12 and 13 having convex portions 29 projecting outward are formed in the glass substrate 11, and the concave portions 30 formed inside the glass substrate 11 in the through holes 12 and 13 are formed. It is also possible to adopt a configuration in which the conductor 18 is provided and the first and second electrode layers 19 and 21 are formed so as to be electrically connected to the external connection terminals 14 and 15 through the conductor 18.

  Furthermore, as shown in FIG. 28, the external connection terminals 14 and 15 are fixed in the through holes 12 and 13 by a non-moisture permeable adhesive 25, and the inner end of the glass substrate 11 of the non-moisture permeable adhesive 25 is silver. It is also possible to provide a structure in which the first and second electrode layers 19 and 21 are formed so that a conductor 18 such as a paste is provided and electrically connected to the external connection terminals 14 and 15 via the conductor 18. Is possible.

  On the other hand, as shown in FIG. 29, the through holes 12 and 13 are molded so as to have a convex shape inside the glass substrate 11, and the external connection terminals 14 and 15 are projected from the convex portion 29 to thereby form the conductor 18. And the first and second electrode layers 19 and 21 are connected to the conductor 18, or the first and second direct connection to the external connection terminals 14 and 15 as shown in FIG. It is also possible to connect the electrode layers 19 and 21.

  In the above description, the first electrode layer 19 formed of a transparent conductive film such as ITO is formed at a position in contact with the surface of the glass substrate 11, and the second electrode layer 21 formed of LiF, Al, or the like. Is located inside the glass substrate 11, the light emitting device has been described with respect to the case where the light irradiation direction is set in the outer direction of the glass substrate 11 opposite to the protective plate 23. In the case where the irradiation direction is changed to the direction of the protective plate 23, the transparent conductive film is formed at the position of the second electrode layer 21 by manufacturing the constituent materials of the first and second electrode layers 19 and 21 opposite to each other. If it is configured to be positioned, light can be irradiated in the direction of the protective plate 23.

  In this case, since the radiated light does not pass through the glass substrate 11 side, the wiring connection with respect to the external connection terminals 14 and 15 of the glass substrate 11 can be freely performed and the radiated light can be installed without blocking. And the degree of design freedom can be improved.

1 is a partially cutaway perspective view and cross-sectional view showing a first embodiment of a light emitting device according to the present invention. Process explanatory drawing for demonstrating the manufacturing method of a light-emitting device similarly. Sectional drawing which shows 2nd Embodiment of the light-emitting device which concerns on this invention. Process explanatory drawing for demonstrating the manufacturing method of a light-emitting device similarly. Process explanatory drawing for demonstrating the other manufacturing method of a light-emitting device similarly. Sectional drawing which shows 3rd Embodiment of the light-emitting device which concerns on this invention. Process explanatory drawing for demonstrating the manufacturing method of a light-emitting device similarly. Sectional drawing which shows 4th Embodiment of the light-emitting device which concerns on this invention. Sectional drawing which shows 5th Embodiment of the light-emitting device based on this invention. Sectional drawing which shows 6th Embodiment of the light-emitting device which concerns on this invention. The partially cutaway perspective view showing a seventh embodiment of a light emitting device according to the present invention. The cross-sectional view similarly. Process explanatory drawing for demonstrating the manufacturing method of a light-emitting device similarly. Sectional drawing which shows 8th Embodiment of the light-emitting device which concerns on this invention. Process explanatory drawing for demonstrating the manufacturing method similarly. Sectional drawing which shows 9th Embodiment of the light-emitting device based on this invention. Sectional drawing which shows 10th Embodiment of the light-emitting device which concerns on this invention. Sectional drawing which shows 11th Embodiment of the light-emitting device which concerns on this invention. Sectional drawing which shows 12th Embodiment of the light-emitting device based on this invention. Sectional drawing which shows 13th Embodiment of the light-emitting device based on this invention. Sectional drawing which shows 14th Embodiment of the light-emitting device based on this invention. Sectional drawing which shows 15th Embodiment of the light-emitting device based on this invention. Process explanatory drawing for demonstrating the manufacturing method similarly. Sectional drawing which shows 16th Embodiment of the light-emitting device based on this invention. Process explanatory drawing for demonstrating the manufacturing method similarly. Sectional drawing which shows 17th Embodiment of the light-emitting device based on this invention. Sectional drawing which shows 18th Embodiment of the light-emitting device based on this invention. Sectional drawing which shows 19th Embodiment of the light-emitting device based on this invention. Sectional drawing which shows 20th Embodiment of the light-emitting device based on this invention. Sectional drawing which shows 21st Embodiment of the light-emitting device based on this invention. The partially notched perspective view which shows the conventional light-emitting device. The cross-sectional view similarly.

Explanation of symbols

11: Glass substrate 12, 13: Through hole 14, 15: External connection terminal 16, 17: Conductive thin film portion 18: Conductor 19: First electrode layer 20: Organic light emitting layer 21: Second electrode layer 22: Sealing body 23: Protection plate 25: Non-moisture permeable adhesive 27: Conductive layer 29: Convex part 30: Concave part

Claims (10)

A transparent glass substrate,
A first electrode layer formed on the glass substrate;
An organic light emitting layer laminated on the electrode layer;
A second electrode layer laminated on the organic light emitting layer;
A pair of external connection terminals respectively connected to the first and second electrode layers and planted on the glass substrate so as to protrude on the opposite side of the electrode layer;
A protective plate disposed to face the glass substrate so as to protect the electrode layer and the organic light emitting layer;
A sealing material interposed between the protective plate and the glass substrate to seal between the two,
The light emitting device, wherein the external connection terminals are arranged in a direction intersecting the glass substrate.   2. The light emitting device according to claim 1, wherein the external connection terminal is connected to the electrode layers directly or via a conductor on the electrode layer side of the glass substrate.   The light emitting device according to claim 1, wherein the external connection terminal is fixed to the through hole formed in a concave portion or a convex portion formed in the glass substrate.   4. The light emitting device according to claim 1, wherein the external connection terminal is fixed via a conductor in the through hole formed in the glass substrate. 5.   The glass substrate is formed in a hemispherical shape so as to hold the electrode layers and the organic light emitting layer inside, and the hemispherical glass substrate end is sealed with the protective plate. Item 5. The light emitting device according to any one of Items 1 to 4. Drilling a pair of spaced-apart through holes penetrating the glass substrate in the glass substrate;
A step of implanting an external connection terminal in the through hole;
Forming a first electrode layer on the glass substrate so as to be electrically connected to one of the external connection terminals;
Laminating an organic light emitting layer on the first electrode layer;
Laminating a second electrode layer located on the organic light emitting layer and electrically connected to the other of the external connection terminals;
The electrode layer and the organic light emitting layer consist of a step of sealing in an airtight state with a sealing material with a protective plate facing the glass substrate,
A method for manufacturing a light emitting device, characterized in that one end of the external connection terminal protrudes in an outward direction intersecting the glass substrate.   The method of manufacturing a light emitting device according to claim 6, wherein a conductive thin film is formed around one end of the external connection terminal, and each electrode layer and the external connection terminal are connected via the thin film.   8. The light emitting device according to claim 6, wherein when the first electrode layer is formed on one side of the through hole, a conductive thin film is simultaneously formed on the other through hole portion. Manufacturing method.   The method for manufacturing a light emitting device according to claim 6, wherein a concave portion or a convex portion is formed in the glass substrate, and the through hole is formed in the concave portion or the convex portion. .   The method for manufacturing a light emitting device according to any one of claims 6 to 9, wherein a glass substrate that is molded in a hemispherical shape in advance is used as the glass substrate.

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