CN109685021A - Shield lower optical sensor chip dimpling lens array mould group, technique and display device - Google Patents
Shield lower optical sensor chip dimpling lens array mould group, technique and display device Download PDFInfo
- Publication number
- CN109685021A CN109685021A CN201811611499.4A CN201811611499A CN109685021A CN 109685021 A CN109685021 A CN 109685021A CN 201811611499 A CN201811611499 A CN 201811611499A CN 109685021 A CN109685021 A CN 109685021A
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- Prior art keywords
- optical sensor
- sensor chip
- mould group
- substrate
- lens array
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The present invention relates to optical devices technologies fields, and in particular to optical sensor chip dimpling lens array mould group, technique and display device under a kind of screen.The thickness that can effectively reduce mould group of the invention, it is most thin to arrive 0.5mm, it can be applied under stealthy optical fingerprint identification module or screen take pictures on photographing module, realize that ultrathin module is imaged in image under screen, is more advantageous under screen and designs arrangement space；Mould group does not need any bracket simultaneously, helps to further decrease mould group whole height；Micro lens arrays are protected on the inside of substrate, so that organizing die-filling group is simpler convenience, are not concerned about the risk of damage micro lens；The encapsulation of micro lens arrays and sensitive chip of the invention is all made of big machining process, cuts into single small unit again after the completion, more meets mass production.
Description
Technical field
The present invention relates to optical devices technologies fields, and in particular to optical sensor chip dimpling lens array mould under a kind of screen
Group, technique and display device.
Background technique
With the development of communication technology, mobile terminal is just being widely used in daily life and work.Currently,
Fingerprint identification device is both provided in mobile terminal, be unlocked by fingerprint recognition, password setting etc. all multioperations.In fingerprint
In identification device, capacitance type fingerprint identification device and optical fingerprint identification device are two kinds of more common fingerprint identification devices.
Although current optical fingerprint identification device has penetration capacity strong, equal spies can be put in any position under support screen
Point, but existing optical fingerprint identification device integral thickness is partially thick, influences it in the design and layout of interior of mobile phone, such as electricity
The layout in pond, the position that will lead to fingerprint module can be only placed at the partial below position of screen, not only limit electronic equipment screen and account for
The raising of ratio, also affects user experience.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of thickness that can effectively reduce mould group, be conducive to shield lower design cloth
Lower optical sensor chip dimpling lens array mould group, technique and display device are simply and easily shielded in office space, assembling.
In order to solve the above-mentioned technical problem, the technical solution adopted by the present invention to solve the technical problems is:
Optical sensor chip dimpling lens array mould group under a kind of screen, including substrate are provided with filter layer on the substrate, institute
It states and is provided with light shield layer on filter layer, multiple openings are evenly arranged on the light shield layer, the opening is in array structure, described
Micro lens is provided in opening, the substrate is connect by cofferdam with optical sensor chip, the cofferdam and optical sensor chip
Between be provided with weld pad, the optical sensor chip is equipped with groove, and the optical sensor chip back is provided with rewiring layer,
And the rewiring layer is connect with the weld pad of the bottom portion of groove.
Preferably, the substrate with a thickness of 0.1 ㎜ -1.5 ㎜；The light shield layer with a thickness of 0.1 μm -20 μm；It is described
The height of micro lens is 1 μm -100 μm, and diameter is 5 μm -1000；The height in the cofferdam is 5 μm -500 μm.
One embodiment of the application additionally provides a kind of processing work of optical sensor chip dimpling lens array mould group under screen
Skill includes the following steps:
Step 1: being arranged one layer of filter layer on a surface of a substrate, and one layer of shading is arranged on the filter surfaces of substrate
Layer is uniformly provided with multiple openings on light shield layer, and opening is in array structure, and micro lens is respectively provided in each opening, completes
The preparation of dimpling mirror；
Step 2: carrying out pressing by cofferdam with optical sensor chip for the substrate of dimpling mirror and be bonded, the optical sensor made
It is a cavity above the induction region of chip, is provided with weld pad between cofferdam and optical sensor chip；
Silicon removal above thinned and weld pad is carried out to the silicon face of optical sensor chip back, by the weldering of optical sensor chip
Acting as a cushion face exposes, and weld pad is exposed optical sensor chip back, and setting reroutes layer after weld pad is exposed, and weld pad is believed
Number draw；Optical sensor chip dimpling lens array mould splits under the screen completed the process is cut into single chip.
Preferably, the substrate with a thickness of 0.1 ㎜ -1.5 ㎜；The upper surface of the substrate is arranged in the filter layer
Or/and lower surface.
Preferably, filter layer is set in the one side of the substrate, light ray anti-reflection layer is arranged in another side.
Preferably, the material of the light shield layer can be organic film or metal film；The light shield layer with a thickness of 0.1 μ
m-20μm。
Preferably, the micro lens bottom shape is round or rectangular, and the height of the micro lens is generally 1 μm -100
μm, diameter is generally 5 μm -1000 μm, and the spacing between neighboring micro head is 10 μm -10000 μm.
Preferably, in step 2, the substrate and optical sensor chip bonding of dimpling mirror be can be used on the substrate of dimpling mirror
Production cofferdam, on optical sensor chip make cofferdam or will be fabricated separately cofferdam and substrate, optical sensor chip respectively into
Line unit closes.
Preferably, the weld pad is by carrying out photoetching and dry etching mode or laser mode exposure to silicon face；The weldering
The exposed structure of pad is any one in multi-step structure, separate unit stage structure or single hole arrangements.
One embodiment of the application additionally provides a kind of display device, including optical sensor core under screen and above-mentioned screen
Piece dimpling lens array mould group, optical sensor chip dimpling lens array mould group is located at the flexible circuit board with reinforcing chip under the screen
On, the screen is located under the screen in optical sensor chip dimpling lens array mould group, optical sensor chip dimpling under the screen
The surrounding of lens array mould group is provided with shading glue.
Beneficial effects of the present invention:
The thickness that can effectively reduce mould group of the invention, it is most thin to arrive 0.5mm, it can be applied to stealthy optical finger print identification mould
It takes pictures on photographing module under block or screen, realizes that ultrathin module is imaged in image under screen, be more advantageous to the lower design arrangement space of screen；
Mould group does not need any bracket simultaneously, helps to further decrease mould group whole height；Micro lens arrays are protected in substrate
Side is not concerned about the risk of damage micro lens so that organizing die-filling group is simpler convenience；Micro lens arrays of the invention and photosensitive
The encapsulation of chip is all made of big machining process, cuts into single small unit again after the completion, more meets mass production.
Detailed description of the invention
Fig. 1 is optical sensor chip dimpling lens array mould group and display device structure signal under a kind of screen of the invention
Figure.
Fig. 2 is antireflection layer structure schematic diagram of the invention.
Fig. 3 is the structural schematic diagram of micro lens of the invention on substrate.
Fig. 4 is the structural schematic diagram of filter layer of the invention on substrate.
Fig. 5 is dimpling mirror structural schematic diagram of the invention.
Fig. 6 is substrate and optical sensor chip bonding structural schematic diagram of the invention.
Fig. 7 is the multi-step structural schematic diagram of exposure weld pad of the invention.
Fig. 8 is the separate unit stage structure schematic diagram of exposure weld pad of the invention.
Fig. 9 is the single hole arrangements schematic diagram of exposure weld pad of the invention.
Figure 10 be multi-step structure screen under optical sensor chip dimpling lens array mould group schematic diagram.
Figure 11 be separate unit stage structure screen under optical sensor chip dimpling lens array mould group schematic diagram.
Figure label explanation: 101, substrate；102, induction region；103, cofferdam；104, weld pad；105, optical sensor core
Piece；106, it reroutes；107, tin ball；201, filter layer；202, light shield layer；203, micro lens；204- antireflection layer；301, reinforcement
Piece；302, flexible circuit board；303, shading glue；304, screen；
Specific embodiment
The present invention will be further explained below with reference to the attached drawings and specific examples, so that those skilled in the art can be with
It more fully understands the present invention and can be practiced, but illustrated embodiment is not as a limitation of the invention.
Referring to Fig.1, shown in Fig. 7, Fig. 8, Fig. 9, optical sensor chip dimpling lens array mould group under a kind of screen, including substrate
101, filter layer 201 is provided on the substrate 101, and light shield layer 202, the light shield layer 202 are provided on the filter layer 201
On be evenly arranged with multiple openings, the opening is in array structure, is provided with micro lens 203, the substrate 101 in the opening
It is connect by cofferdam 103 with optical sensor chip 105, is provided with weld pad between the cofferdam 103 and optical sensor chip 105
104, the optical sensor chip is equipped with groove, and 105 back side of optical sensor chip is provided with 106 layers of rewiring, and institute
106 layers of rewiring is stated to connect with the weld pad 104 of the bottom portion of groove.
The substrate 101 can be organic film, quartz glass or other flaky materials for meeting optical characteristics.
The substrate 101 with a thickness of 0.1 ㎜ -1.5 ㎜；The light shield layer 202 with a thickness of 0.1 μm -20 μm；It is described micro-
The height of camera lens 203 is 1 μm -100 μm, and diameter is 5 μm -1000；The height in the cofferdam 103 is 5 μm -500 μm.
Mould group height of the invention is most thin can to accomplish 0.5 ㎜ -0.8mm, with existing finished product module (existing finishing die
Block height is all in 0.8 ㎜ -1.1mm) height is effectively reduced, it is more advantageous to the lower design arrangement space of screen.
Refering to Fig. 4, required to reach to filter, the filter layer 201 be arranged in the substrate 101 upper surface or/and
Lower surface.
Referring to Fig.2, filter layer 201 is arranged in the one side in the substrate 101, light ray anti-reflection layer 204 is arranged in another side.
The material of the light shield layer 202 can be organic film or metal film；The technique of the light shield layer 202 can be steaming
Plating, sputtering, silk-screen printing, rotary coating, spraying, the single such as semiconductor lithography technique or the compound realization of kinds of processes.
203 bottom shape of micro lens is circle or rectangular, and the height of the micro lens 203 is generally 1 μm of -100 μ
M, diameter are generally 5 μm -1000 μm, and the micro lens 203 is array, can be single camera lens, can also there is camera lens
Difference arrangement, the size adjustable of micro lens 203 is whole, and the spacing between neighboring micro head 203 is 10 μm -10000 μm.
Refering to Fig. 6, in step 2, the substrate 101 of dimpling mirror is bonded with optical sensor chip 105 be can be used in dimpling mirror
Cofferdam 103 is made on substrate 101, is made cofferdam 103 on optical sensor chip 105 or will be fabricated separately cofferdam 103 and base
Plate 101, optical sensor chip 105 are bonded respectively.
The technique in the cofferdam 103 of realization can be to be made on glass, can be made on optical sensor wafer, can also be with
It is cofferdam 103 to be fabricated separately, and be bonded respectively with glass, optical sensor wafer.
The weld pad 104 exposure by way of carrying out photoetching or dry etching to silicon face；Refering to Fig. 7, Fig. 8, Fig. 9,
The groove for exposing the weld pad 104 is provided on the silicon face of the optical sensor chip 105, the groove is multi-step knot
Any one in structure, separate unit stage structure or single hole arrangements.
Referring to Fig.2, Fig. 4, Fig. 5, Fig. 6, Fig. 7, one embodiment of the application additionally provides optical sensor core under a kind of screen
The processing technology of piece dimpling lens array mould group, includes the following steps:
Step 1: one layer of filter layer 201 is set on a surface of the substrate 101, on 201 surface of filter layer of substrate 101
One layer of light shield layer 202 is set, multiple openings are uniformly provided on light shield layer 202, opening is in array structure, in each opening
It is respectively provided with micro lens 203, completes the preparation of dimpling mirror；
Step 2: the substrate 101 of dimpling mirror is subjected to pressing by cofferdam 103 with optical sensor chip 105 and is bonded, is made
It is a cavity above the induction region 102 of optical sensor chip 105, weldering is provided between cofferdam 103 and optical sensor chip 105
Pad 104；
The silicon face at 105 back side of optical sensor chip be thinned and the silicon of 104 top of weld pad removes, by optical sensor core
104 back side of weld pad of piece exposes, and weld pad 104 is exposed 105 back side of optical sensor chip, is set after weld pad 104 is exposed
106 layers of rewiring is set, 104 signal of weld pad is drawn；By optical sensor chip dimpling lens array mould splits under the screen completed the process
It is cut into single chip.
The application further can reroute 106 layers of upper setting tin ball 107, can facilitate subsequent and circuit board welding, together
When can also be also directly welded on circuit board according to different demands.
Shield the mode that lower optical sensor chip dimpling lens array mould splits is cut can be break bar machine cuts or laser
Cutting.
The main function of the filter layer 201 is the light for filtering out particular range of wavelengths, allows the light of its all band can be into
Enter；The antireflection layer 204 increases light amount of incident for reducing light in the reflection of glass interface.
The micro lens 203 can pass through the photoetching and hot technique of backflow system of stamping technique or organic optical materials
Standby, the cofferdam 103 can be photosensitive-ink, and dry film, glass, silicon substrate 101 or organic substrate 101 are made, in step 2
Cofferdam 103 can be located on filter layer 201, can also be located on antireflection layer 204.The height in cofferdam 103 can be burnt according to imaging
It is adjusted away from needs.
The silicon face at 105 back side of optical sensor chip can be carried out thinned by way of mechanical lapping, make optical sensor chip
105 thickness is reduced to 50um-300um, and weld pad 104 exposes optical sensor chip by techniques such as photoetching and dry etchings
105 back side, the exposure chamber of weld pad 104 can be multi-step structure, separate unit stage structure and single hole arrangements, and pass through light
It carves, wet etching process is completed to reroute 106 layers, is drawn 104 signal of weld pad with this.
The light shield layer 202 prevents it from penetrating primarily to blocking the light of certain wavelength, while in light shield layer
The opening of indefinite quantity is designed on 202, is used for subsequent production dimpling mirror.
Refering to Fig. 4, the substrate 101 with a thickness of 0.1 ㎜ -1.5 ㎜；It is required to reach to filter, the filter layer 201
The upper surface or/and lower surface of the substrate 101 are set.
Referring to Fig.2, filter layer 201 is arranged in the one side in the substrate 101, light ray anti-reflection layer 204 is arranged in another side.
The material of the light shield layer 202 can be organic film or metal film；The light shield layer 202 with a thickness of 0.1 μm-
20 μm, the technique of the light shield layer 202 can be vapor deposition, sputtering, silk-screen printing, rotary coating, spraying, and semiconductor lithography etc. is single
Kind technique or the compound realization of kinds of processes.
203 bottom shape of micro lens is circle or rectangular, and the height of the micro lens 203 is generally 1 μm of -100 μ
M, diameter are generally 5 μm -1000 μm, and the micro lens 203 is array, can be single camera lens, can also there is camera lens
Difference arrangement, the size adjustable of micro lens 203 is whole, and the spacing between neighboring micro head 203 is 10 μm -10000 μm.
Refering to Fig. 6, in step 2, the substrate 101 of dimpling mirror is bonded with optical sensor chip 105 be can be used in dimpling mirror
Cofferdam 103 is made on substrate 101, is made cofferdam 103 on optical sensor chip 105 or will be fabricated separately cofferdam 103 and base
Plate 101, optical sensor chip 105 are bonded respectively.
The technique in the cofferdam 103 of realization can be to be made on glass, can be made on optical sensor wafer, can also be with
It is cofferdam 103 to be fabricated separately, and be bonded respectively with glass, optical sensor wafer.
The weld pad 104 is by carrying out photoetching and dry etching mode or laser mode exposure to silicon face；Refering to Fig. 7, figure
8, Fig. 9, the exposed structure of the weld pad 104 is any one in multi-step structure, separate unit stage structure or single hole arrangements
Refering to fig. 1, Figure 10, Figure 11, one embodiment of the application additionally provide a kind of display device, including screen 304
With optical sensor chip dimpling lens array mould group under above-mentioned screen, optical sensor chip dimpling lens array mould group is located under the screen
On flexible circuit board 302 with reinforcing chip 301, the screen 304 is located at optical sensor chip dimpling lens array under the screen
In mould group, the surrounding of optical sensor chip dimpling lens array mould group is provided with shading glue 303 under the screen.
The display device uses application surface attaching method, by resistance capacitance, connector and the lower optical sensor core of screen
In the attachment to the flexible circuit board 302 with reinforcing chip 301 of piece dimpling lens array mould group, realizes and be electrically connected, it is above-mentioned in completion
After attachment, the surrounding of optical sensor chip dimpling lens array mould group makes shading glue 303 under optical screen, prevents side light from penetrating
Into chip interior；The module of above-mentioned completion is finally fixed to 304 lower section of screen by associated adhesives materials such as optical cements.
The thickness that can effectively reduce mould group of the invention, it is most thin to arrive 0.5mm, for adapting to the space requirement shielded comprehensively,
Image under screen 304 may be implemented, ultrathin module is imaged, be more advantageous to the lower design arrangement space of screen, realizes that the lower stealthy optics of screen refers to
It takes pictures under line identification module scheme demand or screen 304 photographing module；Mould group does not need any bracket simultaneously, facilitates further
Reduce mould group whole height；203 array of micro lens is protected in 101 inside of substrate, so that organizing die-filling group is simpler convenience,
It is not concerned about the risk of damage micro lens 203；The encapsulation of 203 array of micro lens and sensitive chip of the invention is all made of large stretch of processing
Technique cuts into single small unit again after the completion, more meets mass production.
Embodiment described above is only to absolutely prove preferred embodiment that is of the invention and being lifted, protection model of the invention
It encloses without being limited thereto.Those skilled in the art's made equivalent substitute or transformation on the basis of the present invention, in the present invention
Protection scope within.Protection scope of the present invention is subject to claims.
Claims (10)
1. optical sensor chip dimpling lens array mould group under a kind of screen, which is characterized in that including substrate, be provided on the substrate
Filter layer is provided with light shield layer on the filter layer, and multiple openings are evenly arranged on the light shield layer, and the opening is in array
Structure is provided with micro lens in the opening, and the substrate is connect by cofferdam with optical sensor chip, the cofferdam and optics
Weld pad is provided between induction chip, the optical sensor chip is equipped with groove, and the optical sensor chip back is provided with
Layer is rerouted, and the rewiring layer is connect with the weld pad of the bottom portion of groove.
2. as described in claim 1 shield lower optical sensor chip dimpling lens array mould group, which is characterized in that the thickness of the substrate
Degree is 0.1 ㎜ -1.5 ㎜；The light shield layer with a thickness of 0.1 μm -20 μm；The height of the micro lens is 1 μm -100 μm, diameter
It is 5 μm -1000；The height in the cofferdam is 5 μm -500 μm.
3. the processing technology of optical sensor chip dimpling lens array mould group under a kind of screen, which comprises the steps of:
Step 1: being arranged one layer of filter layer on a surface of a substrate, and one layer of light shield layer is arranged on the filter surfaces of substrate,
Multiple openings are uniformly provided on light shield layer, opening is in array structure, and micro lens is respectively provided in each opening, completes dimpling mirror
Preparation；
Step 2: carrying out pressing by cofferdam with optical sensor chip for the substrate of dimpling mirror and be bonded, the optical sensor chip made
Induction region above be a cavity, be provided with weld pad between cofferdam and optical sensor chip；
Silicon removal above thinned and weld pad is carried out to the silicon face of optical sensor chip back, the weld pad of optical sensor chip is carried on the back
Face exposes, and weld pad is exposed optical sensor chip back, and setting reroutes layer after weld pad is exposed, and weld pad signal is drawn
Out；Optical sensor chip dimpling lens array mould splits under the screen completed the process is cut into single chip.
4. the processing technology as claimed in claim 3 for shielding lower optical sensor chip dimpling lens array mould group, which is characterized in that institute
State substrate with a thickness of 0.1 ㎜ -1.5 ㎜；The upper surface or/and lower surface of the substrate is arranged in the filter layer.
5. the processing technology as claimed in claim 3 for shielding lower optical sensor chip dimpling lens array mould group, which is characterized in that
Filter layer is arranged in the one side of the substrate, and light ray anti-reflection layer is arranged in another side.
6. the processing technology as claimed in claim 3 for shielding lower optical sensor chip dimpling lens array mould group, which is characterized in that institute
The material for stating light shield layer can be organic film or metal film；The light shield layer with a thickness of 0.1 μm -20 μm.
7. the processing technology as claimed in claim 3 for shielding lower optical sensor chip dimpling lens array mould group, which is characterized in that institute
Micro lens bottom shape is stated to be round or rectangular, the height of the micro lens is generally 1 μm -100 μm, diameter be generally 5 μm -
1000 μm, the spacing between neighboring micro head is 10 μm -10000 μm.
8. the processing technology as claimed in claim 3 for shielding lower optical sensor chip dimpling lens array mould group, which is characterized in that step
In rapid two, the substrate and optical sensor chip bonding of dimpling mirror can be used makes cofferdam, in optics sense on the substrate of dimpling mirror
It answers to make cofferdam on chip or cofferdam will be fabricated separately and be bonded respectively with substrate, optical sensor chip.
9. the processing technology as claimed in claim 3 for shielding lower optical sensor chip dimpling lens array mould group, which is characterized in that institute
Weld pad is stated by carrying out photoetching and dry etching mode or laser mode exposure to silicon face；The exposed structure of the weld pad is more
Any one in stage structure, separate unit stage structure or single hole arrangements.
10. a kind of display device, which is characterized in that including screen and optics under the screen as described in any one of claims 1 to 2
Induction chip dimpling lens array mould group, optical sensor chip dimpling lens array mould group is located at the flexibility with reinforcing chip under the screen
On circuit board, the screen is located under the screen in optical sensor chip dimpling lens array mould group, optical sensor core under the screen
The surrounding of piece dimpling lens array mould group is provided with shading glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811611499.4A CN109685021A (en) | 2018-12-27 | 2018-12-27 | Shield lower optical sensor chip dimpling lens array mould group, technique and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811611499.4A CN109685021A (en) | 2018-12-27 | 2018-12-27 | Shield lower optical sensor chip dimpling lens array mould group, technique and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109685021A true CN109685021A (en) | 2019-04-26 |
Family
ID=66190513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811611499.4A Withdrawn CN109685021A (en) | 2018-12-27 | 2018-12-27 | Shield lower optical sensor chip dimpling lens array mould group, technique and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109685021A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110289218A (en) * | 2019-06-18 | 2019-09-27 | 北京猎户星空科技有限公司 | A kind of integrated circuit plate producing process and integrated circuit board |
| CN110534539A (en) * | 2019-09-03 | 2019-12-03 | 豪威光电子科技（上海）有限公司 | Lens module and forming method thereof |
| CN110956163A (en) * | 2019-12-27 | 2020-04-03 | 苏州科阳光电科技有限公司 | Fingerprint identification module, terminal equipment and preparation method of fingerprint identification module |
-
2018
- 2018-12-27 CN CN201811611499.4A patent/CN109685021A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110289218A (en) * | 2019-06-18 | 2019-09-27 | 北京猎户星空科技有限公司 | A kind of integrated circuit plate producing process and integrated circuit board |
| CN110534539A (en) * | 2019-09-03 | 2019-12-03 | 豪威光电子科技（上海）有限公司 | Lens module and forming method thereof |
| CN110956163A (en) * | 2019-12-27 | 2020-04-03 | 苏州科阳光电科技有限公司 | Fingerprint identification module, terminal equipment and preparation method of fingerprint identification module |
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Application publication date: 20190426 |