CN109755160A - wafer cleaning mechanism - Google Patents
wafer cleaning mechanism Download PDFInfo
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- CN109755160A CN109755160A CN201910027363.7A CN201910027363A CN109755160A CN 109755160 A CN109755160 A CN 109755160A CN 201910027363 A CN201910027363 A CN 201910027363A CN 109755160 A CN109755160 A CN 109755160A
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- wafer
- driving motor
- spray rinsing
- cleaning mechanism
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Abstract
The present invention provides a kind of wafer cleaning mechanism, including driving motor, wafer clamp locking bracket and wafer spray rinsing parts, air inlet, inlet and connection jaws are provided on driving motor, driving motor inner hollow, airflow pipeline and liquid stream pipeline are provided in driving motor, air inlet is communicated with airflow pipeline, and inlet is communicated with liquid stream pipeline；Wafer clamp locking bracket is set on the output shaft of driving motor, and wafer spray rinsing parts are set on wafer clamp locking bracket；Wafer spray rinsing parts have air jet pipe and sparge pipe, and air jet pipe is communicated with airflow pipeline, and sparge pipe is communicated with liquid stream pipeline.The structure setting of wafer cleaning mechanism of the present invention is more scientific, in the washing and cleaning operation of wafer, preferably the lower surface of wafer can be cleaned, keep the cleaning effect of wafer even more ideal, i.e. crystal column surface has better cleanliness and flatness, to promote the processing quality of wafer, so that the processing quality of wafer is even more ideal.
Description
Technical field
The present invention relates to wafer cleaning utensil technical fields, in particular to a kind of wafer cleaning mechanism.
Background technique
Wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle, therefore referred to as wafer；
It can be processed on silicon and is fabricated to various circuit component structures, and become the IC products for having specific electrical functionality.Collection
Manufacture at circuit is the core of electronics and information industry, is the most important high-new of development of promoting the IT development for national economic and social development
One of technology.
In the processing of wafer, need to wafer carry out chemical mechanical polish process, the wafer after polishing treatment need into
Row washing and cleaning operation.In the cleaning process of wafer, need that wafer is fixed in wafer cleaning mechanism, then cleaned.
However, the structure of existing most of wafer cleaning mechanisms is all relatively simple, wafer cleaning mechanism the lower surface to wafer into
When row washing and cleaning operation, it tends to be difficult to reach ideal cleaning effect, i.e. the cleanliness of crystal column surface and flatness is not ideal enough, from
And wafer is made to be difficult to reach ideal processing quality.
Summary of the invention
In view of the above problems, the present invention provides a kind of wafer cleaning mechanism, the structure setting of the wafer cleaning mechanism compared with
Preferably the lower surface of wafer can be cleaned, make the cleaning effect of wafer more in the washing and cleaning operation of wafer for science
Ideal, i.e. crystal column surface have better cleanliness and flatness, so that the processing quality of wafer is promoted, so that the processing matter of wafer
It measures even more ideal.
To achieve the goals above, the present invention adopts the following technical scheme that:
Wafer cleaning mechanism, including driving motor, wafer clamp locking bracket and wafer spray rinsing parts,
Air inlet, inlet and connection jaws, the driving motor inner hollow, the drive are provided on the driving motor
It is provided with airflow pipeline and liquid stream pipeline in dynamic motor, the air inlet is communicated with airflow pipeline, the inlet and fluid flow tube
Road communicates；
The wafer clamp locking bracket is set on the output shaft of the driving motor, and the wafer clamp locking bracket has clamping
The clamping part in portion, the wafer clamp locking bracket forms wafer clamping position；
The wafer spray rinsing parts are set on the wafer clamp locking bracket, and are located at below the wafer clamping position；Institute
Wafer spray rinsing parts are stated with air jet pipe and sparge pipe, the air jet pipe is communicated with the airflow pipeline, the sparge pipe and institute
Liquid stream pipeline is stated to communicate.
As the further optinal plan of above-mentioned wafer cleaning mechanism, the output shaft of the driving motor is exposed to the drive
The top of dynamic motor；
The air inlet and inlet are set to the bottom of the driving motor, and the court of the air inlet and inlet
Setting direction to the output shaft with the driving motor is perpendicular；
The connection jaws are set to the side of the driving motor.
As the further optinal plan of above-mentioned wafer cleaning mechanism, the air jet pipe of the wafer spray rinsing parts has two
Item；
The airflow pipeline has primary air pipe portion and divides air-flow pipe portion, the main gas of the air inlet and the airflow pipeline
The one end in flow tube portion communicates, and the other end of the primary air pipe portion of the airflow pipeline is in the position close to the wafer spray rinsing parts
Divide air-flow pipe portion described in being divided into two, the air jet pipe of the wafer spray rinsing parts divides air-flow with the corresponding airflow pipeline
Pipe portion communicates.
As the further optinal plan of above-mentioned wafer cleaning mechanism, the airflow pipeline is in its primary air pipe portion and divides gas
Sealing element is provided at the branch in flow tube portion.
As the further optinal plan of above-mentioned wafer cleaning mechanism, two air jet pipes of the wafer spray rinsing parts
It is located along the same line.
As the further optinal plan of above-mentioned wafer cleaning mechanism, the sparge pipe of the wafer spray rinsing parts has one
The sparge pipe of item, the wafer spray rinsing parts is set between two air jet pipes of the wafer spray rinsing parts, the wafer
Two air jet pipes of the sparge pipe of hydro-peening parts and the wafer spray rinsing parts are in same plane, and the wafer sprays
Washing machine part is perpendicular with two air jet pipes of the wafer spray rinsing parts respectively.
As the further optinal plan of above-mentioned wafer cleaning mechanism, the airflow pipeline and liquid stream pipeline are close to institute
The periphery for stating wafer spray rinsing parts position is provided with the first waterproof case, and first waterproof case is close to the airflow pipeline and liquid stream
Pipeline.
As the further optinal plan of above-mentioned wafer cleaning mechanism, the periphery of first waterproof case is additionally provided with
Two waterproof cases.
As the further optinal plan of above-mentioned wafer cleaning mechanism, the wafer clamp locking bracket has at least three connections
Arm,
One end rotation of the linking arm of the wafer clamp locking bracket is provided with gripper jaw, and the upper end of the gripper jaw has
The clamping part, the lower end of the gripper jaw are provided with the adjusting parts for adjusting the gripper jaw.
As the further optinal plan of above-mentioned wafer cleaning mechanism, the adjusting parts include lower adjusting block, upper adjusting
Block and pressure spring,
The lower end of the gripper jaw offers mounting hole, and the lower adjusting block and upper adjusting block are set to the mounting hole
Place, and be threadedly coupled with the mounting hole；One end of the pressure spring is set on the lower adjusting block, the other end of the pressure spring
Across the upper adjusting block, and it is butted on the linking arm of the wafer clamp locking bracket.
Advantages of the present invention or principle are illustrated below:
Wafer cleaning mechanism is provided with air inlet, inlet and connection jaws on driving motor, is provided with gas in driving motor
Flow tube road and liquid stream pipeline, air inlet are communicated with airflow pipeline, and inlet is communicated with liquid stream pipeline, and air inlet is for connecting gas transmission
The airflow line of mechanism, inlet are used to connect the fluid pipe of infusion mechanism, and connection jaws are used for the connection of electric wire；Wafer clamps
Bracket is set on the output shaft of driving motor, and the clamping part of wafer clamp locking bracket forms wafer clamping position, wafer clamp locking bracket
For clamping wafer；Wafer spray rinsing parts are set on wafer clamp locking bracket, and are located at below wafer clamping position；Wafer spray rinsing machine
Part has air jet pipe and sparge pipe, and air jet pipe is communicated with airflow pipeline, and sparge pipe is communicated with liquid stream pipeline, wafer spray rinsing parts
Air jet pipe and sparge pipe clean the lower surface of wafer for spraying purge gas and cleaning liquid；Specifically, it is using
When, purge gas enters airflow line from air inlet, then sprays via air jet pipe, and similarly, cleaning liquid enters from inlet
Fluid pipe, then sprayed via sparge pipe；
The wafer cleaning mechanism is provided with the mode of purge of gas and liquid rinse, and the setting of its structure more section
It learns, in the washing and cleaning operation of wafer, which can preferably be cleaned the lower surface of wafer, make the clear of wafer
It is even more ideal to wash effect, i.e., crystal column surface has better cleanliness and flatness, so that the processing quality of wafer is promoted, so that brilliant
Round processing quality is even more ideal.
To enable the above objects, features and advantages of the present invention to be clearer and more comprehensible, preferred embodiment is cited below particularly, and cooperate
Appended attached drawing, is described in detail below.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is the schematic perspective view of the wafer cleaning mechanism of the embodiment of the present invention；
Fig. 2 is the side structure schematic view of the wafer cleaning mechanism of the embodiment of the present invention；
Fig. 3 is the schematic cross-sectional view of the wafer cleaning mechanism of the embodiment of the present invention；
Fig. 4 is the broken section structural schematic diagram of the wafer cleaning mechanism of the embodiment of the present invention；
Fig. 5 is the partial structural diagram of the wafer cleaning mechanism of the embodiment of the present invention.
Description of symbols:
10- driving motor；11- air inlet；12- inlet；13- connection jaws；14- airflow pipeline；15- liquid stream pipeline；16-
First waterproof case；The second waterproof case of 17-；20- wafer clamp locking bracket；21- linking arm；22- gripper jaw；221- clamping part；23- tune
Save parts；Adjusting block under 231-；The upper adjusting block of 232-；233- pressure spring；30- wafer spray rinsing parts；31- air jet pipe；32- hydrojet
Pipe.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Usually
The component for the embodiment of the present invention being described and illustrated herein in the accompanying drawings can be arranged and be designed with a variety of different configurations.Cause
This, is not intended to limit claimed invention to the detailed description of the embodiment of the present invention provided in the accompanying drawings below
Range, but it is merely representative of selected embodiment of the invention.Based on the embodiment of the present invention, those skilled in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall within the protection scope of the present invention.
In the present invention, term " on ", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outside",
" in ", "vertical", "horizontal", " transverse direction ", the orientation or positional relationship of the instructions such as " longitudinal direction " be orientation based on the figure or
Positional relationship.These terms are not intended to limit indicated dress primarily to better describe the present invention and embodiment
Set, element or component must have particular orientation, or constructed and operated with particular orientation.
Also, above-mentioned part term is other than it can be used to indicate that orientation or positional relationship, it is also possible to for indicating it
His meaning, such as term " on " also are likely used for indicating certain relations of dependence or connection relationship in some cases.For ability
For the those of ordinary skill of domain, the concrete meaning of these terms in the present invention can be understood as the case may be.
In addition, term " installation ", " setting ", " being equipped with ", " connection ", " connected " shall be understood in a broad sense.For example, it may be solid
Fixed connection, is detachably connected or monolithic construction；It can be mechanical connection, or point connection；It can be directly connected, either
It indirectly connected through an intermediary, or is two connection internal between device, element or component.For this field
For those of ordinary skill, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In addition, term " first ", " second " etc. are mainly used for distinguishing different devices, element or component (specifically
Type and construction may it is identical may also be different), be not intended to show or implies meaning showing device, element or component
Relative importance and quantity.Unless otherwise indicated, the meaning of " multiple " is two or more.
Referring to Fig. 1 to Fig. 3, wherein Fig. 1 is the schematic perspective view of the wafer cleaning mechanism of the embodiment of the present invention, Fig. 2
It is the side structure schematic view of the wafer cleaning mechanism of the embodiment of the present invention, Fig. 3 is the wafer cleaning mechanism of the embodiment of the present invention
Schematic cross-sectional view.
The wafer cleaning mechanism of the embodiment of the present invention, including driving motor 10, wafer clamp locking bracket 20 and wafer spray rinsing machine
Part 30.
Air inlet 11, inlet 12 and connection jaws 13,10 inner hollow of driving motor, driving are provided on driving motor 10
Airflow pipeline 14 and liquid stream pipeline 15 are provided in motor 10, air inlet 11 is communicated with airflow pipeline 14, inlet 12 and liquid stream
Pipeline 15 communicates.
Wafer clamp locking bracket 20 is set on the output shaft of driving motor 10, and wafer clamp locking bracket 20 has clamping part 221,
The clamping part 221 of wafer clamp locking bracket 20 forms wafer clamping position.
Wafer spray rinsing parts 30 are set on wafer clamp locking bracket 20, and are located at below wafer clamping position；Wafer spray rinsing machine
Part 30 has air jet pipe 31 and sparge pipe 32, and air jet pipe 31 is communicated with airflow pipeline 14, and sparge pipe 32 is communicated with liquid stream pipeline 15.
The wafer cleaning mechanism of the embodiment of the present invention is provided with air inlet 11, inlet 12 and wiring on driving motor 10
Mouthfuls 13, airflow pipeline 14 and liquid stream pipeline 15 are provided in driving motor 10, and air inlet 11 is communicated with airflow pipeline 14, inlet
12 communicate with liquid stream pipeline 15, and air inlet 11 is used to connect the airflow line of gas transmission mechanism, and inlet 12 is for connecting infusion machine
The fluid pipe of structure, connection jaws 13 are used for the connection of electric wire；Wafer clamp locking bracket 20 is set on the output shaft of driving motor 10,
The clamping part 221 of wafer clamp locking bracket 20 forms wafer clamping position, and wafer clamp locking bracket 20 is for clamping wafer；Wafer spray rinsing machine
Part 30 is set on wafer clamp locking bracket 20, and is located at below wafer clamping position；Wafer spray rinsing parts 30 have air jet pipe 31 and
Sparge pipe 32, air jet pipe 31 are communicated with airflow pipeline 14, and sparge pipe 32 is communicated with liquid stream pipeline 15, the spray of wafer spray rinsing parts 30
Tracheae 31 and sparge pipe 32 clean the lower surface of wafer for spraying purge gas and cleaning liquid；Specifically, make
Used time, purge gas enters airflow line from air inlet 11, then sprays via air jet pipe 31, and similarly, cleaning liquid is from feed liquor
Mouth 12 enters fluid pipe, then sprays via sparge pipe 32.
The wafer cleaning mechanism is provided with the mode of purge of gas and liquid rinse, and the setting of its structure more section
It learns, in the washing and cleaning operation of wafer, which can preferably be cleaned the lower surface of wafer, make the clear of wafer
It is even more ideal to wash effect, i.e., crystal column surface has better cleanliness and flatness, so that the processing quality of wafer is promoted, so that brilliant
Round processing quality is even more ideal.
Referring to Fig. 1 to Fig. 3, in the present embodiment, the output shaft of driving motor 10 is exposed to the top of driving motor 10.
Air inlet 11 and inlet 12 are set to the bottom of driving motor 10, and the direction of air inlet 11 and inlet 12
It is perpendicular with the setting direction of the output shaft of driving motor 10；Connection jaws 13 are set to the side of driving motor 10.
The air inlet 11 of driving motor 10 and the setting position of inlet 12 are more scientific, can be convenient for the wafer cleaning machine
The use of structure, convenient for the air inlet 11 and inlet 12 and airflow line of driving motor 10 and the connection of fluid pipe, reducing should
The interference of wafer cleaning mechanism each structure when using, also, the direction of the air inlet 11 of driving motor 10 and inlet 12 can make
Obtaining the wafer cleaning mechanism has better using effect；The setting position of the connection jaws 13 of driving motor 10 is also convenient for the company of electric wire
Connect, make the wafer cleaning mechanism using more convenient.
Referring to Fig. 1 to Fig. 3, in the present embodiment, the air jet pipe 31 of wafer spray rinsing parts 30 has two.
Airflow pipeline 14 has primary air pipe portion and divides air-flow pipe portion, the primary air pipe portion of air inlet 11 and airflow pipeline 14
One end communicate, the other end of the primary air pipe portion of airflow pipeline 14 is divided into two points in the position close to wafer spray rinsing parts 30
Air-flow pipe portion, the air jet pipe 31 of wafer spray rinsing parts 30 divide air-flow pipe portion to communicate with corresponding airflow pipeline 14.
Wafer spray rinsing parts 30 have two air jet pipes 31, and the wafer cleaning mechanism can be made to have more preferably the lower surface of wafer
Cleaning effect；The set-up mode of airflow pipeline 14 is convenient for the processing and production of the wafer cleaning mechanism, and it is clear to reduce the wafer
The difficulty of processing of washing machine structure, to reduce the processing and fabricating cost of the wafer cleaning mechanism.
Referring to Fig. 1 to Fig. 3, as an alternative embodiment, airflow pipeline 14 is in its primary air pipe portion and divides air-flow
Sealing element is provided at the branch of pipe portion.
Sealing element can carry out good sealing at its primary air pipe portion and the branch for dividing air-flow pipe portion to airflow pipeline 14,
Ensure the air-tightness of the wafer cleaning mechanism, using safe and using effect.
Referring to Fig. 1, in the present embodiment, two air jet pipes 31 of wafer spray rinsing parts 30 are located along the same line.
The set-up mode of two air jet pipes 31 of wafer spray rinsing parts 30 can divide setting for air-flow pipe portion convenient for airflow pipeline 14
It sets, simultaneously, moreover it is possible to so that the air jet pipe 31 of wafer spray rinsing parts 30 has more preferably jet cleaning effect to the lower surface of wafer.
Referring to Fig. 1, in the present embodiment, the sparge pipe 32 of wafer spray rinsing parts 30 has one, wafer spray rinsing parts 30
Sparge pipe 32 be set to wafer spray rinsing parts 30 two air jet pipes 31 between, the sparge pipe 32 and wafer of wafer spray rinsing parts 30
Two air jet pipes 31 of hydro-peening parts 30 are in same plane, and wafer spray rinsing parts 30 respectively with wafer spray rinsing parts 30
Two air jet pipes 31 are perpendicular.
The set-up mode of the sparge pipe 32 of wafer spray rinsing parts 30 can preferably reduce sparge pipe 32 and 31 hydro-peening of air jet pipe
When interference so that the sparge pipe 32 of wafer spray rinsing parts 30 has more preferably hydrojet cleaning effect to the lower surface of wafer.
Referring to Fig. 3, in the present embodiment, airflow pipeline 14 and liquid stream pipeline 15 are close to 30 position of wafer spray rinsing parts
Periphery be provided with the first waterproof case 16, the first waterproof case 16 is close to airflow pipeline 14 and liquid stream pipeline 15.
First waterproof case 16 can play good waterproof action, and the setting of the first waterproof case 16 further ensures the wafer
Wiper mechanism uses safe and using effect.
Referring to Fig. 3, in the present embodiment, the periphery of the first waterproof case 16 is additionally provided with the second waterproof case 17.
Second waterproof case 17 can equally play good waterproof action, and the setting of the second waterproof case 17 further ensures
The wafer cleaning mechanism uses safe and using effect.
As an alternative embodiment, the first waterproof case 16 is motor flange, the second waterproof case 17 is chamber shaft flange,
Chamber shaft flange is the flange for being sheathed on 10 chamber axis of driving motor.
Referring to Fig. 1 to Fig. 5, in the present embodiment, wafer clamp locking bracket 20 has at least three linking arms 21, specifically,
The linking arm 21 of wafer clamp locking bracket 20 is three.
One end rotation of the linking arm 21 of wafer clamp locking bracket 20 is provided with gripper jaw 22, and the upper end of gripper jaw 22 has
Clamping part 221, the lower end of gripper jaw 22 are provided with the adjusting parts 23 for adjusting gripper jaw 22.
Its clamping to wafer is convenient in the setting of 20 structure of wafer clamp locking bracket, and adjusting parts 23 can be used for gripper jaw 22
Be adjusted so that wafer clamp locking bracket 20 using more convenient, also, wafer clamp locking bracket 20 is had more preferably to wafer
Clamping effect so that gripping for wafer is reliable, preferably reduction air drag reduces the vibration of wafer, improves wafer
Granularity.
Referring to Fig. 1 to Fig. 5, in the present embodiment, adjusting parts 23 includes lower adjusting block 231, upper adjusting block 232 and pressure spring
233。
The lower end of gripper jaw 22 offers mounting hole, and lower adjusting block 231 and upper adjusting block 232 are set at mounting hole,
And it is threadedly coupled with mounting hole；One end of pressure spring 233 is set on lower adjusting block 231, and the other end of pressure spring 233 passes through upper adjusting
Block 232, and be butted on the linking arm 21 of wafer clamp locking bracket 20.
The adjusting parts 23 can be used to adjust the angle and tightness of gripper jaw 22, so that wafer clamp locking bracket 20
There is better clamping effect to wafer.
In above-mentioned all embodiments, " big ", " small " be in contrast, " more ", " few " be in contrast, "upper",
"lower" is that in contrast, to the form of presentation of such relative terms, the embodiment of the present invention is no longer added to repeat.
It should be understood that " in the present embodiment ", " in the embodiment of the present invention " or " can as one kind that specification is mentioned in the whole text
The embodiment of choosing " means that a particular feature, structure, or characteristic related with embodiment includes at least one reality of the invention
It applies in example.Therefore, " in the present embodiment " that occurs everywhere in the whole instruction, " in the embodiment of the present invention " or " as one kind
Optional embodiment " not necessarily refers to identical embodiment.In addition, these a particular feature, structure, or characteristics can be with any
Suitable mode combines in one or more embodiments.Those skilled in the art should also know that described in this description
Embodiment belongs to alternative embodiment, and related actions and modules are not necessarily necessary for the present invention.
In various embodiments of the present invention, it should be appreciated that magnitude of the sequence numbers of the above procedures are not meant to execute suitable
Successively, the execution sequence of each process should be determined by its function and internal logic the certainty of sequence, without coping with the embodiment of the present invention
Implementation process constitutes any restriction.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should with subject to scope of protection of the claims.
Claims (10)
1. wafer cleaning mechanism, which is characterized in that including driving motor, wafer clamp locking bracket and wafer spray rinsing parts,
Air inlet, inlet and connection jaws, the driving motor inner hollow, the driving electricity are provided on the driving motor
Airflow pipeline and liquid stream pipeline are provided in machine, the air inlet is communicated with airflow pipeline, the inlet and liquid stream pipeline phase
It is logical；
The wafer clamp locking bracket is set on the output shaft of the driving motor, and the wafer clamp locking bracket has clamping part,
The clamping part of the wafer clamp locking bracket forms wafer clamping position；
The wafer spray rinsing parts are set on the wafer clamp locking bracket, and are located at below the wafer clamping position；The crystalline substance
Circle hydro-peening parts have air jet pipe and sparge pipe, and the air jet pipe is communicated with the airflow pipeline, the sparge pipe and the liquid
Flow tube road communicates.
2. wafer cleaning mechanism according to claim 1, which is characterized in that the output shaft of the driving motor is exposed to institute
State the top of driving motor；
The air inlet and inlet are set to the bottom of the driving motor, and the direction of the air inlet and inlet with
The setting direction of the output shaft of the driving motor is perpendicular；
The connection jaws are set to the side of the driving motor.
3. wafer cleaning mechanism according to claim 1, which is characterized in that the air jet pipe of the wafer spray rinsing parts has
Two；
The airflow pipeline has primary air pipe portion and divides air-flow pipe portion, the main gas flow pipe of the air inlet and the airflow pipeline
The one end in portion communicates, and the other end of the primary air pipe portion of the airflow pipeline is divided into the position close to the wafer spray rinsing parts
Divide air-flow pipe portion described in two, the air jet pipe of the wafer spray rinsing parts divides air-flow pipe portion with the corresponding airflow pipeline
It communicates.
4. wafer cleaning mechanism according to claim 3, which is characterized in that the airflow pipeline its primary air pipe portion with
Divide at the branch of air-flow pipe portion and is provided with sealing element.
5. wafer cleaning mechanism according to claim 3, which is characterized in that two sprays of the wafer spray rinsing parts
Tracheae is located along the same line.
6. wafer cleaning mechanism according to claim 5, which is characterized in that the sparge pipe of the wafer spray rinsing parts has
One, the sparge pipe of the wafer spray rinsing parts is set between two air jet pipes of the wafer spray rinsing parts, the crystalline substance
The sparge pipe of circle hydro-peening parts and two air jet pipes of the wafer spray rinsing parts are in same plane, and the wafer
Hydro-peening parts are perpendicular with two air jet pipes of the wafer spray rinsing parts respectively.
7. wafer cleaning mechanism according to claim 1, which is characterized in that the airflow pipeline and liquid stream pipeline are close
The periphery of wafer spray rinsing parts position is provided with the first waterproof case, first waterproof case be close to the airflow pipeline and
Liquid stream pipeline.
8. wafer cleaning mechanism according to claim 7, which is characterized in that the periphery of first waterproof case is also set up
There is the second waterproof case.
9. wafer cleaning mechanism according to claim 1, which is characterized in that the wafer clamp locking bracket has at least three
Linking arm,
One end rotation of the linking arm of the wafer clamp locking bracket is provided with gripper jaw, and the upper end of the gripper jaw has described
Clamping part, the lower end of the gripper jaw are provided with the adjusting parts for adjusting the gripper jaw.
10. wafer cleaning mechanism according to claim 9, which is characterized in that the adjusting parts include lower adjusting block, on
Adjusting block and pressure spring,
The lower end of the gripper jaw offers mounting hole, and the lower adjusting block and upper adjusting block are set at the mounting hole,
And it is threadedly coupled with the mounting hole；One end of the pressure spring is set on the lower adjusting block, and the other end of the pressure spring is worn
The upper adjusting block is crossed, and is butted on the linking arm of the wafer clamp locking bracket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910027363.7A CN109755160A (en) | 2019-01-11 | 2019-01-11 | wafer cleaning mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910027363.7A CN109755160A (en) | 2019-01-11 | 2019-01-11 | wafer cleaning mechanism |
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| CN109755160A true CN109755160A (en) | 2019-05-14 |
Family
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| CN112246747A (en) * | 2020-09-30 | 2021-01-22 | 刘启升 | Continuous semiconductor wafer etching equipment |
| CN112453003A (en) * | 2020-11-03 | 2021-03-09 | 四川美术学院 | Semiconductor wafer clamping equipment |
| CN112768376A (en) * | 2020-12-30 | 2021-05-07 | 上海至纯洁净系统科技股份有限公司 | Wafer cleaning device and wafer cleaning method |
| CN116274096A (en) * | 2023-04-28 | 2023-06-23 | 苏州冠礼科技有限公司 | Clamping type wafer cleaning device |
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| CN112246747B (en) * | 2020-09-30 | 2021-09-17 | 青岛金汇源电子有限公司 | Continuous semiconductor wafer etching equipment |
| CN112453003A (en) * | 2020-11-03 | 2021-03-09 | 四川美术学院 | Semiconductor wafer clamping equipment |
| CN112453003B (en) * | 2020-11-03 | 2022-02-15 | 四川美术学院 | Semiconductor wafer clamping equipment |
| CN112768376A (en) * | 2020-12-30 | 2021-05-07 | 上海至纯洁净系统科技股份有限公司 | Wafer cleaning device and wafer cleaning method |
| CN116274096A (en) * | 2023-04-28 | 2023-06-23 | 苏州冠礼科技有限公司 | Clamping type wafer cleaning device |
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Application publication date: 20190514 |