CN109716517A - 一种类太阳光谱led灯珠结构 - Google Patents

一种类太阳光谱led灯珠结构 Download PDF

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Publication number
CN109716517A
CN109716517A CN201680088060.0A CN201680088060A CN109716517A CN 109716517 A CN109716517 A CN 109716517A CN 201680088060 A CN201680088060 A CN 201680088060A CN 109716517 A CN109716517 A CN 109716517A
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electric pole
design
polar electric
plane
led chip
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CN201680088060.0A
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CN109716517B (zh
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谢锐
林丽玲
刘刚成
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Shenzhen Keweitian Eco-Lighting Co ltd
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Shenzhen Keweitian Eco-Lighting Co ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/02—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters for simulating daylight
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/10—Light sources with three-dimensionally disposed light-generating elements on concave supports or substrates, e.g. on the inner side of bowl-shaped supports
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

一种类太阳光谱LED灯珠结构，包括第一极性电极(10)、多个LED芯片(20)、多个电阻(30)以及电路板(40)；所述第一极性电极(10)与所述电路板(40)相配合，用于封装所述多个LED芯片(20)和所述多个电阻(30)；所述第一极性电极(10)的结构为包含多个平面的立体结构，实现了任意模拟太阳光谱，可最大限定地发挥LED半导体的节能特点。

Description

PCT国内申请，说明书已公开。

Claims (10)

  1. PCT国内申请，权利要求书已公开。
CN201680088060.0A 2016-09-23 2016-09-23 一种类太阳光谱led灯珠结构 Active CN109716517B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/099796 WO2018053772A1 (zh) 2016-09-23 2016-09-23 一种类太阳光谱led灯珠结构

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CN109716517A true CN109716517A (zh) 2019-05-03
CN109716517B CN109716517B (zh) 2022-07-26

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US (1) US10718490B2 (zh)
EP (1) EP3518297A4 (zh)
JP (1) JP2019530969A (zh)
CN (1) CN109716517B (zh)
WO (1) WO2018053772A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6694654B2 (ja) * 2016-09-23 2020-05-20 深▲せん▼市客為天生態照明有限公司 太陽類似スペクトルｌｅｄランプビーズ構造

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58222578A (ja) * 1982-06-18 1983-12-24 Toshiba Corp 照明装置
US20030189830A1 (en) * 2001-04-12 2003-10-09 Masaru Sugimoto Light source device using led, and method of producing same
US20040065894A1 (en) * 2001-08-28 2004-04-08 Takuma Hashimoto Light emitting device using led
US20070228516A1 (en) * 2006-04-03 2007-10-04 Ivoclar Vivadent Ag Semiconductor radiation source and light curing device
EP2246913A2 (en) * 2009-04-28 2010-11-03 LG Innotek Co., Ltd. Light emitting device package and lighting system including the same
WO2016037306A1 (zh) * 2014-09-09 2016-03-17 深圳市客为天生态照明有限公司 一种类太阳光谱led结构

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5838247A (en) * 1997-04-01 1998-11-17 Bladowski; Witold S. Solid state light system
TW408497B (en) * 1997-11-25 2000-10-11 Matsushita Electric Works Ltd LED illuminating apparatus
US6992718B1 (en) * 1998-08-31 2006-01-31 Matsushita Electric Industrial Co., Ltd. Illuminating apparatus, display panel, view finder, video display apparatus, and video camera mounting the elements
JP3940596B2 (ja) * 2001-05-24 2007-07-04 松下電器産業株式会社 照明光源
JP2004311621A (ja) 2003-04-04 2004-11-04 Eeshikku Kk Ｌｅｄ集合球
TW588197B (en) * 2003-04-22 2004-05-21 Au Optronics Corp Light source of backlight
KR20050004005A (ko) * 2003-07-01 2005-01-12 마츠시타 덴끼 산교 가부시키가이샤 실장체, 광 전송로 및 광 전기 회로기판
WO2005089293A2 (en) * 2004-03-15 2005-09-29 Color Kinetics Incorporated Methods and systems for providing lighting systems
CN100356597C (zh) 2005-05-27 2007-12-19 张宇 多光路合成半导体发光器
US7614769B2 (en) * 2007-11-23 2009-11-10 Sell Timothy L LED conversion system for recessed lighting
CN101764067A (zh) 2009-12-24 2010-06-30 复旦大学 一种类太阳光谱led的封装方法
CN201764067U (zh) * 2010-01-20 2011-03-16 特福隆集团有限公司 智能型阀用电动执行器
CN202205741U (zh) 2011-08-13 2012-04-25 都江堰市华刚电子科技有限公司 分层高密led灯珠
US9869456B2 (en) * 2013-11-08 2018-01-16 Osram Sylvania Inc. Fixture design for flexible LED circuit boards
US9562677B2 (en) * 2014-04-09 2017-02-07 Cree, Inc. LED lamp having at least two sectors
US11035993B2 (en) * 2015-08-14 2021-06-15 S.V.V. Technology Innovations, Inc Illumination systems employing thin and flexible waveguides with light coupling structures

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58222578A (ja) * 1982-06-18 1983-12-24 Toshiba Corp 照明装置
US20030189830A1 (en) * 2001-04-12 2003-10-09 Masaru Sugimoto Light source device using led, and method of producing same
US20040065894A1 (en) * 2001-08-28 2004-04-08 Takuma Hashimoto Light emitting device using led
US20070228516A1 (en) * 2006-04-03 2007-10-04 Ivoclar Vivadent Ag Semiconductor radiation source and light curing device
EP2246913A2 (en) * 2009-04-28 2010-11-03 LG Innotek Co., Ltd. Light emitting device package and lighting system including the same
WO2016037306A1 (zh) * 2014-09-09 2016-03-17 深圳市客为天生态照明有限公司 一种类太阳光谱led结构

Also Published As

Publication number Publication date
WO2018053772A1 (zh) 2018-03-29
JP2019530969A (ja) 2019-10-24
US10718490B2 (en) 2020-07-21
CN109716517B (zh) 2022-07-26
EP3518297A1 (en) 2019-07-31
EP3518297A4 (en) 2020-06-10
US20200018461A1 (en) 2020-01-16

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