CN109788668A - Refer to hand vein recognition device and preparation method thereof - Google Patents
Refer to hand vein recognition device and preparation method thereof Download PDFInfo
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- CN109788668A CN109788668A CN201910140405.8A CN201910140405A CN109788668A CN 109788668 A CN109788668 A CN 109788668A CN 201910140405 A CN201910140405 A CN 201910140405A CN 109788668 A CN109788668 A CN 109788668A
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Abstract
This application discloses a kind of finger hand vein recognition devices and preparation method thereof.The production method includes: to form two circuit boards；On one of them described circuit board of described two circuit boards, the finger hand vein recognition module is printed, in another circuit boards RFID module；The circuit board for referring to hand vein recognition module will be printed with to assemble with the circuit module for being printed with the circuit board of the RFID module and being obtained ahead of time, obtain referring to hand vein recognition device；Embedded encapsulation is carried out to the finger hand vein recognition device.Refer to hand vein recognition module and RFID module in different circuit boards respectively, again mount two circuit boards after being completed for printing, compared with only producing the scheme that a circuit board is mounted in the related technology, is more easier using two circuit board attachments.
Description
Technical field
This application involves circuit board production techniques fields more particularly to a kind of finger hand vein recognition device and preparation method thereof.
Background technique
As the cause of modernization flourishes, the security protection of people is realized is continuously improved, and derives biological identification technology,
For example referring to vein identification technology, this is that resulting veinprint image carries out personal identification after penetrating finger using near infrared ray
Technology, be with high-precision, high speed biological identification technology most advanced in the world.In various biological identification technologies,
Because referring to that vein identification technology is the technology that the biology interior feature that can't see using outside is identified, so high anti-as having
The second generation biological identification technology of puppet attracts attention.
Currently, referring to that vein identification technology has been widely applied to intelligent security lock, member identifies all-in-one machine, makes a draft of money
Machine, access control system, computer log in, and instead of automotive lock, safety box management, e-payment etc. needs to carry out personal identification
Field.
In the related technology, refer to include referring to hand vein recognition module and radio frequency identification (Radio Frequency in hand vein recognition device
Identification, RFID) module, refer to by RFID module the registration management etc. of vein.In production process, refer to that vein is known
Other module and RFID module are mounted, and are limited by equipment precision, mounting position is accurately difficult.
Summary of the invention
The purpose of the application is to provide a kind of finger hand vein recognition device and preparation method thereof, quiet to solve finger in the related technology
Arteries and veins identification module and RFID module are not easy the problem of mounting.
The purpose of the application is achieved through the following technical solutions:
A kind of production method referring to hand vein recognition device, which is characterized in that the finger hand vein recognition device includes referring to hand vein recognition
Module and radio frequency discrimination RFID module；Include:
Form two circuit boards；
On one of them described circuit board of described two circuit boards, the finger hand vein recognition module is printed, another
A circuit boards RFID module；
The circuit that the circuit board for referring to hand vein recognition module will be printed with be printed with the RFID module
Plate and the circuit module being obtained ahead of time are assembled, and obtain referring to hand vein recognition device；
Embedded encapsulation is carried out to the finger hand vein recognition device.
Optionally, the printing finger hand vein recognition module and when the printing RFID module, it is one of to use
First scraper is mackle scraper, and the range of the scraper speed of the first scraper is 600mm-640mm/s, the range of the first printing pressure
For 1.5-3kg, the range of the first demoulding speed is 0.05-0.15mm/s, another second scraper used prints scraper, institute to be single
The range for stating the scraper speed of the second scraper is 480-520mm/s, and the range of the second printing pressure is 1-2.5kg, the second demoulding
The range of speed is 0.05-0.15mm/s.
Optionally, the scraper speed of first scraper is 620mm/s, and first printing pressure is 2.5kg, described the
One demoulding speed is 0.1mm/s, and the scraper speed of second scraper is 500mm/s, and second printing pressure is 2kg, institute
Stating the second demoulding speed is 0.1mm/s.
Optionally, the corresponding first attachment rate of first scraper is 25%-35%, and the first material casting rate is less than 1%；Institute
Stating the corresponding second attachment rate of the second scraper is 15%-25%, and the second material casting rate is less than 1%.
Optionally, the first attachment rate is 30%；The second attachment rate is 20%.
Optionally, two circuit boards of the formation, comprising:
Based on back drill technique, drill on each substrate according to drilling file；The material of the substrate is Teflon material；
The substrate with a thickness of 3.2-10mm；
Plasma cleaning is carried out to the substrate after drilling；
Electroless copper plating technique twice is carried out on the substrate after cleaning；
The copper plating process of preset duration is carried out on the substrate Jing Guo the electroless copper plating technique；When described default
Long range is 8-12min；
Thunder is carried out to by the substrate of the copper plating process using default pad pasting pressure and default exposure vacuum degree
Up to the line manufacturing process of antenna, circuit board is obtained；The default pad pasting pressure is 2.5-3.5 ㎏/㎝2；The default exposure
Vacuum degree is 680-760mm/Hg；
External form processing is carried out to the circuit board.
Optionally, described to be based on back drill technique, it drills on each substrate according to drilling file, comprising:
It is once drilled according to drilling file on the substrate by way of machine drilling；
After the drilling file is done mirror image processing, using the primary obtained secondary aperture of drilling as back drill location hole,
Secondary drilling is carried out using the drilling file after mirror image, a hole is drilled through；
The hole for needing to control gun drilling is subjected to third time drilling according to the diameter and depth of the drilling documentation requirements.
It is optionally, described to drill on each substrate according to drilling file, comprising:
Following at least one hole is drilled out on the substrate according to drilling file:
For passing through the through-hole of signal wire；
For blind hole jamproof between signal；
Through-hole for heat dissipation；
Assembly hole for module assembled；
For the fixation hole by the module on fixing piece.
Optionally, described to be printed with the circuit board for referring to hand vein recognition module and be printed with the RFID module
The circuit board and the circuit module that is obtained ahead of time assembled, obtain referring to hand vein recognition device, comprising:
The circuit that the circuit board for referring to hand vein recognition module will be printed with be printed with the RFID module
Plate passes through a pair of matched assembly hole assembling；In the pair of matched assembly hole, the aperture of the two is different；
The circuit board after assembling is assembled with the circuit module being obtained ahead of time.
A kind of finger hand vein recognition device, it is described to refer to that hand vein recognition device is using the finger hand vein recognition device as described in any of the above item
Production method it is prepared.
The application uses above technical scheme, has the following beneficial effects:
In the scheme of the embodiment of the present application, refer to hand vein recognition module and RFID mould in different circuit boards respectively
Block again mounts two circuit boards after being completed for printing, and is assembled with other circuit modules, in this way, to related
The scheme that a circuit board is mounted only is produced in technology to compare, and is more easier using two circuit board attachments.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of application for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is a kind of production method flow chart for finger hand vein recognition device that the application one embodiment provides.
Fig. 2 a is a kind of structure chart for circuit board that another embodiment of the application provides.
Fig. 2 b is a kind of structure chart for circuit board that another embodiment of the application provides.
Specific embodiment
To keep the purposes, technical schemes and advantages of the application clearer, the technical solution of the application will be carried out below
Detailed description.Obviously, described embodiments are only a part of embodiments of the present application, instead of all the embodiments.Base
Embodiment in the application, those of ordinary skill in the art are obtained all without making creative work
Other embodiment belongs to the range that the application is protected.
Embodiment
It is a kind of production method flow chart for finger hand vein recognition device that the application one embodiment provides referring to Fig. 1, Fig. 1.
As shown in Figure 1, a kind of production method for referring to hand vein recognition device provided in this embodiment, includes at least following steps:
Step 11 forms two circuit boards；
Step 12, on one of circuit board of two circuit boards, printing refer to hand vein recognition module, in another circuit
RFID module is printed on plate；
Step 13, the circuit board that will be printed with finger hand vein recognition module are with the circuit board for being printed with RFID module and in advance
The circuit module first obtained is assembled, and obtains referring to hand vein recognition device；
Step 14 carries out embedded encapsulation to finger hand vein recognition device.
It is known as mounting in the surface mount device of circuit board.
In the scheme of the embodiment of the present application, refer to hand vein recognition module and RFID mould in different circuit boards respectively
Block again mounts two circuit boards after being completed for printing, and is assembled with other circuit modules, in this way, to related
The scheme that a circuit board is mounted only is produced in technology to compare, and is more easier using two circuit board attachments.
In the implementation of the present invention, it inventors have found that parameter in printing process, will affect the effect of attachment, passes through
Cross empirical statistics, the parameter combination of the preferable effect reached: optional, printing refers to hand vein recognition module and printing RFID module
When, for one of the first scraper used for mackle scraper, the range of the scraper speed of the first scraper is 600mm-640mm/s,
The range of first printing pressure is 1.5-3kg, and the range of the first demoulding speed is 0.05-0.15mm/s, another use the
Two scrapers are single print scraper, and the range of the scraper speed of the second scraper is 480-520mm/s, and the range of the second printing pressure is 1-
2.5kg, the range of the second demoulding speed are 0.05-0.15mm/s.
As preferential scheme, the scraper speed of the first scraper is 620mm/s, and the first printing pressure is 2.5kg, and first is de-
Film speed is 0.1mm/s, and the scraper speed of the second scraper is 500mm/s, and the second printing pressure is 2kg, and the second demoulding speed is
0.1mm/s。
As a preferred option, the corresponding first attachment rate of the first scraper is 25%-35%, and the first material casting rate is less than
1%；The corresponding second attachment rate of second scraper is 15%-25%, and the second material casting rate is less than 1%.
As a preferred option, the first attachment rate is 30%；Second attachment rate is 20%.
As a preferred option, the corresponding Reflow Soldering speed of the first scraper is 73-77cm/min, preferably 75cm/min, temperature
The setting of area's furnace temperature, can be adjusted by actual production situation, it is proposed that adjustment amplitude is ± 10 DEG C, and speed is ± 10cm.
As a preferred option, the corresponding Reflow Soldering speed 68-72cm/min of the second scraper, preferably 70cm/min, warm area
Furnace temperature setting, can be adjusted by actual production situation, it is proposed that adjustment amplitude is ± 10 DEG C, and speed is ± 10cm.
The value of parameter listed above is the scheme of the optimum efficiency reached by the creative work of inventor.
The specific implementation of above-mentioned steps 11 may is that based on back drill technique, according to drilling file on each substrate
Drilling；The material of substrate is Teflon material；Substrate with a thickness of 3.2-10mm；It is clear that plasma is carried out to the substrate after drilling
It washes；Electroless copper plating technique twice is carried out on substrate after cleaning；When being preset on the substrate Jing Guo electroless copper plating technique
Long copper plating process；The range of preset duration is 8-12min；Wherein, the duration of plating is a very important factor, electricity
Time deficiency, the signal of unbearable big electric current and high frequency band are plated, the duration of the plating of this step is the range of an optimization.
It is made of the route that default pad pasting pressure and default exposure vacuum degree carry out radar antenna to the substrate by copper plating process
Technique obtains circuit board；Default pad pasting pressure is 2.5-3.5 ㎏/㎝2；Default exposure vacuum degree is 680-760mm/Hg；Pad pasting
Pressure is also a very important factor, and pad pasting pressure is excessive, it may appear that the possibility of excessive glue leads to plug-hole, may after plug-hole
Kong Zhongwu copper, the pad pasting pressure of this step are the ranges after optimization.It is equally important to expose vacuum degree, if exposure is too strong,
It is possible that will lead to burning plate, excessively weak, then will lead to development or etching has remaining copper not to the utmost, and the exposure vacuum degree of this step is excellent
Range after change.External form processing is carried out to circuit board.
Since the substrate used is the Teflon material of super thick high frequency, traditional bore process, which cannot achieve, bores it
Hole, therefore, we use back drill technique, specifically, being based on back drill technique, drill on each substrate according to drilling file,
It may include: once to be drilled on substrate according to drilling file by way of machine drilling；Drilling file is done into mirror image
After processing, the obtained secondary aperture that will once drill carries out secondary drilling using the drilling file after mirror image as back drill location hole,
Hole is drilled through；The hole for needing to control gun drilling is subjected to third time drilling according to the diameter and depth of drilling documentation requirements.
When implementation, it can according to need and drill out desired hole, optionally, drill on each substrate according to drilling file,
May include: that following at least one hole is drilled out on substrate according to drilling file:
For passing through the through-hole of signal wire；
For blind hole jamproof between signal；
Through-hole for heat dissipation；
Assembly hole for module assembled；
For the fixation hole by module on fixing piece.
For convenience by module on other fixing pieces, optionally, fixation hole is distributed in the periphery of substrate.
It is and non-limiting the above is only listing several holes that can be bored using the production methods of the application.
As shown in Fig. 2 a, Fig. 2 b, in two circuit boards, first circuit board 21 and second circuit board 22 will be laminated and be assembled in
Together, the attachment for referring to hand vein recognition module and RFID module is realized, the circle in figure on circuit board represents various holes.Based on this,
Optionally, the specific implementation of above-mentioned steps 13, comprising: the circuit board for referring to hand vein recognition module will be printed with and be printed with
The circuit board of RFID module passes through a pair of matched assembly hole assembling；In the pair of matched assembly hole, the aperture of the two is not
Together；Circuit board after assembling is assembled with the circuit module being obtained ahead of time.
It may include: to be milled out by several times to circuit board when carrying out external form processing to circuit board optionally in some embodiments
External form；Fillet processing is carried out to circuit board.
Wherein, external form is milled out by several times to circuit board, may include: that an external form processing is carried out to circuit board, then to electricity
Road plate carries out secondary external form processing.In this way, the better processing effect for thicker circuit board.Wherein it is possible to using calculating
Machine numerically-controlled machine tool carries out external form processing.
It wherein, may include: the thickness when circuit board beyond gong knife edge length when carrying out fillet processing to circuit board
When, after one side carries out a gong side, based on deep gong plate and back gong technology is controlled, secondary gong side, and local position are carried out in another side
Setting does not allow gong saturating.In this way, dividing two sides gong for thicker circuit board, fillet treatment effect is more preferable.
In some embodiments, optionally, refer to that the manufacture craft of hand vein recognition device can also include: to carry out chamfering to circuit board
Technique.In this way, not removing only burr, it is also convenient for installing.
In some embodiments, optionally, substrate with a thickness of 10mm；Preset duration is 10min；Default pad pasting pressure is 3
㎏/㎝2；Default exposure vacuum degree is 720mm/Hg.The cooperation of these parameters in the present embodiment, obtained finger hand vein recognition device
Effect it is best.
It is of course also possible to use other parameters, for example, the thickness of substrate can also be 5mm, 6mm, 8mm, etc..
Below by taking a specific scene as an example, to a kind of production side for referring to hand vein recognition device provided by the embodiments of the present application
Method is described below in greater detail.
The process of the production method of the present embodiment is as follows:
Step 1: the substrate sawing sheet of the Teflon material to 10mm thickness.
Step 2: once being drilled on substrate according to drilling file by way of machine drilling.
Step 3: the obtained secondary aperture that will once drill makes as back drill location hole after drilling file is done mirror image processing
Secondary drilling is carried out with the drilling file after mirror image, a hole is drilled through.
Step 4: the hole for needing to control gun drilling is carried out third time drilling according to the diameter and depth of drilling documentation requirements.
Step 5: commonly being cleaned to the substrate after drilling.
Step 6: carrying out plasma cleaning to the substrate after drilling.
Step 7: carrying out an electroless copper plating technique on substrate after cleaning.
Step 8: carrying out an electroless copper plating technique again on the substrate Jing Guo electroless copper plating technique.
Step 9: carrying out the copper plating process of 10min on the substrate Jing Guo electroless copper plating technique.
Step 10: checking whether technique is qualified.
Step 11: using 3 ㎏/㎝2Default pad pasting pressure and 720mm/Hg default exposure vacuum degree to by electricity
The substrate of copper-plating technique carries out line manufacturing process, obtains circuit board.
Step 12: copper and tin is electroplated on circuit boards.
Step 13: moving back tin to circuit board etching.
Step 14: to circuit board resistance welding text.
Step 15: the surface to circuit board is handled.
Step 16: carrying out an external form processing to circuit board.
Step 17: carrying out secondary external form processing to circuit board.
Step 18: carrying out fillet processing to circuit board.It is specific: when the thickness of circuit board exceeds gong knife edge length
When, after one side carries out a gong side, based on deep gong plate and back gong technology is controlled, secondary gong side, and local position are carried out in another side
Setting does not allow gong saturating.
Step 19: carrying out visual examination to circuit board.Appearance test standard formulation Yi Ju ﹕ IPC-A-610D standard；Inspection
Test content: a, Short Item；B, short circuit；C, wrong part；D, polarity is anti-；E, part is damaged；F, part is stood；G, it deviates；H, missing solder；I, few
The more tin of tin &；J, tin sweat(ing) & scruff；K, reversed；L, part is edge-on.
Step 20: forming two circuit boards；On one of circuit board of two circuit boards, printing refers to hand vein recognition
Module, in another circuit boards RFID module；The circuit board for referring to hand vein recognition module will be printed with and be printed with RFID
The circuit board of module and the circuit module being obtained ahead of time are assembled, and obtain referring to hand vein recognition device.The circuit mould being obtained ahead of time
Block can be various elements and package module etc..
Step 2 11 carries out embedded encapsulation to finger hand vein recognition device.
Step 2 12 tests finger hand vein recognition device.It is put in storage after test passes.
The specific implementation of above-mentioned steps 20 can refer to the above related embodiment.Below with reference to the ginseng in concrete application scene
Number is further for example:
In the present embodiment, printing technology must be passed through, element recognition effect determines component size, and determines patch machine
Suction nozzle model, mounted bill of materials, related process parameters when using tin cream, mounted key parameter, the key of Reflow Soldering
The processes such as parameter.
For example, it is as follows to correspond to table 1 for common component size:
1 common component size of table corresponds to table
For example, by taking the patch machine of YAMAHA YS12 model as an example, patch machine suction nozzle type number is as shown in table 2 below:
2 chip mounter suction nozzle model of table
For example, partial material inventory is as shown in table 3 below:
3 bill of materials of table
For example, the production key parameter of paste solder printing process includes parameter shown in the following table 4:
4 paste solder printing parameter of table
For example, mounted key parameter includes parameter shown in the following table 5:
The mounted key parameter of table 5
For example, the key parameter furnace temperature setting of Reflow Soldering is as shown in table 6 below:
The setting of 6 furnace temperature of table
Wherein, when heat temperature raising, machine will show temperature and lower temperature according to above table, with table one
Reflow Soldering can be just carried out when cause.The setting of furnace temperature is matched with used tin cream.
Another embodiment of the application also provides a kind of finger hand vein recognition device, this refers to that hand vein recognition device is used such as to take up an official post
The production method of finger hand vein recognition device described in embodiment of anticipating is prepared.
It is understood that same or similar part can mutually refer in the various embodiments described above, in some embodiments
Unspecified content may refer to the same or similar content in other embodiments.
It should be noted that term " first ", " second " etc. are used for description purposes only in the description of the present application, without
It can be interpreted as indication or suggestion relative importance.In addition, in the description of the present application, unless otherwise indicated, the meaning of " multiple "
Refer at least two.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is contained at least one embodiment or example of the application.In the present specification, schematic expression of the above terms are not
Centainly refer to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be any
One or more embodiment or examples in can be combined in any suitable manner.
Although embodiments herein has been shown and described above, it is to be understood that above-described embodiment is example
Property, it should not be understood as the limitation to the application, those skilled in the art within the scope of application can be to above-mentioned
Embodiment is changed, modifies, replacement and variant.
Claims (10)
1. a kind of production method for referring to hand vein recognition device, which is characterized in that the finger hand vein recognition device includes referring to hand vein recognition mould
Block and radio frequency discrimination RFID module；Include:
Form two circuit boards；
On one of them described circuit board of described two circuit boards, the finger hand vein recognition module is printed, in another institute
State circuit boards RFID module；
Will be printed with it is described refer to hand vein recognition module the circuit board be printed with the RFID module the circuit board, with
And the circuit module being obtained ahead of time is assembled, and obtains referring to hand vein recognition device；
Embedded encapsulation is carried out to the finger hand vein recognition device.
2. manufacturing method according to claim 1, which is characterized in that the printing finger hand vein recognition module and described
When printing RFID module, for mackle scraper, the range of the scraper speed of the first scraper is one of the first scraper used
600mm-640mm/s, the range of the first printing pressure are 1.5-3kg, and the range of the first demoulding speed is 0.05-0.15mm/s,
Another second scraper used prints scraper to be single, and the range of the scraper speed of second scraper is 480-520mm/s, and second
The range of printing pressure is 1-2.5kg, and the range of the second demoulding speed is 0.05-0.15mm/s.
3. production method according to claim 2, which is characterized in that the scraper speed of first scraper is 620mm/s,
First printing pressure is 2.5kg, and the first demoulding speed is 0.1mm/s, and the scraper speed of second scraper is
500mm/s, second printing pressure are 2kg, and the second demoulding speed is 0.1mm/s.
4. production method according to claim 2, which is characterized in that first scraper corresponding first mounts rate and is
25%-35%, the first material casting rate is less than 1%；It is 15%-25% that second scraper corresponding second, which mounts rate, and second throws
Material rate is less than 1%.
5. production method according to claim 4, which is characterized in that the first attachment rate is 30%；Described second
Mounting rate is 20%.
6. manufacturing method according to claim 1, which is characterized in that two circuit boards of the formation, comprising:
Based on back drill technique, drill on each substrate according to drilling file；The material of the substrate is Teflon material；It is described
Substrate with a thickness of 3.2-10mm；
Plasma cleaning is carried out to the substrate after drilling；
Electroless copper plating technique twice is carried out on the substrate after cleaning；
The copper plating process of preset duration is carried out on the substrate Jing Guo the electroless copper plating technique；The preset duration
Range is 8-12min；
Radar day is carried out to by the substrate of the copper plating process using default pad pasting pressure and default exposure vacuum degree
The line manufacturing process of line, obtains circuit board；The default pad pasting pressure is 2.5-3.5 ㎏/㎝2；The default exposure vacuum
Degree is 680-760mm/Hg；
External form processing is carried out to the circuit board.
7. production method according to claim 6, which is characterized in that it is described to be based on back drill technique, exist according to drilling file
It drills on each substrate, comprising:
It is once drilled according to drilling file on the substrate by way of machine drilling；
After the drilling file is done mirror image processing, using the primary obtained secondary aperture that drills as back drill location hole, use
The drilling file after mirror image carries out secondary drilling, and a hole is drilled through；
The hole for needing to control gun drilling is subjected to third time drilling according to the diameter and depth of the drilling documentation requirements.
8. production method according to claim 6, which is characterized in that described to be bored on each substrate according to drilling file
Hole, comprising:
Following at least one hole is drilled out on the substrate according to drilling file:
For passing through the through-hole of signal wire；
For blind hole jamproof between signal；
Through-hole for heat dissipation；
Assembly hole for module assembled；
For the fixation hole by the module on fixing piece.
9. production method according to claim 8, which is characterized in that described to be printed with the finger hand vein recognition module
The circuit board is assembled with the circuit module for being printed with the circuit board of the RFID module and being obtained ahead of time, and is obtained
To finger hand vein recognition device, comprising:
The circuit board for referring to hand vein recognition module will be printed with to lead to the circuit board for being printed with the RFID module
Cross a pair of matched assembly hole assembling；In the pair of matched assembly hole, the aperture of the two is different；
The circuit board after assembling is assembled with the circuit module being obtained ahead of time.
10. a kind of finger hand vein recognition device, which is characterized in that the finger hand vein recognition device is using such as any one of claim 1~9
The production method of the finger hand vein recognition device is prepared.
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| CN201910140405.8A CN109788668A (en) | 2019-02-25 | 2019-02-25 | Refer to hand vein recognition device and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910140405.8A CN109788668A (en) | 2019-02-25 | 2019-02-25 | Refer to hand vein recognition device and preparation method thereof |
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| JP2016139768A (en) * | 2015-01-29 | 2016-08-04 | 大日本印刷株式会社 | Laminated wiring board |
| CN106304641A (en) * | 2016-08-26 | 2017-01-04 | 广东冠锋科技股份有限公司 | A kind of manufacture method of super thick Teflon circuit board |
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