CN105226079B - Display device - Google Patents
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- CN105226079B CN105226079B CN201510746336.7A CN201510746336A CN105226079B CN 105226079 B CN105226079 B CN 105226079B CN 201510746336 A CN201510746336 A CN 201510746336A CN 105226079 B CN105226079 B CN 105226079B
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- 239000000758 substrate Substances 0.000 claims abstract description 96
- 239000010410 layer Substances 0.000 claims description 115
- 239000010409 thin film Substances 0.000 claims description 36
- 238000005538 encapsulation Methods 0.000 claims description 35
- 239000012044 organic layer Substances 0.000 claims description 13
- 238000010276 construction Methods 0.000 claims description 10
- 230000006378 damage Effects 0.000 abstract description 7
- 238000009792 diffusion process Methods 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 abstract 3
- 238000010586 diagram Methods 0.000 description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 208000037656 Respiratory Sounds Diseases 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 206010027146 Melanoderma Diseases 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 230000000505 pernicious effect Effects 0.000 description 1
- -1 steam Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Electroluminescent Light Sources (AREA)
Abstract
The application discloses a display device. One embodiment of the display device comprises: a substrate including a middle flat region and an edge region surrounding the middle flat region, the edge region being higher or lower than the middle flat region at a first surface of the substrate; a display layer on the first surface of the substrate, the display layer being on the middle flat region; and the display layer is positioned between the film packaging layer and the substrate. The embodiment can inhibit the film packaging layer at the edge position from generating crack diffusion when the panel is cut, and can effectively relieve the damage of cutting stress on the display layer device and the film packaging layer.
Description
Technical field
The application is related to display technology field, more particularly to a kind of display device with encapsulating structure.
Background technology
The necessary basis that organic luminescent device (OLED) can be widely used is that device can for a long time, stably, continuously
Ground works.It has been found that after OLED works certain time, blackspot occurs in its luminous component, and electrode portion branch occurs
Bubble, this phenomenon are considered as the main reason for causing component failure.The Crack cause of blackspot and bubble is organic except device
The metallic cathode of the fuel factor of functional layer, mainly device, organic function layer and between the extraneous steam penetrated into of device, oxygen
Chemical reaction.In order to improve OLED lives of product, it is necessary to by encapsulation process come isolate from the extraneous water vapour of device with
Oxygen.
Thin-film package is packaged type widely used at present, and display device is general as shown in Fig. 1 100.In substrate 101
On prepare have OLED display layers 102, display layer 102 is then completely covered in thin-film encapsulation layer 103.
During the processing procedure of display panel, multiple display panels are produced on a motherboard simultaneously, to the end of processing procedure it
Afterwards, motherboard is cut, so as to form multiple independent display panels.In cutting, currently used technology has machinery to cut
Cut and be cut by laser.Machine cuts can cause thin-film encapsulation layer generation since marginal position to split due to the pressure of cutter head counter plate
Line, it can equally be cracked using laser cutting mode due to fuel factor, the generation of crackle is then steam and oxygen from side
Infiltration provides path.Meanwhile cutting stress can cause certain destruction to display layer device and thin-film encapsulation layer.
The content of the invention
In view of drawbacks described above of the prior art or deficiency, it is expected to provide a kind of thin-film package that can suppress marginal position
The diffusion of layer crackle when panel is cut, and can effectively alleviate destruction of the cutting stress to display layer device and thin-film encapsulation layer
Scheme.To achieve these goals, this application provides a kind of display device.
The display device includes：Substrate, the substrate include intermediate flat area and surround the intermediate flat area
Fringe region, in the first surface of the substrate, the fringe region is higher or lower than the intermediate flat area；Display
Layer, the display layer is located at the first surface of the substrate, and the display layer is located on the intermediate flat area；Film
Encapsulated layer, the display layer is between the thin-film encapsulation layer and the substrate.
In certain embodiments, the substrate is flexible base board.
In certain embodiments, the fringe region and the junction of the intermediate flat area have first end face, institute
The angle stated between the surface of first end face and the intermediate flat area is more than 90 degree.
In certain embodiments, outside of the fringe region away from intermediate flat area has a second end face, and described
Angle between the second surface of biend and the substrate is less than or equal to 90 degree.
In certain embodiments, the fringe region and the junction of the intermediate flat area have first end face, institute
It is arc-shaped curved surface to state first end face.
In certain embodiments, outside of the fringe region away from intermediate flat area has a second end face, and described
Biend is arc-shaped curved surface.
In certain embodiments, the fringe region is higher than the intermediate flat area, and the fringe region is included at least
One groove.
In certain embodiments, the section of the groove be trapezoidal, rectangle, triangle or one kind in curvilinear boundary quadrilateral or
It is several.
In certain embodiments, the fringe region is less than the intermediate flat area, and the fringe region is included at least
One-level step.
In certain embodiments, the step has the 3rd end face, what the 3rd end face was connected with the 3rd end face
Angle between upper and lower surface is all higher than 90 degree.
In certain embodiments, the step has the 3rd end face, and the 3rd end face is arc-shaped curved surface.
In certain embodiments, the thin-film encapsulation layer includes replacing the stepped construction formed with organic layer by inorganic layer,
The stepped construction comprises at least three layers, wherein, point to the direction of the display layer along the substrate, the stepped construction according to
It is secondary to be：First inorganic layer, the first organic layer, the second inorganic layer.
In certain embodiments, first inorganic layer and the second inorganic layer cover the substrate；Described first is organic
Layer covers the display layer, and first organic layer is coated by second inorganic layer.
The display device that the application provides, using the fringe region higher or lower than intermediate flat area, avoids face
Accumulation of the stress in same layer plane, the thin-film encapsulation layer that can suppress marginal position produce when panel is cut when plate is cut
The diffusion of crackle, and can effectively alleviate destruction of the cutting stress to display layer device and thin-film encapsulation layer.
Brief description of the drawings
By reading the detailed description made to non-limiting example made with reference to the following drawings, the application's is other
Feature, objects and advantages will become more apparent upon：
Fig. 1 is the schematic diagram of general display device in the prior art；
Fig. 2A is a kind of top view for display device that the embodiment of the present application one provides；
Fig. 2 B are sectional views of the Fig. 2A along AA '；
Fig. 3 is the schematic diagram for another display device that the embodiment of the present application one provides；
Fig. 4 is a kind of schematic diagram for display device that the embodiment of the present application two provides；
Fig. 5 is the schematic diagram for another display device that the embodiment of the present application two provides；
Fig. 6 is a kind of schematic diagram for display device that the embodiment of the present application three provides；
Fig. 7 is the schematic diagram for another display device that the embodiment of the present application three provides；
Fig. 8 A are the top views for the third display device that the embodiment of the present application three provides；
Fig. 8 B are sectional views of Fig. 8 A along AA '；
Fig. 9 is the schematic diagram for the 4th kind of display device that the embodiment of the present application three provides；
Figure 10 is a kind of schematic diagram for display device that the embodiment of the present application four provides.
Embodiment
The application is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining related invention, rather than the restriction to the invention.It also should be noted that in order to
Be easy to describe, illustrate only in accompanying drawing to about the related part of invention.
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the application can phase
Mutually combination.Describe the application in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
Embodiment one
Fig. 2A is a kind of top view for display device that the embodiment of the present application one provides, and Fig. 2 B are sections of the Fig. 2A along AA '
Figure.
With reference to figure 2A and Fig. 2 B, display device 200 includes substrate 201, display layer 202 and thin-film encapsulation layer 203.In this reality
Apply in example, substrate 201 includes intermediate flat area 2011 and surrounds the fringe region 2012 of intermediate flat area 2011, in substrate
The upper surface of substrate 201 in 201 first surface, i.e. Fig. 2 B, the fringe region 2012 of substrate 201 can be less than middle flat area
Domain 2011.Display layer 202 can be located at the first surface of substrate 201, and be located at intermediate flat area 2011.Thin-film encapsulation layer
203 can be located at the top of display layer 202 so that display layer 202 can be between thin-film encapsulation layer 203 and substrate 201.
In an optional implementation of the present embodiment, in the first surface of substrate, the fringe region of substrate can be with
Higher than intermediate flat area.Fig. 3 is the schematic diagram for another display device that the embodiment of the present application one provides.As shown in Figure 3.It is aobvious
Showing device 300 includes substrate 301, display layer 302 and thin-film encapsulation layer 303.Wherein, substrate 301 includes intermediate flat area
3011 and surround intermediate flat area fringe region 3012, the upper table of substrate 301 in the first surface of substrate 301, i.e. Fig. 3
Face, the fringe region 3012 of substrate 301 can be higher than intermediate flat area 3011.Display layer 302 can be located at the of substrate 301
One surface, and it is located at intermediate flat area 3011.Thin-film encapsulation layer 303 can be located at the top of display layer 302.
In some optional implementations, substrate 201 and substrate 301 can be flexible base board.Can using flexible base board
Form flexible display apparatus.
The display device that above-described embodiment of the application provides, by the intermediate flat area below or above substrate
Substrate edge region so that when panel is cut, stress surface and display layer in the same plane, do not avoid cutting stress same
Accumulation in plane, it can effectively alleviate destruction of the cutting stress to display layer device and thin-film encapsulation layer, suppress substrate edges
The generation of position thin-film encapsulation layer crackle, while the transmission path of stress planar has been blocked, so as to prevent crackle to spread,
Prevent the pernicious gases such as steam, oxygen from being permeated from side.
Embodiment two
With further reference to Fig. 4, a kind of schematic diagram of the display device provided it illustrates the embodiment of the present application two.
As shown in figure 4, the display device 400 includes substrate 401, display layer 402 and thin-film encapsulation layer 403.Wherein, substrate
401 can include intermediate flat area 4011 and surround the fringe region 4012 of intermediate flat area.In the first table of substrate 401
Face is the upper surface of substrate 401, and the fringe region 4012 of substrate 401 can be less than intermediate flat area 4011, and substrate 401
The junction of fringe region 4012 and intermediate flat area 4011 there is first end face 4013, first end face 4013 is put down with centre
Angle α between the surface in smooth region 4011 can be more than 90 degree.Display layer 402 can be located at the first surface of substrate 401
On intermediate flat area 4011, thin-film encapsulation layer 403 can be located at the top of display layer 402.
Second end face 4014 shown in Fig. 4, in outside of the substrate 401 away from intermediate flat area 4011, i.e. the second end
Face 4014 is 401 outermost end face of substrate.Optionally, second end face 4014 can be a plane.It is optional real at some
In existing mode, the second end face 4014 of substrate 401 and the second surface of substrate 401 are the angle β between the lower surface of substrate 401
90 degree can be less than or equal to.
The display device that above-described embodiment of the application provides, due to the first end face of substrate and the middle flat area of substrate
Angle between domain is more than 90 degree, and the angle between the second end face and second substrate surface of substrate is less than or equal to 90 degree,
In the range of this angle, shape between first end face and substrate intermediate flat area and second end face and the second surface of substrate
Into gentle transition structure, it is ensured that junction between thin-film encapsulation layer edge region and intermediate flat area it is continuous
Property, realize more preferable steam and oxygen obstruction effect.In another embodiment of the present embodiment, first with embodiment two
Here is omitted for kind embodiment identical part, and difference is, fringe region and the intermediate flat area of substrate connect
Meeting place has first end face, and first end face can be arc-shaped curved surface.
Fig. 5 is the schematic diagram for another display device that the present embodiment provides.As shown in figure 5, display device 500 includes base
Plate 501, display layer 502 and thin-film encapsulation layer 503.Wherein, the first end face 5013 of substrate 501 can be arc-shaped curved surface.It is optional
, outside of the fringe region away from intermediate flat area of substrate 501 has second end face 5014, and second end face 5014 can be
Arc-shaped curved surface, as shown in Figure 5.
Compared to planar end, arc-shaped curved surface has more smooth structure, in the fringe region and middle flat of substrate
The junction in region, thin-film encapsulation layer have more preferable film forming stability.
It should be noted that except the convex arc-shaped curved surface provided in figure, the edge and centre of connecting substrate upper surface are put down
The first end face in smooth region can also be what matrix arc-shaped curved surface or convex arc-shaped curved surface combined with matrix arc-shaped curved surface
Curved-surface structure, the application are not limited this.
Embodiment three
With further reference to Fig. 6, a kind of schematic diagram of the display device provided it illustrates the embodiment of the present application three.
As shown in fig. 6, the display device 600 includes substrate 601, display layer 602 and thin-film encapsulation layer 603.In this implementation
In example, here is omitted with the identical part of embodiment two, and difference is, is upper table in the first surface of substrate 601
Face, the fringe region 6012 of substrate 601 can be higher than intermediate flat area 6011, and fringe region 6012 and middle flat area
The junction of domain 6011 can have first end face 6013, and first end face 6013 can be plane, first end face 6013 and substrate 601
Intermediate flat area 6011 surface between angle γ can be more than 90 degree.Display layer 602 can be located in substrate 601
Between on flat site 6011.
In some optional implementations, the second end face 6014 of substrate 601 and the second surface of substrate 601, i.e. base
Angle theta between the lower surface of plate 601 can be less than or equal to 90 degree.
The display device that embodiments herein three provides, the angle between the first end face and intermediate flat area of substrate
Setting more than 90 degree enables to form gentle transition structure between first end face and intermediate flat area, ensures film envelope
Fill continuity of the layer in substrate edge region Yu intermediate flat area junction.
In another embodiment of the present embodiment, with the first embodiment identical part of embodiment three herein
Repeat no more, difference is, the first end face of substrate edge region and intermediate flat area junction can be that arc is bent
Face.Fig. 7 is the schematic diagram for another display device that the embodiment of the present application three provides.As shown in fig. 7, display device 700 includes
Substrate 701, display layer 702 and thin-film encapsulation layer 703.Wherein, it is upper surface in the first surface of substrate 701, the side of substrate 701
The first end face 7013 in edge region and intermediate flat area junction is arc-shaped curved surface.
Compared to planar end, arc-shaped curved surface has more smooth structure, in the fringe region and middle flat of substrate
The junction in region, thin-film encapsulation layer have more preferable film forming stability.
It should be noted that except the matrix arc-shaped curved surface provided in figure, first end face 7013 can also be convex arc
The composite surface structure of curved surface or convex arc-shaped curved surface and matrix arc-shaped curved surface, the application are not limited this.Substrate 701 is remote
There can be the second end face 7014 of planar shaped from the outer fix of intermediate flat area.
In some optional implementations, second end face can also be arc-shaped curved surface.
In some optional implementations, the fringe region of substrate is higher than intermediate flat area, and fringe region can wrap
Include at least one groove.
Fig. 8 A are the top views for the third display device that the embodiment of the present application three provides, and Fig. 8 B are Fig. 8 A cutting along AA '
Face figure.Display device 800 includes substrate 801, display layer 802 and thin-film encapsulation layer 803.Wherein, in the first surface of substrate 801
That is upper surface, substrate 801 include intermediate flat area 8011 and surround the fringe region 8012 of intermediate flat area, substrate 801
Fringe region 8012 include groove 8015 shown in phantom, the section of groove 8015 is trapezoidal.
In some optional implementations, number of recesses can have it is multiple, the section of groove can be trapezoidal, rectangle,
One or more in triangle or curvilinear boundary quadrilateral.When carrying out panel cutting, the structure of this multiple grooves can be more preferable
Destruction of the ground isolation cutting stress to display layer device and thin-film encapsulation layer.
In some optional implementations, the fringe region of substrate can be less than intermediate flat area, and fringe region can
With including at least one-level step.Fig. 9 is the schematic diagram for the 4th kind of display device that the embodiment of the present application three provides.As shown in figure 9,
Display device 900 includes substrate 901, display layer 902 and thin-film encapsulation layer 903.Wherein, substrate 901 includes intermediate flat area
9011 and the fringe region 9012 of intermediate flat area is surrounded, fringe region 9012 has with the junction of intermediate flat area 9011
First end face 9013,9013 is planar end, and it is planar ends to have second end face 9014,9014 away from intermediate flat area 9011
Face, there is the 3rd end face 9016 of planar shaped between first end face 9013 and second end face 9014.The He of 3rd end face 9016
Angle between coupled upper surface 9017It can be more than between 90 degree, and coupled lower surface 9018
Angle ω can also be more than 90 degree.When carrying out panel cutting, the structure of this multi-stage stairs can preferably isolate cutting should
Destruction of the power to display layer device and thin-film encapsulation layer.
In some optional implementations, first end face, second end face and the 3rd end face can be arc-shaped curved surface.
Example IV
With further reference to Figure 10, a kind of schematic diagram of the display device provided it illustrates the embodiment of the present application four.
As shown in Figure 10, the display device 11 includes substrate 111, display layer 112 and thin-film encapsulation layer 113.Wherein, in base
The first surface of plate 111 is upper surface, and the fringe region of substrate 111 can be higher than intermediate flat area.Display layer 112 can position
In the intermediate flat area of the first surface of substrate 111.Display layer 112 is between thin-film encapsulation layer 113 and substrate 111.
In the present embodiment, thin-film encapsulation layer 113 can include replacing the stepped construction formed with organic layer by inorganic layer,
This stepped construction comprises at least three layers.As shown in Figure 10, along substrate 111 point to display layer 112 direction, stepped construction according to
It is secondary including：First inorganic layer 1131, the first organic layer 1132 and the second inorganic layer 1133.
In some optional implementations, the first inorganic layer 1131 can be located at the top of display layer 112, and cover base
Plate 111.First organic layer 1132 can be located at the top of the first inorganic layer 1131, positioned at intermediate flat area, cover display layer
112, and coated by the second inorganic layer 1133 above it.Second inorganic layer 1133 can be located on the first organic layer 1132
Side, and cover substrate 111.
It should be noted that the stepped construction of this thin-film encapsulation layer can include three layers, more layers can also be included, this
Application is not limited this.The display device that embodiments herein four provides, because inorganic layer covers whole substrate, film
Encapsulated layer can effectively completely cut off the infiltration of steam and oxygen, and protection shows layer device.On the other hand, between two layers of inorganic layer
The presence of organic layer can effectively alleviate the stress of inorganic layer film, optimize the flexural property of whole encapsulating structure.And centre has
Machine layer is then advantageous to prevent the steam from the external world, oxygen etc. from breaking intermediate organic layer by the cladding completely of the inorganic layer above it
It is bad.
Above description is only the preferred embodiment of the application and the explanation to institute's application technology principle.People in the art
Member should be appreciated that invention scope involved in the application, however it is not limited to the technology that the particular combination of above-mentioned technical characteristic forms
Scheme, while should also cover in the case where not departing from the inventive concept, carried out by above-mentioned technical characteristic or its equivalent feature
The other technical schemes for being combined and being formed.Such as features described above has similar work(with (but not limited to) disclosed herein
The technical scheme that the technical characteristic of energy is replaced mutually and formed.
Claims (9)
1. a kind of display device, it is characterised in that the display device includes：
Substrate, the substrate are flexible base board, and the substrate includes intermediate flat area and surrounds the intermediate flat area
Fringe region, in the first surface of the substrate, the fringe region is higher than the intermediate flat area；
Display layer, the display layer is located at the first surface of the substrate, and the display layer is located at the intermediate flat area
On；
Thin-film encapsulation layer, the display layer is between the thin-film encapsulation layer and the substrate.
2. display device according to claim 1, it is characterised in that the fringe region and the intermediate flat area
Junction has first end face, and the angle between the first end face and the surface of the intermediate flat area is more than 90 degree.
3. display device according to claim 2, it is characterised in that the fringe region is away from the intermediate flat area
Outside there is second end face, the angle between the second end face and the second surface of the substrate be less than or equal to 90 degree.
4. display device according to claim 1, it is characterised in that the fringe region and the intermediate flat area
Junction has first end face, and the first end face is arc-shaped curved surface.
5. display device according to claim 4, it is characterised in that the fringe region is outer away from intermediate flat area
Side has second end face, and the second end face is arc-shaped curved surface.
6. the display device described in any one in claim 2 to 5, it is characterised in that the fringe region includes
At least one groove.
7. display device according to claim 6, it is characterised in that the section of the groove is trapezoidal, rectangle, triangle
Or the one or more in curvilinear boundary quadrilateral.
8. display device according to claim 1, it is characterised in that the thin-film encapsulation layer include by inorganic layer with it is organic
The stepped construction that layer is alternately formed, the stepped construction comprise at least three layers, wherein, point to the display layer along the substrate
Direction, the stepped construction is followed successively by：First inorganic layer, the first organic layer, the second inorganic layer.
9. display device according to claim 8, it is characterised in that
First inorganic layer and the second inorganic layer cover the substrate；
First organic layer covers the display layer, and first organic layer is coated by second inorganic layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510746336.7A CN105226079B (en) | 2015-11-05 | 2015-11-05 | Display device |
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|---|---|---|---|
| CN201510746336.7A CN105226079B (en) | 2015-11-05 | 2015-11-05 | Display device |
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| CN105226079A CN105226079A (en) | 2016-01-06 |
| CN105226079B true CN105226079B (en) | 2018-03-09 |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106158740A (en) * | 2016-09-26 | 2016-11-23 | 昆山工研院新型平板显示技术中心有限公司 | Flexible substrate substrate and the preparation method of flexible OLED display |
| CN107122077B (en) * | 2017-05-02 | 2020-06-02 | 上海天马微电子有限公司 | Touch display device |
| EP3682478B1 (en) * | 2017-08-21 | 2024-02-21 | BOE Technology Group Co., Ltd. | Method of fabricating display substrate |
| CN109509402B (en) * | 2017-09-14 | 2022-03-18 | 广州国显科技有限公司 | Flexible display device |
| KR102401414B1 (en) * | 2017-10-31 | 2022-05-23 | 엘지디스플레이 주식회사 | Display apparatus |
| CN108666353B (en) * | 2018-05-14 | 2020-07-24 | 云谷（固安）科技有限公司 | Display panel and manufacturing method thereof |
| CN108428728B (en) * | 2018-05-14 | 2019-07-02 | 云谷（固安）科技有限公司 | Array substrate and production method, display panel and production method, display device |
| US10840267B2 (en) | 2018-05-14 | 2020-11-17 | Yungu (Gu'an) Technology Co., Ltd. | Array substrates and manufacturing methods thereof, and display panels |
| CN108711577B (en) | 2018-05-24 | 2022-01-07 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and display device |
| CN109360847A (en) * | 2018-10-30 | 2019-02-19 | 昆山国显光电有限公司 | The manufacturing method of display panel, display device and display panel |
| CN115050908B (en) * | 2022-06-09 | 2023-12-01 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
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| WO2013136771A1 (en) * | 2012-03-12 | 2013-09-19 | パナソニック株式会社 | Organic electroluminescence element |
| US9441416B2 (en) * | 2012-09-27 | 2016-09-13 | Guardian Industries Corp. | Low temperature hermetic sealing via laser |
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| CN101635306A (en) * | 2008-07-24 | 2010-01-27 | 精工爱普生株式会社 | Organic electroluminescence device, process of producing organic electroluminescence device, and electronic apparatus |
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