CN109822257B - Lead-free solder for sealing quartz glass - Google Patents
Lead-free solder for sealing quartz glass Download PDFInfo
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- CN109822257B CN109822257B CN201910273944.9A CN201910273944A CN109822257B CN 109822257 B CN109822257 B CN 109822257B CN 201910273944 A CN201910273944 A CN 201910273944A CN 109822257 B CN109822257 B CN 109822257B
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Abstract
The invention discloses a lead-free solder for sealing quartz glass. The lead-free solder has a base body made of tin, and introduced Ti and O have the atomic percentage composition of Ti: 0.2% -6%, O: 0.05-5.9%, wherein the atomic ratio of Ti to O is more than 1, and the mass percentage of impurities in the lead-free solder isThe ratio is 0.1% or less. The lead-free solder has a soldering temperature range of 600-800 deg.C and a soldering vacuum degree of 5 × 10 or less‑3Pa. The lead-free solder for sealing the quartz glass does not need soldering flux in the process of sealing the quartz glass, simplifies the sealing process of the quartz glass and improves the vacuum sealing reliability of sealing the quartz glass. The lead-free solder can be widely applied to sealing of quartz glass, can also be applied to quartz glass, and has a softening temperature of not less than 800 ℃ and SiO2The glass, titanium material and metal with titanium coating on the surface are welded together. The method is particularly suitable for preparing the pulse xenon lamp, and can obviously improve the service life and the working reliability of the pulse xenon lamp.
Description
Technical Field
The invention belongs to the technical field of brazing solder, and particularly relates to a lead-free solder for sealing quartz glass.
Background
The lead-free solder for sealing the quartz glass can be widely applied to the fields of electric vacuum equipment, electric light sources, solar receiving tubes, lithium batteries and the like, and a welding area has good vacuum sealing performance and higher structural strength. The high-power pulse xenon lamp has wide application as a pumping light source of a large laser. In the preparation technology of a high-power pulse xenon lamp, how to realize vacuum sealing between quartz glass and metal is always a technical difficulty, because the thermal expansion coefficients of the quartz glass and the metal are different by an order of magnitude, and larger sealing stress exists.
The widely used sealing method between quartz glass and metal at present adopts several kinds of transition glass to connect quartz glass and metal to realize stress matching. The sealing technology needs oxyhydrogen flame processing, has great hidden danger in production safety, and is not easy to realize mechanical and automatic production. In the xenon lamp preparation technology, the connection between quartz glass and a metal electrode assembly can be realized by adopting a molybdenum foil sealing method, but the molybdenum foil has poor electric conductivity, and the sealing method is only suitable for a low-power pulse xenon lamp.
The Chinese patent document library discloses a patent application with a publication number of CN201410307078.8, which is a high-temperature metal sealing high-power pulse xenon lamp and a preparation method thereof, and discloses a sealing method of quartz glass and a metal electrode. And welding the metal layer part of the quartz connecting pipe plated with the metal layer with the metal thin-wall sleeve by using Ag-based solder. The sealing method between the quartz glass and the metal has complex process and high requirement on equipment condition.
Disclosure of Invention
The invention aims to solve the technical problem of providing a lead-free solder for sealing quartz glass.
The lead-free solder for sealing the quartz glass is characterized in that a substrate of the lead-free solder is tin, and introduced Ti and O comprise the following components in atomic percentage:
Ti：0.2%～6%；
O：0.05%～5.9%；
wherein the atomic ratio of Ti to O is greater than 1;
the mass percentage of impurities in the lead-free solder is less than or equal to 0.1 percent.
Further, the matrix of the lead-free solder is tin, and the introduced Ti and O comprise the following components in atomic percentage:
Ti：0.5%～2%；
O：0.05%～1.9%；
wherein the atomic ratio of Ti to O is greater than 1;
the mass percentage of impurities in the lead-free solder is less than or equal to 0.1 percent.
Still further, the matrix of the lead-free solder is tin, and the introduced Ti and O comprise the following components in atomic percentage:
Ti：1.5%；
O：0.5%。
the lead-free solder for sealing the quartz glass is in a block or sheet shape.
The welding temperature range of the lead-free solder for sealing the quartz glass is 600-800 ℃, and the welding vacuum degree is less than or equal to 5 multiplied by 10-3Pa。
The lead-free solder for sealing quartz glass is used at 600-800 ℃ and the vacuum degree is less than or equal to 5 multiplied by 10-3The sealing material can perform interface replacement reaction with quartz glass in a Pa environment to form a continuous transition layer, the sealing process is simple, the sealing process is clean and pollution-free, and the sealing area has extremely high vacuum sealing performance and good structural strength.
The lead-free solder for sealing the quartz glass does not need soldering flux in the process of sealing the quartz glass, simplifies the sealing process of the quartz glass and improves the vacuum sealing reliability of sealing the quartz glass. The lead-free solder for sealing quartz glass can be widely applied to sealing quartz glass, can also be applied to quartz glass, and has the softening temperature of not lower than 800 ℃ and SiO2The glass, titanium material and metal with titanium coating on the surface are welded together, and the welding area has good vacuum sealing performance. Particularly, the lead-free solder for sealing the quartz glass is used for preparing the pulse xenon lamp, so that the service life and the working reliability of the pulse xenon lamp are obviously improved.
Detailed Description
The present invention will be described in detail below with reference to examples.
The following examples preferably satisfy Ti: 0.2 to 6 percent and the atomic ratio of Ti to O is more than 1, and the following conditions are selected on the basis that: embodiment(s) of the condition(s) 0.05% to 5.9%.
Example 1
The lead-free solder for sealing quartz glass in the embodiment has a base body of tin, and introduced Ti and O comprise the following components in atomic percent: 0.2%, O: 0.05 percent. The melting point of the lead-free solder was 231.9 ℃. The lead-free solder is a square block with the side length of 2 mm.
Example 2
The lead-free solder for sealing quartz glass in the embodiment has a base body of tin, and introduced Ti and O comprise the following components in atomic percent: 6%, O: 5.9 percent. The melting point of the lead-free solder was 231.9 ℃. The lead-free solder is a sheet with a thickness of 0.25 mm.
Example 3
The lead-free solder for sealing quartz glass in the embodiment has a base body of tin, and introduced Ti and O comprise the following components in atomic percent: 0.5%, O: 0.05 percent. The melting point of the lead-free solder was 231.9 ℃. The lead-free solder is a sheet with a thickness of 0.15 mm.
Example 4
The lead-free solder for sealing quartz glass in the embodiment has a base body of tin, and introduced Ti and O are mixed according to the atomic percentage: 2%, O: 1.9 percent. The melting point of the lead-free solder was 231.9 ℃. The lead-free solder is a sheet with a thickness of 0.2 mm.
Example 5
The lead-free solder for sealing quartz glass in the embodiment has a base body of tin, and introduced Ti and O are mixed according to the atomic percentage: 1.5%, O: 0.5 percent. The melting point of the lead-free solder was 231.9 ℃. The lead-free solder is a sheet with a thickness of 0.2 mm.
The present invention is not limited to the above-described embodiments, and those skilled in the art will be able to make various modifications without creative efforts from the above-described conception, and fall within the scope of the present invention.
Claims (3)
1. The lead-free solder for sealing the quartz glass is characterized in that a matrix of the lead-free solder is tin, and introduced Ti and O comprise the following components in atomic percentage:
Ti：0.5％～2％；
O：0.05％～1.9％；
wherein the atomic ratio of Ti to O is greater than 1;
the mass percentage of impurities in the lead-free solder is less than or equal to 0.1 percent;
the welding temperature range of the lead-free solder is 600-800 ℃, and the welding vacuum degree is less than or equal to 5 multiplied by 10-3Pa。
2. The lead-free solder for sealing quartz glass according to claim 1, wherein the base of the lead-free solder is tin, and the introduced Ti and O have the following composition in atomic percent:
Ti：1.5％；
O：0.5％。
3. a lead-free solder for sealing quartz glass according to claim 1, wherein the lead-free solder is in the form of a block or a sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910273944.9A CN109822257B (en) | 2019-04-08 | 2019-04-08 | Lead-free solder for sealing quartz glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910273944.9A CN109822257B (en) | 2019-04-08 | 2019-04-08 | Lead-free solder for sealing quartz glass |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109822257A CN109822257A (en) | 2019-05-31 |
| CN109822257B true CN109822257B (en) | 2021-12-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910273944.9A Active CN109822257B (en) | 2019-04-08 | 2019-04-08 | Lead-free solder for sealing quartz glass |
Country Status (1)
| Country | Link |
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| CN (1) | CN109822257B (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0195893A (en) * | 1987-10-08 | 1989-04-13 | Seiko Instr & Electron Ltd | Brazing filler metal |
| KR20010072364A (en) * | 1999-06-11 | 2001-07-31 | 이즈하라 요조 | Lead-free solder |
| CN104051224B (en) * | 2014-06-30 | 2016-04-13 | 中国科学院上海光学精密机械研究所 | High-temperature metal sealing-in high power xenon flashlamp and preparation method thereof |
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2019
- 2019-04-08 CN CN201910273944.9A patent/CN109822257B/en active Active
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