CN109698155B - Substrate processing apparatus including elevating guide part - Google Patents
Substrate processing apparatus including elevating guide part Download PDFInfo
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- CN109698155B CN109698155B CN201811173490.XA CN201811173490A CN109698155B CN 109698155 B CN109698155 B CN 109698155B CN 201811173490 A CN201811173490 A CN 201811173490A CN 109698155 B CN109698155 B CN 109698155B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
Abstract
The present invention relates to a substrate processing apparatus including a guide portion that moves up and down inside a chamber. The substrate processing apparatus including a guide part that ascends and descends according to the present invention includes: a chamber including a formation region as a region where a process substance is formed, a process region as a region where a substrate is processed with the process substance, and a discharge region as a region where the process substance is discharged in connection with a pump; a chuck disposed inside the chamber and configured to receive the substrate at an upper portion thereof such that the substrate is positioned in the processing region; and a guide portion that rises inside the chamber when the substrate is carried into and out of the chamber, and descends inside the chamber when the substrate is processed, and that is formed with a guide hole that penetrates through the center so as to gradually decrease in diameter toward the processing region, and that guides the processing substance formed in the formation region to the processing region through the guide hole.
Description
Technical Field
The present invention relates to a substrate processing apparatus including a guide portion that moves up and down inside a chamber.
Background
A substrate processing apparatus is an apparatus for performing a semiconductor process, and more particularly, an apparatus for processing a substrate with a processing substance.
At this time, the substrate may mean a wafer or a tray on which the wafer is mounted, and the process substance may mean gas or plasma for processing the substrate.
For example, the substrate processing apparatus may be an apparatus that performs one or more of etching, evaporation, and ashing using plasma, or an apparatus that performs evaporation using a metal gas.
The substrate processing apparatus includes a chamber.
The chamber includes a formation region as a region where a process substance is formed, a process region as a region where a substrate is processed with the process substance, and a discharge region as a region connected to a pump to discharge the process substance.
The substrate is transferred by the robot arm through a substrate entrance formed between the formation region and the processing region, and is carried into the chamber from the outside of the chamber and placed on the upper portion of the chuck.
However, since the formation region and the processing region are close to each other for substrate processing, there is a problem that the space for carrying the substrate into the chamber is insufficient.
In order to solve such a problem, conventionally, a chuck is lifted and lowered to secure a space in which a substrate is carried into a chamber.
However, since the chuck includes various structures for fixing the substrate and controlling the temperature, there are problems in that: in order to secure a space in which the chuck ascends and descends inside the chamber, the size of the chamber is increased; the lifting requires more power due to the weight of the chuck; the various structures included in the chuck are also raised and lowered together with the chuck.
Documents of the prior art
Patent document
Patent document 0001: KR 10-1443792B 1(2014.09.17)
Patent document 0002: KR 10-2014-0103872A (2014.08.27)
Patent document 0003: KR 10-2006-0013987A (2006.02.14)
Disclosure of Invention
Technical problem
The present invention is made to solve the above problems.
The invention aims to provide a substrate processing device comprising a guide part which ascends and descends.
Technical scheme
The present invention for achieving the above object is a substrate processing apparatus including a guide part that ascends and descends, including: a chamber including a formation region as a region where a process substance is formed, a process region as a region where a substrate is processed with the process substance, and a discharge region as a region where the process substance is discharged in connection with a pump; a chuck disposed inside the chamber and configured to receive the substrate at an upper portion thereof such that the substrate is positioned in the processing region; and a guide portion that rises inside the chamber when the substrate is carried into and out of the chamber, and descends inside the chamber when the substrate is processed, and that is formed with a guide hole that penetrates through the center so as to gradually decrease in diameter toward the processing region, and that guides the processing substance formed in the formation region to the processing region through the guide hole.
The substrate processing apparatus including a guide part that ascends and descends includes: a linkage part which is arranged through the chamber and is linked with the guide part to lift the guide part; and a driving part which is arranged outside the chamber and provides driving force for the linkage part so as to lift the linkage part.
The substrate processing apparatus including a guide part that ascends and descends includes: and a guide descending boundary line boss protruding from the inner wall of the chamber and formed at a descending boundary line of the guide part.
The substrate processing apparatus including a guide part that ascends and descends includes: a first guide portion located inside the chamber in a shape extending long up and down; and a second guide part formed at the guide part and formed in a shape corresponding to the first guide part to prevent the guide part from being separated from the first guide part when the guide part is lifted.
The substrate processing apparatus including a guide portion that moves up and down includes: a limiting part which is inserted into the substrate and limits the processing substance to process the substrate; a restricting interlocking hole formed in the restricting portion; and a restricting interlocking part formed on one side of the interlocking part with a diameter larger than that of the restricting interlocking hole, wherein a predetermined section of the interlocking part is formed with a diameter smaller than that of the restricting interlocking hole, passes through the restricting interlocking hole when moving up and down, and moves up and down in interlocking with the interlocking part when being locked to the restricting interlocking part.
The substrate processing apparatus including a guide portion that moves up and down includes: and a limiting part formed inside the limiting part, wherein the limiting part is in a shape of covering a part of the outer side of the substrate or in a shape of protruding higher than the substrate to surround the outer side of the substrate.
The substrate processing apparatus including a guide portion that moves up and down includes: a placing part which ascends to receive the substrate and descends to place the substrate on an upper portion of the chuck; a placement linkage hole formed in the placement section; and a placement locking portion formed at one side of the interlocking portion with a diameter larger than that of the placement interlocking hole, wherein a predetermined section of the interlocking portion is formed with a diameter smaller than that of the placement interlocking hole, passes through the placement interlocking hole when lifted, and is lifted and lowered in conjunction with the interlocking portion when locked at the placement locking portion.
The substrate processing apparatus including a guide part that ascends and descends includes: a placement placing hole formed inside the placement portion with a diameter smaller than that of the substrate; and a chuck seating part inserted into the seating hole in a structure protruding from the chuck, and having an upper surface contacting a rear surface of the substrate to electrostatically fix the substrate.
ADVANTAGEOUS EFFECTS OF INVENTION
First, the guide portion ascends to secure a space between the formation region and the process region, thereby having an advantage of carrying the substrate into the chamber without ascending the chuck.
Secondly, there is an advantage that the guide portion can be restricted from being lifted more than necessary.
Third, there is an advantage in that the first guide portion and the second guide portion guide the guide portion to prevent the guide portion from being inclined to one side when the guide portion ascends or descends.
Fourth, there is an advantage in that the restricting part can be lifted and lowered in conjunction with the guide part without adding a structure, and there is an advantage in that the distance between the guide part and the substrate can be adjusted as required when the substrate is processed.
Fifth, the substrate processing apparatus has an advantage that the placing part can be moved up and down in conjunction with the guide part without adding an additional structure, and has an advantage that the distance between the guide part and the substrate can be adjusted as required when the substrate is processed.
Drawings
Fig. 1 is a diagram showing a state when the guide portion of the present invention is raised.
Fig. 2 is a diagram showing a state in which the guide portion of the present invention is lowered.
Fig. 3 and 4 are diagrams illustrating an embodiment of the driving portion.
Fig. 5 is a diagram illustrating an embodiment of the linkage portion.
Fig. 6 and 7 are diagrams illustrating embodiments of the first guide portion and the second guide portion.
Fig. 8 to 11 are diagrams illustrating an embodiment of the restricting portion.
Fig. 12 is a diagram showing an example of the restricting locking portion.
Fig. 13 and 14 are diagrams illustrating an embodiment of a placing section.
Description of the symbols
10: substrate, 100: chamber, 110: formation region, 120: treatment area, 130: discharge area, 200: chuck, 300: linkage, 400: drive unit, 500: guide portion, 600: restriction portion, 700: a placing part.
Detailed Description
Since the chuck 200 includes various structures for fixing the substrate 10 and controlling temperature, there are problems in that: in order to secure a space in which the chuck 200 ascends inside the chamber 100, the size of the chamber 100 is increased; the lifting requires more power due to the weight of the chuck 200; the various structures included in the chuck 200 are also elevated together with the chuck 200.
To solve such a problem, as illustrated in fig. 1 and 2, the substrate processing apparatus including the elevating guide of the present invention includes a chamber 100, a chuck 200, a guide 500, a linkage 300, and a driving part 400.
The chamber 100 includes a formation region 110 which is a region where a process substance is formed, a process region 120 which is a region where the substrate 10 is processed with the process substance, and a discharge region 130 which is a region where the process substance is discharged by being connected to a pump.
The chuck 200 is disposed inside the chamber 100 and mounts the substrate 10 at an upper portion such that the substrate 10 is positioned in the processing region 120.
The guide part 500 ascends inside the chamber 100 when the substrate 10 is carried into or out of the chamber 100, descends inside the chamber 100 when the substrate 10 is processed, forms a guide hole 510 penetrating the center so as to gradually decrease in diameter toward the processing region 120, and guides the processing substance formed in the formation region 110 to the processing region 120 through the guide hole 510.
The interlocking part 300 is provided to penetrate the chamber 100, and moves up and down the guide part 500 in conjunction with the guide part 500.
The driving part 400 is disposed outside the chamber 100, and provides a driving force to the interlocking part 300 to lift the interlocking part 300.
The driving part 400 may mean a cylinder and a motor.
When the driving unit 400 is a telescopic cylinder, the interlocking unit 300 may have a rod shape that moves up and down in conjunction with the driving unit 400.
When the driving part 400 is a rotating motor, the interlocking part 300 may be a ball screw that rotates in conjunction with the driving part 400, and the guide part 500 may be connected to a nut housing that is raised and lowered by the rotation of the ball screw and raised and lowered.
The driving part 400 may be located at a lower portion of the chamber 100, or, as illustrated in fig. 3, the driving part 400 may be located at an upper portion of the chamber 100.
The driving part 400 may be connected to the connection plate 310 to simultaneously provide driving force to the plurality of interlocking parts 300, or, as illustrated in fig. 4, the driving part 400 may be connected to the interlocking parts 300 to provide driving force to each interlocking part 300, respectively.
The guide part 500 may be fixed to one end of the interlocking part 300 to interlock with each other.
At this time, the linkage 300 may be coupled or extended.
As shown in fig. 5 (a), the guide part 500 may be not fixed to the interlocking part 300 but may be in contact with one end of the interlocking part 300 to be interlocked with the interlocking part 300.
As shown in fig. 5 (b), the guide part 500 may be linked with the linkage part 300 together with the pogo pin 320 connected to one end of the linkage part 300.
As shown in fig. 5 (c), the guide part 500 may be formed with a guide interlocking hole 520, the interlocking part 300 may be formed with a guide locking part 530 protruding larger than the diameter of the guide interlocking hole 520, and the guide part 500 may be interlocked with the interlocking part 300 by locking the guide interlocking hole 520 and the guide locking part 530 with a difference in diameter.
At this time, the guide locking part 530 may be coupled to the interlocking part 300 or extended.
Next, the operation of the present invention is analyzed. As illustrated in fig. 1, the guide part 500 is raised by the interlocking part 300 and the driving part 400 to secure a space between the formation region 110 and the processing region 120.
Thereafter, when the substrate 10 is transferred by the robot arm 210 and carried into the chamber 100, the lift pins 220 receive the substrate 10 from the robot arm 210 and place the substrate 10 on the upper portion of the chuck 200.
Thereafter, as illustrated in fig. 2, the guide part 500 is lowered by the interlocking part 300 and the driving part 400 to reduce the space between the formation region 110 and the processing region 120 again.
In this manner, since the guide part 500 is raised to secure a space between the formation region 110 and the process region 120, there is an advantage in that the substrate 10 can be carried into the chamber 100 without raising the chuck 200.
When the guide part 500 is lifted, there is a problem that the guide part is excessively lifted according to circumstances.
To solve such a problem, as illustrated in fig. 1 and 2, a guide rising boundary line boss 540 and a guide falling boundary line boss 550 protruding from an inner wall of the chamber 100 may be formed at a boundary line where the guide part 500 ascends and descends.
The guide ascending boundary line boss 540 formed on the ascending boundary line of the guide part 500 restricts the guide part 500 from ascending to the upper part of the guide ascending boundary line boss 540, and the guide descending boundary line boss 550 formed on the descending boundary line of the guide part 500 restricts the guide part 500 from descending to the lower part of the guide descending boundary line boss 550.
The guide rising boundary line boss 540 and the guide falling boundary line boss 550 may protrude along the outer periphery of the inner wall of the chamber 100, or partially protrude along the outer periphery of the inner wall of the chamber 100.
This has an advantage that the guide part 500 can be restricted from being excessively lifted.
When the guide part 500 is moved up and down, there is a problem that the guide part 500 is inclined to one side when the driving force is deviated to one side.
To solve such a problem, as illustrated in fig. 6 and 7, a first guide portion 560 and a second guide portion 570 are included.
The first guide 560 is located inside the chamber 100 in a shape extending long up and down.
The second guide part 570 is formed at the guide part 500 in a shape corresponding to the first guide part 560 to prevent the guide part 500 from being separated from the first guide part 560 when ascending and descending.
As illustrated in fig. 6, the first guide portion 560 may have a rod shape, and the second guide portion 570 may be a hole through which the first guide portion 560 passes.
As illustrated in fig. 7, the first guide portion 560 may have a rod shape that protrudes from the chamber 100 in the vertical direction, and the second guide portion 570 may be a groove through which the first guide portion 560 passes.
The first guide portion 560 may be a groove formed to be long from the upper portion to the lower portion of the chamber 100, and the second guide portion 570 may be a protrusion protruding from the guide portion 500 inserted into the groove.
In this way, there is an advantage that the first guide portion 560 and the second guide portion 570 guide the guide portion 500 to prevent the guide portion 500 from being inclined to one side when the guide portion 500 ascends or descends.
< embodiment of additionally installing restriction part 600 >
The interlocking part 300 may be lifted and lowered in conjunction with the restricting part 600 in addition to the guide part 500.
The restricting portion 600 may be fixed to one side of the interlocking portion 300 and may be lifted and lowered in conjunction with the interlocking portion 300.
However, if the restricting part 600 is fixed to one side of the interlocking part 300, there is a problem in that the distance between the guide part 500 and the substrate 10 cannot be adjusted as required when the substrate 10 is processed.
To solve such a problem, as illustrated in fig. 8 to 10 of the present invention, the substrate processing apparatus including the guide part for elevating and lowering of the present invention includes a restriction part 600, a restriction processing part 610, a restriction interlocking hole 620, and a restriction locking part 630.
The regulating portion 600 is inserted into the substrate 10 and regulates the processing of the substrate 10 by the processing substance.
The restriction processing portion 610 is formed to extend from the inside of the restriction portion 600.
The limiting process portion 610 may have a shape covering a part of the outer side of the substrate 10, or, as illustrated in fig. 11, may have a shape protruding higher than the height of the substrate 10 to surround the outer side of the substrate 10.
The restricting interlocking hole 620 is formed in the restricting portion 600.
The limit latch 630 is formed at one side of the interlocking part 300 with a diameter larger than that of the limit interlocking hole 620.
As illustrated in fig. 12 (a), the restricting locking portion 630 may be formed by connecting sections of different diameters of the interlocking portion 300.
As illustrated in fig. 12 (b), the restricting locking portion 630 may be formed to protrude from one side of the interlocking portion 300.
The predetermined section of the interlocking part 300 is formed with a diameter smaller than that of the restricting interlocking hole 620, and when it is lifted up and down, the restricting interlocking hole 620 moves up and down in interlocking with the interlocking part 300 when it is locked to the restricting locking part 630.
That is, as shown in fig. 9 and 10, a part of the section where the guide part 500 is lifted is released from the interlocking with the regulating part 600 and only the guide part 500 is lifted, and as shown in fig. 8, when the regulating part 600 needs to be lifted for carrying in or out the substrate 10, the regulating part 600 is lifted together with the guide part 500.
As described above, there is an advantage in that the regulating part 600 can be lifted and lowered in conjunction with the guide part 500 without an additional structure, and there is an advantage in that the distance between the guide part 500 and the substrate 10 can be adjusted as required when the substrate 10 is processed.
< embodiment in which the placing section 700 is additionally provided >
The interlocking part 300 may be lifted and lowered in conjunction with the placing part 700, in addition to the guide part 500.
The placement unit 700 may be fixed to one side of the interlocking unit 300 and may be lifted and lowered in conjunction with the interlocking unit 300.
However, if the placing part 700 is fixed to one side of the interlocking part 300, there is a problem in that the distance between the guide part 500 and the substrate 10 cannot be adjusted as required when the substrate 10 is processed.
To solve such a problem, as illustrated in fig. 13 to 14 of the present invention, the substrate processing apparatus including the elevating guide of the present invention includes a placing part 700, a placing hole 710, a chuck placing part 230, a placing interlocking hole 720, and a placing latch 730.
The placing unit 700 is raised to receive the substrate 10 from the robot arm 210 instead of the lift pins 220, and is lowered to place the substrate 10 on the upper portion of the chuck 200.
The placement placing hole 710 is formed at the inner side of the placement part 700 with a diameter smaller than that of the substrate 10.
The chuck seating part 230 is inserted into the seating hole 710 as a structure protruding from the chuck 200, and the upper surface thereof is in contact with the rear surface of the substrate 10 to electrostatically fix the substrate 10.
The placement linkage hole 720 is formed in the placement portion 700.
The placing latch 730 is formed at one side of the interlocking part 300 with a diameter larger than that of the placing interlocking hole 720.
The set locking portion 730 may be formed by connecting sections having different diameters of the interlocking portion 300, or the set locking portion 730 may be formed to protrude from one side of the interlocking portion 300.
The one-side section of the interlocking part 300 may be formed to have a diameter smaller than that of the interlocking hole of the placing part 700, and when the interlocking part is lifted, the interlocking hole 720 is placed, and when the interlocking part is locked to the placing locking part 730, the interlocking part 300 is lifted and lowered in an interlocking manner.
That is, a part of the section in which the interlocking unit 300 moves up and down is released from interlocking with the placing unit 700, and only the guide unit 500 moves up and down, and when it is necessary to move up and down the placing unit 700 in order to carry in or out the substrate 10, the placing unit 700 moves up and down together with the guide unit 500.
Thus, there is an advantage in that the placing part 700 can be lifted and lowered in conjunction with the guide part 500 without adding a separate structure, and there is an advantage in that the distance between the guide part 500 and the substrate 10 can be adjusted as required when the substrate 10 is processed.
Claims (9)
1. A substrate processing apparatus including a guide portion that ascends and descends, comprising:
a chamber including a formation region as a region where a process substance is formed, a process region as a region where a substrate is processed with the process substance, and a discharge region as a region where the process substance is discharged in connection with a pump;
a chuck for mounting the substrate on an upper portion thereof such that the substrate is located in the processing region;
a guide unit that moves up inside the chamber when the substrate is carried into and out of the chamber, moves down inside the chamber when the substrate is processed, and guides the processing substance formed in the formation region to the processing region;
an interlocking part which is interlocked with the guide part to lift the guide part;
a driving part which provides a driving force to the linkage part to lift the linkage part; and
a limiting part which is inserted into the substrate and limits the processing substance to process the substrate;
the linkage part lifts and lowers the guide part in a part of the lifted and lowered section, and lifts and lowers the guide part and the regulating part together in the other part of the lifted and lowered section.
2. The substrate processing apparatus including the elevating guide part according to claim 1, comprising:
a restricting interlocking hole formed in the restricting portion; and
a limit locking part formed on one side of the linkage part with a diameter larger than that of the limit linkage hole,
the interlocking portion is formed with a diameter smaller than that of the restricting interlocking hole, and when the partial section is raised, the guide portion is raised through the restricting interlocking hole, and when the remaining partial section is raised, the restricting locking portion is locked in the restricting interlocking hole, and the guide portion and the restricting portion are raised together.
3. The substrate processing apparatus including the elevating guide part according to claim 1, further comprising:
and a guide descending boundary line boss protruding from the inner wall of the chamber and formed at a descending boundary line of the guide part.
4. The substrate processing apparatus including the elevating guide part according to claim 1, further comprising:
a first guide portion located inside the chamber in a shape extending long up and down; and
and a second guide part formed at the guide part and formed in a shape corresponding to the first guide part to prevent the guide part from being separated from the first guide part when the guide part is lifted.
5. The substrate processing apparatus including the elevating guide part according to claim 1,
comprises a restriction processing part formed inside the restriction part,
the limiting processing part is in a shape of covering a part of the outer side of the substrate or in a shape of protruding higher than the substrate to surround the outer side of the substrate.
6. A substrate processing apparatus including a guide portion that ascends and descends, comprising:
a chamber including a formation region as a region where a process substance is formed, a process region as a region where a substrate is processed with the process substance, and a discharge region as a region where the process substance is discharged in connection with a pump;
a chuck disposed inside the chamber and configured to receive the substrate at an upper portion thereof such that the substrate is positioned in the processing region;
a guide unit that moves up inside the chamber when the substrate is carried into and out of the chamber, moves down inside the chamber when the substrate is processed, and guides the processing substance formed in the formation region to the processing region;
a linkage part which is arranged through the chamber and is linked with the guide part to lift the guide part;
a driving part which is arranged outside the chamber and provides driving force for the linkage part so as to lift the linkage part; and
a placing part which ascends to receive the substrate and descends to place the substrate on an upper portion of the chuck,
the linkage part lifts and lowers the guide part in a part of the lifted and lowered section, and lifts and lowers the guide part and the placement part together in the other part of the lifted and lowered section.
7. The substrate processing apparatus including the elevating guide part according to claim 6, comprising:
a placement linkage hole formed in the placement section; and
a placing interlocking part formed on one side of the interlocking part with a diameter larger than that of the placing interlocking hole,
the interlocking part is formed with a diameter smaller than that of the placing interlocking hole, when the partial section is raised, the guide part is raised through the placing interlocking hole, and when the other partial section is raised, the placing clamping part is clamped in the placing interlocking hole, so that the guide part and the placing part are raised and lowered together.
8. The substrate processing apparatus including the elevating guide part according to claim 6, comprising:
a placement placing hole formed inside the placement portion with a diameter smaller than that of the substrate;
a chuck seating part inserted into the seating hole in a structure protruding from the chuck, and having an upper surface contacting a rear surface of the substrate to electrostatically fix the substrate.
9. The substrate processing apparatus including the elevating guide part according to claim 1 or 6,
the guide portion includes a guide hole penetrating through a center thereof so that a diameter thereof gradually decreases toward the processing region.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170137606A KR101856689B1 (en) | 2017-10-23 | 2017-10-23 | Substrate processing apparatus including an elevating induced part |
| KR10-2017-0137606 | 2017-10-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109698155A CN109698155A (en) | 2019-04-30 |
| CN109698155B true CN109698155B (en) | 2020-02-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811173490.XA Active CN109698155B (en) | 2017-10-23 | 2018-10-09 | Substrate processing apparatus including elevating guide part |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101856689B1 (en) |
| CN (1) | CN109698155B (en) |
| TW (1) | TWI659499B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102114891B1 (en) * | 2019-11-18 | 2020-05-26 | 주식회사 기가레인 | Plasma processing apparatus |
Citations (5)
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| JP2001267248A (en) * | 2000-03-15 | 2001-09-28 | Shibaura Mechatronics Corp | Semiconductor processor |
| KR20060067257A (en) * | 2004-12-14 | 2006-06-19 | 삼성에스디아이 주식회사 | Substrate processing apparatus having substrate align means |
| CN101621021A (en) * | 2008-07-02 | 2010-01-06 | 周星工程股份有限公司 | Substrate support frame and substrate processing device containing the frame |
| CN102355792A (en) * | 2011-10-19 | 2012-02-15 | 中微半导体设备(上海)有限公司 | Electromagnetic coupling plasma device capable of improving uniformity and efficiency of plasma |
| CN106976051A (en) * | 2015-12-02 | 2017-07-25 | 东京毅力科创株式会社 | The processing unit that space after decompression is handled machined object |
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| US9095038B2 (en) * | 2011-10-19 | 2015-07-28 | Advanced Micro-Fabrication Equipment, Inc. Asia | ICP source design for plasma uniformity and efficiency enhancement |
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- 2017-10-23 KR KR1020170137606A patent/KR101856689B1/en active IP Right Grant
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- 2018-10-09 CN CN201811173490.XA patent/CN109698155B/en active Active
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| JP2001267248A (en) * | 2000-03-15 | 2001-09-28 | Shibaura Mechatronics Corp | Semiconductor processor |
| KR20060067257A (en) * | 2004-12-14 | 2006-06-19 | 삼성에스디아이 주식회사 | Substrate processing apparatus having substrate align means |
| CN101621021A (en) * | 2008-07-02 | 2010-01-06 | 周星工程股份有限公司 | Substrate support frame and substrate processing device containing the frame |
| CN102355792A (en) * | 2011-10-19 | 2012-02-15 | 中微半导体设备(上海)有限公司 | Electromagnetic coupling plasma device capable of improving uniformity and efficiency of plasma |
| CN106976051A (en) * | 2015-12-02 | 2017-07-25 | 东京毅力科创株式会社 | The processing unit that space after decompression is handled machined object |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109698155A (en) | 2019-04-30 |
| TWI659499B (en) | 2019-05-11 |
| KR101856689B1 (en) | 2018-05-14 |
| TW201917819A (en) | 2019-05-01 |
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