CN108011051B - A kind of organic light emitting display panel and its display device - Google Patents
A kind of organic light emitting display panel and its display device Download PDFInfo
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- CN108011051B CN108011051B CN201711234889.XA CN201711234889A CN108011051B CN 108011051 B CN108011051 B CN 108011051B CN 201711234889 A CN201711234889 A CN 201711234889A CN 108011051 B CN108011051 B CN 108011051B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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Abstract
The embodiment of the present invention provides a kind of organic light emitting display panel and its display device, is related to field of display technology, for reducing the border width of organic light emitting display panel.Wherein, which includes: first substrate, and the first substrate includes display area and the packaging area around the display area；The second substrate being oppositely arranged with the first substrate；Packaging plastic for the first substrate and the second substrate to be bonded together, the packaging plastic are located at the packaging area in the orthographic projection of the first substrate in the orthographic projection of the first substrate；The first substrate further includes a plurality of signal wire, the packaging area includes first area, in the first area, the orthographic projection of at least partly described a plurality of signal wire on the first substrate and the orthographic projection of at least partly described packaging plastic on the first substrate are overlapping.Above-mentioned organic light emitting display panel is suitable in display device.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of organic light emitting display panels and its display device.
Background technique
Compared with many display panels, OLED (Organic Light-Emitting Diode, hereinafter referred to as OLED) is aobvious
Show panel and have many advantages, such as actively to shine, high contrast, no angle limit etc. its.OLED display panel not only in volume more
Add frivolous, also below other display devices in power consumption, to help to be promoted the cruising ability of display device, therefore, OLED is aobvious
Show that panel is widely used in field of display technology, the main product of display device from now on will be become.
As the function of display is more and more, the quantity of the various connecting lines in OLED display panel is set also increasingly
More, these connecting lines are arranged in the frame of display device, and the frame size that will lead to display device is larger.
With the arrival in comprehensive screen epoch, how to reduce the border width of OLED display panel, currently face in the industry
Main difficult technical.
Summary of the invention
The embodiment of the present invention provides a kind of organic light emitting display panel and its display device, for reducing OLED display panel
Border width.
In a first aspect, the present invention provides a kind of organic light emitting display panel, organic light emitting display panel includes:
First substrate, the first substrate include display area and the packaging area around the display area；
The second substrate being oppositely arranged with the first substrate；
Packaging plastic for the first substrate and the second substrate to be bonded together, the packaging plastic is described
The orthographic projection of one substrate is located at the packaging area in the orthographic projection of the first substrate；
The first substrate further includes a plurality of signal wire, and the packaging area includes first area,
In the first area, the orthographic projection of at least partly described a plurality of signal wire on the first substrate at least
The orthographic projection of the part packaging plastic on the first substrate is overlapping.
Second aspect, the present invention provide a kind of display device, which includes involved by first aspect present invention
Organic light emitting display panel.
Having the beneficial effect that the aspect and any possible implementation manners as described above:
In the present invention, in first area, at least partly a plurality of signal wire is set, and at least partly a plurality of signal wire is first
Orthographic projection and at least partly orthographic projection of packaging plastic on the first substrate on substrate is overlapping, that is to say, that this is at least partly more
Signal line is arranged in first area, and due to a part that the first area is packaging area, it will thus be appreciated that at least
Segment signal line is arranged in packaging area.It, can be by partial amt in the present embodiment for the signal wire of equivalent amount
Signal wire is arranged in packaging area, to reduce the width of routing region；Alternatively, for commensurateiy wide signal wire and
It says, a part of signal wire itself can be arranged in packaging area in the present embodiment, and then reduce the signal wire and occupy
The width in line region.Above two mode can reduce the border width of organic light emitting display panel, and increasing this accordingly has
The width of display area in machine light emitting display panel.For compared with the prior art, the present embodiment can effectively reduce organic hair
The border width of light display panel, conducive to the realization of narrow frame.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Bright some embodiments for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is a kind of structural schematic diagram of organic light emitting display panel provided by the embodiment of the present invention；
Fig. 2 provides a kind of structural schematic diagram of first substrate by the embodiment of the present invention；
Fig. 3 is the sectional view of the position AA ' in Fig. 2 provided by the embodiment of the present invention；
Fig. 4 is another structural schematic diagram of first substrate provided by the embodiment of the present invention；
Fig. 5 is the sectional view of the position BB ' in Fig. 4 provided by the embodiment of the present invention；
Fig. 6 is another structural schematic diagram of organic light emitting display panel provided by the embodiment of the present invention；
Fig. 7 is another structural schematic diagram of first substrate provided by the embodiment of the present invention；
Fig. 8 is another structural schematic diagram of first substrate provided by the embodiment of the present invention；
Fig. 9 is another structural schematic diagram of organic light emitting display panel provided by the embodiment of the present invention；
Figure 10 is another structural schematic diagram of first substrate provided by the embodiment of the present invention；
The sectional view of the position CC ' in Figure 10 provided by Figure 11 embodiment of the present invention
Figure 12 is another structural schematic diagram of first substrate provided by the embodiment of the present invention；
Figure 13 is the sectional view of the position DD ' in Fig. 7 provided by the embodiment of the present invention；
Figure 14 is another structural schematic diagram of first substrate provided by the embodiment of the present invention；
Figure 15 is a kind of sectional view of the position EE ' in Figure 14 provided by the embodiment of the present invention；
Another sectional view of the position EE ' in Figure 14 provided by Figure 16 embodiment of the present invention；
Figure 17 is another structural schematic diagram of first substrate provided by the embodiment of the present invention；
Figure 18 is the sectional view in Figure 17 provided by the embodiment of the present invention at the position FF '；
Figure 19 is another sectional view in Figure 17 provided by the embodiment of the present invention at the position FF '；
The structural schematic diagram of display device provided by Figure 20 embodiment of the present invention.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
Every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
The term used in embodiments of the present invention is only to be not intended to be limiting merely for for the purpose of describing particular embodiments
The present invention.In the embodiment of the present invention and the "an" of singular used in the attached claims, " described " and "the"
It is also intended to including most forms, unless the context clearly indicates other meaning.
It should be appreciated that term "and/or" used herein is only a kind of incidence relation for describing affiliated partner, indicate
There may be three kinds of relationships, for example, A and/or B, can indicate: individualism A, exist simultaneously A and B, individualism B these three
Situation.In addition, character "/" herein, typicallys represent the relationship that forward-backward correlation object is a kind of "or".
It will be appreciated that though substrate may be described in embodiments of the present invention using term first, second etc., but these
Substrate should not necessarily be limited by these terms.These terms are only used to for substrate being distinguished from each other out.For example, not departing from the embodiment of the present invention
In the case where range, first substrate can also be referred to as the second substrate, and similarly, the second substrate can also be referred to as the first base
Plate.
It should be noted that the nouns of locality such as "upper", "lower" described in the embodiment of the present invention, "left", "right" are with attached drawing
Shown in angle come what is be described, should not be construed as the restriction to the embodiment of the present invention.Furthermore within a context, it is also necessary to manage
Solution can not only be formed directly into another when mentioning an element and being formed on "above" or "below" another element
Perhaps "lower" can also be indirectly formed by intermediary element in another element "upper" or "lower" for a element "upper".
The present embodiment provides a kind of organic light emitting display panels, as shown in Figure 1, it is to have provided by the embodiment of the present invention
A kind of structural schematic diagram of machine light emitting display panel, the organic light emitting display panel 500 include first substrate 1 and first substrate 1
The second substrate 2 being oppositely arranged, and the packaging plastic 3 for first substrate 1 and the second substrate 2 to be bonded together, it is inevitable, it should
Packaging plastic 3 is arranged between first substrate 1 and the second substrate 2.
Wherein, as shown in Fig. 2, it provides a kind of structural schematic diagram of first substrate by the embodiment of the present invention, this first
Substrate 1 includes that the side of first substrate 1 is arranged in display area 10 and the packaging area 30 around display area 10, packaging area 30
Frame surrounding.Packaging plastic 3 is located at packaging area 30 in the orthographic projection of first substrate 1 in the orthographic projection of first substrate 1, that is,
Say, it is shown in Fig. 2 go out first direction 100 on, packaging plastic 3 on first substrate 1 the width of orthographic projection maximum value be encapsulation region
The width b in domain 30.
With continued reference to Fig. 2, which further includes a plurality of signal wire 4, and packaging area 30 includes first area 301；?
In first area 301, the orthographic projection of at least partly a plurality of signal wire 4 on first substrate 1 and at least partly packaging plastic 3 are first
Orthographic projection on substrate 1 is overlapping.Packaging area 30 can be interpreted as to the region that packaging plastic 3 is covered in the present embodiment, that is,
The region that the orthographic projection of packaging plastic 3 on first substrate 1 is covered.At this point, " in first area 301, at least partly a plurality of letter
Number orthographic projection of line 4 on first substrate 1 is overlapping at least partly orthographic projection of packaging plastic 3 on first substrate 1 ", at least may be used
Understand that the signal wire 4 is arranged in the first area 301 of packaging area 30 out, further there is the following two kinds understanding:
The first is as described in Figure 3 the sectional view of the position AA ' in Fig. 2 provided by the embodiment of the present invention, a plurality of letter
The signal wire 4 of partial amt in number line 4 is arranged in first area 301.Signal wire 4 is also possible to be arranged in packaging area 30
The region except first area 301 is removed, but this example is not particularly limited it.The present embodiment is due to by a plurality of signal
The signal wire 4 of a part of quantity in line 4 is arranged in packaging area 30, can reduce routing region (explain in detail and see below) width
Degree, and then reduce the border width of entire organic light emitting display panel 500.
Second, as shown in Figure 4 and Figure 5, Fig. 4 is that another structure of first substrate provided by the embodiment of the present invention is shown
It is intended to, Fig. 5 is the sectional view of the position BB ' in Fig. 4 provided by the embodiment of the present invention, and a part setting of signal wire 4 itself exists
In first area 301.Since a part setting of signal wire 4 itself in first area 301 (packaging area), being reduced relatively
Signal wire 4 accounts for the width of routing region (as detailed below), and the frame that can significantly reduce organic light emitting display panel 500 is wide
Degree.
Certainly, it may also comprise a plurality of signal wire 4 in display area 10, not to being arranged in display area 10 in the present embodiment
Place film layer, quantity and the width of signal wire 4 etc. make and being particularly limited to.
Light-emitting component in organic light emitting display panel be prepared by organic material, although its have actively shine,
The advantages such as contrast is higher, but the organic material in light-emitting component is easy to receive the intrusion of aqueous vapor and oxygen, so that this shines
Aging and denaturation occur for element, to influence brightness and the service life of the light-emitting component.
To solve the above-mentioned problems, it needs to be sealed organic light emitting display panel encapsulation, is used in the present embodiment molten
Packaging technology is connect, i.e., packaging plastic 3 is heated using laser spot, it is made to be molten into liquid, by the frame of first substrate 1 and
The frame of two substrates 2 is bonded together, so that forming closed area between first substrate 1 and the second substrate 2, obstructs extraneous water
It is invaded with oxygen from the side of the organic light emitting display panel 500, further prevents the hair in the organic light emitting display panel 500
Optical element contacts water and oxygen.Packaging plastic 3 in the present embodiment can be glass cement (Frit) material, inhale in this kind of material containing laser
The property received pigment, becomes molten condition after absorbing light, to can reach good adhesive effect, sealing effect is preferable.
In order to make the packaging plastic absorb more light, at least partly a plurality of letter is arranged in first area 301 in the present embodiment
Number line 4, the orthographic projection of at least partly a plurality of signal wire 4 on first substrate 1 at least partly packaging plastic 3 on first substrate 1
Orthographic projection it is overlapping, that is to say, that at least partly a plurality of signal wire 4 is arranged in first area 301, and due to firstth area
Domain 301 is a part of packaging area 30, it will thus be appreciated that the signal wire is arranged in packaging area 30.Due to the signal wire
4 material can be metal, illustratively can be metal molybdenum so that the signal wire 4 can reflection laser spot, again by the laser spot of reflection
Secondary irradiation packaging plastic 3 improves irradiation temperature, promotes packaging plastic 3 to the absorbability of laser, reaches preferably fusing effect.
Organic light emitting display panel in the prior art includes display area, the routing region of display area periphery, and is walked
Line region all around around packaging area.The orthographic projection of the routing region on the first substrate and packaging area are on the first substrate
Orthographic projection no overlap, that is to say, that it is aobvious that the routing region and the packaging area around the routing region constitute organic light emission
Show the non-display area in panel.A plurality of signal wire in the prior art is arranged in the routing region on the outside of display area.Mesh
Before, with being gradually increased for display screen, the signal wire in scanning circuit is that quantity is consequently increased.However, corresponding specific ruler
For very little organic light emitting display panel, the quantity of signal wire increases, and certainly will will increase the width of routing region, thus accordingly
The width of display area reduces.Furthermore border width increases, and also disagrees with present fashion trend.
In the present embodiment, in first area 301, at least partly a plurality of signal wire 4, at least partly a plurality of signal wire are set
4 orthographic projection on first substrate 1 is overlapping at least partly orthographic projection of packaging plastic 3 on first substrate 1, that is to say, that should
At least partly a plurality of signal wire 4 is arranged in first area 301, and since the first area 301 is one of packaging area 30
Point, it will thus be appreciated that at least partly signal wire is arranged in packaging area 30.For the signal wire of equivalent amount, this reality
Applying in example, the signal wire of partial amt can be arranged in packaging area, to reduce the width of routing region；Alternatively, for
For the signal wire of commensurateiy wide, a part of signal wire itself can be arranged in packaging area in the present embodiment, and then subtract
The small signal wire occupies the width of routing region.The frame that above two mode can reduce organic light emitting display panel is wide
Degree, increases the width of display area in the organic light emitting display panel accordingly.For compared with the prior art, the present embodiment
The border width of organic light emitting display panel can be effectively reduced, conducive to the realization of narrow frame.
In a kind of feasible embodiment, as shown in fig. 6, it is organic light emitting display provided by the embodiment of the present invention
Another structural schematic diagram of panel, the organic light emitting display panel 500 further include area of isolation 20, and the setting of area of isolation 20 exists
Between packaging area 30 and display area 10, from packaging area 30 to the direction of display area 10 on, direction as illustrated in FIG. 6
On 100, the width y of area of isolation is 45~55 millimeters.Cabling is also provided between display area 10 and area of isolation 20
Scanning element 9 can be arranged in the routing region 60, can be easy to burn comprising at least partly heated in scanning element 9 for region 60
Device, the setting of area of isolation 20 is to avoid device heated in order to protect device in routing region 60 and burn in the present embodiment.
This is because the temperature of laser spot is higher in encapsulation process, it is heated and burns in encapsulation process to there can be device
Situation.The range for how selecting the area of isolation, is a technological difficulties, inventor by test of many times, repeatedly conscientious grind
Show that the width of the area of isolation 20 is arranged between 45~55 millimeters after studying carefully, it optionally, can be by the isolation in the present embodiment
The width in region 20 is set as 50 millimeters.When the width of area of isolation 20 is less than 45 millimeters, the device in routing region 60 is set
Part distance packaged region 30 is more closely damaged vulnerable to heat；When the width of area of isolation 20 is greater than 55 millimeters, although routing region 60
Interior device is not easy to be excited the influence of hot spot, and still, the width of area of isolation 20 increases, and it is narrow to be unfavorable for organic light emitting display panel
The realization of frame, is disagreed with fashion trend.For the organic light emitting display panel of specific dimensions, the width of area of isolation
It is larger, then mean that the big width in display area is relatively small, is unfavorable for the realization of narrow frame.
It should be noted that the area of isolation 20 is only in the device for needing with being easily affected by temperature, there are ability when certain distance
It can be arranged；If device and/or cabling (signal wire) high temperature resistant, laser spot on its without significantly influence when, can be not provided with this every
From region 20.
In a kind of feasible embodiment, as shown in fig. 7, it is the another of first substrate provided by the embodiment of the present invention
A kind of structural schematic diagram, the packaging area 30 are first area 301.Embodiment in conjunction with shown in above-mentioned Fig. 2 and Fig. 4 can
Know, at least partly signal wire 4 may be provided in the first area 301, at this time it is understood that in the present embodiment at least partly
A plurality of signal wire 4 is arranged in entire packaging area 30, i.e., relatively greater number of signal wire 4 is arranged in packaging area 30.
Greater number of signal wire 4 is arranged in packaging area 30, can reduce the width of routing region, reduce organic light emitting display
The border width of panel 500.Simultaneously as the material of the signal wire is that metal molybdenum reflects more laser in encapsulation process
Spot, and then reach preferable packaging effect.
In one embodiment, as shown in figure 8, it is tied for the another of first substrate provided by the embodiment of the present invention
Structure schematic diagram, the display area 10 include: the first display area 101 and at least two second display areas 102, and two second aobvious
Show that region 102 is located at the same side of the first display area 101, and there is first area between two the second display areas 102
301.In conjunction with the embodiment of above-mentioned Fig. 2 and Fig. 4, in the present embodiment, which can be arranged in the first area 301,
That is, the indentation, there of the organic light emitting display panel, the area between two the second display areas 102 is arranged in the signal wire 4
Domain can be regarded as the gap regions of the organic light emitting display panel.It should be noted that in other implementations, the first display
The quantity of region 101 and the second display area 102 can be to be multiple, and the quantity of gap regions may be multiple, the application couple
This is not specifically limited.
In another embodiment, as shown in figure 9, it is organic light emitting display panel provided by the embodiment of the present invention
Another structural schematic diagram, connected by connection side 501 between the two adjacent sides of organic light emitting display panel 500, connection
The shape on side 501 be can be the shape on arc illustrated in fig. 9 or the connection side can also be straight line, the setting of signal wire 4 is even
In first area 301 at edge fit 501.
In one embodiment, as shown in Figure 10 and Figure 11, Figure 10 is first substrate provided by the embodiment of the present invention
Another structural schematic diagram, Figure 11 is the sectional view of the position CC ' in Figure 10 provided by the embodiment of the present invention, the first substrate
1 further includes the package metals layer 5 positioned at packaging area 30, the orthographic projection of package metals layer 5 on first substrate 1 and signal wire 4
Orthographic projection no overlap on first substrate 1, that is to say, that be separated from each other, do not have between package metals layer 5 and the signal wire 4
The case where in the presence of contact, covering.It the position of the package metals layer 5, can be opposite for 4 position of signal wire
Closer to display area or its can be relatively distant from display area.In the present embodiment, since the signal of signal wire 4 needs to transmit
Into display area 10 in corresponding circuit, therefore, the setting of package metals layer 5 in the present embodiment is separate in a plurality of signal wire 4
The side of display area 10, as shown in Figure 8 and Figure 9.Those skilled in that art are it should be understood that in some realization sides of the application
In formula, the package metals layer and signal wire being set in first area play reflection laser all to enhance the work of packaging effect
With.In the case where there is signal wire in the first region, in the settable encapsulation gold in the region that the region is not covered by signal wire
Belong to layer 5, and the package metals layer 5 and neighbouring signal wire are insulated or in electrical contact.Therefore the embodiment of the present application for
Package metals layer 5, which is set to signal wire 4 and is relatively distant from display area closer to display area or signal wire 4, not to be limited specifically
It is fixed, depending on being needed with specific reference to actual design.
It should be noted that the material of the package metals layer 5 in the present embodiment is metal, it illustratively can be metal molybdenum,
It is reflective it acts as being carried out to laser spot in encapsulation process, and the laser spot of reflection is irradiated on packaging plastic again, so that
Packaging plastic preferably melts, to preferably bond first substrate and the second substrate.Also, due to glutinous after packaging plastic fusing
Degree is higher, after cooling solidification, can generate certain stress, in order to which the stress release is fallen, in order to avoid influence sealing performance, this reality
It applies in example and sets engraved structure for the package metals layer, to will be answered after the encapsulation adhesive curing by the stomata of the hollow out
Power release, reaches good packaging effect.
In addition, package metals layer and signal wire can be located at different film layers, identical film layer may also be at, it is excellent in this example
Choosing, package metals layer is located on the same floor with film layer where signal wire.On the one hand can reduce by a step prepares signal for such setting
The step of line or package metals layer, on the other hand in encapsulation process, distance and package metals of the signal wire apart from laser spot
Distance of the layer apart from laser spot is identical, to keep the amount of laser light reflected at each position in packaging area balanced, convenient for obtain compared with
Good packaging effect.
It further, as shown in figure 12, is another structural representation of first substrate provided by the embodiment of the present invention
Figure, inventor narrow frame and packaging effect in order to balance, has carried out the width of the package metals layer in packaging area deep
Research, obtains after multiple data verification, on from packaging area 30 to the direction 100 of display area 10, the width of package metals layer 5
Degree is a, and the width of packaging area 30 is b, wherein b/2≤a≤3b/4.Specifically, the width of package metals layer 5 is less than encapsulation
When the half of the width b in region 30, packaging effect is poor, it is to be understood that the amount of the laser spot of package metals layer reflection
It is smaller, to extend the use time of laser spot, the light-emitting component in display area may be impacted；Package metals layer
After 5 width is smaller, also it is unfavorable for release and encapsulates the stress after adhesive curing, influence packaging effect.The width of package metals layer is too
Greatly, after 3/4ths of the width beyond packaging area 30, although packaging effect is preferable, remaining width is smaller, is unfavorable for
Setting signal line, further, even if being provided with signal wire, reduced border width on remaining a quarter width
It is very limited.The present embodiment is preferred, and the width a of the package metals layer is about 5/8ths of packaging area width.
With continued reference to Figure 10, on from packaging area 30 to the direction 100 of display area 10, the width c of signal wire 4 is 20~
30 microns.How to determine that the width of signal wire is a technological difficulties, the too wide organic light emitting display panel that will affect of signal wire
Border width, signal wire is too narrow and can impact to signal transmission.Inventor show that signal wire 4 exists after deeply studying intensively
On from packaging area 30 to the direction 100 of display area 10, width is 20~30 microns.This is because signal wire 4 is square herein
To the width on 100 less than 20 microns after, the resistance of signal wire 4 is relatively large, causes biggish obstruction to the transmission of signal.Letter
Number line 4 is after the width on above-mentioned direction 100 is greater than 30 microns, although being conducive to the transmission of signal, organic light emission can be made aobvious
Show that the border width of panel broadens, is unfavorable for the realization of narrow frame.This example is preferred, and the signal wire 4 is on above-mentioned direction 100
Width be 25 microns.
The film layer structure of first substrate 1 in the implementation of the application is simply introduced below:
As shown in figure 13, be the sectional view of the position DD ' in Fig. 7 provided by the embodiment of the present invention, from first substrate 1 to
On the direction 200 of the second substrate 2, first substrate 1 includes substrate layer 50, active layer 11, grid layer 14, capacitance electrode layer 15.Its
In, above structure is arranged in display area 10, also, the first substrate 1 further includes the source electrode being electrically connected with active layer 11
18 are electrically connected with drain electrode 17, source electrode 18 or drain electrode 17 with anode (not shown), anode and luminescent layer (not shown)
It is electrically connected, is additionally provided with cathode (not shown) on luminescent layer, applies voltage between the anode and cathode, then luminescent layer emits
Visible light out.
It is apparent that insulating layer can be arranged between each layer of structure, illustratively, with continued reference to Figure 13, active layer 11 with
It is provided with gate insulating layer 12 between grid layer 14, the first interlayer insulating film is provided between grid layer 14 and capacitance electrode layer 15
13, it is provided with the second interlayer insulating film 16 between capacitance electrode layer 15 and source electrode 18 and/or drain electrode 17, and in source electrode 18
And/passivation layer 19 is additionally provided between drain electrode 17 and anode.
In addition, it is necessary to explanation, above structure is for realizing the display function of display area and must prepare,
And in packaging area 30, since the packaging area 30 is not used in display, the film layer of needs is optionally prepared, no
All film layers must be prepared, to achieve the purpose that save preparation time.
It is first substrate provided by the embodiment of the present invention as shown in figure 14 in a kind of feasible embodiment
Another structural schematic diagram, first substrate 1 further include a plurality of connecting line 6, and a plurality of connecting line 6 is electrically connected with a plurality of signal wire 4；And
6 place film layer of connecting line is different from 4 place film layer of signal wire.In conjunction with above-described embodiment, a part of signal wire 4 or a plurality of letter
Partial amt signal wire 4 in number line 4 is arranged in packaging area 30, and the frame on the one hand reducing organic light emitting display panel is wide
On the other hand degree is alternatively arranged as reflecting metal when encapsulation, reflects laser spot.When signal wire 4 is as reflecting metal, meeting
By the irradiation of laser spot, temperature is increased, since the heating conduction of metal is stronger, at this point, if by the reflecting metal (signal wire
4) directly it is connected with the scanning circuit unit in display area 10, then there can be the wind for burning the device in scanning circuit unit
Danger, therefore, avoids the presence of the above problem, i.e., by one end of signal wire 4 and connection by way of thread-changing in the present embodiment
Line 6 is electrically connected, and connecting line 6 is electrically connected with scanning circuit unit again.You need to add is that in the present embodiment, signal wire 4 with connect
As long as line 6 is not in same film layer and point connection each other, film layer position where the present embodiment is not specific to the two carry out
It is special to limit.
Further, with continued reference to Figure 14, first substrate 1 further includes scanning element 9, and connecting line 6 is not electrically connected with signal wire 4
The one end connect is electrically connected to scanning element 9.It is understood that scanning element is used to provide unlatching scanning letter for each grid line
Number.Signal wire 4 in the present embodiment can provide signal for scanning element.Illustratively, the signal wire 4 being related in the present embodiment
To be at least one or more of clock cable, high level signal line, low level signal line, initial signal line.For example, should
Signal wire 4 can be clock cable, can provide clock signal for the scanning element 9；The signal wire 4 is high level signal line, can
High level signal is provided for the scanning element 9；The signal wire 4 is low level signal, and low level letter can be provided for the scanning element 9
Number；The signal 4 is initial signal, can provide initial open signal for the scanning element 9.
Illustratively, the film layer relationship where signal wire 4 and connecting line 6 is introduced in the present embodiment:
In a kind of specific embodiment, Figure 15 is one kind of the position EE ' in Figure 14 provided by the embodiment of the present invention
4 place film layer of signal wire can be located on the same floor in the present embodiment by sectional view with grid layer 14；6 place film layer of connecting line and electricity
Hold electrode layer 15 to be located on the same floor.On the one hand, capacitance electrode layer 15 and grid layer are all metallic diaphragms, and the illustrative metal can
It may make the signal transmission performance of the two consistent at this point, signal wire 4 is identical as the material of connecting line 6 for metal molybdenum, it can't
The transmission of signal is impacted；On the other hand, signal wire 4 and grid layer 14 are located at same film layer, connecting line 6 and capacitance electrode
Layer 15 is located at same film layer and is convenient for since grid layer 14 (signal wire 4) is close with the film layer of capacitance electrode layer 15 (connecting line 6)
Signal wire 4 is electrically connected with connecting line 6.Illustratively, the present embodiment can be by way of punching by signal wire 4 and connecting line 6
Electrical connection.It should be noted that this example of the specific structure of scanning element 9 is not unfolded to discuss to it.
In another specific embodiment, Figure 16 is the another of the position EE ' in Figure 14 provided by the embodiment of the present invention
A kind of sectional view, 4 place film layer of signal wire are located on the same floor with capacitance electrode layer 15；6 place film layer of connecting line and grid layer 14
Positioned at same film layer.On the one hand, capacitance electrode layer 15 and grid layer are all metallic diaphragms, and the illustrative metal can be metal
Molybdenum may make the signal transmission performance of the two consistent at this point, signal wire 4 is identical as the material of connecting line 6, can't be to signal
Transmission impact；On the other hand, signal wire 4 and capacitance electrode layer 15 are located at same film layer, connecting line 6 and grid layer 14
In same film layer, since grid layer 14 (connecting line 6) is close with the film layer of capacitance electrode layer 15 (signal wire 4), it is convenient for signal wire 4
With being electrically connected for connecting line 6.
In one embodiment, as shown in Figure 17 and Figure 18, Figure 17 is first substrate provided by the embodiment of the present invention
Another structural schematic diagram, Figure 18 is a kind of sectional view provided by the embodiment of the present invention in Figure 17 at the position FF ', first
Substrate 1 includes the substrate layer 50 and array layer 40 being stacked, and array layer 40 includes a plurality of signal wire 4, and array layer 40 is located at lining
Bottom 50 is close to the side of the second substrate 2；Through-hole 7 is provided on array layer 40, orthographic projection of the through-hole 7 on substrate layer 50 is located at
In the orthographic projection on substrate layer 50, packaging plastic 3 is filled in through-hole 7 packaging plastic 3, and is contacted by through-hole 7 with substrate layer 50.
It should be noted that since the through-hole 7 in the orthographic projection on substrate layer 50 is located at packaging plastic 3 on substrate layer 50
In orthographic projection, it will be appreciated that be that the through-hole 7 is located in packaging area 30.Also, the through-hole 7 is engraved structure, that is to say, that logical
Film layer structure at 7 position of hole is removed.In addition, since the adhesive force between packaging plastic 3 and glass is stronger, this reality
Packaging plastic 3 is directly contacted with substrate layer 50 (substrate glass) in applying by through-hole 7, it can effectively lift-off seal performance.
A layer structure is prepared on the substrate glass (substrate layer 50), this layer of structure can be referred to as array layer 40, also
It is to say, which may include the above-mentioned layer structure being related to, for example, active layer 11, grid layer 14 and capacitance electrode layer 15
Deng.
In a kind of specific embodiment, with continued reference to Figure 17 and Figure 18, from packaging area 30 to display area 10
On direction 100, a plurality of through-hole 7 is intervally arranged with a plurality of signal wire 4；Orthographic projection of the signal wire 4 on substrate layer 50 and through-hole 7 exist
Orthographic projection no overlap on substrate layer.Signal wire 4 is alternatively arranged with through-hole 7, it will be appreciated that is letter adjacent in packaging area 30
Through-hole 7 is arranged in region between number line 4, due to the through-hole region additional without additionally occupancy packaging area, not will increase
The width of packaging area 30；On the other hand, the viscosity of packaging plastic 3 itself is higher, will form some gas in its flow process
Bubble, these bubbles can play the role of discharging stress well after the solidification of packaging plastic 3, and then promote packaging effect.It needs
Bright, through-hole 7 can be multiple discrete via holes between signal wire 4, be also possible to more between signal wire 4
A via hole communicates with each other the groove to be formed, i.e. through-hole 7 can be formed as the groove being set between any two signal line 4,
Perpendicular on the direction of first substrate, the film layer at groove location is removed the perforation knot to be formed from groove top to bottom
Structure.On the extending direction for being parallel to signal wire, the length of groove can be more than or equal to the length of each signal wire, be also possible to by
The separate structure that multistage groove is constituted.The specific set-up mode of the embodiment of the present application through-hole 7 can there are many, specifically can be according to reality
Depending on border needs.
It is in Figure 17 provided by the embodiment of the present invention as shown in figure 19 in another specific embodiment
Another sectional view at the position FF ', array layer 40 include the inorganic layer 401 positioned at signal wire 4 close to 2 side of the second substrate；
Hollowed out area 8 is provided on inorganic layer 401, orthographic projection of the hollowed out area 8 on substrate layer 50 is located at packaging plastic 3 in substrate layer 50
On orthographic projection in, packaging plastic 3 is filled in hollowed out area 8, and is contacted with signal wire 4 by hollowed out area 8.In the present embodiment
Film layer of the signal wire 4 close to 2 side of the second substrate will be arranged in remove, so that hollowed out area 8 is formed, due in the hollowed out area 8
Fillable packaging plastic 3 improves packaging effect to increase the amount of packaging plastic 3.In addition, since the signal wire 4 can be used as reflection
Metal, screening of the signal wire after the film layer structure removal of 2 side of the second substrate, without film layer to signal wire 4 (reflective metals)
Gear, the reflecting effect of signal wire 4 are improved.
The present embodiment provides a kind of display devices, are display device provided by the embodiment of the present invention as shown in figure 20
Structural schematic diagram, the display device 400 include the present embodiment involved by organic light emitting display panel 500.It needs to illustrate
, Figure 20 using mobile phone as display device for carry out example, but display device is not limited to mobile phone, specifically, this is aobvious
Showing device can include but is not limited to personal computer (Personal Computer, PC), personal digital assistant (Personal
Digital Assistant, PDA), radio hand-held equipment, tablet computer (Tablet Computer), MP4 player or TV
Any electronic equipment having a display function such as machine.
Organic light emitting display panel and its display device provided by the invention are arranged at least partly more in first area
Signal line, the orthographic projection of at least partly a plurality of signal wire on the first substrate and at least partly packaging plastic are on the first substrate
Orthographic projection is overlapping, that is to say, that at least partly a plurality of signal wire is arranged in first area, and since the first area is envelope
The a part in region is filled, it will thus be appreciated that at least partly signal wire is arranged in packaging area.For the signal of equivalent amount
For line, the signal wire of partial amt can be arranged in packaging area in the present embodiment, to reduce the width of routing region
Degree；Alternatively, a part of signal wire itself can be arranged in encapsulation region in the present embodiment for the signal wire of commensurateiy wide
In domain, and then reduce the width that the signal wire occupies routing region.Above two mode can reduce organic light emitting display face
The border width of plate increases the width of display area in the organic light emitting display panel accordingly.Compared with the prior art and
Speech, the present embodiment can effectively reduce the border width of organic light emitting display panel, conducive to the realization of narrow frame.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (17)
1. a kind of organic light emitting display panel characterized by comprising
First substrate, the first substrate include display area and the packaging area around the display area；
The second substrate being oppositely arranged with the first substrate；
Packaging plastic for the first substrate and the second substrate to be bonded together, the packaging plastic is in first base
The orthographic projection of plate is located at the packaging area in the orthographic projection of the first substrate；
The first substrate further includes a plurality of signal wire, and the packaging area includes first area, in the first area, until
The orthographic projection of a plurality of signal wire on the first substrate described in small part and at least partly described packaging plastic are in first base
Orthographic projection on plate is overlapping；
The first substrate includes the substrate layer and array layer being stacked, and the array layer includes a plurality of signal wire, institute
It states array layer and is located at the substrate layer close to the side of the second substrate；
Through-hole is provided on the array layer, orthographic projection of the through-hole on the substrate layer is located at the packaging plastic described
In orthographic projection on substrate layer, and the film layer structure at the lead to the hole site is removed to form engraved structure, the packaging plastic
It is filled in the through-hole, and is contacted by the through-hole with the substrate layer；
On from the packaging area to the direction of the display area, a plurality of through-hole and a plurality of signal wire interval are arranged
Cloth；The signal wire is in the orthographic projection and orthographic projection no overlap of the through-hole on the substrate layer on the substrate layer.
2. organic light emitting display panel according to claim 1, which is characterized in that the first substrate further includes being located at institute
The package metals layer of packaging area is stated, one of a plurality of signal wire far from the display area is arranged in the package metals layer
Side.
3. organic light emitting display panel according to claim 2, which is characterized in that the package metals layer and the signal
Film layer where line is located on the same floor.
4. organic light emitting display panel according to claim 2, which is characterized in that from the packaging area to the display
On the direction in region, the width of the package metals layer is a, and the width of the packaging area is b,
Wherein, b/2≤a≤3b/4.
5. organic light emitting display panel according to claim 1, which is characterized in that the signal wire is to be at least clock letter
One or more of number line, high level signal line, low level signal line, initial signal line.
6. organic light emitting display panel according to claim 5, which is characterized in that from the packaging area to the display
On the direction in region, the width of the signal wire is 20~30 microns.
7. organic light emitting display panel according to claim 1, which is characterized in that from the first substrate to described second
On the direction of substrate, the first substrate includes active layer, grid layer, capacitance electrode layer.
8. organic light emitting display panel according to claim 7, which is characterized in that
The first substrate further includes a plurality of connecting line, and a plurality of connecting line is electrically connected with a plurality of signal wire；
And film layer is different from film layer where the signal wire where the connecting line.
9. organic light emitting display panel according to claim 8, which is characterized in that
Film layer where the signal wire is located on the same floor with the grid layer；
Film layer where the connecting line is located on the same floor with the capacitance electrode layer.
10. organic light emitting display panel according to claim 8, which is characterized in that
Film layer where the signal wire is located on the same floor with the capacitance electrode layer；
Film layer and the grid layer are located at same film layer where the connecting line.
11. organic light emitting display panel according to claim 8, which is characterized in that
The first substrate further includes scanning element,
One end that the connecting line is not electrically connected with the signal wire is electrically connected to the scanning element.
12. organic light emitting display panel according to claim 1, which is characterized in that
The array layer includes the inorganic layer positioned at the signal wire close to the second substrate side；
Hollowed out area is provided on the inorganic layer, orthographic projection of the hollowed out area on the substrate layer is located at the encapsulation
In the orthographic projection on the substrate layer, the packaging plastic is filled in the hollowed out area glue, and passes through the hollowed out area
It is contacted with the signal wire.
13. organic light emitting display panel according to claim 1, which is characterized in that further include:
Area of isolation, the area of isolation is arranged between the packaging area and the display area, from the packaging area
To the direction of the display area, the width of the area of isolation is 45~55 millimeters.
14. organic light emitting display panel according to claim 1, which is characterized in that the display area includes:
First display area and at least two second display areas, two second display areas are located at first viewing area
The same side in domain, and there is first area between two second display areas.
15. organic light emitting display panel according to claim 1, which is characterized in that the organic light emitting display panel
By the connection of connection side between two adjacent sides, the shape on the connection side is arc or straight line, and the signal wire setting exists
In first area at the connection side.
16. organic light emitting display panel according to claim 1, which is characterized in that the packaging area is described first
Region.
17. a kind of display device, which is characterized in that including the described in any item organic light emitting display faces of such as claim 1~16
Plate.
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| CN108899341B (en) * | 2018-06-29 | 2021-01-12 | 武汉天马微电子有限公司 | Display panel and display device |
| CN109119447B (en) * | 2018-08-29 | 2020-11-13 | 武汉天马微电子有限公司 | Display panel and display device |
| CN109147572B (en) * | 2018-09-30 | 2020-12-01 | 武汉天马微电子有限公司 | Display panel and display device |
| CN109192767B (en) | 2018-11-01 | 2020-08-21 | 武汉天马微电子有限公司 | Display panel and display device |
| CN109493736B (en) * | 2018-11-19 | 2021-02-19 | 武汉天马微电子有限公司 | Display panel and display device thereof |
| CN109713012B (en) | 2018-12-27 | 2020-11-20 | 厦门天马微电子有限公司 | Display panel and display device |
| CN109949711B (en) | 2019-03-29 | 2021-08-31 | 上海天马微电子有限公司 | Display panel, display device and manufacturing method of display panel |
| CN110289289B (en) | 2019-06-24 | 2021-04-20 | 昆山国显光电有限公司 | Display panel and display device |
| CN111769213B (en) | 2020-07-31 | 2023-05-23 | 武汉天马微电子有限公司 | Display panel and display device |
| CN112420957B (en) * | 2020-11-19 | 2022-10-11 | 武汉天马微电子有限公司 | Display panel and display device |
| CN113193032A (en) * | 2021-04-29 | 2021-07-30 | 合肥维信诺科技有限公司 | Display panel, display device and preparation method of display panel |
| CN117042499A (en) * | 2023-08-31 | 2023-11-10 | 绵阳惠科光电科技有限公司 | Display panel and display device |
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