CN109712898A - A kind of packaging method and packaging - Google Patents
A kind of packaging method and packaging Download PDFInfo
- Publication number
- CN109712898A CN109712898A CN201811506059.2A CN201811506059A CN109712898A CN 109712898 A CN109712898 A CN 109712898A CN 201811506059 A CN201811506059 A CN 201811506059A CN 109712898 A CN109712898 A CN 109712898A
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- Prior art keywords
- paste layer
- tin paste
- substrate
- frame
- tin
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
Abstract
This application discloses a kind of packaging method and packaging, the packaging method includes: to form the first tin paste layer at least one first area on substrate/frame surface, and the substrate/frame is carried out reflow treatment；The second tin paste layer is formed back to the substrate/frame side in first tin paste layer, and the substrate/frame is subjected to reflow treatment；Directly the chip and the substrate/frame are fixed by second tin paste layer.By the above-mentioned means, the application can be directly fixed by chip and substrate/frame, without the prefabricated tin cream on chip.
Description
Technical field
This application involves encapsulation technology fields, more particularly to a kind of packaging method and packaging.
Background technique
It include: commonly in chip by the fixed method of chip and substrate/frame in technical field of semiconductor encapsulation
Tin cream is formed on metal salient point/metal pillar, then one end that chip is provided with tin cream is placed in the groove of carrying fluxing agent
It is interior, so that adhering to fluxing agent on the metal salient point of chip/metal pillar；By one end of chip setting fluxing agent and base
Plate/frame surface contacts；Chip and substrate/frame entirety are flowed back, so that chip and substrate/frame surface are solid
It is fixed.
Present inventor has found in chronic study procedure, and metal salient point/gold in chip is needed in the above process
Belong to prefabricated tin cream on pillar, the process costs and time cost of prefabricated tin cream are higher.
Summary of the invention
The application, can be by chip and base mainly solving the technical problems that provide a kind of packaging method and packaging
Plate/frame is directly fixed, without the prefabricated tin cream on chip.
In order to solve the above technical problems, the technical solution that the application uses is: providing a kind of packaging method, the envelope
Dress method includes: to form the first tin paste layer at least one first area on substrate/frame surface, and by the substrate/frame
Frame carries out reflow treatment；The second tin paste layer is formed back to the substrate/frame side in first tin paste layer, and by the base
Plate/frame carries out reflow treatment；Directly the chip and the substrate/frame are fixed by second tin paste layer.
Wherein, described to form the first tin paste layer at least one first area of substrate/frame surface, comprising: by first
Web plate is placed in the substrate/frame surface, wherein and first web plate includes the first side being disposed opposite to each other and second side, and
At it, at least central region is provided with multiple the first mesh through first side and described second side, institute to first web plate
It is corresponding with the first area to state the first mesh；Tin cream is coated in first side of first web plate, the tin cream is through institute
It states the first mesh and falls on the first area to form first tin paste layer.
Wherein, forming the second tin paste layer on first tin paste layer on the surface in the substrate/frame includes: by second
Web plate is placed in the substrate/frame surface, and second web plate includes the third side and the 4th side being disposed opposite to each other, and described
Two web plates are provided with multiple the second mesh through the third side and the 4th side in its at least central region, and described second
Mesh is corresponding with first tin paste layer；The tin cream, the tin cream warp are coated on the third side of second web plate
Second mesh is fallen on first tin paste layer of the substrate/frame surface to form second tin paste layer.
Wherein, first mesh and second mesh are in the center of the projection of plane where substrate/frame weight
It closes, and first mesh is identical as the size of second mesh.
Wherein, first mesh and second mesh are in the center of the projection of plane where substrate/frame weight
It closes, and the size of second mesh is less than the size of first mesh.
Wherein, described before the multiple first areas in substrate/frame surface form the first tin paste layer, the packaging method
Further include: oxide layer is formed between the multiple first areas in the substrate/frame surface.
Wherein, the position of corresponding first tin paste layer in the surface in the substrate/frame is formed before the second tin paste layer,
The packaging method further include: form oxide layer between multiple first tin paste layers in the substrate/frame surface.
Wherein, after the first tin paste layer reflux, there is first gap between adjacent first tin paste layer；Described second
After tin paste layer reflux, first tin paste layer and second tin paste layer on first tin paste layer are combined into same tin
Cream block has Second gap between the adjacent tin cream block.
Wherein, described the chip is directly passed through into the second tin paste layer fixation with the substrate/frame surface to include:
The chip is provided, the surface of the chip is provided with pad, and the bond pad surface is provided with metalwork, the metalwork end
There is no tin cream；The metalwork and second tin paste layer are flowed back, so that the surface of the chip and the substrate/frame
It is fixed.
In order to solve the above technical problems, another technical solution that the application uses is: a kind of packaging is provided, it is described
Packaging is formed using packaging method described in any of the above-described embodiment, and the packaging includes: substrate/frame, described
Substrate/frame surface is provided at least one first area, and the first area is formed with the first tin paste layer and is located at
The second tin paste layer on first tin paste layer；Chip, the chip are fixed with second tin paste layer.
The beneficial effect of the application is: be in contrast to the prior art, packaging method provided herein include:
At least one first area on substrate/frame surface forms the first tin paste layer and the second tin paste layer stacked, then directly logical
The second tin paste layer is crossed to fix chip and substrate/frame.Without the prefabricated tin on chip in packaging method provided herein
Cream can uniformly form tin paste layer on substrate/frame, thereby reduce the process costs and time cost of prefabricated tin cream；Separately
Outside, chip needs to undergo the step of dipping scaling powder in the prior art, and the step is not necessarily in the application, the first tin in the application
It include certain scaling powder in layer of paste and the second tin paste layer, and the scaling powder foot for including in the first tin paste layer and the second tin paste layer
So that chip is temporarily fixed to substrate/frame surface, and then the time of chip attachment can be further decreased, and reduced because helping weldering
Chip caused by the amount of agent lacks and the bad problem of substrate/frame welding.
Detailed description of the invention
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the drawings in the following description are only some examples of the present application, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.Wherein:
Fig. 1 is the flow diagram of one embodiment of the application packaging method；
Fig. 2 is the flow diagram of mono- embodiment of step S101 in Fig. 1；
Fig. 3 is the structural schematic diagram of the corresponding embodiment of step S201-S203 in Fig. 2；
Fig. 4 is the flow diagram of mono- embodiment of step S102 in Fig. 1；
Fig. 5 is the structural schematic diagram of the corresponding embodiment of step S301-S304 in Fig. 4；
Fig. 6 is the flow diagram of mono- embodiment of step S103 in Fig. 1；
Fig. 7 is the structural schematic diagram of the corresponding embodiment of step S401-S402 in Fig. 6；
Fig. 8 is the structural schematic diagram of one embodiment of the application packaging；
Fig. 9 is the structural schematic diagram of another embodiment of the application packaging.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of embodiments of the present application, rather than whole embodiments.Based on this
Embodiment in application, those of ordinary skill in the art are obtained every other under the premise of not making creative labor
Embodiment shall fall in the protection scope of this application.
Referring to Fig. 1, Fig. 1 is the flow diagram of one embodiment of the application packaging method, envelope provided herein
Dress method includes:
S101: the first tin paste layer is formed at least one first area on substrate/frame surface, and by substrate/frame
Carry out reflow treatment.
Specifically, in technical field of semiconductor encapsulation, substrate/frame is the carrier of chip, can provide and be electrically connected for chip
Connect, protect, support, radiate, assemble and other effects, to realize more pins, reduce encapsulating products volume, improvement electrical property and heat dissipation
Property, it is ultra dense degree or multi-chip module purpose.Multiple first areas are typically provided on substrate/frame, which can
To be the pad etc. on substrate/frame, it is mainly used for being electrically connected with chip.
It in one embodiment, is that the process of mono- embodiment of step S101 in Fig. 1 is shown incorporated by reference to Fig. 2 and Fig. 3, Fig. 2
It is intended to, Fig. 3 is the structural schematic diagram of the corresponding embodiment of step S201-S203 in Fig. 2.Above-mentioned steps S101 is specifically wrapped
It includes:
S201: the first web plate 10 is placed in 12 surface of substrate/frame, wherein the first web plate 10 includes being disposed opposite to each other
First side 100 and second side 102, and the first web plate 10 is provided in its at least central region and multiple runs through the first side 100 and
First mesh 104 of two sides 102, the first mesh 104 are corresponding with first area 120.
Specifically, Fig. 3 a is please referred to, the material of the first web plate 10 can be steel mesh, plastic net；The material of steel mesh can be
Iron, copper, stainless steel etc.；The material of plastic net can be polyethylene, polypropylene, polyvinyl chloride etc..The shape of first mesh 104 can
To be cylindrical body, prism etc..In the present embodiment, suitable first web plate 10 can be selected according to actual needs, so that
The first area 120 of substrate/frame 12 is corresponding with the first mesh 104.
S202: tin cream is coated in the first side 100 of the first web plate 10, tin cream falls on first area 120 through the first mesh 104
To form the first tin paste layer 16.
Specifically, referring to Fig. 3 a, in the present embodiment, the tools such as scraper 14 be can use in the first web plate 10
First side 100 coats tin cream.Scraper 14 can be any in the prior art, for example, scraper 14 can be scraped for flat scraper, triangle
Knife or crescent scraper etc..
In addition, in the present embodiment, tin cream is mainly made of scaling powder and glass putty, scaling powder is usually by activator, touching
Become the composition such as agent, resin, solvent, the content of scaling powder is generally the 10.5%-13% of gross mass；Tin cream has excellent wetting
Property and solderability, therefore be often used to chip and substrate/frame 12 is fixed.
S203: the first web plate 10 is separated with substrate/frame 12.
Specifically, as shown in Figure 3b, tin cream is fallen on the first area 120 of substrate/frame 12 to form the first tin at this time
Layer of paste 16.The shape of the first tin paste layer 16 can be roughly the same with the shape of the first mesh 104 of the first web plate 10 at this time.
S204: substrate/frame 12 is subjected to reflow treatment.
Specifically, as shown in Figure 3c, in reflux course, solvent or portions additive in the first tin paste layer 16 are waved
Hair, the first tin paste layer 16 are fixed together with first area 120.And passing through the reflux course, the first tin paste layer 16 can be from figure
Shape in 3b is collapsed for the hemispherical or ellipticity etc. in Fig. 3 c, upper table of first tin paste layer 16 far from substrate/frame 12
Face has arch section.
In above-described embodiment in such a way that the first web plate 10 forms the first tin paste layer 16 on substrate/frame 12, efficiency
It is higher, once the first tin paste layer 16 can be formed simultaneously in multiple first areas 120 of substrate/frame 12.Certainly, in other realities
It applies in example, the method for above-mentioned the first tin paste layer of formation 16 can also be other, for example, the modes such as dispensing, the application do not limit this
It is fixed.
S102: the second tin paste layer is formed back to substrate/frame side in the first tin paste layer, and substrate/frame is returned
Stream process.
It specifically, in one embodiment, is mono- embodiment of step S102 in Fig. 1 incorporated by reference to Fig. 4 and Fig. 5, Fig. 4
Flow diagram, Fig. 5 are the structural schematic diagram of the corresponding embodiment of step S301-S304 in Fig. 4.Above-mentioned steps S102 tool
Body includes:
S301: the second web plate 20 is placed in 12 surface of substrate/frame, the second web plate 20 includes the third side being disposed opposite to each other
200 and the 4th side 202, and the second web plate 20 its at least central region be provided with it is multiple through third side 200 and the 4th side 202
The second mesh 204, the second mesh 204 is corresponding with the first tin paste layer 16.
Specifically, as shown in Figure 5 a, in the present embodiment, since the first tin paste layer 16 passes through reflow treatment, the first tin cream
Layer 16 is similar to hemispherical or ellipsoid etc., and therefore, the second web plate 20 can use external fixation device, so that the second net
The position of plate 20 is fixed, and will not be shifted during subsequent print solder paste.The material of second web plate 20 can be steel mesh, modeling
Glue net；The material of steel mesh can be iron, copper, stainless steel etc.；The material of plastic net can be polyethylene, polypropylene, polyvinyl chloride
Deng.The shape of second mesh 204 can be cylindrical body, prism etc..In the present embodiment, it can select to close according to actual needs
The second suitable web plate 20, so that the second mesh 204 in the second web plate 20 is corresponding with the first tin paste layer 16.
In one embodiment, the first web plate 10 is identical as the second web plate 20, the first mesh 104 and the second mesh 204
It is overlapped at the center of the projection of 12 place plane of substrate/frame, and the first mesh 104 is identical as the size of the second mesh 204.?
Under the set-up mode, the first web plate 10 and the second web plate 20 can be using the same alignment mark or contraposition settings.
In another embodiment, the throwing of the first mesh 104 and the second mesh 204 in 12 place plane of substrate/frame
The center of shadow is overlapped, and the size of the second mesh 204 is less than the size of the first mesh 104.Under the set-up mode, the first web plate
10 and second web plate 20 can using the same alignment mark or contraposition setting；And subsequent second mesh 204 can be made to fall
Under tin cream be located on the first tin paste layer 16, and then reduce the probability of the tin cream that falls between adjacent first tin paste layer 16.
S302: coating tin cream on the third side 200 of the second web plate 20, and tin cream falls on substrate/frame through the second mesh 204
To form the second tin paste layer 22 on first tin paste layer 16 on 12 surfaces.
Specifically, referring to Fig. 5 a, in the present embodiment, the tools such as scraper 14 be can use in the second web plate 20
Third side 200 coats tin cream.Scraper 14 can be any in the prior art, for example, scraper 14 can be scraped for flat scraper, triangle
Knife or crescent scraper etc..
S303: the second web plate 20 is separated with substrate/frame 12.
Specifically, Fig. 5 b is please referred to, falls tin cream on the first tin paste layer 16 of substrate/frame 12 at this time to form the second tin
Layer of paste 22；At this time the second tin paste layer 22 only have part it is roughly the same with the shape of the second mesh 204 of the second web plate 20, this be because
It is the first tin paste layer 16 after flowing back, the first upper surface of the tin paste layer 16 far from substrate/frame 12 includes arc area, the second tin
The part that layer of paste 22 is contacted with the first tin paste layer 16 may be sprawled along the arc area of the first tin paste layer 16.
S304: substrate/frame 12 is subjected to reflow treatment.
Specifically, as shown in Figure 5 c, in reflux course, solvent or portions additive in the second tin paste layer 22 are waved
Hair, and then the second tin paste layer 22 and the first tin paste layer 16 can be fixed together.And pass through the reflux course, the second tin paste layer
It is near-spherical that 22 shape, which is collapsed, and the second surface of the tin paste layer 22 far from substrate/frame 12 includes arc.
In above-described embodiment in such a way that the second web plate 20 forms the second tin paste layer 22 on substrate/frame 12, efficiency
It is higher, once the second tin paste layer 22 can be formed simultaneously on multiple first tin paste layers 16 of substrate/frame 12.Certainly, at it
In his embodiment, the method for above-mentioned the second tin paste layer of formation 22 can also be other, for example, the modes such as dispensing, the application to this not
It limits.It include certain scaling powder in the first tin paste layer 16 and the second tin paste layer 22 provided herein, and the first tin
The scaling powder for including in layer of paste 16 and the total amount of the second tin paste layer 22 is enough that subsequent chip is made to be temporarily fixed to 12 table of substrate/frame
Face, and then the time of chip attachment can be further decreased, and reduce chip and substrate/frame caused by the amount missing because of scaling powder
The problem of frame failure welding.
S103: directly chip and substrate/frame are fixed by the second tin paste layer.
Specifically, in one embodiment, Fig. 6-Fig. 7 is please referred to, Fig. 6 is mono- embodiment of step S103 in Fig. 1
Flow diagram；Fig. 7 is the structural schematic diagram of the corresponding embodiment of step S401-S402 in Fig. 6.Above-mentioned steps S103 tool
Body includes:
S401: providing chip 30, and the surface of chip 30 is provided with pad (not shown), and bond pad surface is provided with metalwork
32,32 end of metalwork does not have tin cream.
Specifically, as shown in Figure 7a, in the present embodiment, chip 30 uses the form of upside-down mounting, and metalwork 32 can be gold
Belong to salient point or metal pillar.When metalwork 32 is metal salient point, bonding technology can be used and formed, the material of metal salient point
It can be gold etc.；When metalwork 32 be metal pillar when, electroplating technology can be used and formed, electroplating technology include parcel plating,
The material of the modes such as composite plating, pulse plating, electroforming, mechanical plating, metal pillar can be nickel, chromium, copper, zinc, cadmium, alloy etc.
Conductive metal material, the application do not limit this.
S402: metalwork 32 and the second tin paste layer 22 are flowed back, so that the surface of chip 30 and substrate/frame 12 is solid
It is fixed.
Specifically, as shown in Figure 7b, due to containing fluxing agent in the first tin paste layer 16 and the second tin paste layer 22, work as core
When piece 30 is placed into substrate/12 surface of frame, by means of the surface tension of scaling powder, chip 30 temporarily can be fixed on base
12 surface of plate/frame.Tin when metalwork 32 and the second tin paste layer 22 are flowed back, in the first tin paste layer 16 and the second tin paste layer 22
Powder melts, and due to the gravity of chip 30, by the first tin paste layer 16 and the second tin paste layer 22 pushes and drawout, then makes
The metalwork 32 and 22 contact area of the second tin paste layer for obtaining chip 30 increase.
In packaging method provided herein without on the metalwork 32 of chip 30 prefabricated tin cream, can substrate/
Tin paste layer is uniformly formed on frame 12, thereby reduces the process costs and time cost of prefabricated tin cream；In addition, in the prior art
Chip 30 needs to undergo the step of dipping scaling powder, and the step is not necessarily in the application, the first tin paste layer 16 and the in the application
It include certain scaling powder in two tin paste layers 22, and the amount foot of the first tin paste layer 16 and the second tin paste layer 22 scaling powder that includes
So that chip 30 is temporarily fixed to 12 surface of substrate/frame, and then can further decrease the mounted time of chip 30, and reduce
The problem of chip 30 caused by being lacked because of the amount of scaling powder and substrate/12 failure welding of frame.
In the present embodiment, to avoid adjacent first tin paste layer 16 from contacting with the second tin paste layer 22 in reflux, to subsequent
Electrical connection has an impact, and packaging method provided herein is before above-mentioned steps S101 further include: in 12 table of substrate/frame
Oxide layer is formed between multiple first areas 120 in face.In the present embodiment, oxide layer, which can be, does not send out with the first tin paste layer 16
The substance of raw reaction, and there is insulation performance to be equivalent to and enclose for example, the oxide layer can be silica, silica etc.
Dam, the first tin paste layer 16 is during subsequent reflow, due to the presence of oxide layer, can't be spread to outside beyond oxide layer.
Certainly, in other embodiments, to avoid the contact in reflux of adjacent second tin paste layer 22, to subsequent electrical connectivity
It can have an impact, packaging method provided herein is before above-mentioned steps S102 further include: on 12 surface of substrate/frame
Oxide layer is formed between multiple first tin paste layers 16.In the present embodiment, oxide layer can be not with the first tin paste layer 16, second
The substance that tin paste layer 22 reacts, and there is insulation performance, for example, the oxide layer can be silica, silica etc.,
It is equivalent to box dam, the first tin paste layer 16, the second tin paste layer 22, can't due to the presence of oxide layer during subsequent reflow
It is spread to beyond outside oxide layer.
Since the presence of above-mentioned oxide layer has first after the reflux of the first tin paste layer 16 between adjacent first tin paste layer 16
Gap；After the reflux of second tin paste layer 22, the first tin paste layer 16 and the second tin paste layer 22 on the first tin paste layer 16 are combined into
Same tin cream block has Second gap between adjacent tin cream block.Above-mentioned Second gap makes will not between subsequent adjacent tin cream block
There are electrical connections, and then reduce the probability of short circuit.
Referring to Fig. 8, Fig. 8 is the structural representation of one embodiment of the application packaging, encapsulation provided herein
Device is formed using the packaging method in any of the above-described embodiment, and packaging includes: substrate/frame 12 and chip 30, and substrate/
The surface of frame 12 is provided at least one first area (not showing in Fig. 8), and first area be formed with the first tin paste layer 16 with
And the second tin paste layer 22 on the first tin paste layer 16；Chip 30 and the second tin paste layer 22 are fixed.Certainly, in other embodiments
In, the first tin paste layer 16 and the second tin paste layer 22 formed on above-mentioned first area can also be electrically connected with components such as resistance.
In one embodiment, the second tin paste layer 22 spreads over the surface of the first tin paste layer 16, and the first tin paste layer 16 can
It is covered with some or all of by the second tin paste layer 22.
In another embodiment, referring to Fig. 9, the structure that Fig. 9 is another embodiment of the application packaging is shown
It is intended to.In the present embodiment, the periphery of the first tin paste layer 16 is additionally provided with oxide layer 34, and the height of oxide layer 34 is less than or equal to the
The sum of the height of one tin paste layer 16 and the second tin paste layer 22；Oxide layer 34 can be not with the first tin paste layer 16, the second tin paste layer
22 substances to react, and there is insulation performance, for example, silica, silica etc., which can limit first
The position of tin paste layer 16 and the second tin paste layer 22, so that adjacent first tin paste layer 16 or adjacent second tin paste layer 22 will not be sent out
Raw electrical connection.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the patents of the application, all to utilize this
Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field similarly includes in the scope of patent protection of the application.
Claims (10)
1. a kind of packaging method, which is characterized in that the packaging method includes:
The first tin paste layer is formed at least one first area on substrate/frame surface, and the substrate/frame is returned
Stream process；
The second tin paste layer is formed back to the substrate/frame side in first tin paste layer, and the substrate/frame is carried out
Reflow treatment；
Directly chip and the substrate/frame are fixed by second tin paste layer.
2. packaging method according to claim 1, which is characterized in that it is described substrate/frame surface at least one
One region forms the first tin paste layer, comprising:
First web plate is placed in the substrate/frame surface, wherein first web plate include the first side for being disposed opposite to each other and
Second side, and first web plate its at least central region be provided with it is multiple through the of first side and described second side
One mesh, first mesh are corresponding with the first area；
Tin cream is coated in first side of first web plate, the tin cream falls on the first area through first mesh
To form first tin paste layer.
3. packaging method according to claim 2, which is characterized in that the first of the surface in the substrate/frame
The second tin paste layer is formed on tin paste layer includes:
Second web plate is placed in the substrate/frame surface, second web plate includes the third side and the 4th being disposed opposite to each other
Side, and at it, at least central region is provided with multiple the second nets through the third side and the 4th side to second web plate
Hole, second mesh are corresponding with first tin paste layer；
The tin cream is coated on the third side of second web plate, the tin cream falls on the base through second mesh
To form second tin paste layer on first tin paste layer of plate/frame surface.
4. packaging method according to claim 3, which is characterized in that first mesh is with second mesh described
The center of the projection of plane is overlapped where substrate/frame, and first mesh is identical as the size of second mesh.
5. packaging method according to claim 3, which is characterized in that first mesh is with second mesh described
The center of the projection of plane is overlapped where substrate/frame, and the size of second mesh is less than the size of first mesh.
6. packaging method according to claim 1, which is characterized in that described in multiple firstth areas in substrate/frame surface
Domain is formed before the first tin paste layer, the packaging method further include:
Oxide layer is formed between the multiple first areas in the substrate/frame surface.
7. packaging method according to claim 1, which is characterized in that the surface in the substrate/frame corresponding the
The position of one tin paste layer is formed before the second tin paste layer, the packaging method further include:
Oxide layer is formed between multiple first tin paste layers in the substrate/frame surface.
8. packaging method according to claim 6 or 7, which is characterized in that
After the first tin paste layer reflux, there is first gap between adjacent first tin paste layer；
After the second tin paste layer reflux, first tin paste layer and second tin paste layer on first tin paste layer
It is combined into same tin cream block, there is Second gap between the adjacent tin cream block.
9. packaging method according to claim 1, which is characterized in that described by the chip and the substrate/frame table
Face directly passes through the second tin paste layer fixation
The chip is provided, the surface of the chip is provided with pad, and the bond pad surface is provided with metalwork, the metalwork
End does not have tin cream；
The metalwork and second tin paste layer are flowed back, so that the surface of the chip and the substrate/frame is fixed.
10. a kind of packaging, which is characterized in that the packaging uses the described in any item encapsulation sides claim 1-9
Method is formed, and the packaging includes:
Substrate/frame, the surface of the substrate/frame is provided at least one first area, and the first area is formed with
First tin paste layer and the second tin paste layer on the first tin paste layer；
Chip, the chip are fixed with second tin paste layer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811506059.2A CN109712898A (en) | 2018-12-10 | 2018-12-10 | A kind of packaging method and packaging |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811506059.2A CN109712898A (en) | 2018-12-10 | 2018-12-10 | A kind of packaging method and packaging |
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