CN109986233B - Sn-Ti-Ag ternary alloy solder for sealing quartz glass - Google Patents
Sn-Ti-Ag ternary alloy solder for sealing quartz glass Download PDFInfo
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- CN109986233B CN109986233B CN201910273946.8A CN201910273946A CN109986233B CN 109986233 B CN109986233 B CN 109986233B CN 201910273946 A CN201910273946 A CN 201910273946A CN 109986233 B CN109986233 B CN 109986233B
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- ternary alloy
- alloy solder
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- quartz glass
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Abstract
The invention discloses quartz glassSn-Ti-Ag ternary alloy solder for sealing. The ternary alloy solder has a matrix of tin, and the introduced Ti and Ag comprise the following components in percentage by weight: 0.1-1.6%, Ag: 0.1 to 2.0 percent of the total mass of the solder, 0.05 to 3.9 percent of the atomic percent of the introduced O, and less than or equal to 0.1 percent of the mass percent of impurities in the ternary alloy solder. The welding temperature range of the ternary alloy solder is 650-800 ℃, and the welding vacuum degree is less than or equal to 5 multiplied by 10‑3Pa. The ternary alloy solder does not need soldering flux in the process of sealing the quartz glass, simplifies the sealing process of the quartz glass and improves the vacuum sealing reliability of sealing the quartz glass. The ternary alloy solder can be widely applied to sealing of quartz glass, can also be applied to quartz glass, and has the softening temperature of not less than 800 ℃ and is made of SiO2The mutual welding of glass, titanium material, oxygen-free copper and metal with titanium coating on the surface is especially suitable for preparing pulse xenon lamp, and can raise the service life and work reliability of pulse xenon lamp obviously.
Description
Technical Field
The invention belongs to the technical field of brazing solders, and particularly relates to an Sn-Ti-Ag ternary alloy solder for sealing quartz glass.
Background
The ternary alloy solder for sealing quartz glass can be widely applied to the fields of electric vacuum equipment, electric light sources, solar receiving tubes, lithium batteries and the like, and a welding area has good vacuum sealing performance and higher structural strength. The high-power pulse xenon lamp has wide application as a pumping light source of a large laser. In the preparation technology of a high-power pulse xenon lamp, how to realize vacuum sealing between quartz glass and metal is always a technical difficulty, because the thermal expansion coefficients of the quartz glass and the metal are different by an order of magnitude, and larger sealing stress exists.
The widely used sealing method between quartz glass and metal at present adopts several kinds of transition glass to connect quartz glass and metal to realize stress matching. The sealing technology needs oxyhydrogen flame processing, has great hidden danger in production safety, and is not easy to realize mechanical and automatic production. In the xenon lamp preparation technology, the connection between quartz glass and a metal electrode assembly can be realized by adopting a molybdenum foil sealing method, but the molybdenum foil has poor electric conductivity, and the sealing method is only suitable for a low-power pulse xenon lamp.
The Chinese patent document library discloses a patent application with a publication number of CN201410307078.8, which is a high-temperature metal sealing high-power pulse xenon lamp and a preparation method thereof, and discloses a sealing method of quartz glass and a metal electrode. And welding the metal layer part of the quartz connecting pipe plated with the metal layer with the metal thin-wall sleeve by using Ag-based solder. The sealing method between the quartz glass and the metal has complex process and high requirement on equipment condition.
Disclosure of Invention
The invention aims to solve the technical problem of providing the Sn-Ti-Ag ternary alloy solder for sealing the quartz glass.
The Sn-Ti-Ag ternary alloy solder for sealing the quartz glass is characterized in that a substrate of the ternary alloy solder is tin, and the introduced Ti and Ag comprise the following components in percentage by weight:
Ti：0.2%～1.6%；
Ag：0.1%～2.0%；
the atomic percentage of the introduced O is 0.05 to 3.9 percent;
the mass percentage of impurities in the ternary alloy solder is less than or equal to 0.1 percent.
Further, the substrate of the ternary alloy solder is tin, and the introduced Ti and Ag comprise the following components in percentage by weight:
Ti：0.2%～0.8%；
Ag：0.2%～1.2%；
the atomic percentage of the introduced O is 0.1 to 1.9 percent;
the mass percentage of impurities in the ternary alloy solder is less than or equal to 0.1 percent.
Still further, the substrate of the ternary alloy solder is tin, and the introduced Ti and Ag comprise the following components in percentage by weight:
Ti：0.6%；
Ag：0.8%；
the atomic percentage composition of O introduced was 0.5%.
The Sn-Ti-Ag ternary alloy solder for sealing the quartz glass is in a block or sheet shape.
The welding temperature range of the Sn-Ti-Ag ternary alloy solder for sealing quartz glass is 650-800 ℃, and the welding vacuum degree is less than or equal to 5 multiplied by 10-3Pa。
The Sn-Ti-Ag ternary alloy solder for sealing quartz glass is prepared at 650-800 ℃ and the vacuum degree of less than or equal to 5 multiplied by 10-3The sealing material can perform interface replacement reaction with quartz glass in a Pa environment to form a continuous transition layer, the sealing process is simple, the sealing process is clean and pollution-free, and the sealing area has extremely high vacuum sealing performance and good structural strength.
The Sn-Ti-Ag ternary alloy solder for sealing the quartz glass does not need soldering flux in the process of sealing the quartz glass, simplifies the sealing process of the quartz glass and improves the vacuum sealing reliability of the quartz glass sealing. The Sn-Ti-Ag ternary alloy solder for sealing quartz glass can be widely usedCan be widely applied to sealing of quartz glass, can also be applied to quartz glass, and has the softening temperature of not less than 800 ℃ and SiO2The glass, titanium material, oxygen-free copper and metal with titanium coating on the surface are welded together, and the welding zone has good vacuum sealing performance. Particularly, the Sn-Ti-Ag ternary alloy solder for sealing the quartz glass is used for preparing the pulse xenon lamp, so that the service life and the working reliability of the pulse xenon lamp are obviously improved.
Detailed Description
The present invention will be described in detail below with reference to examples.
The following examples preferably satisfy Ti: 0.1% -1.6% and Ag: 0.1% -2.0%, on the basis of which the following conditions are selected to satisfy the following conditions: embodiment(s) of the condition(s) 0.05% to 3.9%.
Example 1
The Sn-Ti-Ag ternary alloy solder for sealing quartz glass in the embodiment has a substrate of Sn, and the introduced Ti and Ag comprise the following components in percentage by weight: 0.1%, Ag: 2.0 percent, and the introduced O comprises the following components in percentage by atom: 0.05 percent. The melting point of the ternary alloy solder is 221 ℃. The ternary alloy solder is a sheet with the thickness of 0.3 mm.
Example 2
The Sn-Ti-Ag ternary alloy solder for sealing quartz glass in the embodiment has a substrate of Sn, and the introduced Ti and Ag comprise the following components in percentage by weight: 2.0%, Ag: 0.1 percent, and the introduced O comprises the following components in percentage by atom: 3.9 percent. The melting point of the ternary alloy solder is 231.9 ℃. The ternary alloy solder is a sheet with the thickness of 0.4 mm.
Example 3
The Sn-Ti-Ag ternary alloy solder for sealing quartz glass in the embodiment has a substrate of Sn, and the introduced Ti and Ag comprise the following components in percentage by weight: 0.2%, Ag: 1.2 percent, and the introduced O comprises the following components in percentage by atom: 0.1 percent. The melting point of the ternary alloy solder is 221 ℃. The ternary alloy solder is a sheet with the thickness of 0.15 mm.
Example 4
The Sn-Ti-Ag ternary alloy solder for sealing quartz glass in the embodiment has a substrate of Sn, and the introduced Ti and Ag comprise the following components in percentage by weight: 0.8%, Ag: 0.2 percent, and the introduced O comprises the following components in percentage by atom: 1.9 percent. The melting point of the ternary alloy solder is 231.9 ℃. The ternary alloy solder is a sheet with the thickness of 0.25 mm.
Example 5
The Sn-Ti-Ag ternary alloy solder for sealing quartz glass in the embodiment has a substrate of Sn, and the introduced Ti and Ag comprise the following components in percentage by weight: 0.6%, Ag: 0.8 percent, and the introduced O comprises the following components in percentage by atom: 0.5 percent. The melting point of the ternary alloy solder is 221 ℃. The ternary alloy solder is a sheet with the thickness of 0.2 mm.
The present invention is not limited to the above-described embodiments, and those skilled in the art will be able to make various modifications without creative efforts from the above-described conception, and fall within the scope of the present invention.
Claims (3)
1. The Sn-Ti-Ag ternary alloy solder for sealing the quartz glass is characterized in that a substrate of the ternary alloy solder is tin, and introduced Ti and Ag comprise the following components in percentage by weight:
Ti：0.2％～0.8％；
Ag：0.2％～1.2％；
the atomic percentage of the introduced O is 0.1 to 1.9 percent;
the mass percentage of impurities in the ternary alloy solder is less than or equal to 0.1 percent;
the welding temperature range of the ternary alloy solder is 650-800 ℃, and the welding vacuum degree is less than or equal to 5 multiplied by 10- 3Pa。
2. The Sn-Ti-Ag ternary alloy solder for sealing quartz glass according to claim 1, wherein the matrix of the ternary alloy solder is Sn, and the introduced Ti and Ag comprise the following components in percentage by weight:
Ti：0.6％；
Ag：0.8％；
the atomic percentage composition of O introduced was 0.5%.
3. The ternary Sn-Ti-Ag alloy solder for sealing quartz glass according to claim 1, wherein the ternary alloy solder is in the shape of a block or a sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910273946.8A CN109986233B (en) | 2019-04-08 | 2019-04-08 | Sn-Ti-Ag ternary alloy solder for sealing quartz glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910273946.8A CN109986233B (en) | 2019-04-08 | 2019-04-08 | Sn-Ti-Ag ternary alloy solder for sealing quartz glass |
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| Publication Number | Publication Date |
|---|---|
| CN109986233A CN109986233A (en) | 2019-07-09 |
| CN109986233B true CN109986233B (en) | 2021-12-03 |
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| CN201910273946.8A Active CN109986233B (en) | 2019-04-08 | 2019-04-08 | Sn-Ti-Ag ternary alloy solder for sealing quartz glass |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0195893A (en) * | 1987-10-08 | 1989-04-13 | Seiko Instr & Electron Ltd | Brazing filler metal |
| CN1313802A (en) * | 1999-06-11 | 2001-09-19 | 日本板硝子株式会社 | Lead-free solder |
| CN104051224A (en) * | 2014-06-30 | 2014-09-17 | 中国科学院上海光学精密机械研究所 | High temperature metal sealing-in high power pulse xenon lamp and manufacturing method thereof |
-
2019
- 2019-04-08 CN CN201910273946.8A patent/CN109986233B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0195893A (en) * | 1987-10-08 | 1989-04-13 | Seiko Instr & Electron Ltd | Brazing filler metal |
| CN1313802A (en) * | 1999-06-11 | 2001-09-19 | 日本板硝子株式会社 | Lead-free solder |
| CN104051224A (en) * | 2014-06-30 | 2014-09-17 | 中国科学院上海光学精密机械研究所 | High temperature metal sealing-in high power pulse xenon lamp and manufacturing method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 大功率脉冲氨灯研制中的几个关键问题;马永波等;《第九届中国核靶技术学术交流会摘要集》;20070930;第76-77页 * |
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| CN109986233A (en) | 2019-07-09 |
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