CN109715849A - It is used for transmission the equipment of carrier, the system for being vacuum-treated substrate and the method for transport vehicle in a vacuum chamber - Google Patents

It is used for transmission the equipment of carrier, the system for being vacuum-treated substrate and the method for transport vehicle in a vacuum chamber Download PDF

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Publication number
CN109715849A
CN109715849A CN201780031568.1A CN201780031568A CN109715849A CN 109715849 A CN109715849 A CN 109715849A CN 201780031568 A CN201780031568 A CN 201780031568A CN 109715849 A CN109715849 A CN 109715849A
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China
Prior art keywords
carrier
transmission
path
lower railway
section
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Granted
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CN201780031568.1A
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Chinese (zh)
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CN109715849B (en
Inventor
奥利弗·海姆尔
克里斯蒂安·沃尔夫冈·埃曼
拉尔夫·林登贝格
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Abstract

A kind of equipment (100) for the transport vehicle (10) in vacuum chamber (102) is provided.Equipment (100) includes the first Transmission system (112) and path integration component (150), first Transmission system (112) provides along the first transmission path (T1) on transmission direction (T) and including lower railway section (121) and upper rail section (122), path integration component (150) is configured to along path integration direction (S) mobile vehicle, and carrier is made to leave the first transmission path (T1).Equipment further comprises actuator (125), for being converted between transmission location (I) and path integration position (II), there is first distance between lower railway section (121) in transmission location (I) and upper rail section (122), there is second distance between lower railway section (121) in path integration position (II) and upper rail section (122), first distance is less than second distance.In addition, describing a kind of system including path integration component and a kind of method of transport vehicle in a vacuum chamber.

Description

It is used for transmission the equipment of carrier, the system for being vacuum-treated substrate and is used for The method of transport vehicle in vacuum chamber
Technical field
The embodiment of present disclosure is related to a kind of equipment for transport vehicle in a vacuum chamber, a kind of for vacuum Handle the system and a kind of method for transport vehicle in a vacuum chamber of substrate.The embodiment of present disclosure is special It is related to a kind of vacuum system, the vacuum system is with depositing device and has and is configured to pass in the first transmission path and second The path integration component of mobile vehicle between defeated path.Particularly, the side of track of the description for changing carrier in a vacuum chamber Method.
Background technique
Technology for carrying out layer deposition on substrate includes such as sputtering sedimentation, vapor deposition and chemical vapor deposition (CVD). Sputter deposition craft can be used in depositing materials on substrates layer, such as insulation material layer or conductor material layer.
In order to deposit multiple-level stack, tandem (in-line) processing module arrangement can be used.Tandem processing system includes Multiple continuous processing modules, such as deposition module and other optional processing modules, such as cleaning module and/or etch module, In terms of wherein carrying out each processing in order in processing module, allow to continuously or quasi-continuous in tandem processing system The multiple substrates of ground processing.
Substrate can be by carrier (i.e. for delivering the toter of substrate) delivery.It is logical usually using Transmission system transport vehicle Cross vacuum system.Transmission system can be configured to have substrate disposed thereon for transporting along one or more transmission paths Carrier.Neighbouring mutual at least two transmission path can be provided in vacuum system, such as carried for being transmitted along forward direction First transmission path of body and for along the returning direction transport vehicle opposite with forward direction the second transmission path.
Transmission system can have idler wheel or other supporting elements, and the idler wheel or other supporting elements are configured to along transmission road Diameter supports and transports carrier and/or supports and be transported to another transmission path (also known as carrier from a transmission path " path integration " or " track conversion ").During the transmission of carrier, the friction between carrier and carrier support be can produce Grain, particle may adversely affect the vacuum environment in vacuum system.Layer of the particle meeting pollution deposit on substrate, with And the quality of sedimentary can be reduced.
Based on the above situation, newly the setting for the transport vehicle in a vacuum chamber particle reduced in vacuum chamber generated System standby, for being vacuum-treated substrate and there are demands for the method for transport vehicle in a vacuum chamber.Furthermore to Convenient path integration is provided between at least two transmission paths in vacuum chamber and reduces the generation of the particle in vacuum chamber simultaneously New equipment, there are demands for system and method.
Summary of the invention
In view of the foregoing, a kind of equipment for transport vehicle in a vacuum chamber, a kind of for being vacuum-treated base is provided The system of plate and a kind of method for transport vehicle in a vacuum chamber.Other aspect, advantage and features of present disclosure It is come into focus by claims, specification and attached drawing.
According to the one side of present disclosure, a kind of equipment for transport vehicle in a vacuum chamber is provided.The equipment Including the first Transmission system, first Transmission system is provided along the first transmission path in the transmit direction, wherein described First Transmission system includes lower railway section and upper rail section.The equipment further comprises path integration component and actuating Device, the path integration component is configured on path integration direction the mobile carrier, and leaves the carrier First transmission path, the actuator is for changing the lower railway section of first Transmission system and the upper rail The distance between road section.
The actuator may be configured for converting between transmission location and path integration position, in transmission location There is first distance, the lower railway section described in path integration position between the lower railway section and the upper rail section There is second distance between the upper rail section, the first distance is less than the second distance.
In some embodiments, first Transmission system can be configured to along described in the transmission direction First transmission path transmits the carrier in a non-contact manner.During the transmission, the carrier can be held in vertical orientation, special It is not held in the carrier transmission space between the upper rail section and the lower railway section.Particularly, the first transmission System can be magnetic levitation systems.
According to another aspect of the present disclosure, a kind of system for being vacuum-treated substrate is provided.The system comprises Vacuum chamber and one or more handling implements selected from the group being made of following item being arranged in the vacuum chamber: sedimentary origin splashes Penetrate source, evaporation source, surface treating implement, heating device, cleaning device, etch tool and combination above-mentioned.The system into One step includes the equipment according to any embodiment described herein.
According to the another aspect of present disclosure, a kind of method for transport vehicle in a vacuum chamber is provided.The side Method includes: between the lower railway section and upper rail section of the first Transmission system along the first transmission road in the transmit direction Diameter transport vehicle；Increase the distance between the lower railway section and the upper rail section；And crosscutting (transverse) the mobile carrier on the path integration direction of the transmission direction, and the carrier is made to leave described first Transmission path.
According to the another aspect of present disclosure, a kind of method for transport vehicle in a vacuum chamber is provided.The side Method includes: along the first transmission path carrier in the transmit direction；And the mobile carrier is passed to from described first Second transmission path of defeated path horizontal offset, including reduce the carrier, on path integration direction the mobile carrier, with And the lifting carrier.
Embodiment is also for the equipment for carrying out disclosed method, and including for executing each method described The environment division of aspect.In terms of these methods can by hardware component, with the computer of appropriate software programming, both any combination Or it executes in any other manner.In addition, according to the embodiment of the present disclosure also for for operating described equipment Method, in terms of the method for operating described equipment includes the method for carrying out each function of equipment.
Detailed description of the invention
In order to which the features described above of present disclosure can be understood in detail, can obtain being briefly summarized by referring to embodiment in On present disclosure particularly description.Attached drawing and is described in down about the embodiment of present disclosure:
Figure 1A shows the schematic diagram of the equipment for being used for transmission carrier according to implementations described herein；
Figure 1B shows the schematic diagram of the equipment of Figure 1A in path integration position；
Fig. 2 shows according to implementations described herein include be used for transmission carrier equipment system diagrammatic top Figure；
Fig. 3 A to Fig. 3 H shows each of the method for utilizing the equipment transport vehicle according to implementations described herein The kind stage；
After Fig. 4 A to Fig. 4 B is shown for utilizing the method according to the equipment transport vehicle of implementations described herein The continuous stage；
Fig. 5 A to Fig. 5 D shows each of the method for utilizing the equipment transport vehicle according to implementations described herein The kind stage；
Fig. 6 is the flow chart for showing the method for being used for transmission carrier according to implementations described herein；And
Fig. 7 is the flow chart for showing the method for being used for transmission carrier according to implementations described herein.
Specific embodiment
The various embodiments of present disclosure will be described in detail now, one or more examples of embodiment It is illustrated in figure.In the description below for figure, identical label indicates identical component.In general, only to about each The difference of other embodiment is described.Each example is provided for explaining present disclosure, rather than is intended to for limiting Present disclosure processed.In addition, as an embodiment a part and the feature that is shown or describes can be used for or combine it His embodiment, to generate another embodiment.Description content is intended to include these modifications and variation.
Equipment for transport vehicle in a vacuum chamber can provide one, two or more transmission paths, wherein can Carrier is moved or transported along transmission path.First transmission path T1 can extend adjacent to the second transmission path T2, such as second passes Defeated path T2 is substantially parallel to the first transmission path T1.First transmission path T1 and/or the second transmission path T2 can transmitted Extend on the T of direction, transmission direction T can be substantial horizontal direction.
First transmission path T1 and the second transmission path T2 can be on the S of path integration direction from horizontally offset from each other by.On road The distance between diameter conversion direction S upper first transmission path T1 and the second transmission path T2 can be for 10cm or bigger, especially 20cm or bigger and/or 100cm or smaller, especially 50cm or smaller.
Equipment as described herein for transport vehicle can be a part of vacuum flush system, and vacuum flush system is such as Tandem processing system, so that substrate can be handled continuously or quasi-continuously.Equipment can be configured to leave carrier First transmission path T1 and shift or be moved to the second transmission path T2 and the place processing at least one of position T3, wherein substrate It can be handled in processing position T3.Particularly, equipment can by carrier from the first position on the first transmission path T1 along path Conversion direction S transverse shift is to the second position for leaving the first track.Path integration direction S can crosscutting transmission direction T, especially Substantially perpendicular to transmission direction T.When carrier is moved to another transmission path from a transmission path along path integration direction S When, the movement is alternatively referred to as " path integration " or " track conversion ".
In some embodiments, carrier is transmitted along the first transmission path T1 on transmission direction T；Along path integration Direction S moves away the first transmission path T1 and arrives and handle position T3, and wherein substrate is handled in processing position T3；Along path Conversion direction S is moved to the second transmission path T2, and transmits along the second transmission path T2.
Equipment may include Transmission system.Transmission system can be configured to for non-along the first and/or second transmission path Transport vehicle in contact, such as use magnetic force.In other words, Transmission system can not use mechanical force (mechanical force) Carry out transport vehicle.On the contrary, Transmission system can magnetically push or pull on carrier towards new position.What present disclosure used in the whole text Term " contactless " and " moving in a non-contact manner " are construed as not being the machine using between carrier and Transmission system Tool contact carrys out mobile vehicle, but by repelling and/or attracting magnetic force come magnetically mobile vehicle.In some embodiments, During the transmission along the first and/or second transmission path, the absolutely not Mechanical Contact between equipment and carrier.
Transmission system can be magnetic levitation systems in some embodiments.Magnetic levitation systems may include upper rail and under Track, wherein carrier substantially perpendicular can be orientated and transmit between upper rail and lower railway.Upper rail can be arranged in lower rail Above road.The magnet and/or driving unit of magnetic levitation systems can be arranged in upper rail and/or lower railway.For example, quilt Upper rail can be disposed in by being disposed for holding active magnetic unit of the carrier under upper rail in a non-contact manner, be configured Lower railway can be disposed at for the driving unit along track mobile vehicle.
The contactless transmission of carrier is beneficial, because due to the section of carrier and Transmission system during carrier transmission Between Mechanical Contact and the quantity of particle that generates is reduced, wherein all idler wheels in this way of the section of Transmission system.Therefore, vacuum chamber In vacuum environment not by the negative effect of carrier transmission.The purity (purity) of the layer deposited on substrate can be improved, especially Because particle generation is minimized or even avoids when using the Transmission system for being configurable for contactless transmission.
Figure 1A is to be used to transmit in vacuum chamber 101 in transmission location (I) according to implementations described herein The schematic diagram of the equipment 100 of carrier 10.In transmission location (I), carrier 10 can transmit road along first on transmission direction T Diameter T1 transmission.It, can be between carrier and upper rail section and between carrier and lower railway section during contactless transmission (small) gap is provided.
Figure 1B is the schematic diagram of the equipment of Figure 1A in path integration position (II).In path integration position (II), Carrier 10 can move away the first transmission path T1, such as the second transmission path T2 of direction along path integration direction S.According to some Embodiment, equipment 100 can be a part of vacuum flush system, vacuum flush system such as sputtering depositing system or vapor deposition Depositing system.
Carrier 10 can be the substrate carrier for being configured for delivery substrate 11.For example, carrier 10 may include card Tight device, such as magnetic clamp or electrostatic chuck for the retaining surface clamping substrate 11 towards carrier 10.In other implementations In mode, carrier 10 may be configured for delivery different objects, such as mask (mask) or shielding part (shield).Carrier 10 It may be configured for for substrate 11 being immobilizated in substantially perpendicular orientation.In other words, during transport vehicle 10, substrate 11 Angle between major surfaces and gravity vector (gravity vector) is usually less than 20 °.For example, the main table of substrate Angle between face and gravity vector can be from -10 ° to+10 °, especially from -1 ° to -5 °, wherein negative angle is intended to indicate face Downward substrate.
Carrier can be configured to delivery large-area substrates, especially be used for the large-area substrates of display manufacturing.Implementing In mode, substrate can have 1m2Or bigger, especially 5m2Or it is bigger, or even 10m2Or it is bigger to processed surface area. Therefore, carrier can have substrate holder surface, and substrate holder surface has 1m2Or bigger size, especially 5m2Or it is bigger, or Even 10m2Or it is bigger.For example, the height of carrier 10 can be for 1m or bigger, especially 2m or bigger and/or carrier Width can be for 1m or bigger, especially 2m or bigger.Carrier 10 may be configured for delivering in substantially vertical orientation Substrate.
Equipment 100 includes first be configured to along the first transmission path T1 transport vehicle 10 on transmission direction T Transmission system 112 is especially configured for the Transmission system of the contactless transmission of carrier.First Transmission system 112 can To be configured for the first magnetic suspension system along the first transmission path T1 transport vehicle in a non-contact manner.First transmission system System 112 includes lower railway section 121 and upper rail section 122.Carrier can lower railway section 121 and upper rail section 122 it Between carrier transmission space in transmit.The magnet unit of first Transmission system 112 can be arranged in lower railway section 121 and/or Get on the right track section 122.For example, it is non-to be used for that the controlled magnet unit of multiple actives can be arranged in upper rail section 122 Fixing carrier 10 is under upper rail section 122 in contact.
Equipment 100 further comprises path integration component 150.Path integration component 150 can be configured to in path Mobile vehicle on conversion direction S and so that carrier is left the first transmission path T1.Particularly, path integration component 150 can be configured At substantially perpendicular to mobile vehicle on the path integration direction S of transmission direction T, to make carrier from the first transmission path T1 It is moved to the second transmission path T2.Or or in addition, path integration component 150 can be configured to mobile vehicle to processing position T3 is set, carrier is handled in processing position T3, such as is coated with.Handling position T3 can be horizontal partially from the first and second transmission paths It moves.
Meaning property is painted as shown in FIG. 1A and 1B, and handling implement 105 may be arranged in vacuum chamber, for arranging when carrier The substrate 11 that processing carrier 10 is held when handling in the T3 of position.Handling implement 105 can be arranged to sink on substrate The sedimentary origin of product coating material.
Equipment 100 further comprises actuator 125, the road that the transmission location (I) and Figure 1B for describing in Figure 1A are described It is converted between diameter conversion position (II).In transmission location (I), lower railway section 121 and upper rail section 122 are arranged At first distance apart, and in path integration position (II), lower railway section 121 and upper rail section 122 are by cloth It is set to second distance apart.First distance is less than second distance.
In other words, according to implementations described herein, the lower railway section 121 and upper rail of the first Transmission system 112 The distance between section 122 is adjustable, can especially increase and or reduce.First distance (small distance) may be adapted under Along transmission direction transport vehicle in a non-contact manner between track section 121 and upper rail section 122.It is mentioned when with relatively small distance When for lower railway section and upper rail section, it may be difficult that along path integration direction, mobile vehicle, which leaves the first transmission path T1, 's.Second distance (big distance) between lower railway section 121 and upper rail section 122 may be adapted to move along path integration direction Carrier leaves the first transmission path, i.e., to the second transmission path T2 and/or extremely processing position T3.
In some embodiments, the first distance between lower railway section 121 and upper rail section 122 can be 1m or more Greatly, especially 2m or bigger.For example, first distance can be slightly larger than the vertical dimension of carrier, allow carrier in lower rail It is transmitted in a non-contact manner between road section and upper rail section.Second distance it is big than first distance several millimeters or centimetre.Especially Ground, the difference between first distance and second distance can be for 5mm or bigger, 20mm or bigger, 40mm or bigger, or even 100mm Or it is bigger.In other words, actuator 125 may be configured for changing the distance between lower railway section and upper rail section 5mm or more, 20mm or more, 40mm or more, or even 100mm or more.
In other words, actuator 125 can be provided along the part for being disposed with path integration component 150 of the first transmission path T1 For increasing the distance between lower railway section 121 and upper rail section 122.Actuator may include driving device, such as electricity Machine, hydraulic device or pneumatic device, for increasing the distance between lower railway section 121 and upper rail section 122.Some In embodiment, in order to increase upper rail the distance between section 122 and lower railway section 121, actuator 125 be can be configured to For moving lower railway section 121 far from upper rail section 122, such as vertically, especially in a downwardly direction.Some In embodiment, in order to increase upper rail the distance between section 122 and lower railway section 121, actuator 125 be can be configured to For mobile upper rail section 122 far from lower railway section 121, such as vertically, especially in upward direction.
The path integration for leaving the carrier of the first transmission path T1 may include along the first transmission road on transmission direction T Diameter transport vehicle, while the first Transmission system 112 is set to the discribed transmission location of Figure 1A (I).With upper rail section and Relatively large distance between lower railway section can stop carrier, and removable first Transmission system 112 arrives the path that Figure 1B describes It converts position (II).Therefore, carrier can move away the first transmission path T1 along path integration direction S.
Because multiple reasons, along path integration direction, S mobile vehicle leaves the first transmission path in path integration position T1 may be easier.For example, the magnetic force effect for the permanent magnet that can be acted on carrier from upper and lower track section can lead to It crosses and moves upper and lower track section and reduce away from each other.In addition, in path integration position (II), be connected to above and/or under The side rails (side guiding rails) of track section may not interference carrier.In addition, in path integration position, Biggish space is provided between upper rail section and lower railway section, is laterally passed so as to facilitate passage path transition components It send carrier and is capable of providing more compact path integration component.During path integration, it can avoid between carrier and track Contact.
In some embodiments, in the path integration position (II) that Figure 1A transmission location (I) described and Figure 1B describe Between conversion may include moving lower railway section 121 in a downwardly direction using actuator.For example, lower railway section 121 20mm or bigger distance, especially 40mm or bigger distance, more particularly 80mm or bigger distance can be moved down.Under Vertical space between track section 121 and upper rail section 122 can increase to promote path integration mobile.
It is some can be in the embodiment in conjunction with other embodiments described herein, path integration component 150 includes It can be along the carrier hlding part 152 that path integration direction S is moved, for transmitting carrier hlding part 152 along path integration direction S The carrier 10 held.For example, carrier 10 can be mechanically supported on carrier hlding part 152.Describe in Figure 1B In embodiment, carrier 10 is supported from below by carrier hlding part 152, i.e., carrier 10 can be placed in carrier hlding part 152 Top on.In other embodiments, carrier hlding part can hold carrier from side or from top.For example, carrier Hlding part 152 may include magnetic clamp, for carrier to be secured to carrier hlding part 152.
It can provide driving device (being also known as " cross-drive (cross drive) " herein), for along path integration side To S mobile vehicle hlding part 152 carrier is transmitted to the second transmission path T2 and processing position from the first transmission path T1 The place at least one of T3.Driving device (not being illustrated in figure) can be disposed at the outside of vacuum chamber 101, carrier hlding part 152 can extend across the wall of vacuum chamber 101.Alternatively, driving device can be disposed in vacuum chamber 101.
Driving device can be configured to make carrier hlding part 152 along path integration direction S move 10cm or bigger away from From especially 20cm or bigger distance, from the first transmission path T1 to the second transmission path T2.For example, the first transmission The distance between path T1 and the second transmission path T2 can be 25cm or bigger and 100cm or smaller.
The carrier hlding part 152 for the embodiment that Figure 1B describes includes carrier supported surface, for positioning carrier in load On body support surface.For example, carrier 10 can be moved in a downwardly direction by lower railway section 121 and be located in load On the support surface of body hlding part 152.Therefore, path integration component 150 can be along path integration direction S mobile vehicle holding parts Divide 152, to leave the first transmission path T1 for transmitting carrier.
It is some can be in the embodiment in conjunction with other embodiments described herein, it is possible to provide the second Transmission system 114, for along the second transmission path T2 transport vehicle 10.Second Transmission system 114 can be along the second transmission path Second magnetic levitation systems of T2 setting.Second transmission path T2 can be from the first transmission path T1 horizontal-shift.Path integration group Part 150 can be moved to along path integration direction S from the first transmission path T1 the second transmission path T2 and handle position T3 in At few one.
Particularly, the carrier hlding part 152 of path integration component 150 can be moved along path integration direction S, with for from First transmission path T1 transmits carrier the 10 to the second transmission path T3 and/or processing position T3, processing position T3 from first and the Both two transmission paths horizontal-shift.
Similar to the first Transmission system 112, the second Transmission system 114 may include on the second lower railway section 123 and second Track section 124, wherein carrier can be between the second lower railway section 123 and the second upper rail section 124 along the second transmission Path T2 transmission.
In some embodiments, it is possible to provide actuator, for increasing and oing reduce 123 He of the second lower railway section The distance between second upper rail section 124.In some embodiments, it is possible to provide individual actuator (such as activate Device 125), between the lower railway section 121 for increasing and oing reduce the first Transmission system 112 and upper rail section 122 The distance between the second lower railway section 123 and the second upper rail section 124 of distance and the second Transmission system 114.At it In his embodiment, it is possible to provide the first actuator, with the lower railway section for increasing and oing reduce the first Transmission system 112 The distance between 121 and upper rail section 122, and can provide the second actuator, for increasing and oing reduce the second transmission The distance between second lower railway section 123 and the second upper rail section 124 of system 114.
Particularly, in some embodiments, the second lower railway section 123 of the second Transmission system 114 can be along Vertical Square It is mobile to V, it is especially moved to path integration position (II) in a downwardly direction and is moved in upward direction transmission location (I).
In some embodiments that can be configured together with other embodiments described herein, the first Transmission system 112 Lower railway section 121 can independently of the second Transmission system 114 the second lower railway section 123 and vertically V is mobile.Figure 1A shows lower railway section 121 and the second lower railway section 123 is in the top position for corresponding to transmission location (I), is passing Carrier can be along the first and second transmission paths in defeated position (I).Figure 1B shows lower railway section 121 and the second lower rail Road section 123 is in the lower position corresponding to path integration position (II), can be transmitted in path integration position (II) Path integration between path.
Meaning property is painted as shown in Figure 1A, in transmission location (I), the upside guiding element 141 of the second magnetic suspension system and/or Downside guiding element 142 can avoid path integration of the carrier from the first transmission path T1 towards the second transmission path T2.It is being transformed into figure After path integration position (II) depicted in 1B, due to the distance increased between upper and lower track section, carrier can be along path Conversion direction S moves through upside guiding element 141 and passes through downside guiding element 142.
Fig. 2 shows according to implementations described herein include be used for transmission carrier equipment system 200 signal Top view.The equipment can correspond to the equipment 100 that Figure 1A and Figure 1B describe, thus can refer to it is described above, it is no longer heavy herein It states.
It include vacuum chamber 101, according to this according to the system 200 for being vacuum-treated substrate of implementations described herein The equipment 100 of any embodiment of text description and the one or more handling implements 105 being arranged in vacuum chamber 101.One A or multiple handling implements can be selected from the group being made of following item: sedimentary origin, sputtering source, evaporation source, surface treating implement, heating The combination of device, cleaning device, etch tool and aforementioned item.
First transmission path T1 and vacuum is extended through from the second transmission path T2 of the first transmission path T1 horizontal-shift Room 101.Selectively, can be provided as transmitting from the first transmission path T1 and second in the processing position T3 for wherein handling substrate Path T2 horizontal-shift.In some embodiments, mask is provided between the processing position T3 of carrier 10 and handling implement 105 12.Mask 12 can be such as edge exclusion mask (edge exclusion mask) or fine metal mask (fine metal mask).For example, a part that mask 12 can avoid substrate is applied and/or mask can have corresponding to be deposited on base The patterns of openings of patterns of material on plate.
Equipment 100 includes for the first Transmission system along the first transmission path T1 transport vehicle 10 in a non-contact manner 112, for the second Transmission system 114 of transport vehicle 10 and being configured in a non-contact manner along the second transmission path T2 Carrier the 10 to the second transmission path T2 is transmitted from the first transmission path T1 along path integration direction S and/or handles the road of position T3 Diameter transition components 150.Path integration component 150 may include carrier hlding part 152, and carrier hlding part 152 is configured to solid It holds and/or supports carrier 10 and can be moved along path integration direction S.
First Transmission system 112 may include lower railway section 121 (dotted line is schematically represented as in Fig. 2) and actuator, The actuator is configured to move in the vertical direction lower railway section 121.Length of the lower railway section 121 on transmission direction T Degree can be equal to or the length greater than carrier 10 on transmission direction T.Road can be transmitted along the first of deposition path transition components 150 The section of diameter provides lower railway section 121.Therefore, lower railway section 121 can move in a downwardly direction, so that path integration component Carrier 10 can be transmitted along path integration direction S leave the first transmission path T1.
In some embodiments, the second Transmission system 114 may include that the second lower railway section 123 (illustrates earth's surface in Fig. 2 Be shown as dotted line) and actuator, the actuator be configured to move in the vertical direction the second lower railway section 123.Under second Track section 123 can be equal in the length on transmission direction T or the length greater than carrier 10 on transmission direction T.Second lower rail Road section 123 can extend along the section of the second transmission path of deposition path transition components 150.Therefore, the second lower railway area Section 123 can move in a downwardly direction, transmit so that path integration component can transmit carrier 10 to the second along path integration direction S On the T2 of path or across the second transmission path T2.
Fig. 3 A to Fig. 3 H is shown according to implementations described herein for the method using equipment 300 transport vehicle The various stages.Equipment 300 can be similar to equipment 100 depicted in Figure 1A and Figure 1B, thus can refer to it is described above, herein no longer It repeats.
Equipment 300 include the first Transmission system 112 and the second Transmission system 114, the first Transmission system 112 be used for along First transmission path T1 contactless transmission carrier 110, the second Transmission system 114 are used for along horizontal from the first transmission path T1 Second transmission path T2 contactless transmission carrier 10 of offset.
In addition, path integration component 150 is provided for transmitting the transmission of carrier 10 to the second from the first transmission path T1 Path T2 and/or processing position T3.Processing position T3 is only painted in fig. 3e, and is optional.In other words, it can also be passed from first Carrier is directly transmitted along path integration direction to the second transmission path, to replace transmitting carrier from the first transmission path T1 in defeated path The second transmission path T2 is then retransmitted to processing position T3.It is carried alternatively, can be transmitted from processing position T3 depicted in Fig. 3 E Body returns to the first transmission path T1, and non-transmission carrier is to the second transmission path T2.
Path integration component 150 may include carrier hlding part 152, carrier hlding part 152 be configured to hold and/or Carrier is supported, wherein carrier hlding part 152 can S be moved along path integration direction together with carrier.Path integration component is matched It is set to along path integration direction S mobile vehicle.
First Transmission system 112 includes lower railway section 121, and/or the second Transmission system 114 may include the second lower railway Section 123, lower railway section 121 can move on vertical direction V, and the second lower railway section 123 can be moved up in vertical direction V It is dynamic.Lower railway section 121 and the second lower railway section 123 can be arranged to adjacent to each other and be parallel to each other, so that carrier can edge Path integration direction S is transmitted between lower railway section 121 and the second lower railway section 123, is not especially changing carrier 10 Orientation in the case where be transmitted.In other words, during path integration, carrier can keep the essence of alignment along transmission direction T It is vertically oriented.
In figure 3 a, carrier is passed by the first Transmission system 112 along the first transmission path T1 on transmission direction T It is defeated.Transmission can be contactless transmission.In other words, carrier 10 can be immobilizated in the one of 121 top of lower railway section by magnetic force At distance (for example, about distance of 2mm), the magnetic force repulsion magnetic force for example to work from below and/or work from top Attract magnetic force.In figure 3 a, it shows transmission location (I), transmission location (I) is configured for along the first transmission path T1's Contactless transmission, wherein first distance is provided in the lower railway section 121 and upper rail section 122 of the first Transmission system 112 Between.
Carrier 10 is transferred to the position of deposition path transition components 150 along the first transmission path T1 depicted in Fig. 3 A It sets.
It is some can in the embodiment in conjunction with other embodiments, path integration component 150 include upper holding unit 154, upper holding unit 154 is configured to hold and/or the upper part of stable carrier 10.Upper holding unit 154 can turn in path It changes on the S of direction and moves.Upper holding unit 154 optionally can also move on vertical direction V.Upper holding unit 154 can be configured At the inclination movement for avoiding carrier when magnetic suspension is closed.
In some embodiments, upper holding unit 154 can be configured to contact carrier 10 upper part and/or can be It is moved on vertical direction V and the upper part of contact carrier 10.For example, upper holding unit 154 may include finger-shaped material or its His holding unit, finger-shaped material or other holding units are configured to contact from above and catch carrier.Particularly, upper holding unit 154 may include the finger-shaped material of spring installation, and the finger-shaped material of spring installation is configured to the magnetcisuspension when the first Transmission system 112 provides Fixing and/or stable carrier when floating closing.For example, the side on the S of path integration direction can be provided by upper holding unit 154 To stabilization.Meaning property is painted as shown in Figure 3B, and upper holding unit 154 provides the lateral stability of carrier on path integration direction and keeps away Exempt from movement of tumbling.
In some embodiments, the magnetic levitation of the first Transmission system 112 can be decreased or turned off so that carrier 10 with 121 Mechanical Contact of lower railway section is simultaneously supported on lower railway section 121.For example, magnetic outstanding by being gradually reduced first The magnetic levitation of floating system, carrier can be smoothly placed on lower railway section 121.
In order to which carrier to be placed on lower railway section 121, by the decaying for the magnetic levitation that the first Transmission system 112 provides It is illustrated in Fig. 4 A and Fig. 4 B in more detail.In Figure 4 A, carrier is held in a non-contact manner by the first Transmission system 112 At one distance of the top of lower railway section 121.For example, the active magnetic unit 301 being arranged at upper rail section 122 Carrier 10 can be held in a non-contact manner above the lower railway section 121 at a distance.In figure 4b, the upper part of carrier is by upper solid It holds device 154 to stablize, magnetic levitation is reduced or is closed with the substrate support table for carrier to be placed in lower railway section 121 On face.Then lower railway section 121 can decline.
According to the another aspect that can be used as subject matter of the independent claims of present disclosure, actuator 125 is configured to The lower railway section 121 for being supported by carrier 10 thereon is reduced, with the carrier holding parts for carrier to be placed in path integration component Divide on 152.
Fig. 3 B is returned to, actuator can be configured to move lower railway section 121 in a downwardly direction far from upper rail section 122, so that the distance between lower railway section 121 and upper rail section 122 increase.The load being supported on lower railway section 121 Body 10 is reduced towards carrier hlding part 152, until carrier is placed on carrier hlding part 152.For example, lower railway area Section 121 can reduce 20mm or bigger distance, especially 40mm or bigger distance from first level face L1, and it is solid to drop to carrier Hold the horizontal plane of part 152.
As Fig. 3 B and Fig. 3 C are schematically painted, the carrier holding parts of lower railway section 121 and path integration component 150 152 are divided to can be configured to support carrier 10 from below.In other words, the bottom surface of carrier 10 can be first positioned in lower railway section On 121 (Fig. 3 B) and (Fig. 3 C) is then placed on carrier hlding part 152.
As Fig. 3 B is further painted, the lower railway section 121 for being supported by carrier thereon can move away from a downwardly direction Get on the right track section 122, until carrier 10 is positioned on carrier hlding part 152.Lower railway section can continue to be moved downwardly until Lower railway section 121 is positioned at the second horizontal plane L2, such as under the horizontal plane of carrier hlding part 152, as Fig. 3 C illustrates What property was painted.The distance between first level face L1 and the second horizontal plane L2 can be for 40mm or bigger, especially 80mm or bigger. Therefore, first distance (the distance between lower railway section 121 and upper rail section 122 i.e. in transmission location (I)) and second Difference between distance (i.e. in the distance between lower railway section 121 in path integration position (II) and upper rail section 122) can It is for 40mm or bigger, especially 80mm or bigger.
According to it is some can with the embodiment in conjunction with other embodiments described herein, the first Transmission system 112 be magnetic Property suspension system, the magnetic levitation systems are configured to that carrier is retained on lower rail in a non-contact manner in transmission location (I) 121 top of road section, especially via the magnetic force acted on carrier.In addition, lower railway section 121 may include carrier supported Part, for mechanically supporting carrier from below.Particularly, during contactless transmission, carrier can be non-contactly suspended in down Above track section, and during path integration, carrier can contact lower railway section and be supported on lower railway section.
Due to moving down for the carrier 10 that is supported on lower railway section 121, between carrier 10 and upper rail section 122 Distance can increase.Due to the moving down relative to the carrier 10 supported by carrier hlding part 152 of lower railway section 121, The distance between carrier and lower railway section 121 can increase.Therefore, it can help to transmission of the carrier on the S of path integration direction It is mobile, because the free space during path integration above carrier 10 and below carrier can be increased.
As Fig. 3 D and Fig. 3 E are schematically painted, the carrier hlding part 152 for being supported by carrier 10 thereon can turn along path Direction S is changed to be moved to the second transmission path T2 (Fig. 3 D) from the first transmission path T1 and/or to processing position (Fig. 3 E), handling Substrate can be handled by handling implement 105 in position.
It is some can be in the embodiment in conjunction with other embodiments described herein, carrier 10 is sent to the second biography Defeated path T2.It in some embodiments, may include under second along the second Transmission system 114 that the second transmission path T2 is arranged Track section 123, the second lower railway section 123 can move in vertical direction.
As Fig. 3 F is schematically painted, the second lower railway section 123 can move in upward direction from path integration position, directly It contacts to carrier with the second lower railway section 123 and is lifted by the second lower railway section 123 from carrier hlding part 152.Citing For, the second lower railway section 123 can be moved to first level face L1, the second horizontal plane from the second horizontal plane L2 in upward direction L2 is below the horizontal plane of carrier hlding part 152, and first level face L1 is above the horizontal plane of carrier hlding part 152.
The second transmission system can be reduced if Fig. 3 G is schematically painted by the second lower railway section 123 mobile in upward direction The distance between second lower railway section 123 and the second upper rail section 124 of system 114, until reaching transmission location (I).It passes Defeated position (I) is illustrated in Fig. 3 H.
In the transmission location depicted in Fig. 3 H (I), the magnetic suspension of the second Transmission system 114 can be turned on, and will be carried Body is immobilizated in a non-contact manner between the second lower railway section 123 and the second upper rail section 124.Then, it can be passed along second Defeated path T2, such as along transmission direction T, in a non-contact manner transport vehicle.
The carrier hlding part 152 of path integration component 150 can be moved along path integration direction S towards the first transmission path T1 It returns, the path integration of Second support then can be performed.
Fig. 5 A to Fig. 5 D shows the various of the method for utilizing 400 transport vehicle of equipment according to implementations described herein Stage.Equipment 400 can be similar to equipment 300 depicted in Fig. 3 A to Fig. 3 H, thus can refer to it is described above, it is no longer heavy herein It states.
The equipment 400 of Fig. 4 A includes path integration component 150, and path integration component 150 is configured to from the first transmission road Diameter T1 transmits carrier the 10 to the second transmission path T2 and/or to processing position T3, and maintains the virtually constant of carrier 10 simultaneously Orientation.
Path integration component 150 may include the carrier hlding part 152 that can be moved on the S of path integration direction and can be on road The upper holding unit 154 moved on diameter conversion direction S.
It is some can be in the embodiment in conjunction with other embodiments described herein, upper holding unit 154 is configured At fixing and/or the upper part of stable carrier 10, especially when the magnetic levitation of magnetic levitation systems is decreased or turned off. " the upper part of carrier " is understood that into the top of vertically oriented carrier, upper 50% including vertically oriented carrier, especially It is upper 20%.Particularly, upper holding unit can stable carrier upper end.
Upper holding unit 154 can on the S of path integration direction stable carrier, such as pass through carrier opposite sides apply The stability force of opposite direction.
Upper holding unit 154 may include at least one magnet unit, on the S of path integration direction to the top of carrier Give plus repel magnetic force.It is some can be in the embodiment in conjunction with other embodiments described herein, upper holding unit 154 Including the first magnet unit 302 and the second magnet unit 304, the first magnet unit 302 is used for from the first side to carrier 10 Part, which applies, repels magnetic force, and the second magnet unit 304 from top of the second side opposite with the first side to carrier 10 for giving Add repulsion magnetic force.
Magnetic opposite unit (magnetic counter-unit) can be fixed in the top of carrier 10, thus respectively with 304 magnetic interaction of first magnet unit 302 and the second magnet unit.Particularly, the first magnet list of upper holding unit 154 Member 302, which can apply the first magnetic opposite unit for being fixed on the first side of carrier, repels magnetic force and/or upper holding unit 154 the second magnet unit 304 can apply the unit opposite with second magnetism of the opposite second side in the first side for being fixed on carrier Add repulsion magnetic force.Carrier can be stable in a non-contact manner to the center between the first magnet unit 302 and the second magnet unit 304 Region.
Upper holding unit 154 can along path integration direction, S be moved together and synchronously with carrier hlding part 152, such as For transmitting carrier between track.
In some embodiments, upper holding unit 154 may include the first arm 311 and the second arm 312, wherein the first arm 311 can move independently of the second arm 312 on the S of path integration direction.For example, the first lateral stability unit, such as First magnet unit 302 can be fixed to the first arm 311 and the second lateral stability unit, such as the second magnet unit 304, It can be fixed to the second arm 312.In order to by carrier stablize between the first arm and the second arm, close carrier magnetic suspension it Before, the first arm 311 can be mobile from the first side towards carrier, and the second arm 312 can be mobile from second side towards carrier.
Particularly, upper holding unit 154 can move on the S of path integration direction, so that during the path integration of carrier Can stable carrier in a non-contact manner top.
In some embodiments, upper holding unit 154 can move on the S of path integration direction, but not in vertical direction V Upper movement.In other embodiments, upper holding unit 154 can move on path integration direction S and vertical direction V.
It is some can be in the embodiment in conjunction with other embodiments described herein, upper holding unit 154 can be matched It is set to and the lateral stability of carrier is provided during vertically moving in carrier about upper holding unit 154.For example, upper fixing dress It sets 154 and can provide and be arranged in the first upright position relative to upper holding unit 154 and be arranged in relative to upper holding unit 154 The lateral stability of the carrier of second upright position.First upright position and the second upright position can vertical shift such as 30mm each other Or bigger distance, especially 50mm or bigger distance.Particularly, upper holding unit can be for offer in the first vertical-horizontal The carrier of face and the second vertical level provides lateral stability, without vertically moving upper holding unit.
In some embodiments, at least one of at least one magnet unit of upper holding unit 154 and/or carrier 10 Magnetic opposite unit can have 30mm or bigger vertical dimension, especially 40mm or bigger, more particularly 50mm or bigger.Cause This, when magnetic opposite unit about magnet unit vertical displacement such as 30mm or bigger apart from when, at least one magnet unit It can be at least one magnetic opposite unit magnetic interaction.
In fig. 5, carrier 10 is arranged in the first vertical level on the first transmission path T1.It is configured as the first magnetic First Transmission system 112 of property suspension system stable carrier in vertical direction and track conversion direction.
In figure 5B, upper holding unit 154 is mobile from two opposite lateral edge path integration direction S towards carrier.Carrier can It is stable between the first magnet unit 302 of holding unit 154 and the second magnet unit 304 in a non-contact manner.
Then, the magnetic suspension of the first Transmission system 112 can be closed.
Carrier 10 is moved to the second vertical level relative to upper holding unit in a downwardly direction in figure 5 c, such as moves 20mm, 40mm or bigger distance.For example, the lower railway section 121 for being supported by carrier thereon can move in a downwardly direction. Upper holding unit 154 is configured so that carrier is stable during carrier is vertically moved about upper holding unit.Citing and Speech, the first magnet unit 302 and the second magnet unit 304 can extend 30mm or bigger distance on vertical direction V, especially 40mm or bigger.
Then, carrier 10 can be moved along path integration direction S, for example, by path integration direction with upper holding unit 154 together and are substantially synchronized mobile vehicle hlding part 152.
When through first or second Transmission system fixing and stable carrier, such as on the road towards the second transmission path T2 After the second magnetic levitation systems of diameter conversion and starting, upper holding unit 154 is moved away from carrier.
According to another aspect described herein, method of the description for transport vehicle in a vacuum chamber.
Fig. 6 is the flow chart for showing the first method according to implementations described herein.
In block 610, carrier 10 is transmitted along the first transmission path T1 on transmission direction T.During the transmission, carrier In the 10 carrier transmission spaces for being disposed in the lower railway section 121 of the first Transmission system 112 between the section 122 that gets on the right track. Carrier can transmit in a non-contact manner in the carrier transmission space between lower railway section and upper rail section, such as pass through magnetism Suspension system.
In frame 620, increase the distance between lower railway section 121 and upper rail section 122.For example, make lower rail Road section for example moves away from upper rail section vertically down.Additionally or alternatively, make to get on the right track section example along vertical Histogram is to moving upwardly away from lower railway section.Actuator be can provide for reducing lower railway section.
In frame 630, carrier moves away the first transmission path T1 along the path integration direction S of crosscutting transmission direction T, special It is not moved to the second transmission path T2 and/or is moved to processing position T3.Particularly, carrier can be on the S of path integration direction It is mobile, while being mechanically supported on the carrier hlding part of path integration component and/or by the carrier of path integration component Hlding part is mechanically held.It is moved in the case where carrier can be supported on it along path integration direction carrier hlding part.
When carrier is moved along path integration direction S, the second lower railway section 123 and second of the second Transmission system 114 The distance between upper rail section 124 can be set as big distance.This can make carrier get enter into the second transmission path T2.
When carrier is positioned on the second transmission path T2, the second lower railway section 123 of the second Transmission system 114 and The distance between two upper rail sections 124 can be reduced, to allow via the second magnetic levitation systems along the second transmission road Diameter transport vehicle.
One or more other transmission stages can be provided between frame 610 and 620 and/or between frame 620 and 630. See, for example the transmission method referring to Fig. 3 A to Fig. 3 H description.It is not repeated herein described above.
Fig. 7 is the stream for the second method of transport vehicle in a vacuum chamber being painted according to implementations described herein Cheng Tu.
In block 710, carrier transmits in a non-contact manner along the first transmission path T1 on transmission direction T, especially Pass through the first magnetic levitation systems.
Then, it is horizontal partially from the first transmission path T1 to be moved to the second transmission path T2, the second transmission path T2 for carrier It moves.
Mobile vehicle includes the carrier on the first transmission path T1 being reduced in frame 720, in frame to the second transmission path Along path integration direction S mobile vehicle to the second transmission path T2 in 730, and in frame 740 lifting in the second transmission path Carrier on T2.
In frame 720, carrier can be placed on the lower railway section 121 of the first Transmission system 112, especially by reduction Or close the magnetic levitation provided by the first Transmission system.
The lower railway section 121 for being supported by carrier thereon can move in a downward direction.Actuator be can provide for edge Vertical direction moves lower railway section 121, is particularly away from the upper rail section 122 of the first Transmission system.It therefore, can be via cause It moves device and increases the distance between lower railway section 121 and upper rail section 122.
In frame 720, carrier can be lowered on the carrier hlding part 152 of path integration component 150, path integration group The carrier being supported on is moved along path integration direction S in the carrier hlding part 152 of part 150.Driving device is especially intersected Driving can be provided that for along path integration direction S mobile vehicle hlding part 152.
In frame 750, along the second lower railway section 123 of the second transmission path T2 the second Transmission system 114 provided It can move in upward direction.Second lower railway section 123 can move in upward direction, until carrier is from carrier hlding part 152 It is elevated and is arranged at the predetermined level of 152 top of carrier hlding part.Particularly, the second lower railway section 123 can The second upper rail section towards the second Transmission system is mobile.The second lower railway section and the second lower railway section can therefore be reduced The distance between.
It then, can be along the second transmission path T2 transport vehicle in a non-contact manner.
It, can be in the base region without departing substantially from present disclosure although embodiment of the above content about present disclosure In the case where, other and further embodiment of present disclosure are designed, scope of the present disclosure the power by being appended Sharp claim determines.

Claims (16)

1. equipment (100) of the one kind for the transport vehicle (10) in vacuum chamber (101), comprising:
First Transmission system (112) is provided along the first transmission path (T1) on transmission direction (T) and including lower railway area Section (121) and upper rail section (122)；
Path integration component (150) is used for along path integration direction (S) the mobile carrier, and it is described to leave the carrier First transmission path (T1)；And
Actuator (125), for changing the distance between the lower railway section (121) and the upper rail section (122).
2. equipment as described in claim 1, wherein the path integration component (150) includes carrier hlding part (152), institute Stating carrier hlding part (152) can move on the path integration direction (S), to upload in the path integration direction (S) Send the carrier (10) held by the carrier hlding part (152).
3. equipment as claimed in claim 2, wherein the actuator (125) is configured to reduce is supported by the carrier thereon (10) the lower railway section (121), for the carrier to be placed in the carrier hlding part (152).
4. equipment as claimed any one in claims 1 to 3 further comprises the second Transmission system (114), described second is passed Defeated system (114) provides along from the second transmission path (T2) of the first transmission path (T1) horizontal-shift, the path It the carrier hlding part (152) of transition components (150) can be along the path integration direction (S) from first transmission path (T1) It is moved to second transmission path (T2) and the place processing at least one of position T3, the processing position T3 is from described first Transmission path and the second transmission path horizontal-shift.
5. equipment as claimed in claim 4, wherein second Transmission system (114) includes the second lower railway section (123), The second lower railway section (123) can move on vertical direction (V).
6. the equipment as described in any one of claims 1 to 5, wherein the actuator (125) is configured in a downwardly direction The mobile lower railway section (121) is far from the upper rail section (122), and/or wherein actuator (125) quilt It is configured to move the upper rail section (122) in upward direction far from the lower railway section (121).
7. such as equipment described in any one of claims 1 to 6, wherein first Transmission system (112) is first magnetic outstanding Floating system, first magnetic levitation systems are configured to for the carrier to be immobilizated in the lower railway section in a non-contact manner (121) at one distance of top, the lower railway section (121) further comprises carrier support, for described in mechanically support Carrier is in the carrier support.
8. the equipment as described in any one of claims 1 to 7, wherein the path integration component (150) includes upper fixing dress It sets (154), the upper holding unit (154) is configured to hold and/or stablize the upper part of the carrier (10), described solid Holding device (154) at least can be mobile along the path integration direction (S).
9. equipment as claimed in claim 8, wherein the upper holding unit (154) includes the first magnet unit (302) and the Two magnet units (304), first magnet unit (302) from the top of first side to the carrier (10) for giving Add repulsion magnetic force, second magnet unit (304) is used for from second side opposite with first side to the carrier (10) The top give plus repel magnetic force.
10. equipment as claimed in any one of claims 1-9 wherein, wherein the lower railway section (121) and the path integration The carrier hlding part (152) of component (150) is configured to support the carrier (10) from below.
11. a kind of system for being vacuum-treated substrate, comprising:
Vacuum chamber (101)；
Equipment (100) as described in any one of claims 1 to 10；And
One or more handling implements (105), are arranged in the vacuum chamber (101), one or more described handling implements (105) Selected from the group being made of following item: sedimentary origin, sputtering source, evaporation source, surface treating implement, heating device, cleaning device, etching The combination of tool and aforementioned item.
12. a kind of method for transport vehicle in a vacuum chamber, comprising:
Along in transmission direction between the lower railway section (121) and upper rail section (122) of the first Transmission system (112) (T) the first transmission path (T1) transport vehicle (10) on；
Increase the distance between the lower railway section (121) and the upper rail section (122)；And
Along the mobile carrier in the path integration direction (S) of the crosscutting transmission direction (T), and the carrier is made to leave described the One transmission path (T1).
13. a kind of method for transport vehicle in a vacuum chamber, comprising:
Along the first transmission path (T1) transport vehicle (10) on transmission direction (T)；And
The carrier is moved to the second transmission path (T2) from the first transmission path (T1) horizontal-shift, including is reduced The carrier moves described carrier and the lifting carrier along path integration direction (S).
14. method as claimed in claim 13, wherein the step of reducing the carrier (10) includes:
The carrier is placed in the lower railway section of the first Transmission system (112) along first transmission path (T1) setting (121) on；And
The lower railway section (121) is moved in a downwardly direction.
15. method according to claim 13 or 14, wherein the carrier is lowered to the carrier of path integration component (150) On hlding part (152), the carrier hlding part (152) is along the mobile institute supported thereon of the path integration direction (S) State carrier.
16. method as claimed in claim 15, wherein the step of lifting the carrier includes:
The second lower rail of the second Transmission system (114) of the second transmission path (T2) setting is moved along upward direction Road section (123) is held until the carrier is lifted and be disposed in the carrier from the carrier hlding part (152) Partially at the predetermined level above (152).
CN201780031568.1A 2017-08-25 2017-08-25 Apparatus for transporting a carrier in a vacuum chamber, system for vacuum processing a substrate, and method for transporting a carrier in a vacuum chamber Active CN109715849B (en)

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CN109715849B (en) 2020-12-22
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JP2019531590A (en) 2019-10-31
TW201913860A (en) 2019-04-01

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