CN109830494A - A kind of image chip encapsulating structure and preparation method thereof with heat sinking function - Google Patents
A kind of image chip encapsulating structure and preparation method thereof with heat sinking function Download PDFInfo
- Publication number
- CN109830494A CN109830494A CN201910188179.0A CN201910188179A CN109830494A CN 109830494 A CN109830494 A CN 109830494A CN 201910188179 A CN201910188179 A CN 201910188179A CN 109830494 A CN109830494 A CN 109830494A
- Authority
- CN
- China
- Prior art keywords
- cofferdam
- image chip
- radiating groove
- encapsulating structure
- sinking function
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to image chip technical fields, more particularly to a kind of image chip encapsulating structure and preparation method thereof with heat sinking function, including image chip, image chip contains functional surfaces and non-functional surface corresponding thereto, and the functional surfaces contain weld pad and functional areas；Cofferdam is provided on the upside of the image chip, euphotic cover plate is provided at the top of cofferdam, several radiators have been evenly arranged on the inner sidewall in the cofferdam, radiating groove is uniformly provided on the cofferdam at the radiator back side, the slot cross-section that radiates is in isosceles trapezoid, and the big end of radiating groove is inwards arranged, and several cooling fins have been evenly arranged in the radiating groove.It is in arc-shaped the beneficial effects of the invention are as follows the mounting bar being evenly arranged on radiator, so that more heat sink strips can be installed in a limited space, it is then bigger with the contact area of heat, therefore more preferably heat dissipation effect can be played, effectively increase the service life of image chip.
Description
Technical field
The present invention relates to image chip technical fields, and in particular to a kind of image chip encapsulating structure with heat sinking function
And preparation method thereof.
Background technique
Image sensing chip is a kind of semiconductor module, is a kind of equipment that optical image is converted into electronic signal,
Electronic signal can be used to be further processed or stored after digitizing, or show for image to be transferred to display device
Show, it is widely used in digital camera and other electro-optical devices.Although CCD image sensor the quality of image with
And noise etc. is better than CMOS image sensor, but cmos sensor can be manufactured with traditional semiconductor fabrication techniques, it is raw
Cost is relatively low for production；Simultaneously because parts number used is relatively fewer and signal transmission distance is short, CMOS image sensor has
The advantages that low in energy consumption, capacitor, inductance and stray delay reduce.
A kind of air-tightness image chip encapsulating structure of Chinese patent (publication number CN107221516A) and preparation method thereof,
A kind of image chip encapsulating structure is disclosed in that patent, but certain heat can be generated at work by working as image chip,
The partial heat can not disperse in closed space, and the service life of image chip is then caused to decline to a great extent.
Summary of the invention
The purpose of the present invention is to provide a kind of image chip encapsulating structure and preparation method thereof with heat sinking function, with
Solve the problems mentioned above in the background art.
To achieve the above object, the invention provides the following technical scheme:
A kind of image chip encapsulating structure with heat sinking function, including image chip, image chip contain functional surfaces and and its
Opposite non-functional surface, the functional surfaces contain weld pad and functional areas；Cofferdam, the top in cofferdam are provided on the upside of the image chip
Portion is provided with euphotic cover plate, has been evenly arranged several radiators on the inner sidewall in the cofferdam, on the cofferdam at the radiator back side
Even to offer radiating groove, heat dissipation slot cross-section is in isosceles trapezoid, and the big end of radiating groove is inwards arranged, in the radiating groove uniformly
It is disposed with several cooling fins.
It is as a further solution of the present invention: is connected with conducting wire, conducting wire and cofferdam bottom on the upside of the weld pad
Portion is connected；Be connected with U-shaped on the downside of the image chip and reroute metallic circuit, U-shaped reroute metallic circuit both ends with
Conducting wire fits, and U-shaped reroutes and is provided with conductive structure on the downside of metallic circuit.
As the present invention, further scheme is: being provided with insulating layer on the outside of the cofferdam.
As the present invention, further scheme is: the cooling fin is vertically arranged, and the height of cooling fin is from radiating groove
Big end successively reduced to small end.
As the present invention, further scheme is: the radiator includes circular mounting plate, and circular mounting plate is fixed to be connected
It is connected on the inner sidewall of cofferdam, several mounting bars is uniformly fixedly connected on the circular mounting plate, have been evenly arranged on mounting bar
Several heat sink strips, heat sink strip surface layout have several radiation tooths.
As the present invention, further scheme is: the mounting bar is in semicircle shape.
As the present invention, further scheme is: the heat sink strip is bending.
As the present invention, further scheme is: the distance between the small end of the radiating groove and cofferdam lateral wall are to enclose
/ 5th of weir thickness.
A method of making the image chip encapsulating structure with heat sinking function, comprising the following steps:
Step 1: providing a cofferdam, conducting wire is formed in cofferdam bottom；
Step 2: offering radiating groove on the side wall in cofferdam, and cooling fin is installed in radiating groove；
Step 3: being fixedly connected with radiator on the cofferdam inner sidewall of radiating groove big end；
Step 4: euphotic cover plate to be bonded in the top in cofferdam；
Step 5: the weld pad of image chip is bonded with conducting wire；
Step 6: the lateral wall in cofferdam forms insulating layer；
Step 7: being bonded with U-shaped in the lower surface of image chip reroutes metallic circuit, and metal wire is rerouted in U-shaped
Electric conductor is formed on the downside of road.
It is in arc-shaped the beneficial effects of the invention are as follows the mounting bar being evenly arranged on radiator, so that in a limited space
It is interior that more heat sink strips can be installed, then it is bigger with the contact area of heat, therefore more preferably heat dissipation effect can be played, effectively
Improve the service life of image chip；Radiator will be dispersed into radiating groove after heat absorption, the heat dissipation arranged in radiating groove
Piece can be by heat step by step to external diffusion, and distributes heat to the outside in cofferdam, so that the temperature in cofferdam reduces, then into one
Step improves the service life of image chip.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is the structural schematic diagram of radiator of the present invention；
Fig. 3 is the enlarged drawing of heat sink strip of the present invention.
In figure: the cofferdam 1-；2- image chip；3- conducting wire；4- euphotic cover plate；5- radiator；6- radiating groove；7- heat dissipation
Piece；8-U font reroutes metallic circuit；9- conductive structure；10- insulating layer；201- weld pad；The functional areas 202-；501- circle peace
Loading board；502- mounting bar；503- heat sink strip；504- radiation tooth.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Embodiment 1:
Referring to Fig. 1, in the embodiment of the present invention, a kind of image chip encapsulating structure with heat sinking function, including image chip
2, non-functional surface of the image chip 2 containing functional surfaces and corresponding thereto, the functional surfaces contain weld pad 201 and functional areas 202；Institute
It states and is provided with cofferdam 1 on the upside of image chip 2, the top in cofferdam 1 is provided with euphotic cover plate 4, on the inner sidewall in the cofferdam 1 uniformly
Several radiators 5 are disposed with, radiating groove 6 are uniformly provided on the cofferdam 1 at 5 back side of radiator, 6 section of radiating groove is in isosceles ladder
Shape, and the big end of radiating groove 6 is inwards arranged, has been evenly arranged several cooling fins 7 in the radiating groove 6, radiator 5 is by heat
It is dispersed into after absorption in radiating groove 6, the cooling fin 7 arranged in radiating groove 6 can be by heat step by step to external diffusion, and heat is dissipated
It is dealt into the outside in cofferdam 1, so that the temperature in cofferdam 1 reduces, further improves the service life of image chip 2.
Conducting wire 3 is connected on the upside of the weld pad 201, conducting wire 3 is connected with 1 bottom of cofferdam；The image core
It is connected with U-shaped on the downside of piece 2 and reroutes metallic circuit 8, U-shaped reroutes 8 both ends of metallic circuit and fits with conducting wire 3,
And U-shaped reroutes and is provided with conductive structure 9 on the downside of metallic circuit 8.
Insulating layer 10 is provided on the outside of the cofferdam 1.
The cooling fin 7 is vertically arranged, and the height of cooling fin 7 is successively reduced from the big end of radiating groove 1 to small end.
Embodiment 2:
Fig. 1-Fig. 3 is please referred to, the radiator 5 includes circular mounting plate 501, and circular mounting plate 501 is fixedly connected in cofferdam 1
On side wall, several mounting bars 502 are uniformly fixedly connected on the circular mounting plate 501, if being evenly arranged on mounting bar 502
Dry heat sink strip 503,503 surface layout of heat sink strip have several radiation tooths 504, the mounting bar 502 being evenly arranged on radiator 5
In arc-shaped, so that more heat sink strips 503 can be installed in a limited space, then it is bigger with the contact area of heat, because
This can play more preferably heat dissipation effect, effectively increase the service life of image chip 2；Radiation tooth 504 further improves
Contact area.
The mounting bar 502 is in semicircle shape.
The heat sink strip 503 is bending.
The distance between small end and 1 lateral wall of cofferdam of the radiating groove 6 are 1/5th of 1 thickness of cofferdam.
A method of making the image chip encapsulating structure with heat sinking function, comprising the following steps:
Step 1: providing a cofferdam 1, conducting wire 3 is formed in 1 bottom of cofferdam；
Step 2: offering radiating groove 6 on the side wall in cofferdam 1, and cooling fin 7 is installed in radiating groove 6；
Step 3: being fixedly connected with radiator 5 on 1 inner sidewall of cofferdam of 6 big end of radiating groove；
Step 4: euphotic cover plate 4 to be bonded in the top in cofferdam 1；
Step 5: the weld pad 201 of image chip 2 is bonded with conducting wire 3；
Step 6: the lateral wall in cofferdam 1 forms insulating layer 10；
Step 7: being bonded with U-shaped in the lower surface of image chip 2 reroutes metallic circuit 8, and metal is rerouted in U-shaped
Electric conductor 9 is formed on the downside of route 8.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (9)
1. a kind of image chip encapsulating structure with heat sinking function, including image chip (2), image chip (2) is containing functional
Face and non-functional surface corresponding thereto, the functional surfaces contain weld pad (201) and functional areas (202)；On the image chip (2)
Side is provided with cofferdam (1), and euphotic cover plate (4) are provided at the top of cofferdam (1), which is characterized in that the inner sidewall of the cofferdam (1)
On be evenly arranged several radiators (5), be uniformly provided with radiating groove (6), radiating groove on the cofferdam (1) at radiator (5) back side
(6) section is in isosceles trapezoid, and the big end of radiating groove (6) is inwards arranged, and several dissipate has been evenly arranged in the radiating groove (6)
Backing (7).
2. a kind of image chip encapsulating structure with heat sinking function according to claim 1, which is characterized in that the weldering
It is connected with conducting wire (3) on the upside of pad (201), conducting wire (3) is connected with cofferdam (1) bottom；Under the image chip (2)
Side is connected with U-shaped and reroutes metallic circuit (8), and U-shaped reroutes metallic circuit (8) both ends and fits with conducting wire (3),
And U-shaped reroutes and is provided with conductive structure (9) on the downside of metallic circuit (8).
3. a kind of image chip encapsulating structure with heat sinking function according to claim 2, which is characterized in that described to enclose
Insulating layer (10) are provided on the outside of weir (1).
4. a kind of image chip encapsulating structure with heat sinking function according to claim 1, which is characterized in that described to dissipate
Backing (7) is vertically arranged, and the height of cooling fin (7) is successively reduced from the big end of radiating groove (1) to small end.
5. a kind of image chip encapsulating structure with heat sinking function according to claim 3, which is characterized in that described to dissipate
Hot body (5) includes circular mounting plate (501), and circular mounting plate (501) is fixedly connected on cofferdam (1) inner sidewall, the circle
It is uniformly fixedly connected on mounting plate (501) several mounting bars (502), mounting bar has been evenly arranged several heat dissipations on (502)
Item (503), heat sink strip (503) surface layout have several radiation tooths (504).
6. a kind of image chip encapsulating structure with heat sinking function according to claim 5, which is characterized in that the peace
Filling item (502) is in semicircle shape.
7. a kind of image chip encapsulating structure with heat sinking function according to claim 5, which is characterized in that described to dissipate
Hot item (503) is bending.
8. a kind of image chip encapsulating structure with heat sinking function according to claim 4, which is characterized in that described to dissipate
The distance between small end and cofferdam (1) lateral wall of heat channel (6) are 1/5th of cofferdam (1) thickness.
9. a kind of method for making the image chip encapsulating structure as claimed in claim 5 with heat sinking function, feature exist
In, comprising the following steps:
Step 1: providing a cofferdam (1), conducting wire (3) are formed in cofferdam (1) bottom；
Step 2: offering radiating groove (6) on the side wall of cofferdam (1), and cooling fin (7) are installed in radiating groove (6)；
Step 3: being fixedly connected with radiator (5) on cofferdam (1) inner sidewall of radiating groove (6) big end；
Step 4: euphotic cover plate (4) to be bonded in the top of cofferdam (1)；
Step 5: the weld pad (201) of image chip (2) is bonded with conducting wire (3)；
Step 6: the lateral wall in cofferdam (1) forms insulating layer (10)；
Step 7: being bonded with U-shaped in the lower surface of image chip (2) reroutes metallic circuit (8), and rerouted in U-shaped
Electric conductor (9) are formed on the downside of metallic circuit (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910188179.0A CN109830494A (en) | 2019-03-13 | 2019-03-13 | A kind of image chip encapsulating structure and preparation method thereof with heat sinking function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910188179.0A CN109830494A (en) | 2019-03-13 | 2019-03-13 | A kind of image chip encapsulating structure and preparation method thereof with heat sinking function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109830494A true CN109830494A (en) | 2019-05-31 |
Family
ID=66868932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910188179.0A Pending CN109830494A (en) | 2019-03-13 | 2019-03-13 | A kind of image chip encapsulating structure and preparation method thereof with heat sinking function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109830494A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010004128A1 (en) * | 1999-12-10 | 2001-06-21 | Park Young Kuk | Semiconductor package and manufacturing method thereof |
| CN1577875A (en) * | 2003-07-29 | 2005-02-09 | 许程翔 | Horizontal control image sensing chip packaging structure and packaging method thereof |
| KR20120021086A (en) * | 2010-08-31 | 2012-03-08 | 엘지이노텍 주식회사 | Camera module and methid of cooling thereof |
| CN104576570A (en) * | 2013-10-25 | 2015-04-29 | 佳能株式会社 | Electronic component, electronic apparatus, and method for manufacturing the electronic component |
-
2019
- 2019-03-13 CN CN201910188179.0A patent/CN109830494A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010004128A1 (en) * | 1999-12-10 | 2001-06-21 | Park Young Kuk | Semiconductor package and manufacturing method thereof |
| CN1577875A (en) * | 2003-07-29 | 2005-02-09 | 许程翔 | Horizontal control image sensing chip packaging structure and packaging method thereof |
| KR20120021086A (en) * | 2010-08-31 | 2012-03-08 | 엘지이노텍 주식회사 | Camera module and methid of cooling thereof |
| CN104576570A (en) * | 2013-10-25 | 2015-04-29 | 佳能株式会社 | Electronic component, electronic apparatus, and method for manufacturing the electronic component |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR200448519Y1 (en) | Heat sink for protrusion type ic package | |
| KR101711007B1 (en) | Image sensor module having image sensor package | |
| KR101278393B1 (en) | Power package module and a fabricating mothod the same | |
| US7902649B2 (en) | Leadframe for leadless package, structure and manufacturing method using the same | |
| JP2009105297A (en) | Resin-encapsulated semiconductor device | |
| US8371715B2 (en) | LED illuminator module with high heat-dissipating efficiency and manufacturing method therefor | |
| CN103098205A (en) | Apparatus for integrated circuit packaging | |
| JP5446302B2 (en) | Heat sink and module | |
| US6643136B2 (en) | Multi-chip package with embedded cooling element | |
| CN106098641B (en) | A kind of integrated circuit package structure of heat dissipation | |
| US20150364409A1 (en) | Electronic device with die being sunk in substrate | |
| CN109830494A (en) | A kind of image chip encapsulating structure and preparation method thereof with heat sinking function | |
| US20050157469A1 (en) | Cooling arrangement for a printed circuit board with a heat-dissipating electronic element | |
| US20060197219A1 (en) | Heat sink and package structure | |
| US8410597B2 (en) | Three dimensional semiconductor device | |
| JP2006237464A (en) | Semiconductor light emitting device | |
| TWI619212B (en) | Bonding-wire-type heat sink structure applicable to semiconductor devices | |
| CN216624253U (en) | LQFP (low-profile quad flat package) packaging chip | |
| CN214226906U (en) | Chip heat radiation structure, packaged chip and electronic equipment | |
| CN217641297U (en) | Built-in heat dissipation chip packaging structure | |
| CN214588837U (en) | Electronic packaging heat sink assembly with heat radiation structure | |
| CN220934057U (en) | Packaging structure | |
| CN214956889U (en) | Chip laminated POP packaging structure applied to image sensor | |
| CN215896378U (en) | Heat radiation structure and chip structure thereof | |
| JP2006140203A (en) | Sip heat dissipation package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190531 |