CN205863170U - A kind of display base plate - Google Patents
A kind of display base plate Download PDFInfo
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- CN205863170U CN205863170U CN201620556145.4U CN201620556145U CN205863170U CN 205863170 U CN205863170 U CN 205863170U CN 201620556145 U CN201620556145 U CN 201620556145U CN 205863170 U CN205863170 U CN 205863170U
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- base plate
- display base
- packaging area
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Abstract
The utility model discloses a kind of display base plate, described display base plate includes that underlay substrate, described underlay substrate are divided into viewing area and the packaging area arranged around described viewing area, wherein, described display base plate also includes that barrier layer, described barrier layer are arranged in described packaging area.The problem causing underlay substrate to ftracture due to the adhesion of packaging plastic Yu underlay substrate when display base plate disclosed in this utility model avoids packaging area cutting occurs so that the packaging area cutting of display base plate easily realizes.
Description
Technical field
This utility model relates to Display Technique field, particularly relates to a kind of display base plate.
Background technology
Organic Light Emitting Diode (OLED, Organic Light-Emitting Diode) device has ultra-thin, low one-tenth
Basis, low-power consumption, wide viewing angle, all solidstate, self-luminous, driving voltage are low and can realize the many advantages such as soft display, become and have very much
The flat panel display of new generation of future.
Along with being gradually increased of organic light emitting diode device commercially share, market is also to Organic Light Emitting Diode device
Part is had higher requirement.Such as, screen intensity wants height, and the life-span to grow, and it is narrower etc. that finished product needs that thinner, the frame that do do
Deng.The narrowest frame, owing to can increase the area of viewing area, makes user can have preferably and uses and experience effect, thus
The emphasis of research is become about how realizing narrow frame.
In the prior art, it is achieved narrow frame typically requires and cuts on glass cement, as it is shown in figure 1, underlay substrate
11 are divided into viewing area 111 and packaging area 112, need to cut packaging plastic 12 part in packaging area 112, so that
The distance at packaging plastic and display floater edge is zero to increase the area of viewing area, reach the effect of ultra-narrow frame.But
After laser curing technique, reaction is there occurs with Organic Light Emitting Diode underlay substrate 11 contact surface so that glass at packaging plastic 12
Glass glue is more tight with contacting of Organic Light Emitting Diode underlay substrate 11, when cutting in packaging plastic 12 region,
Easily make glass that the risk of fragmentation occurs, affect the yield of product.
Utility model content
The purpose of this utility model is to provide a kind of display base plate, and described display base plate can solve the problem that in prior art and seals
The problem that dress region causes underlay substrate to ftracture due to the adhesion of packaging plastic Yu underlay substrate when cutting.
For achieving the above object, as first aspect of the present utility model, it is provided that a kind of display base plate, including substrate base
Plate, described underlay substrate is divided into viewing area and the packaging area arranged around described viewing area, wherein, described display
Substrate also includes that barrier layer, described barrier layer are arranged in described packaging area.
Preferably, described packaging area includes the first packaging area and the second packaging area being disposed adjacent, described first
Packaging area is arranged on the described packaging area side near described viewing area, is provided with heat radiation in described first packaging area
Layer, described barrier layer is arranged in described second packaging area, and described heat dissipating layer and described barrier layer are positioned at described display base plate
The same side.
Preferably, the thickness on described barrier layer is
Preferably, the width of described packaging area is 400 μm～700 μm.
Preferably, the width on described barrier layer is the 5%-10% of width of described packaging area.
Preferably, the width of described second packaging area is more than the width on described barrier layer.
Preferably, described display base plate is array base palte.
Preferably, described heat dissipating layer includes being successively set on described array base palte cushion, the first insulating barrier, metal
Layer and the second insulating barrier.
Preferably, described display base plate includes gate metal layer, gate insulator and the interlayer dielectric layer set gradually, institute
Stating the first insulating barrier and described gate insulator arranges with layer and forms as one, described metal level and described gate metal layer are same
Layer arranges and forms as one, and described second insulating barrier and described interlayer dielectric layer arrange with layer and form as one.
Preferably, described display base plate is encapsulation cover plate.
The display base plate that this utility model provides, arranges barrier layer in the packaging area of display base plate.Work as display base plate
Time in display device, need to utilize packaging plastic that display base plate is packaged.Now, barrier layer is possible to prevent packaging area
In directly the contacting of packaging plastic and display base plate, it is to avoid due to the adhesion of packaging plastic Yu underlay substrate when packaging area cuts
The problem causing underlay substrate to ftracture occurs so that the packaging area cutting of display base plate easily realizes.
Accompanying drawing explanation
Accompanying drawing is used to offer and is further appreciated by of the present utility model, and constitutes a part for description, with following
Detailed description of the invention be used for explaining this utility model together, but be not intended that restriction of the present utility model.In the accompanying drawings:
Fig. 1 is the structural representation of display base plate of the prior art；
Fig. 2 is the structural representation of display base plate of the present utility model；
Fig. 3 is the structural representation that barrier layer of the present utility model is formed；
Fig. 4 is the display substrate structure schematic diagram after coating photoresist of the present utility model；
Fig. 5 is the display substrate structure schematic diagram after photoresist lift off of the present utility model.
11, underlay substrate；111, viewing area；112, packaging area；12, packaging plastic；13, the second insulating barrier；14, metal
Layer；15, the first insulating barrier；16, cushion；17, line of cut；18, barrier layer；19, the first packaging area；20, the second encapsulation region
Territory；21, heat dissipating layer；22, photoresist；23, silver mask plate；24, non-exposed areas；25 barrier material layers.
Detailed description of the invention
Below in conjunction with accompanying drawing, detailed description of the invention of the present utility model is described in detail.It should be appreciated that herein
Described detailed description of the invention is merely to illustrate and explains this utility model, is not limited to this utility model.
As an aspect of the present utility model, it is provided that a kind of display base plate, as in figure 2 it is shown, include underlay substrate 11, lining
Substrate 11 is divided into viewing area 111 and the packaging area 112 arranged around viewing area 111, wherein, described display base
Plate also includes that barrier layer 18, barrier layer 18 are arranged in packaging area 112.
The display base plate that this utility model provides, arranges barrier layer in the packaging area of display base plate.Work as display base plate
Time in display device, need to utilize packaging plastic that display base plate is packaged.Now, barrier layer is possible to prevent packaging area
In directly the contacting of packaging plastic and display base plate, it is to avoid due to the adhesion of packaging plastic Yu underlay substrate when packaging area cuts
The problem causing underlay substrate to ftracture occurs so that the packaging area cutting of display base plate easily realizes.
It is understood that the viewing area 111 on underlay substrate 11 is positioned at the zone line of underlay substrate 11, in display
The surrounding in region 111 is provided with packaging area 112.It should be noted that Fig. 1-Fig. 5 only illustrates a part of packaging area and one
Divide viewing area.
In packaging area 112, need a part of packaging area is cut, to realize the purpose of ultra-narrow frame, make
For one specifically embodiment, as in figure 2 it is shown, packaging area 112 includes the first packaging area 19 and second being disposed adjacent
Packaging area 20, the first packaging area 19 is arranged on the packaging area 112 side near viewing area 111, the first packaging area
Being provided with heat dissipating layer 21 in 19, barrier layer 18 is arranged in the second packaging area 20, and heat dissipating layer 21 and barrier layer 18 are positioned at described
The same side of display base plate.
It is understood that in organic light-emitting diode display field, when display floater is packaged, generally use envelope
Arrange box two substrates are packaged by dress glue, therefore, are provided with packaging plastic in packaging area 112, it is preferable that encapsulation
Glue 12 is mainly disposed to the top of the heat dissipating layer 21 in the first packaging area 19, and the Zone Full of the second packaging area 20
In.In order to reduce the second packaging area 20 along line of cut 17 shown in Fig. 2 cut time underlay substrate 11 fragmentation risk,
Barrier layer 18 is set in the second packaging area 20, it is preferable that barrier layer 18 is arranged between packaging plastic 12 and underlay substrate 11,
The packaging plastic 12 so can being effectively prevented from the second packaging area 20 directly contacts, i.e. in the second envelope with underlay substrate 11
The phenomenon of packaging plastic 12 and underlay substrate 11 adhesion, when cutting, substrate base is not had along line of cut 17 in dress region 20
Plate 11 is easier in line of cut 17 position to separate, and reduces the risk of underlay substrate 11 fragmentation, improves the non-defective unit of product
Rate.
It should be noted that arrange heat dissipating layer 21 in the first packaging area 19 can effectively prevent packaging plastic 12 temperature mistake
The infringement of film layer or the problem such as deformation that cause viewing area 111 time high occur.
Preferably, packaging plastic 12 generally selects glass cement, usual underlay substrate to be glass substrate, and glass cement is through laser
React with glass substrate contact surface after solidification so that glass cement is closely coupled with glass substrate, serve the effect of sealing,
So can be effectively prevented from Organic Light Emitting Diode to be affected by the factor such as air, steam, it is possible to increase organic light-emitting diodes
The life-span of tube device and picture quality.
In this utility model, the thickness on barrier layer 18 is not particularly limited, for the ease of molding and reduce resistance
The application of barrier material, guarantees that barrier encapsulation glue bonds with underlay substrate simultaneously, preferably can be by the thickness on described barrier layer
It is set to
In order to obtain the display device of narrow frame, generally the width of packaging area 112 is set to 400 μm～700 μm.?
When packaging area 112 is cut, owing to the width of the packaging area after the restriction of cutting technique, generally cutting is 350 μm
～400 μm.As a example by shown in Fig. 2, the second packaging area 20 is region to be cut, then the width of the first packaging area 19 is about
350 μm～400 μm.
In order to ensure the blocking effect on barrier layer, the most do not affect the encapsulation effect of packaging plastic, specifically real as another kind
Executing mode, the width on barrier layer 18 is the 5%-10% of the width of packaging area 112.Preferably, described previously understanding stop
Layer 18 is arranged in the second packaging area 20, and in order to ensure blocking effect, barrier layer 18 has been arranged on packaging plastic 12 and substrate base
Between plate 11.And in order to ensure that barrier layer 18 makes the cutting of packaging area 112 be easier to when playing barrier effect, logical
Often the one end on barrier layer 18 is arranged at the interface location of the first packaging area 19 and the second packaging area 20, it is preferable that
The interface of the first packaging area 19 shown in Fig. 2 and the second packaging area 20 is line of cut 17 position, so by
Fig. 2 is it can be seen that the one end on barrier layer 18 is arranged on the position of line of cut 17.It is understood that another of barrier layer 18
End then extends to the edge direction of packaging area 112.
Preferably, metal material is generally selected on barrier layer 18, it is further preferred that owing to argent is outstanding at barrier encapsulation glue
It is that glass cement effect when contacting with underlay substrate is preferable, so generally selecting argent as the first-selected material on barrier layer 18
Material.
In order to ensure the packaging plastic encapsulation effect at packaging area further, it is preferable that the width of the second packaging area 20
Degree is more than the width on barrier layer 18.It is understood that barrier layer 18 can not by the packaging plastic 12 in the second packaging area 20 with
Underlay substrate 11 intercepts open completely, and otherwise, the packaging plastic 12 in the second packaging area 20 can not play encapsulation effect, i.e. can not
The underlay substrate arranging box is packaged, shadow in the air in the external world, steam etc. so can be caused to enter into viewing area
Ring display picture quality etc..Therefore, the width on barrier layer 18 can not all cover on the underlay substrate of the second packaging area 20.
Preferably, described display base plate is array base palte.The underlay substrate of described array base palte will be divided into viewing area
Territory and packaging area, described barrier layer is arranged between the packaging plastic in packaging area and array base palte.
Preferably, when described display base plate is array base palte, it is arranged on the first encapsulation region as in figure 2 it is shown, described previously
Cushion the 16, first insulating barrier 15 that heat dissipating layer 21 in territory 19 specifically can include being successively set on described array base palte,
Metal level 14 and the second insulating barrier 13.
Skilled addressee readily understands that, gate metal layer, grid that described display base plate includes setting gradually are exhausted
Edge layer and interlayer dielectric layer.In order to simplify manufacturing process, it is preferable that the first insulating barrier 15 and described gate insulator are arranged with layer
And form as one, metal level 14 and described gate metal layer arrange with layer and form as one, the second insulating barrier 13 and described
Interlayer dielectric layer arranges with layer and forms as one.As such, it is possible to form the first insulating barrier 15 and described in same step process
Gate insulator；The first insulating barrier 15 and the same layer of described gate insulator is formed in same step process；In same portion composition work
Skill is formed metal level 14 and described gate metal layer；And in same portion technique, form the second insulating barrier 13 and described interlayer
Dielectric layer.
Preferably, described display base plate is encapsulation cover plate.Packaging plastic that described barrier layer is arranged in packaging area and envelope
Between capping plate.
It is understood that generally in display floater, box is arranged by array base palte and encapsulation cover plate, and packaging plastic is arranged on
Packaging area, connects described array base palte and described encapsulation cover plate.Cutting to packaging area is easily achieved, then by described
Barrier layer both can be arranged between described packaging plastic and described array base palte, it is also possible to described barrier layer is arranged on described envelope
Between dress glue and described encapsulation cover plate, or between described packaging plastic and described array base palte and described packaging plastic and described envelope
Described barrier layer it is respectively provided with between capping plate.
By described previously understand barrier layer 18 be arranged on packaging area, barrier layer 18 formed time only at display base plate
Manufacturing process increases by one masking process, so not increasing manufacture difficulty in the processing technology of display base plate.Specifically,
As shown in Figure 3-Figure 5, the processing technology of display base plate specifically may comprise steps of:
The first step, forms display circuit on underlay substrate 11, and described display circuit specifically can include grid line, data
Line, image element circuit, Organic Light Emitting Diode, signal detection line and scan line etc., also wrap while described display circuit is formed
Include the heat dissipating layer 21 formed in the first packaging area 19；
Second step, after the step being previously formed display circuit completes, in packaging area 112, deposit thickness scope isBarrier material layer 25, it is preferable that barrier material layer 25 uses metallic Silver material (to describe all with gold below
Belong to as a example by silver), deposit thickness withAs a example by, then this step can be understood as deposit thickness in packaging area 112 and is Argent, as shown in Figure 3.
3rd step, coating photoresist 22, use silver mask plate 23 that silver-colored barrier material layer 25 structure formed is exposed,
As shown in Figure 4, the unexposed silver barrier layer on the non-exposed areas 24 corresponding substrate substrate 11 on silver mask plate 23 in figure.
4th step, develops to the photoresist 22 after exposure, and the silver-colored barrier material layer 25 exposed is carried out wet etching, so
After the photoresist 22 of residual is peeled off, form the structure on barrier layer 18 as shown in Figure 5 after stripping.
It is understood that when follow-up being packaged, in addition it is also necessary to proceed the formation process of packaging plastic, if encapsulation
Glue uses glass cement, and box substrate will be fitted by needs by glass cement is sintered technique, and it is solid to carry out laser
Change.Now, do not react with substrate at the region glass cement having silver-colored barrier layer, i.e. glass cement in this region does not has with substrate
Adhesion.Then underlay substrate can be easier made to divide when packaging area being cut by cutting tools such as mechanical blades the most again
From, reduce and cut, at packaging area, the fragmentation risk caused, arrive ultra-narrow border effect, improve the yield rate of product.
It is understood that embodiment of above be merely to illustrate that principle of the present utility model and use exemplary
Embodiment, but this utility model is not limited thereto.For those skilled in the art, without departing from this
In the case of the spirit of utility model and essence, can make various modification and improvement, these modification and improvement are also considered as this reality
With novel protection domain.
Claims (9)
1. a display base plate, including underlay substrate, described underlay substrate is divided into viewing area and around described viewing area
The packaging area that territory is arranged, it is characterised in that described display base plate also includes that barrier layer, described barrier layer are arranged on described encapsulation
In region, the width on described barrier layer is the 5%-10% of the width of described packaging area.
Display base plate the most according to claim 1, it is characterised in that described packaging area includes the first envelope being disposed adjacent
Dress region and the second packaging area, described first packaging area is arranged on described packaging area near the one of described viewing area
Side, is provided with heat dissipating layer in described first packaging area, described barrier layer is arranged in described second packaging area, described heat radiation
Layer and described barrier layer are positioned at the same side of described display base plate.
Display base plate the most according to claim 1, it is characterised in that the thickness on described barrier layer is
4. according to the display base plate described in any one in claim 1-3, it is characterised in that the width of described packaging area is
400 μm～700 μm.
Display base plate the most according to claim 2, it is characterised in that the width of described second packaging area is more than described resistance
The width of barrier.
Display base plate the most according to claim 2, it is characterised in that described display base plate is array base palte.
Display base plate the most according to claim 6, it is characterised in that described heat dissipating layer includes being successively set on described array
Cushion, the first insulating barrier, metal level and the second insulating barrier on substrate.
Display base plate the most according to claim 7, it is characterised in that described display base plate includes the grid set gradually
Metal level, gate insulator and interlayer dielectric layer, described first insulating barrier and described gate insulator arrange with layer and are formed as
Integrally, described metal level and described gate metal layer arrange with layer and form as one, described second insulating barrier and described interlayer
Dielectric layer arranges with layer and forms as one.
Display base plate the most according to claim 2, it is characterised in that described display base plate is encapsulation cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620556145.4U CN205863170U (en) | 2016-06-07 | 2016-06-07 | A kind of display base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620556145.4U CN205863170U (en) | 2016-06-07 | 2016-06-07 | A kind of display base plate |
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| CN205863170U true CN205863170U (en) | 2017-01-04 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107644945A (en) * | 2017-09-13 | 2018-01-30 | 上海天马有机发光显示技术有限公司 | Array base palte, display panel, the method for packing of display panel and display device |
| CN108281570A (en) * | 2018-02-27 | 2018-07-13 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof |
| CN108717832A (en) * | 2018-06-04 | 2018-10-30 | 京东方科技集团股份有限公司 | Display base plate motherboard and preparation method thereof and cutting method, display base plate and display device |
| CN109830518A (en) * | 2019-02-28 | 2019-05-31 | 上海天马有机发光显示技术有限公司 | Display panel and display device |
-
2016
- 2016-06-07 CN CN201620556145.4U patent/CN205863170U/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107644945A (en) * | 2017-09-13 | 2018-01-30 | 上海天马有机发光显示技术有限公司 | Array base palte, display panel, the method for packing of display panel and display device |
| US10431609B2 (en) | 2017-09-13 | 2019-10-01 | Shanghai Tianma AM-OLED Co., Ltd. | Array substrate, display panel with frit at cutting edge for narrow bezel |
| CN108281570A (en) * | 2018-02-27 | 2018-07-13 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof |
| CN108281570B (en) * | 2018-02-27 | 2020-04-17 | 京东方科技集团股份有限公司 | Display panel and manufacturing method thereof |
| CN108717832A (en) * | 2018-06-04 | 2018-10-30 | 京东方科技集团股份有限公司 | Display base plate motherboard and preparation method thereof and cutting method, display base plate and display device |
| CN108717832B (en) * | 2018-06-04 | 2020-04-24 | 京东方科技集团股份有限公司 | Display substrate mother board, preparation method and cutting method thereof, display substrate and display device |
| CN109830518A (en) * | 2019-02-28 | 2019-05-31 | 上海天马有机发光显示技术有限公司 | Display panel and display device |
| CN109830518B (en) * | 2019-02-28 | 2021-09-14 | 上海天马有机发光显示技术有限公司 | Display panel and display device |
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