CN109822257A - A kind of quartz glass sealing-in lead-free solder - Google Patents
A kind of quartz glass sealing-in lead-free solder Download PDFInfo
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- CN109822257A CN109822257A CN201910273944.9A CN201910273944A CN109822257A CN 109822257 A CN109822257 A CN 109822257A CN 201910273944 A CN201910273944 A CN 201910273944A CN 109822257 A CN109822257 A CN 109822257A
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- lead
- free solder
- quartz glass
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- glass sealing
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Abstract
The invention discloses a kind of quartz glass sealing-in lead-free solders.The matrix of the lead-free solder is tin, and the atomic percent group of the Ti and O of introducing are divided into Ti:0.2%~6%, O:0.05%~5.9%, wherein the atomic ratio of Ti and O is greater than 1, and the impurity mass percent in lead-free solder is less than or equal to 0.1%.The welding temperature range of the lead-free solder is 600 DEG C~800 DEG C, and welding vacuum degree is less than or equal to 5 × 10‑3Pa.Quartz glass sealing-in of the invention does not need scaling powder during quartz glass sealing-in with lead-free solder, simplifies quartz glass process for sealing, improves the vacuum sealing reliability of quartz glass sealing-in.The lead-free solder can be widely applied to quartz glass sealing-in, can also be applied to quartz glass, softening temperature not less than 800 DEG C with SiO2There is being welded to each other for metal of titanium coating etc. on glass, titanium and surface as main component.It is particularly suitable for preparing xenon flash lamp, the service life of xenon flash lamp and functional reliability can be made to significantly improve.
Description
Technical field
The invention belongs to brazing solder technical fields, and in particular to a kind of quartz glass sealing-in lead-free solder.
Background technique
Quartz glass sealing-in can be widely applied to electrovacuum equipment, electric light source, solar energy reception pipe and lithium with lead-free solder
The fields such as battery, welding section have good vacuum sealing performance and higher structural strength.High power xenon flashlamp is as big
The pump light source of type laser has a wide range of applications.In high power xenon flashlamp technology of preparing, how quartz glass is realized
Vacuum sealing between metal is a technological difficulties all the time, and reason is the thermal expansion coefficient of quartz glass and metal
An order of magnitude is differed, there are biggish stress of sealing.
The method for sealing between quartz glass and metal being widely used at present is to connect stone using several transitional glass
English glass and metal realize Stress match.This sealing technology will be processed using oxyhydrogen flame, and there are larger hidden for production security
Suffer from, and is not easy to realize mechanization and automated production.In xenon lamp technology of preparing, quartz can also be realized using molybdenum foil method for sealing
The connection of glass and metal electrode component, but molybdenum foil conductive capability is poor, and this method for sealing is only applicable to Low-power pulsed xenon lamp.
Chinese patent literature library discloses the patent application of Publication No. CN201410307078.8, this patent application is
High-temperature metal sealing-in high power xenon flashlamp and preparation method thereof, the method for sealing of disclosed quartz glass and metal electrode
It is to carry out metal Ti ion implanting in the outer surface of quartz adapter tube first, outer surface of tube wall is made to form a Ti ion implanting
Layer is coated with metallic diaphragm at the position for forming Ti ion implanted layer, and outermost layer selects Ni layers.It will be coated with using Ag parent metal
It is welded with metal thin-wall sleeve at the metal layer position of the quartz adapter tube of metal layer.Between this quartz glass and metal
Method for sealing complex process requires appointed condition high.
Summary of the invention
Technical problem to be solved by the invention is to provide a kind of quartz glass sealing-in lead-free solders.
Quartz glass sealing-in lead-free solder of the invention, its main feature is that, the matrix of the lead-free solder is tin, is introduced
Ti and O it is as follows according to atomic percent component:
Ti:0.2%~6%；
O:0.05%~5.9%；
Wherein, the atomic ratio of Ti and O is greater than 1；
Impurity mass percent in the lead-free solder is less than or equal to 0.1%.
Further, the matrix of the lead-free solder is tin, and the Ti and O of introducing are as follows according to atomic percent component:
Ti:0.5%~2%；
O:0.05%~1.9%；
Wherein, the atomic ratio of Ti and O is greater than 1；
Impurity mass percent in the lead-free solder is less than or equal to 0.1%.
Further, the matrix of the lead-free solder is tin, and the Ti and O of introducing are as follows according to atomic percent component:
Ti:1.5%；
O:0.5%.
The shape of the quartz glass sealing-in lead-free solder is block or sheet.
The welding temperature range of the quartz glass sealing-in lead-free solder is 600 DEG C~800 DEG C, and welding vacuum degree is small
In equal to 5 × 10-3Pa。
Quartz glass sealing-in lead-free solder of the invention is less than or equal to 5 × 10 in 600 DEG C~800 DEG C and vacuum degree-3Pa
Interface displacement can occur in environment with quartz glass to react, form continuous transition layer, process for sealing is simple, and sealing-in process is clean
Pollution-free, sealing-in area has high vacuum sealing performance and good structural strength.
Quartz glass sealing-in of the invention does not need scaling powder during quartz glass sealing-in with lead-free solder, simplifies
Quartz glass process for sealing improves the vacuum sealing reliability of quartz glass sealing-in.Quartz glass sealing-in nothing of the invention
Kupper solder both can be widely applied to quartz glass sealing-in, can also be applied to quartz glass, softening temperature not less than 800 DEG C with
SiO2There is being welded to each other for metal of titanium coating etc. on glass, titanium and surface as main component, and there is good vacuum in welding section
Sealing performance.Especially, quartz glass sealing-in of the invention is used to prepare xenon flash lamp with lead-free solder, can make xenon flash lamp
Service life and functional reliability significantly improve.
Specific embodiment
Below by embodiment, the present invention will be described in detail.
Following embodiment preferentially meets condition of the atomic ratio greater than 1 of Ti:0.2%~6% and Ti and O, selects on this basis
Select the embodiment for meeting the condition of O:0.05%~5.9%.
Embodiment 1
The matrix of the quartz glass sealing-in lead-free solder of the present embodiment is tin, and the Ti and O of introducing are according to atomic percent component
For Ti:0.2%, O:0.05%.The fusing point of lead-free solder is 231.9 DEG C.Lead-free solder is the square block that side length is 2mm.
Embodiment 2
The matrix of the quartz glass sealing-in lead-free solder of the present embodiment is tin, and the Ti and O of introducing are according to atomic percent component
For Ti:6%, O:5.9%.The fusing point of lead-free solder is 231.9 DEG C.Lead-free solder is the sheet material with a thickness of 0.25mm.
Embodiment 3
The matrix of the quartz glass sealing-in lead-free solder of the present embodiment is tin, and the Ti and O of introducing are according to atomic percent component
For Ti:0.5%, O:0.05%.The fusing point of lead-free solder is 231.9 DEG C.Lead-free solder is the sheet material with a thickness of 0.15mm.
Embodiment 4
The matrix of the quartz glass sealing-in lead-free solder of the present embodiment is tin, and the Ti and O of introducing are according to atomic percent component
Ti:2%, O:1.9%.The fusing point of lead-free solder is 231.9 DEG C.Lead-free solder is the sheet material with a thickness of 0.2mm.
Embodiment 5
The matrix of the quartz glass sealing-in lead-free solder of the present embodiment is tin, and the Ti and O of introducing are according to atomic percent component
Ti:1.5%, O:0.5%.The fusing point of lead-free solder is 231.9 DEG C.Lead-free solder is the sheet material with a thickness of 0.2mm.
The present invention is not limited to above-mentioned specific embodiment, person of ordinary skill in the field from the above idea,
Without creative labor, made various transformation are within the scope of the present invention.
Claims (5)
1. a kind of quartz glass sealing-in lead-free solder, which is characterized in that the matrix of the lead-free solder is tin, the Ti of introducing
It is as follows according to atomic percent component with O:
Ti:0.2%~6%；
O:0.05%~5.9%；
Wherein, the atomic ratio of Ti and O is greater than 1；
Impurity mass percent in the lead-free solder is less than or equal to 0.1%.
2. quartz glass sealing-in lead-free solder according to claim 1, which is characterized in that the base of the lead-free solder
Body is tin, and the Ti and O of introducing are as follows according to atomic percent component:
Ti:0.5%~2%；
O:0.05%~1.9%；
Wherein, the atomic ratio of Ti and O is greater than 1；
Impurity mass percent in the lead-free solder is less than or equal to 0.1%.
3. quartz glass sealing-in lead-free solder according to claim 2, which is characterized in that the base of the lead-free solder
Body is tin, and the Ti and O of introducing are as follows according to atomic percent component:
Ti:1.5%；
O:0.5%.
4. quartz glass sealing-in lead-free solder according to claim 1, which is characterized in that the lead-free solder shape
For block or sheet.
5. quartz glass sealing-in lead-free solder according to claim 1, which is characterized in that the weldering of the lead-free solder
Jointing temp range is 600 DEG C~800 DEG C, and welding vacuum degree is less than or equal to 5 × 10-3Pa。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910273944.9A CN109822257B (en) | 2019-04-08 | 2019-04-08 | Lead-free solder for sealing quartz glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910273944.9A CN109822257B (en) | 2019-04-08 | 2019-04-08 | Lead-free solder for sealing quartz glass |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109822257A true CN109822257A (en) | 2019-05-31 |
| CN109822257B CN109822257B (en) | 2021-12-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910273944.9A Active CN109822257B (en) | 2019-04-08 | 2019-04-08 | Lead-free solder for sealing quartz glass |
Country Status (1)
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0195893A (en) * | 1987-10-08 | 1989-04-13 | Seiko Instr & Electron Ltd | Brazing filler metal |
| CN1313802A (en) * | 1999-06-11 | 2001-09-19 | 日本板硝子株式会社 | Lead-free solder |
| CN104051224A (en) * | 2014-06-30 | 2014-09-17 | 中国科学院上海光学精密机械研究所 | High temperature metal sealing-in high power pulse xenon lamp and manufacturing method thereof |
-
2019
- 2019-04-08 CN CN201910273944.9A patent/CN109822257B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0195893A (en) * | 1987-10-08 | 1989-04-13 | Seiko Instr & Electron Ltd | Brazing filler metal |
| CN1313802A (en) * | 1999-06-11 | 2001-09-19 | 日本板硝子株式会社 | Lead-free solder |
| CN104051224A (en) * | 2014-06-30 | 2014-09-17 | 中国科学院上海光学精密机械研究所 | High temperature metal sealing-in high power pulse xenon lamp and manufacturing method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 马永波等: "大功率脉冲氨灯研制中的几个关键问题", 《第九届中国核靶技术学术交流会摘要集》 * |
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|---|---|
| CN109822257B (en) | 2021-12-03 |
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