JPH0195893A - Brazing filler metal - Google Patents
Brazing filler metalInfo
- Publication number
- JPH0195893A JPH0195893A JP25437087A JP25437087A JPH0195893A JP H0195893 A JPH0195893 A JP H0195893A JP 25437087 A JP25437087 A JP 25437087A JP 25437087 A JP25437087 A JP 25437087A JP H0195893 A JPH0195893 A JP H0195893A
- Authority
- JP
- Japan
- Prior art keywords
- brazing filler
- filler metal
- ceramics
- metal
- corrosion resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 27
- 239000002184 metal Substances 0.000 title claims abstract description 27
- 238000005219 brazing Methods 0.000 title claims abstract description 22
- 239000000945 filler Substances 0.000 title claims abstract description 17
- 239000000843 powder Substances 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims 1
- 239000000919 ceramic Substances 0.000 abstract description 21
- 230000007797 corrosion Effects 0.000 abstract description 9
- 238000005260 corrosion Methods 0.000 abstract description 9
- 239000000463 material Substances 0.000 description 7
- 150000002739 metals Chemical class 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000002845 discoloration Methods 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、セラミックス−セラミックス、セラミック
ス−金属を接合するろう材に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a brazing material for joining ceramics to ceramics and ceramics to metals.
低融点のＳｎをベースとし、セラミックスとの接合を目
的としＴｉを含み、接合材の耐食性向上を狙いとしてＮ
ｉを含み、接合温度が８００℃以下のろう材を提供する
。It is based on Sn with a low melting point, contains Ti for the purpose of bonding with ceramics, and contains N for the purpose of improving the corrosion resistance of the bonding material.
The present invention provides a brazing filler metal containing i and having a bonding temperature of 800°C or less.
従来、この種の接合には、Ｔｉ−Ｃｕ−へｇ＋Ｔ１Ｎｉ
等が用いられていた。Conventionally, this type of bonding involves Ti-Cu- to g+T1Ni.
etc. were used.
従来のろう材であると、９００℃以上での接合となり、
ろう材中の活性金属とセラミックスとの反応が急速に進
むため、ろう材とセラミックス界面が２〜３ｍＩＩに渡
り変色するだけでなく、セラミックス全面も変色する。With conventional brazing filler metal, joining occurs at temperatures of 900°C or higher,
Since the reaction between the active metal in the brazing material and the ceramic progresses rapidly, not only the interface between the brazing material and the ceramic changes color over 2 to 3 mII, but also the entire surface of the ceramic material changes color.
更に、セラミックス表面の溶融現象が生し、凹凸が発生
するため表面のラッピング後に接合できないという欠点
を有していた。Furthermore, there is a drawback that the ceramic surface melts and unevenness occurs, making it impossible to bond the surface after lapping.
又、ろう材自体の塩水、汗等に対する耐食性も悪いとい
う欠点を有していた。そこで、本発明は従来のこのよう
な欠点を解決するため、ろう材の検討を行い、低い接合
温度で耐食性の良いバランスのとれたろう材を提供する
ことを目的としている。Furthermore, the brazing material itself has a disadvantage in that it has poor corrosion resistance against salt water, sweat, and the like. Therefore, in order to solve these conventional drawbacks, the present invention examines brazing filler metals and aims to provide a well-balanced brazing filler metal that has good corrosion resistance at a low bonding temperature.
上記問題を解決するため、この発明は活性金属のＴｉを
必要最小限にした。又、耐食性をより良くするため、Ｎ
ｉを接合温度が８００℃以内に収まる範囲で加えた。In order to solve the above problem, the present invention minimizes the amount of Ti as an active metal. In addition, to improve corrosion resistance, N
i was added within a range that kept the bonding temperature within 800°C.
上記のようなろう材であると、接合温度が８００℃以下
と低く、耐食性が良くセラミックスの変色が生じない。The brazing filler metal described above has a low bonding temperature of 800° C. or less, has good corrosion resistance, and does not cause discoloration of the ceramic.
以下に本発明の詳細な説明する。 The present invention will be explained in detail below.
表−１に、５ｎ−Ｔｉ系のろう材の成分例と特性を示す
。Table 1 shows examples of components and characteristics of 5n-Ti brazing filler metal.
ここで、Ｔｉ量の下限を０．１χとしたのは、セラミッ
クスとろう材の接合強度を維持するため、上限を５％と
したのは、セラミックスの変色防止のためである。５％
を越えると、接合部近辺だけでなく、セラミックス全体
が変色する。これは、ジルコニアセラミックス等の還元
され易い材料では、顕著に現れる。従って、外観色調が
厳しい装飾用途のときには、Ｔｉを５％以内に抑えるこ
とが必要となる。一方、Ｓｎは、その融点が２３２℃と
低いため、接合温度を８００℃以下とすることができ、
セラミックス、金属の仕上がり後の接合によっても、そ
の表面状態を害することなく接合できる。Here, the lower limit of the amount of Ti is set to 0.1χ in order to maintain the bonding strength between the ceramic and the brazing filler metal, and the upper limit is set to 5% to prevent discoloration of the ceramic. 5%
If it exceeds this, not only the area near the joint but the entire ceramic will discolor. This is noticeable in materials that are easily reduced, such as zirconia ceramics. Therefore, for decorative applications where the external color tone is severe, it is necessary to suppress Ti to within 5%. On the other hand, Sn has a low melting point of 232°C, so the bonding temperature can be lower than 800°C.
Ceramics and metals can be joined after finishing without damaging their surface conditions.
表−２に、耐食性を向上させた低温度接合のろう材の成
分例と特性を示す。Table 2 shows examples of ingredients and properties of brazing filler metals for low temperature bonding with improved corrosion resistance.
ここで、Ｎｉ量の下限を０．０２％としたのは、耐食性
をアップさせる最小限の値いであるためであり、上限を
１２％としたのは、ろう材の接合温度を、８００℃以下
に抑えるためである。表−２からも判るとおり、比較材
よりバランスのとれたろう材である。表−３は、ろう材
の各成分金属を粉末で供給したときに、合金で供給した
ときより接合温度が低くなることを示している。Here, the lower limit of Ni content was set at 0.02% because it was the minimum value to improve corrosion resistance, and the upper limit was set at 12% because the joining temperature of the brazing metal was set to 800°C or less. This is to keep it to a minimum. As can be seen from Table 2, this is a brazing filler metal with better balance than the comparative materials. Table 3 shows that when each component metal of the brazing filler metal is supplied in powder form, the joining temperature is lower than when it is supplied in alloy form.
表−１
更に、粉末供給の方が、接合強度も平均して、１０％程
度高くなっている。Table 1 Furthermore, the bonding strength is about 10% higher on average when powder is supplied.
本発明は、以上述べたように活性金属の量を制御するこ
とにより、接合部近辺以外のセラミックス部の変色を抑
え、Ｎｉの適度な添加により耐食性の著しい向上を図る
とともに、接合温度の上昇は、その組成比により８００
℃以下とラッピング上りのセラミックス表面の凹凸発生
を防止できるという効果を有している。又、接合される
金属も鏡面加工後に接合でき、装飾品等におけるデザイ
ンの自由度が向上するという効果がある。As described above, the present invention suppresses discoloration of ceramic parts other than the vicinity of the joint by controlling the amount of active metal, significantly improves corrosion resistance by adding appropriate Ni, and suppresses the rise in joining temperature. , depending on the composition ratio, 800
It has the effect of preventing the occurrence of unevenness on the surface of ceramics after wrapping at temperatures below 30°F. Furthermore, the metals to be joined can be joined after mirror finishing, which has the effect of improving the degree of freedom in designing ornaments and the like.
以上 出願人 セイコー電子工業株式会社 ７一that's all Applicant: Seiko Electronics Industries Co., Ltd. 71
Claims (3)
を特徴とするろう材。(1) A brazing filler metal characterized by containing 0.1% to 5% Ti and the remainder consisting of Sn.
，残りがＳｎからなることを特徴とするろう材。(2) Ti 0.1% to 5%, Ni 0.02% to 12%
, the remainder being Sn.
されることを特徴とする特許請求の範囲第１項もしくは
第２項記載のろう材。(3) The brazing filler metal according to claim 1 or 2, wherein each component metal is supplied in a predetermined amount in powder form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25437087A JPH0195893A (en) | 1987-10-08 | 1987-10-08 | Brazing filler metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25437087A JPH0195893A (en) | 1987-10-08 | 1987-10-08 | Brazing filler metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0195893A true JPH0195893A (en) | 1989-04-13 |
Family
ID=17264046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25437087A Pending JPH0195893A (en) | 1987-10-08 | 1987-10-08 | Brazing filler metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0195893A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000076717A1 (en) * | 1999-06-11 | 2000-12-21 | Nippon Sheet Glass Co., Ltd. | Lead-free solder |
| DE102009054068A1 (en) * | 2009-11-20 | 2011-05-26 | Epcos Ag | Solder material for fixing an outer electrode in a piezoelectric component and piezoelectric component with a solder material |
| CN102319962A (en) * | 2011-08-24 | 2012-01-18 | 哈尔滨工业大学 | Sn-Zn-Ti activated brazing filler metal with melting point lower than 600 DEG C and preparation method thereof |
| JP2018087377A (en) * | 2016-11-28 | 2018-06-07 | 財團法人工業技術研究院Ｉｎｄｕｓｔｒｉａｌ Ｔｅｃｈｎｏｌｏｇｙ Ｒｅｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅ | Corrosion resistant structure and fuel battery using the same |
| JP2018090460A (en) * | 2016-12-06 | 2018-06-14 | パナソニックＩｐマネジメント株式会社 | Joint material, joined body therefrom, and production method of joined body |
| CN109822257A (en) * | 2019-04-08 | 2019-05-31 | 中国工程物理研究院核物理与化学研究所 | A kind of quartz glass sealing-in lead-free solder |
| CN109986233A (en) * | 2019-04-08 | 2019-07-09 | 中国工程物理研究院核物理与化学研究所 | A kind of quartz glass sealing-in Sn-Ti-Ag ternary alloy three-partalloy solder |
| CN109986232A (en) * | 2019-04-08 | 2019-07-09 | 中国工程物理研究院核物理与化学研究所 | A kind of quartz glass sealing-in Sn-Ti-Cu ternary alloy three-partalloy solder |
-
1987
- 1987-10-08 JP JP25437087A patent/JPH0195893A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6319461B1 (en) | 1999-06-11 | 2001-11-20 | Nippon Sheet Glass Co., Ltd. | Lead-free solder alloy |
| WO2000076717A1 (en) * | 1999-06-11 | 2000-12-21 | Nippon Sheet Glass Co., Ltd. | Lead-free solder |
| DE102009054068A1 (en) * | 2009-11-20 | 2011-05-26 | Epcos Ag | Solder material for fixing an outer electrode in a piezoelectric component and piezoelectric component with a solder material |
| US8823245B2 (en) | 2009-11-20 | 2014-09-02 | Epcos Ag | Solder material for fastening an outer electrode on a piezoelectric component and piezoelectric component comprising a solder material |
| CN102319962A (en) * | 2011-08-24 | 2012-01-18 | 哈尔滨工业大学 | Sn-Zn-Ti activated brazing filler metal with melting point lower than 600 DEG C and preparation method thereof |
| US10511030B2 (en) | 2016-11-28 | 2019-12-17 | Industrial Technology Research Institute | Anti-corrosion structure and fuel cell employing the same |
| JP2018087377A (en) * | 2016-11-28 | 2018-06-07 | 財團法人工業技術研究院Ｉｎｄｕｓｔｒｉａｌ Ｔｅｃｈｎｏｌｏｇｙ Ｒｅｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅ | Corrosion resistant structure and fuel battery using the same |
| JP2018090460A (en) * | 2016-12-06 | 2018-06-14 | パナソニックＩｐマネジメント株式会社 | Joint material, joined body therefrom, and production method of joined body |
| CN109986233A (en) * | 2019-04-08 | 2019-07-09 | 中国工程物理研究院核物理与化学研究所 | A kind of quartz glass sealing-in Sn-Ti-Ag ternary alloy three-partalloy solder |
| CN109986232A (en) * | 2019-04-08 | 2019-07-09 | 中国工程物理研究院核物理与化学研究所 | A kind of quartz glass sealing-in Sn-Ti-Cu ternary alloy three-partalloy solder |
| CN109822257A (en) * | 2019-04-08 | 2019-05-31 | 中国工程物理研究院核物理与化学研究所 | A kind of quartz glass sealing-in lead-free solder |
| CN109986233B (en) * | 2019-04-08 | 2021-12-03 | 中国工程物理研究院核物理与化学研究所 | Sn-Ti-Ag ternary alloy solder for sealing quartz glass |
| CN109986232B (en) * | 2019-04-08 | 2021-12-03 | 中国工程物理研究院核物理与化学研究所 | Sn-Ti-Cu ternary alloy solder for sealing quartz glass |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH01298127A (en) | Intermetallic compound tial-base lightweight heat-resisting alloy | |
| US4684052A (en) | Method of brazing carbide using copper-zinc-manganese-nickel alloys | |
| JPH0195893A (en) | Brazing filler metal | |
| EP0222004B1 (en) | Copper-zinc-manganese-nickel alloys | |
| US3246981A (en) | Homogenous ductile nickel base alloy weld deposit and method for producing same | |
| EP0096428A1 (en) | High temperature brazing alloys | |
| US4576789A (en) | Grain-refined gold-free dental alloys for porcelain-fused-to-metal restorations | |
| US4539176A (en) | Low gold dental alloys | |
| US4124382A (en) | Dental alloy for use in the adhesion of porcelain | |
| JPS59153857A (en) | Alloy for forming joint | |
| US4483821A (en) | Cobalt-chromium dental alloys | |
| US5385791A (en) | Gold-nickel-vanadium-molybdenum brazing materials | |
| JPS6216896A (en) | Brazing filler metal for ceramics | |
| US4490437A (en) | Ductile nickel based brazing alloy foil | |
| US6156266A (en) | Gold alloy for firing on porcelain | |
| JP2755455B2 (en) | Brazing powder for ceramic bonding | |
| JPH04305073A (en) | Ceramic bonding brazer | |
| JPH0615477A (en) | Ag brazer | |
| JPH01130898A (en) | Brazing filler metal | |
| US5273832A (en) | Gold-nickel-vanadium braze joint | |
| JPS63126690A (en) | Brazing filler metal | |
| JPH01107997A (en) | Ni alloy brazing filler metal | |
| JPH01138086A (en) | Brazing filler metal for joining ceramics | |
| US4046561A (en) | Dental alloy of use in the adhesion of porcelain | |
| JPH04285076A (en) | Paste brazing filler metal for joining ceramics |