CN109796728A - 一种聚多酚改性的碳氢组合物基半固化片及其制备的覆铜板 - Google Patents
一种聚多酚改性的碳氢组合物基半固化片及其制备的覆铜板 Download PDFInfo
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- CN109796728A CN109796728A CN201910090260.5A CN201910090260A CN109796728A CN 109796728 A CN109796728 A CN 109796728A CN 201910090260 A CN201910090260 A CN 201910090260A CN 109796728 A CN109796728 A CN 109796728A
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- Prior art keywords
- polyphenol
- poly
- hydrocarbon composition
- epoxy resin
- modified
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- 235000013824 polyphenols Nutrition 0.000 title claims abstract description 70
- 150000008442 polyphenolic compounds Chemical class 0.000 title claims abstract description 67
- 239000000203 mixture Substances 0.000 title claims abstract description 45
- 150000002430 hydrocarbons Chemical class 0.000 title claims abstract description 44
- 229930195733 hydrocarbon Natural products 0.000 title claims abstract description 43
- 239000004215 Carbon black (E152) Substances 0.000 title claims abstract description 42
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 239000003822 epoxy resin Substances 0.000 claims abstract description 24
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 24
- 230000004048 modification Effects 0.000 claims abstract description 23
- 238000012986 modification Methods 0.000 claims abstract description 23
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000012779 reinforcing material Substances 0.000 claims abstract description 12
- 239000011889 copper foil Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 10
- 229920000090 poly(aryl ether) Polymers 0.000 claims abstract description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 5
- 238000001723 curing Methods 0.000 claims description 28
- 239000003063 flame retardant Substances 0.000 claims description 19
- 239000004744 fabric Substances 0.000 claims description 16
- -1 polyene hydrocarbons Chemical class 0.000 claims description 15
- 239000000945 filler Substances 0.000 claims description 14
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 10
- 239000006185 dispersion Substances 0.000 claims description 9
- 239000007864 aqueous solution Substances 0.000 claims description 8
- 239000012298 atmosphere Substances 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 6
- 239000000835 fiber Substances 0.000 claims description 6
- 239000012766 organic filler Substances 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims description 4
- 239000003365 glass fiber Substances 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims description 2
- 229910015900 BF3 Inorganic materials 0.000 claims description 2
- 229930185605 Bisphenol Natural products 0.000 claims description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 claims description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910001051 Magnalium Inorganic materials 0.000 claims description 2
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Natural products P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims description 2
- 239000004699 Ultra-high molecular weight polyethylene Substances 0.000 claims description 2
- JCLOGSKIMBJQAA-UHFFFAOYSA-N [Mo].[Sn] Chemical compound [Mo].[Sn] JCLOGSKIMBJQAA-UHFFFAOYSA-N 0.000 claims description 2
- 150000008065 acid anhydrides Chemical class 0.000 claims description 2
- 125000003368 amide group Chemical group 0.000 claims description 2
- 229910000410 antimony oxide Inorganic materials 0.000 claims description 2
- 239000004305 biphenyl Substances 0.000 claims description 2
- 235000010290 biphenyl Nutrition 0.000 claims description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 2
- 229940106691 bisphenol a Drugs 0.000 claims description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Substances FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 claims description 2
- YGBGWFLNLDFCQL-UHFFFAOYSA-N boron zinc Chemical compound [B].[Zn] YGBGWFLNLDFCQL-UHFFFAOYSA-N 0.000 claims description 2
- 239000004202 carbamide Substances 0.000 claims description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims description 2
- 239000004643 cyanate ester Substances 0.000 claims description 2
- 150000004985 diamines Chemical class 0.000 claims description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 2
- 229910001882 dioxygen Inorganic materials 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 claims description 2
- 238000011049 filling Methods 0.000 claims description 2
- 239000011261 inert gas Substances 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 125000001624 naphthyl group Chemical group 0.000 claims description 2
- 239000003960 organic solvent Substances 0.000 claims description 2
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 claims description 2
- 238000012856 packing Methods 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 150000002989 phenols Chemical class 0.000 claims description 2
- 229910052698 phosphorus Inorganic materials 0.000 claims description 2
- 239000011574 phosphorus Substances 0.000 claims description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims description 2
- 229920000768 polyamine Polymers 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallyl group Chemical group C1(=C(C(=CC=C1)O)O)O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 150000005846 sugar alcohols Polymers 0.000 claims description 2
- 239000002344 surface layer Substances 0.000 claims description 2
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 claims description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 3
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 239000011159 matrix material Substances 0.000 abstract description 12
- 229920005672 polyolefin resin Polymers 0.000 abstract description 6
- 239000012763 reinforcing filler Substances 0.000 abstract description 5
- 238000004132 cross linking Methods 0.000 abstract description 4
- 238000006243 chemical reaction Methods 0.000 abstract description 3
- 238000004891 communication Methods 0.000 abstract description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 abstract description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 7
- 229920006380 polyphenylene oxide Polymers 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 239000011256 inorganic filler Substances 0.000 description 6
- 229910003475 inorganic filler Inorganic materials 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 description 2
- 229910003080 TiO4 Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(iii) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229910002929 BaSnO3 Inorganic materials 0.000 description 1
- 229920002748 Basalt fiber Polymers 0.000 description 1
- 229910004774 CaSnO3 Inorganic materials 0.000 description 1
- 229910002971 CaTiO3 Inorganic materials 0.000 description 1
- 229910002976 CaZrO3 Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 206010054949 Metaplasia Diseases 0.000 description 1
- 229910003781 PbTiO3 Inorganic materials 0.000 description 1
- 229910020698 PbZrO3 Inorganic materials 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004410 SrSnO3 Inorganic materials 0.000 description 1
- 229910002370 SrTiO3 Inorganic materials 0.000 description 1
- 229910010252 TiO3 Inorganic materials 0.000 description 1
- 229910007694 ZnSnO3 Inorganic materials 0.000 description 1
- 229910003122 ZnTiO3 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 229910021523 barium zirconate Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 229910001679 gibbsite Inorganic materials 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 230000015689 metaplastic ossification Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011325 microbead Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910014031 strontium zirconium oxide Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/024—Woven fabric
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
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Abstract
本发明涉及一种聚多酚改性的碳氢组合物基半固化片及其制备的覆铜板。本发明选用端羟基、端氨基或端巯基修饰的聚芳醚或聚烯烃树脂为基体树脂,环氧树脂为主要固化剂,构建了介电性能优异的碳氢组合物。同时,本发明还将聚多酚修饰到增强材料和填料的表面,因聚多酚含有丰富的羟基官能团,可参与到端基修饰的聚芳醚或聚烯烃与环氧树脂的交联固化反应中来,由此将基体树脂直接键连到增强材料和填料的表面,增强了他们的相容性和粘结力。进一步地,用该半固化片和铜箔制作的高频覆铜板,其热‑机械性能佳、介电性能优异、综合性能稳定性好、均匀性佳、铜箔剥离强度高,能满足高频、高速通信领域对基板材料的各项综合性能要求。
Description
技术领域
本发明属于通信材料领域,具体涉及一种聚多酚改性的碳氢组合物基半固化片及其制备的覆铜板。
背景技术
覆铜板是信息电子产业的关键材料之一,已广泛应用在通信基站、卫星、无人驾驶汽车、无人机和智能机器人等多个领域。聚苯醚和聚烯烃树脂因具有优异的介电性能,可用来制作覆铜板。现如今,人们已开发出了聚苯醚基和聚二烯烃基热固型的覆铜板。其中,热固型聚苯醚树脂主要有侧乙烯基修饰和端乙烯基修饰两大类。侧乙烯基修饰聚苯醚的制备过程需要用到丁基锂等反应性极强、危险度高、毒性大的物质,生产工艺极为复杂。端乙烯基修饰的聚苯醚已经实现了商品化,然而其固化过程需要添加额外的交联剂。比如,CN1745142A和WO2006/023371A1采用TAIC和不饱和烯烃单体等为热固型聚苯醚的小分子交联固化剂,然而,在上胶、半固化片烘烤等生产过程中,此类小分子交联固化剂极易挥发,导致聚苯醚的固化程度和半固化片的品质难控、且污染严重。为解决此问题,CN102807658B和CN103467967A改用聚二烯烃等高分子交联固化剂。但是,除了聚苯乙烯,聚苯醚一般与其他树脂的相容性都不好,致使半固化片复合基体内的树脂分相严重。
此外,覆铜板制作过程中常用的玻纤布和无机填料(例如氧化硅、氧化铝等),表面含有丰富的亲水性官能团——羟基,而乙烯基修饰的聚苯醚基和聚二烯烃不含有含氧、含氮等亲水性官能团,与玻纤布和无机填料的相容性不佳,由此制备得到的覆铜板不同部位的介电性能及其均匀性不完美,不适合于制作多层覆铜板,也就难以满足当下高频、高速通信领域对覆铜板材料的功能多元化和复杂化、线路布置高密度化等各项要求。
在无机填料、玻纤布或是铜箔表面修饰上偶联剂,是一种常用的增强它们与基体树脂之间相互作用力的方法。《先进功能材料》杂志(Advanced Functional Materials,2007, 318, 426.)报道了一些植物多酚在紫外光照射下可通过氧化聚合在几乎所有物质的表面迅速、强有力地吸附。同时,聚多酚含有丰富的羟基官能团,可参与到环氧树脂的固化过程中来。因此,聚多酚是一种潜在的有效改善覆铜板基体中各物料之间相互作用力和粘结力的物质。
发明内容
本发明的目的在于提供一种聚多酚改性的碳氢组合物基半固化片。
本发明的另一个目的在于提供一种由该半固化片制备得到的热-机械性能优异、介电性能及其均匀性好、铜箔剥离强度高的高频高速覆铜板。
本发明解决上述问题采用的技术方案是一种聚多酚改性的碳氢组合物基半固化片,依次通过以下步骤制得:
S1、用0.1~80mg/mL多酚水溶液浸渍增强材料,在非惰性气氛且紫外光照射下晾置5~360min后,经干燥得到产物,即表面修饰了聚多酚的增强材料,记为聚多酚@增强材料;
S2、向0.1~80mg/mL多酚水溶液中加入0.1~25wt/v%填料,在非惰性气氛且紫外光照射下搅拌分散均匀,浸泡5~720min后,经过滤、洗涤、干燥得到产物,即表面修饰了聚多酚的填料,记为聚多酚@填料;
S3、配置固含量为35~75wt/v%碳氢组合物的均匀分散液,将该均匀分散液浸渍所述聚多酚@增强材料,经烘烤干燥得到半固化片,
所述多酚为分子式中含有邻苯二酚或邻苯三酚结构的植物多酚中的一种或几种的混合物,所述多酚水溶液的pH值在4.5和9.0之间,所述非惰性气氛为含有氧气的气氛,其中氧气占非惰性气体的含量≥3v/v%,所述紫外光的波长≤340nm,紫外光的光强≥1mW/cm2,紫外光照射时的环境温度≤50℃,紫外光光源与照射物之间的距离≤100cm,所述碳氢组合物包括了端基修饰的碳氢聚合物、主固化次、次固化剂、固化促进剂、所述聚多酚@填料和阻燃剂六类组分。
进一步优选的技术方案在于:步骤S1中,所述增强材料为106、1080、2116和7628电子级无碱玻纤布、或氟树脂纤维编织布中的一种,所述聚多酚@增强材料中的聚多酚占增强材料质量的0.03~1.0wt%。
进一步优选的技术方案在于:步骤S2中,所述的填料由无机填料和有机填料组成,其中所述无机填料为SiO2、Al2O3、TiO2、ZnO、MgO、Bi2O3、AlN、BN、SiC、Si3N4、Al(OH)3、Mg(OH)2、SrTiO3、BaTiO3、Mg2TiO4、Bi2(TiO3)3、PbTiO3、NiTiO3、CaTiO3、ZnTiO3、Zn2TiO4、BaSnO3、Bi2(SnO3)3、CaSnO3、PbSnO3、MgSnO3、SrSnO3、ZnSnO3、BaZrO3、CaZrO3、PbZrO3、MgZrO3、SrZrO3、ZnZrO3、氧化石墨、氟化石墨、滑石粉、云母粉、高岭土、粘土、实心玻璃微珠、空心玻璃微珠、玻璃纤维、玄武岩纤维和碳纤维中的一种、或是几种的混合物,所述无机填料的粒径≤100um,其用量占碳氢组合物的12~60wt%;
所述有机填料为超高分子量聚乙烯纤维、凯夫拉纤维、氟树脂和聚酰亚胺及其衍生物中的一种、或是几种的混合物,所述有机填料的含量为碳氢组合物的1~20wt%,所述聚多酚@填料中的聚多酚占填料质量的0.03~1.0wt%。
进一步优选的技术方案在于:步骤S3中,所述碳氢聚合物为聚芳醚和聚烯烃及其衍生物中的一种或几种的混合物,所述的端基为胺基、羟基和巯基中的一种或几种,所述端基修饰的碳氢聚合物占总的碳氢组合物的4~25wt%。
进一步优选的技术方案在于:步骤S3中,所述主固化剂为环氧树脂,具体为双酚A型环氧树脂、氢化双酚A型环氧树脂、双酚S型环氧树脂、双酚F型环氧树脂、双环戊二烯型环氧树脂、萘环结构环氧树脂、联苯型环氧树脂、杂环型环氧树脂、酚醛型环氧树脂、有机硅环氧树脂、多官能团环氧树脂、脂肪族环氧树脂和氰酸酯改性环氧树脂及其衍生物中的一种或几种的混合物,所述的主固化剂占碳氢组合物的15~68wt%;
所述次固化剂为活性聚酯、二元醇、多元醇、二元胺、多元胺、二硫醇、多元硫醇、二元酚、多元酚、酚醛树脂、氰酸酯树脂、酸酐、双氰胺和苯并噁嗪及其衍生物中的一种或几种的混合物,所述次固化剂占碳氢组合物的0.1~12wt%;
所述固化促进剂为叔胺类化合物、咪唑类化合物、膦类化合物、取代脲类化合物、酚类化合物和三氟化硼胺类络合物中的一种或几种的混合物,所述的固化促进剂占主固化剂的0.02~5.0wt%;
所述阻燃剂为铝镁系阻燃剂、硼锌系阻燃剂、钼锡系阻燃剂、溴系阻燃剂、三氧化二锑、磷系阻燃剂和氮系阻燃剂及其衍生物中的一种或多种的混合物,所述的阻燃剂占碳氢组合物的1~50wt%。
进一步优选的技术方案在于:步骤S3中,所述均匀分散液的溶剂为可使得碳氢组合物均匀分散的有机溶剂中的一种或几种的混合物。
进一步优选的技术方案在于:步骤S3中,所述烘烤干燥分为两个阶段,第一阶段烘烤干燥温度为30~110℃,第二阶段烘烤干燥温度为110~180℃。
一种采用聚多酚改性的碳氢组合物基半固化片制备的覆铜板,依次通过以下步骤制得:将所述半固化片和覆于表层的铜箔叠合在一起,经层压得到覆铜板,其中半固化片的张数≥1,铜箔的张数为1或2,层压温度为130~280℃,层压压力为80~130kg/cm2,层压时间为5min~480min。
本发明选用端羟基、端氨基或端巯基修饰的聚芳醚或聚烯烃树脂为基体树脂,环氧树脂为主要固化剂,构建了介电性能优异的碳氢组合物。同时,本发明还将聚多酚修饰到增强材料和填料的表面,因聚多酚含有丰富的羟基官能团,可参与到端基修饰的聚芳醚或聚烯烃与环氧树脂的交联固化反应中来,由此将基体树脂直接键连到增强材料和填料的表面,增强了他们的相容性和粘结力。在本发明中,用增强材料浸渍碳氢组合物的分散液、再经烘烤干燥制得的半固化片含胶量均匀、浸胶质量佳、树脂附着力强、表面平整、强韧性和粘性适宜。进一步地,用该半固化片和铜箔制作的高频覆铜板,其热-机械性能佳、介电性能优异、综合性能稳定性好、均匀性佳、铜箔剥离强度高。
发明人还发现,聚多酚在增强材料和填料表面的修饰量不可过少,否则增强材料、填料和基体树脂之间的相互作用力提升不明显;但聚多酚的修饰量也不可过多,否则覆铜板的介电损耗会增大。
本发明制备条件温和、生产成本低、易于批量化和规模化生产、普适性强,具有良好的工业化生产基础和广阔的应用前景。
具体实施方式
以下通过实施例进一步详细说明本发明提供的一种采用聚多酚改性的碳氢组合物基半固化片、以及用该半固化片制备得到的高频覆铜板。然而,该实施例仅仅是作为提供说明,而不是限定本发明。
实施例 1~5
将1080玻纤布于40mg/mL多酚水溶液中浸泡30min并同时进行紫外光照射,紫外光的波长为260nm,紫外光的光强为10mW/cm2,环境温度为30℃,紫外光光源与照射物之间的距离为30cm,随后取出得到表面修饰了聚多酚的1080玻纤布,记为“聚多酚@1080玻纤布”。将填料在40mg/mL多酚的水溶液中搅拌、浸泡30min并同时进行紫外光照射,紫外光的波长为260nm,紫外光的光强为10mW/cm2,环境温度为30℃,紫外光光源与照射物之间的距离为10cm,后经过滤、洗涤、干燥,得到表面修饰了聚多酚的填料,记为“聚多酚@填料”。将端羟基修饰的碳氢聚合物、主固化剂、次固化剂、固化促进剂、“聚多酚@填料”和阻燃剂均匀分散在甲苯中,控制该分散液的固含量在60wt%,再将“聚多酚@1080玻纤布”在该均匀分散液中浸胶,经烘烤得到半固化片。第一阶段烘烤干燥温度为60~100℃;第二阶段烘烤干燥温度为100~170℃。取8张半固化片叠合在一起,两面分别附上loz铜箔,在真空、加压、高温下层压数小时后制得覆铜板。具体配方详见下表。
对比例 1
对比例1采用未经聚多酚修饰的1080玻纤布和填料,其他工艺与实施例1相同。
对比例 2
对比例2采用聚多酚修饰的填料,而未采用聚多酚修饰的1080玻纤布,其他工艺与实施例1相同。
其中,半固化片和覆铜板的各项测试性能如下所示。
如对比例1所示,若玻纤布和填料的表面未经聚多酚修饰,基体树脂无法直接键连到玻纤布和填料表面,三者之间的粘结力不强,所制备得到的覆铜板耐浸焊性和钻孔性不佳。若只单独在填料的表面修饰上聚多酚,如对比例2所示,覆铜板基体内各组分的粘结力有所提高,其耐浸焊性和钻孔性得以提升,但程度不明显。只有在玻纤布和填料表面均修饰上聚多酚,如实施例1~5所示,因聚多酚可参与到端基修饰的聚芳醚或聚烯烃与环氧树脂的交联固化反应中来,基体树脂将直接键连到玻纤布和填料的表面,最大程度地提升了覆铜板基体内各组分之间的粘结力,在进一步提高板材的耐浸焊性和钻孔性的同时,因板子均匀性的提升、基体树脂内自由体积和缺陷的减少,而使得覆铜板的吸水率和介质损耗也有一定程度的下降。
本发明制备条件温和,生产成本较低,易于批量化、规模化生产,具有良好的工业化生产基础和广阔的应用前景。
Claims (8)
1.一种聚多酚改性的碳氢组合物基半固化片,其特征在于依次通过以下步骤制得:
S1、用0.1~80mg/mL多酚水溶液浸渍增强材料,在非惰性气氛且紫外光照射下晾置5~360min后,经干燥得到产物,即表面修饰了聚多酚的增强材料,记为聚多酚@增强材料;
S2、向0.1~80mg/mL多酚水溶液中加入0.1~25wt/v%填料,在非惰性气氛且紫外光照射下搅拌分散均匀,浸泡5~720min后,经过滤、洗涤、干燥得到产物,即表面修饰了聚多酚的填料,记为聚多酚@填料;
S3、配置固含量为35~75wt/v%碳氢组合物的均匀分散液,将该均匀分散液浸渍所述聚多酚@增强材料,经烘烤干燥得到半固化片,
所述多酚为分子式中含有邻苯二酚或邻苯三酚结构的植物多酚中的一种或几种的混合物,所述多酚水溶液的pH值在4.5和9.0之间,所述非惰性气氛为含有氧气的气氛,其中氧气占非惰性气体的含量≥3v/v%,所述紫外光的波长≤340nm,紫外光的光强≥1mW/cm2,紫外光照射时的环境温度≤50℃,紫外光光源与照射物之间的距离≤100cm,所述碳氢组合物包括了端基修饰的碳氢聚合物、主固化次、次固化剂、固化促进剂、所述聚多酚@填料和阻燃剂六类组分。
2.根据权利要求1所述的一种聚多酚改性的碳氢组合物基半固化片,其特征在于:步骤S1中,所述增强材料为106、1080、2116和7628电子级无碱玻纤布、或氟树脂纤维编织布中的一种,所述聚多酚@增强材料中的聚多酚占增强材料质量的0.03~1.0wt%。
3.根据权利要求1所述的一种聚多酚改性的碳氢组合物基半固化片,其特征在于:步骤S2中,所述填料包括有机填料,所述有机填料为超高分子量聚乙烯纤维、凯夫拉纤维、氟树脂和聚酰亚胺及其衍生物中的一种、或是几种的混合物,所述有机填料的含量为碳氢组合物的1~20wt%,所述聚多酚@填料中的聚多酚占填料质量的0.03~1.0wt%。
4.根据权利要求1所述的一种聚多酚改性的碳氢组合物基半固化片,其特征在于:步骤S3中,所述碳氢聚合物为聚芳醚和聚烯烃及其衍生物中的一种或几种的混合物,所述的端基为胺基、羟基和巯基中的一种或几种,所述端基修饰的碳氢聚合物占总的碳氢组合物的4~25wt%。
5.根据权利要求1所述的一种聚多酚改性的碳氢组合物基半固化片,其特征在于:步骤S3中,所述主固化剂为环氧树脂,具体为双酚A型环氧树脂、氢化双酚A型环氧树脂、双酚S型环氧树脂、双酚F型环氧树脂、双环戊二烯型环氧树脂、萘环结构环氧树脂、联苯型环氧树脂、杂环型环氧树脂、酚醛型环氧树脂、有机硅环氧树脂、多官能团环氧树脂、脂肪族环氧树脂和氰酸酯改性环氧树脂及其衍生物中的一种或几种的混合物,所述的主固化剂占碳氢组合物的15~68wt%;
所述次固化剂为活性聚酯、二元醇、多元醇、二元胺、多元胺、二硫醇、多元硫醇、二元酚、多元酚、酚醛树脂、氰酸酯树脂、酸酐、双氰胺和苯并噁嗪及其衍生物中的一种或几种的混合物,所述次固化剂占碳氢组合物的0.1~12wt%;
所述固化促进剂为叔胺类化合物、咪唑类化合物、膦类化合物、取代脲类化合物、酚类化合物和三氟化硼胺类络合物中的一种或几种的混合物,所述的固化促进剂占主固化剂的0.02~5.0wt%;
所述阻燃剂为铝镁系阻燃剂、硼锌系阻燃剂、钼锡系阻燃剂、溴系阻燃剂、三氧化二锑、磷系阻燃剂和氮系阻燃剂及其衍生物中的一种或多种的混合物,所述的阻燃剂占碳氢组合物的1~50wt%。
6.根据权利要求1所述的一种聚多酚改性的碳氢组合物基半固化片,其特征在于:步骤S3中,所述均匀分散液的溶剂为可使得碳氢组合物均匀分散的有机溶剂中的一种或几种的混合物。
7.根据权利要求1所述的一种聚多酚改性的碳氢组合物基半固化片,其特征在于:步骤S3中,所述烘烤干燥分为两个阶段,第一阶段烘烤干燥温度为30~110℃,第二阶段烘烤干燥温度为110~180℃。
8.一种采用如权利要求1所述的聚多酚改性的碳氢组合物基半固化片制备的覆铜板,其特征在于依次通过以下步骤制得:将所述半固化片和覆于表层的铜箔叠合在一起,经层压得到覆铜板,其中半固化片的张数≥1,铜箔的张数为1或2,层压温度为130~280℃,层压压力为80~130kg/cm2,层压时间为5min~480min。
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Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1223727A (zh) * | 1996-06-28 | 1999-07-21 | 西巴特殊化学品控股有限公司 | 光聚合热固树脂组合物 |
CA2133813C (en) * | 1993-10-12 | 2000-04-25 | Hsueh-Chi Lee | Method of making hybrid polymer of epoxy resin and the resulting product |
JP2001163953A (ja) * | 1999-12-09 | 2001-06-19 | Sumitomo Bakelite Co Ltd | 積層板用エポキシ樹脂組成物およびこれを用いた積層板 |
JP3645739B2 (ja) * | 1999-04-23 | 2005-05-11 | 住友ベークライト株式会社 | 液状封止樹脂組成物及びそれを用いた半導体装置 |
WO2014071453A1 (en) * | 2012-11-07 | 2014-05-15 | Deakin University | Toughened thermosets |
CN105218847A (zh) * | 2015-09-14 | 2016-01-06 | 北京化工大学 | 一种基于多酚类化合物的材料表界面功能化改性方法 |
CN106632993A (zh) * | 2017-01-03 | 2017-05-10 | 苏州生益科技有限公司 | 一种树脂组合物及其应用 |
CN106916418A (zh) * | 2015-12-25 | 2017-07-04 | 广东生益科技股份有限公司 | 一种热固性树脂组合物、半固化片、覆金属箔层压板以及印制电路板 |
CN108192145A (zh) * | 2018-01-11 | 2018-06-22 | 青岛科技大学 | 一种二维纳米填料协效阻燃剂及其制备方法、应用 |
US10190028B2 (en) * | 2014-04-02 | 2019-01-29 | Dow Global Technologies Llc | Epoxy two-part formulations |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1039868C (zh) | 1991-08-05 | 1998-09-23 | 农业研究和咨询有限公司 | 从巴西三叶橡胶树采集胶乳的方法 |
JP2001063953A (ja) | 1999-08-31 | 2001-03-13 | Hitachi Ltd | 乗客コンベアの移動手摺清掃装置 |
CN101643525B (zh) | 2009-08-24 | 2012-01-11 | 广东生益科技股份有限公司 | 环氧树脂及其制备方法 |
CN101643571B (zh) | 2009-08-24 | 2012-02-08 | 广东生益科技股份有限公司 | 热固性树脂组合物及用其制成的半固化片与印制电路用层压板 |
CN102093666B (zh) * | 2010-12-23 | 2012-09-26 | 广东生益科技股份有限公司 | 无卤树脂组合物及使用其的无卤覆铜板的制作方法 |
CN109796728B (zh) | 2019-01-30 | 2020-04-17 | 常州中英科技股份有限公司 | 一种聚多酚改性的碳氢组合物基半固化片及其制备的覆铜板 |
-
2019
- 2019-01-30 CN CN201910090260.5A patent/CN109796728B/zh active Active
-
2020
- 2020-01-21 US US17/424,937 patent/US11845840B2/en active Active
- 2020-01-21 WO PCT/CN2020/073412 patent/WO2020156366A1/zh active Application Filing
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2133813C (en) * | 1993-10-12 | 2000-04-25 | Hsueh-Chi Lee | Method of making hybrid polymer of epoxy resin and the resulting product |
CN1223727A (zh) * | 1996-06-28 | 1999-07-21 | 西巴特殊化学品控股有限公司 | 光聚合热固树脂组合物 |
JP3645739B2 (ja) * | 1999-04-23 | 2005-05-11 | 住友ベークライト株式会社 | 液状封止樹脂組成物及びそれを用いた半導体装置 |
JP2001163953A (ja) * | 1999-12-09 | 2001-06-19 | Sumitomo Bakelite Co Ltd | 積層板用エポキシ樹脂組成物およびこれを用いた積層板 |
WO2014071453A1 (en) * | 2012-11-07 | 2014-05-15 | Deakin University | Toughened thermosets |
US10190028B2 (en) * | 2014-04-02 | 2019-01-29 | Dow Global Technologies Llc | Epoxy two-part formulations |
CN105218847A (zh) * | 2015-09-14 | 2016-01-06 | 北京化工大学 | 一种基于多酚类化合物的材料表界面功能化改性方法 |
CN106916418A (zh) * | 2015-12-25 | 2017-07-04 | 广东生益科技股份有限公司 | 一种热固性树脂组合物、半固化片、覆金属箔层压板以及印制电路板 |
CN106632993A (zh) * | 2017-01-03 | 2017-05-10 | 苏州生益科技有限公司 | 一种树脂组合物及其应用 |
CN108192145A (zh) * | 2018-01-11 | 2018-06-22 | 青岛科技大学 | 一种二维纳米填料协效阻燃剂及其制备方法、应用 |
Non-Patent Citations (1)
Title |
---|
崔可建等: "基于植物多酚构筑新型功能材料", 《材料导报A:综述篇》 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020156366A1 (zh) * | 2019-01-30 | 2020-08-06 | 常州中英科技股份有限公司 | 一种聚多酚改性的碳氢组合物基半固化片及其制备的覆铜板 |
US11845840B2 (en) | 2019-01-30 | 2023-12-19 | Changzhou Zhongying Science & Technology Co., Ltd. | Polyphenol-modified hydrocarbon composition-based prepreg and copper clad laminate prepared therefrom |
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