CN109686693A - A kind of device and cleaning method for the fixed wafer of wet process organic washing technique - Google Patents
A kind of device and cleaning method for the fixed wafer of wet process organic washing technique Download PDFInfo
- Publication number
- CN109686693A CN109686693A CN201811628445.9A CN201811628445A CN109686693A CN 109686693 A CN109686693 A CN 109686693A CN 201811628445 A CN201811628445 A CN 201811628445A CN 109686693 A CN109686693 A CN 109686693A
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- CN
- China
- Prior art keywords
- wafer
- microscope carrier
- rear cover
- handle
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 45
- 238000004140 cleaning Methods 0.000 title claims abstract description 31
- 238000005406 washing Methods 0.000 title claims abstract description 17
- 239000007921 spray Substances 0.000 claims abstract description 17
- 239000013078 crystal Substances 0.000 claims abstract description 12
- 238000001179 sorption measurement Methods 0.000 claims abstract description 8
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 7
- 239000010935 stainless steel Substances 0.000 claims abstract description 7
- 238000007789 sealing Methods 0.000 claims abstract description 6
- 230000001681 protective effect Effects 0.000 claims abstract description 4
- 238000011084 recovery Methods 0.000 claims abstract description 4
- 238000005507 spraying Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000004065 semiconductor Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 239000012634 fragment Substances 0.000 abstract description 2
- 208000027418 Wounds and injury Diseases 0.000 abstract 1
- 208000014674 injury Diseases 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 27
- 238000011109 contamination Methods 0.000 description 9
- 239000002245 particle Substances 0.000 description 4
- 238000002604 ultrasonography Methods 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000012864 cross contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 239000006210 lotion Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Abstract
The present invention proposes a kind of device and cleaning method for the fixed wafer of wet process organic washing technique, under the premise of guaranteeing that semiconductor laser chip is injury-free in cleaning link, improves cleaning effect.The device includes: to be provided with several adsorption holes for adsorbing the microscope carrier of wafer, the rear cover fixed with microscope carrier sealing backside and the handle fixed with rear cover, microscope carrier front, and rear cover is closed the chamber to be formed and be connected to several adsorption holes with microscope carrier；There is hollow pipeline, hollow pipeline one end is connected to the chamber, and the other end connects vacuum pump by hose in handle；When use; operator one holds the handle of the device; in the protective cover with devil liquor recovery of stainless steel; another pistol sprays crystal column surface; both the validity of wet process organic washing technique had been ensure that; the fragment rate cleaned using spray gun is reduced again, improves the yields of product and the efficiency of production.
Description
Technical field
The present invention relates to a kind of devices and cleaning method for the fixed wafer of wet process organic washing technique.
Background technique
As semiconductor chip critical size constantly reduces, diameter wafer size constantly expands, and manufacturing process also becomes
In complication, therefore, in the production process of chip, particle, impurity, chemical substance of crystal column surface absorption etc. are stain, for
The yield rate and reliability effect of chip production are of crucial importance, must be very dry this requires entering the crystal column surface of every step process
Only.
On traditional 6 inches, 8 inches, 12 inches of production lines, equipment is fully-automatic equipment, without introducing
Excessive human factor, the relatively good realization of control that wafer is stain.For example, by using multi-groove type immersion, circulating filtration, spray
Leaching, bubbling, the mode of scrub etc..
And semiconductor laser chip is due to the limitation of its substrate watt, volume production is all 3 inch wafers at present, for clear
The equipment for washing 3 inch wafers is all semi-automatic or even manual operation equipment.Semiconductor laser chip, especially bar item produce
Product, it is desirable that in 10mm*1mm, 10mm*2mm even regional scope of 10mm*4mm, quantity and size for contamination, which have, to be compared
Strict requirements.Therefore the removal rate stain is always an important factor for influencing yield.
Because the contamination that personnel's operation, operation mode etc. factor introduce is more, it is generally the case that traditional manual operation
Often in a manner of being impregnated in cleaning solution or introduce ultrasound or million sound in the way of clean wafer surface contamination and
Grain: low frequency ultrasound cleaning capacity is strong, is commonly used to clean biggish contamination and particle, but the fatal disadvantage of low frequency ultrasound is easy
The epitaxial structure for damaging device, influences the reliability of device；High frequency ultrasound is poor to biggish contamination cleaning capacity, is suitable only for cleaning
Lesser particle；Megasonic cleaning also has certain requirement for staiing size, is also suitable only for lesser contamination, adds million
Whether acoustic equipment is expensive, and damaged to device unknown, is also limited only in research, examines at present for cost
Consider, practical application is less.
Summary of the invention
The purpose of the present invention is overcoming the shortcomings of semi-automatic at present and manual operation cleaning equipment, propose a kind of for wet
The device and cleaning method of the fixed wafer of method organic washing technique guarantee that semiconductor laser chip is not damaged in cleaning link
Under the premise of wound, cleaning effect is improved.
Solution of the invention is as follows:
This fixes the device of wafer for wet process organic washing technique, comprising:
For adsorbing the microscope carrier of wafer, microscope carrier front is provided with several adsorption holes；
Fixed rear cover, rear cover are closed the chamber to be formed and be connected to several adsorption holes with microscope carrier with microscope carrier sealing backside
Room；
The fixed handle with rear cover, the handle is interior to have hollow pipeline, and hollow pipeline one end is connected to the chamber, the other end
Vacuum pump is connect by hose.
Based on above scheme, the present invention has also further made following optimization:
It is realized and is tightly connected by O-ring seal between the microscope carrier back side and rear cover.
If being achieved a fixed connection between the microscope carrier back side and rear cover by bolt stem；If the bolt stem is uniformly distributed in
Rear cover plane leans on a circle of proximal edge.
Vacuum switch is provided on the handle.
The handle uses stainless steel tube.
The link position of the handle and rear cover is located at the side of rear cover.
Using the method for above-mentioned apparatus cleaning wafer, comprising the following steps:
The microscope carrier of the device is face-up laid flat, wafer to be cleaned is moved to the microscope carrier front of the device, it is ensured that
Wafer covers the vacuum hole on microscope carrier, and crystal round fringes are apart from microscope carrier edge 2-3mm；
Open vacuum switch, pull of vacuum 0.4-0.5kg；
Operator one holds the handle of the device, in the protective cover with devil liquor recovery of stainless steel, another hand
It holds spray gun to spray crystal column surface, corresponding watering can pressure limit 0.3-0.4kg；
As needed, pressure and spraying swath, the spray angles and distance of watering can are adjusted；It is finally completed wafer cleaning；
The microscope carrier of the device is face-up laid flat, vacuum switch is closed, the wafer after removing cleaning.
The invention has the following advantages that
The present invention is directed to cleaning process link, devises the fixture of fixed wafer, both ensure that wet process organic washing technique
Validity, and reduce using spray gun clean fragment rate, improve the yields of product and the efficiency of production.
Detailed description of the invention
Fig. 1 is the schematic diagram that the device of wafer is fixed for wet process organic washing technique.
Fig. 2 is the partial enlarged view of Fig. 1.
Fig. 3 is the schematic rear view at position shown in Fig. 2.
Fig. 4 is the side view of Fig. 3.
Drawing reference numeral explanation:
101- microscope carrier；102- rear cover；103- handle (stainless steel tube)；104-O type sealing ring；105- bolt；
Size 1 is the length of handle；Size 2 is the thickness of microscope carrier；Size 3 is the thickness of rear cover；Size 4 is microscope carrier with after
Lid seals the integral thickness after fixing, wherein the difference that the sum of size 3 and size 2 are subtracted with a thickness of size 4 of sealing ring.
Specific embodiment
The present invention will be described in detail with reference to the accompanying drawings and examples.
The present invention is directed to cleaning process link, devises the fixture of fixed wafer, as shown in Figures 1 to 4, the fixture packet
It includes:
For adsorbing the microscope carrier 101 (material of resistance to cleaning corrosion) of wafer, microscope carrier front is provided with several adsorption holes；
With microscope carrier sealing backside fixed rear cover 102, rear cover are closed to be formed with microscope carrier and be connected to several adsorption holes
Chamber；
The fixed handle 103 with rear cover, the handle is interior to have hollow pipeline, and hollow pipeline one end is connected to the chamber, separately
One end connects vacuum pump by hose.
It is realized and is tightly connected by O-ring seal 104 between the microscope carrier back side and rear cover, if being realized by bolt stem 105 solid
Fixed connection；If bolt stem is uniformly distributed in the circle that rear cover plane leans on proximal edge.
Specific cleaning operation process is as follows:
There is the wafer of contamination on surface, and perhaps the tweezers of the wafer with photoresist or sucking pen are moved to the load of the device
On platform, it is ensured that wafer covers the vacuum hole on microscope carrier, and crystal round fringes open vacuum switch, pull of vacuum apart from microscope carrier 2-3mm
For 0.4-0.5kg, then left hand picks up the handle of the device, related microscope carrier and wafer, in stainless steel with devil liquor recovery
In protective cover, crystal column surface is sprayed with spray gun, when using spray gun cleaning wafer surface, wafer will not be generated significantly
Displacement, the pressure and spraying swath of watering can are adjustable, N2Pressure limit 0.3-0.4kg.
The device can manually control rotational handle any direction angle and with the distance between watering can to adjust wafer
The spray solution that surface receives can also flexibly spray the position emphasis for having contamination.Wherein, clear used in watering can
Organic solution can be used in washing lotion, such as acetone, isopropanol, ethyl alcohol either diluted organic solution, is also possible to inorganic acid
Or the mixture of alkali.The cleaning solution that spray gun sprays reaches crystal column surface and has certain flushing strength, crystal column surface can be with
(small pollutant size is generally 2-10 μm, and big pollutant size is generally 10-50 μ for the contamination for taking away 2-50 μm of size and particle
M), while not the active graphical of crystal column surface is damaged, is sprayed by the angle direction and spray gun that control hand-held device
Time, can satisfy reduce stain demand.Such hand-holdable formula single-wafer processing unit and previous traditional slot type flower
Basket technique is compared, and the cross contamination in cleaning process can be not only reduced, and significantly improves the quality of cleaning, reduces batch wafer
The loss of yield rate in processing, can also greatly shorten the time of cleaning process, reduce the usage amount of cleaning solution.
Claims (7)
1. a kind of device for the fixed wafer of wet process organic washing technique characterized by comprising
For adsorbing the microscope carrier of wafer, microscope carrier front is provided with several adsorption holes；
Fixed rear cover, rear cover are closed the chamber to be formed and be connected to several adsorption holes with microscope carrier with microscope carrier sealing backside；
The fixed handle with rear cover, the handle is interior to have hollow pipeline, and hollow pipeline one end is connected to the chamber, and the other end passes through
Hose connects vacuum pump.
2. the device according to claim 1 for the fixed wafer of wet process organic washing technique, it is characterised in that: the load
It is realized and is tightly connected by O-ring seal between the platform back side and rear cover.
3. the device according to claim 1 for the fixed wafer of wet process organic washing technique, it is characterised in that: the load
If being achieved a fixed connection between the platform back side and rear cover by bolt stem；If the bolt stem is uniformly distributed in rear cover plane by near side (ns)
One circle of edge.
4. the device according to claim 1 for the fixed wafer of wet process organic washing technique, it is characterised in that: the hand
Vacuum switch is provided on handle.
5. the device according to claim 1 for the fixed wafer of wet process organic washing technique, it is characterised in that: the hand
Handle uses stainless steel tube.
6. the device according to claim 1 for the fixed wafer of wet process organic washing technique, it is characterised in that: the hand
The link position of handle and rear cover is located at the side of rear cover.
7. the method for application claim 1 described device cleaning wafer, comprising the following steps:
The microscope carrier of the device is face-up laid flat, wafer to be cleaned is moved to the microscope carrier front of the device, it is ensured that wafer
The vacuum hole on microscope carrier is covered, crystal round fringes are apart from microscope carrier edge 2-3mm；
Open vacuum switch, pull of vacuum 0.4-0.5kg；
Operator one holds the handle of the device, in the protective cover with devil liquor recovery of stainless steel, the hand-held spray of another
Rifle sprays crystal column surface, corresponding watering can pressure limit 0.3-0.4kg；
As needed, pressure and spraying swath, the spray angles and distance of watering can are adjusted；It is finally completed wafer cleaning；
The microscope carrier of the device is face-up laid flat, vacuum switch is closed, the wafer after removing cleaning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811628445.9A CN109686693A (en) | 2018-12-28 | 2018-12-28 | A kind of device and cleaning method for the fixed wafer of wet process organic washing technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811628445.9A CN109686693A (en) | 2018-12-28 | 2018-12-28 | A kind of device and cleaning method for the fixed wafer of wet process organic washing technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109686693A true CN109686693A (en) | 2019-04-26 |
Family
ID=66190204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811628445.9A Pending CN109686693A (en) | 2018-12-28 | 2018-12-28 | A kind of device and cleaning method for the fixed wafer of wet process organic washing technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109686693A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114156212A (en) * | 2021-11-26 | 2022-03-08 | 北京北方华创微电子装备有限公司 | Process chamber, semiconductor process equipment and maintenance method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10154678A (en) * | 1996-11-26 | 1998-06-09 | Hitachi Ltd | Cleaning of semiconductor wafer |
| KR20030089022A (en) * | 2002-05-15 | 2003-11-21 | 삼성전자주식회사 | Jig apparatus used to fixing wafer |
| CN202084522U (en) * | 2011-05-24 | 2011-12-21 | 北京通美晶体技术有限公司 | Wafer cleaning clamp |
| JP2014212253A (en) * | 2013-04-19 | 2014-11-13 | 東京エレクトロン株式会社 | Substrate cleaning method and substrate cleaning device |
| CN104241095A (en) * | 2014-07-31 | 2014-12-24 | 上海华力微电子有限公司 | Cleaning water gun |
| CN206774508U (en) * | 2017-04-25 | 2017-12-19 | 山东华光光电子股份有限公司 | A kind of semiconductor wafer shake cleaning flower stand |
| CN209232758U (en) * | 2018-12-28 | 2019-08-09 | 西安立芯光电科技有限公司 | A kind of device for the fixed wafer of wet process organic washing technique |
-
2018
- 2018-12-28 CN CN201811628445.9A patent/CN109686693A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10154678A (en) * | 1996-11-26 | 1998-06-09 | Hitachi Ltd | Cleaning of semiconductor wafer |
| KR20030089022A (en) * | 2002-05-15 | 2003-11-21 | 삼성전자주식회사 | Jig apparatus used to fixing wafer |
| CN202084522U (en) * | 2011-05-24 | 2011-12-21 | 北京通美晶体技术有限公司 | Wafer cleaning clamp |
| JP2014212253A (en) * | 2013-04-19 | 2014-11-13 | 東京エレクトロン株式会社 | Substrate cleaning method and substrate cleaning device |
| CN104241095A (en) * | 2014-07-31 | 2014-12-24 | 上海华力微电子有限公司 | Cleaning water gun |
| CN206774508U (en) * | 2017-04-25 | 2017-12-19 | 山东华光光电子股份有限公司 | A kind of semiconductor wafer shake cleaning flower stand |
| CN209232758U (en) * | 2018-12-28 | 2019-08-09 | 西安立芯光电科技有限公司 | A kind of device for the fixed wafer of wet process organic washing technique |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114156212A (en) * | 2021-11-26 | 2022-03-08 | 北京北方华创微电子装备有限公司 | Process chamber, semiconductor process equipment and maintenance method |
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