CN109694547A - A kind of flame retardant composite material and preparation method thereof of epoxy resin as substrate - Google Patents
A kind of flame retardant composite material and preparation method thereof of epoxy resin as substrate Download PDFInfo
- Publication number
- CN109694547A CN109694547A CN201710986169.2A CN201710986169A CN109694547A CN 109694547 A CN109694547 A CN 109694547A CN 201710986169 A CN201710986169 A CN 201710986169A CN 109694547 A CN109694547 A CN 109694547A
- Authority
- CN
- China
- Prior art keywords
- parts
- epoxy resin
- composite material
- substrate
- flame retardant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
A kind of flame retardant composite material and preparation method thereof the present invention relates to epoxy resin as substrate, belongs to Epoxy Resin Technology field.The composite material includes carbon fibre fabric and coated in the following raw materials in parts by weight on carbon fibre fabric: 35-55 parts of bisphenol A type epoxy resin E-51,10-30 parts of epoxidized butadiene, 5506#10-20 parts of curing agent, 664#10-20 parts of diluent, 20-30 parts of fume colloidal silica, 1-12 parts of magnesium hydroxide, 2-6 parts of halogen-free flame-retardant polyamide, 1-5 parts of aluminium triphosphate.The present invention is soft for substrate with epoxy resin from macromolecule MOLECULE DESIGN, using carbon fiber as reinforcing material, is prepared for flame retardant composite material of the epoxy resin as substrate.Have higher anti-flammability when the composite material is as electronic building brick, greatly reduces combustibility.
Description
Technical field
The present invention relates to a kind of composite material and preparation methods, it is more particularly related to a kind of epoxy resin
Flame retardant composite material and preparation method thereof as substrate, belongs to Epoxy Resin Technology field.
Background technique
Epoxy resin is a kind of thermosetting resin, because having excellent adhesion, the characteristics such as mechanical strength and electrical insulating property,
And be widely used in adhesive, coating and matrices of composite material etc..But due to pure epoxy resin there are matter crisp, endurance
Property, the disadvantages of heat resistance and shock resistance are poor, be subject to certain restrictions its application.Therefore the modification work to epoxy resin
The heat subject always studied.
State Intellectual Property Office discloses a Publication No. CN101412838A, entitled " encapsulation in 2009.04.22
With composition epoxy resin and use the electronic building brick of the composition " invention, which is related to a kind of encapsulating epoxy resin
Composition, the composition include epoxy resin (A), curing agent (B) and complex metal hydroxide (C), and have be greater than or
Fluidity (disc flow) equal to 80 millimeters.The resin combination is preferably used to encapsulate at least one of following
The semiconductor devices of feature, these features include: (a) envelope on the downside of the encapsulating material and semiconductor chip on the upside of semiconductor chip
The thickness of at least one of package material is less than or equal to 0.7 millimeter；(b) number of leads is greater than or equal to 80；(c) conductor length
More than or equal to 2 millimeters；(d) the weld pad spacing of semiconductor core on piece is less than or equal to 90 microns；(e) it is configured on mounting substrate
There is the thickness of the packaging part of semiconductor chip to be less than or equal to 2 millimeters；And (f) area of semiconductor chip is greater than or equal to 25
Square millimeter.
Above-mentioned composition epoxy resin is higher as electronic building brick combustibility, and there are security risks.
Summary of the invention
Present invention seek to address that epoxide resin material in the prior art there are the problem of, a kind of epoxy resin conduct is provided
The flame retardant composite material of substrate has higher anti-flammability, greatly reduces combustibility when the composite material is as electronic building brick.
In order to achieve the above-mentioned object of the invention, specific technical solution is as follows:
The flame retardant composite material of a kind of epoxy resin as substrate, it is characterised in that: including carbon fibre fabric and be coated in carbon fiber
Tie up the following raw materials in parts by weight on fabric:
35-55 parts of bisphenol A type epoxy resin E-51
10-30 parts of epoxidized butadiene
10-20 parts of curing agent 5506#
10-20 parts of diluent 664#
20-30 parts of fume colloidal silica
1-12 parts of magnesium hydroxide
2-6 parts of halogen-free flame-retardant polyamide
1-5 parts of aluminium triphosphate.
The preparation method of the flame retardant composite material of a kind of epoxy resin as substrate, it is characterised in that: including following technique
Step:
A, according to recipe requirements, epoxy resin E-51 is added in a mixer；
B, other components in addition to curing agent are sequentially added, in stirring 0.5-1.0h in high speed agitator；
C, the scattered material of step B is transferred on three-roller, curing agent is added and continues to roll mixing 0.5h；
D, the carbon fibre fabric for carrying out surface treatment through alcohol or acetone in advance is completed in mold carries out epoxy resin coating
5-8 layers；
E, mold is transferred in baking oven and carries out curing reaction: 70 DEG C of 2h, 100 DEG C of 2h, 120/2h, 140 DEG C of 2h by following techniques
And 160 DEG C of 2h.
F, the product of cured reaction is taken out.
Bring advantageous effects of the present invention:
The present invention is soft for substrate with epoxy resin from macromolecule MOLECULE DESIGN, using carbon fiber as reinforcing material, is prepared for ring
Flame retardant composite material of the oxygen resin as substrate.Have higher anti-flammability when the composite material is as electronic building brick, drops significantly
Low combustibility.
Specific embodiment
Embodiment 1
35 parts of bisphenol A type epoxy resin E-42
35 parts of bisphenol A type epoxy resin E-51
10 parts of epoxidized butadiene
10 parts of curing agent 524#
10 parts of curing agent 5506#
15 parts of diluent 664#
20 parts of fume colloidal silica
10 parts of nanometer calcium carbonate.
Embodiment 2
35 parts of bisphenol A type epoxy resin E-42
35 parts of bisphenol A type epoxy resin E-51
15 parts of epoxidized butadiene
20 parts of curing agent 524#
20 parts of curing agent 5506#
20 parts of diluent 664#
30 parts of fume colloidal silica
15 parts of nanometer calcium carbonate.
Embodiment 3
35 parts of bisphenol A type epoxy resin E-42
35 parts of bisphenol A type epoxy resin E-51
12.5 parts of epoxidized butadiene
15 parts of curing agent 524#
15 parts of curing agent 5506#
17.5 parts of diluent 664#
25 parts of fume colloidal silica
12.5 parts of nanometer calcium carbonate.
Embodiment 4
35 parts of bisphenol A type epoxy resin E-42
35 parts of bisphenol A type epoxy resin E-51
12 parts of epoxidized butadiene
11 parts of curing agent 524#
18 parts of curing agent 5506#
18 parts of diluent 664#
21 parts of fume colloidal silica
13.5 parts of nanometer calcium carbonate.
Claims (2)
1. a kind of flame retardant composite material of epoxy resin as substrate, it is characterised in that: including carbon fibre fabric and be coated in carbon
Following raw materials in parts by weight on fabric:
35-55 parts of bisphenol A type epoxy resin E-51
10-30 parts of epoxidized butadiene
10-20 parts of curing agent 5506#
10-20 parts of diluent 664#
20-30 parts of fume colloidal silica
1-12 parts of magnesium hydroxide
2-6 parts of halogen-free flame-retardant polyamide
1-5 parts of aluminium triphosphate.
2. a kind of preparation method of flame retardant composite material of the epoxy resin according to claim 1 as substrate, feature
It is: comprises the following steps that:
A, according to recipe requirements, epoxy resin E-51 is added in a mixer；
B, other components in addition to curing agent are sequentially added, in stirring 0.5-1.0h in high speed agitator；
C, the scattered material of step B is transferred on three-roller, curing agent is added and continues to roll mixing 0.5h；
D, the carbon fibre fabric for carrying out surface treatment through alcohol or acetone in advance is completed in mold carries out epoxy resin coating
5-8 layers；
E, mold is transferred in baking oven and carries out curing reaction: 70 DEG C of 2h, 100 DEG C of 2h, 120/2h, 140 DEG C of 2h by following techniques
And 160 DEG C of 2h.
F, the product of cured reaction is taken out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710986169.2A CN109694547A (en) | 2017-10-20 | 2017-10-20 | A kind of flame retardant composite material and preparation method thereof of epoxy resin as substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710986169.2A CN109694547A (en) | 2017-10-20 | 2017-10-20 | A kind of flame retardant composite material and preparation method thereof of epoxy resin as substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109694547A true CN109694547A (en) | 2019-04-30 |
Family
ID=66225378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710986169.2A Pending CN109694547A (en) | 2017-10-20 | 2017-10-20 | A kind of flame retardant composite material and preparation method thereof of epoxy resin as substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109694547A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102226033A (en) * | 2011-05-03 | 2011-10-26 | 广东生益科技股份有限公司 | Epoxy resin composition as well as prepreg and metal-foil-clad laminated board manufactured by using same |
| CN106633633A (en) * | 2016-10-20 | 2017-05-10 | 蓝星（成都）新材料有限公司 | Aramid composite material and preparation method thereof |
-
2017
- 2017-10-20 CN CN201710986169.2A patent/CN109694547A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102226033A (en) * | 2011-05-03 | 2011-10-26 | 广东生益科技股份有限公司 | Epoxy resin composition as well as prepreg and metal-foil-clad laminated board manufactured by using same |
| CN106633633A (en) * | 2016-10-20 | 2017-05-10 | 蓝星（成都）新材料有限公司 | Aramid composite material and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI701287B (en) | Engineered polymer-based electronic materials | |
| JP2001519838A (en) | Die adhesive or encapsulant of epoxysiloxane and polyepoxy resin | |
| KR20090092786A (en) | Semiconductor package, core layer material, buildup layer material, and encapsulation resin composition | |
| CN104531027A (en) | Epoxy resin encapsulating material as well as preparation method and application thereof | |
| JPH10212395A (en) | Resin composition and semiconductor device produced by using the same | |
| JPH03177450A (en) | Epoxy resin composition for semiconductor and production of semiconductor device | |
| KR101854501B1 (en) | Composition for encapsulating semiconductor device and semiconductor device encapsulated by using the same | |
| JP2015024945A (en) | Inorganic filler, and insulating resin composition, insulating film, prepreg and printed circuit board including the same | |
| JPWO2019235234A1 (en) | Method for producing glass-coated aluminum nitride particles and method for producing heat-dissipating resin composition containing the glass-coated aluminum nitride particles | |
| JP6329043B2 (en) | Epoxy resin composition for two-part casting and electronic component | |
| KR20150037114A (en) | Surface modified inorganic filler, method for manufacturing the same, epoxy resin composition and insulating film including the same | |
| JP2012054363A (en) | Sealing method of electronic component | |
| JP2017179361A (en) | Conductive coating and manufacturing method of shield package using the same | |
| CN102786858B (en) | Flame resistance epoxy resin powder paint | |
| JP6347644B2 (en) | Surface-modified silica powder and slurry composition | |
| WO2019124147A1 (en) | Glass-coated aluminum nitride particles, method for producing same, and heat dissipating resin composition containing same | |
| CN109694547A (en) | A kind of flame retardant composite material and preparation method thereof of epoxy resin as substrate | |
| CN106280275B (en) | A kind of high dielectric-epoxy plastic packaging material and its preparation method and application | |
| CN108034247A (en) | A kind of liquid capsulation material and preparation method thereof | |
| JP5862176B2 (en) | Selection method and manufacturing method of liquid epoxy resin composition, and manufacturing method of electronic component device | |
| JP6357089B2 (en) | Two-component casting epoxy resin composition, method for producing the epoxy resin composition, and coil component | |
| JP2002338230A (en) | Silica particles and resin composition | |
| JP6046894B2 (en) | Liquid encapsulant | |
| CN109694546A (en) | A kind of epoxy resin-base composite material and preparation method thereof | |
| JP6571923B2 (en) | Method for producing cured product by laser light irradiation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190430 |