CN110534539A - Lens module and forming method thereof - Google Patents
Lens module and forming method thereof Download PDFInfo
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- CN110534539A CN110534539A CN201910829484.3A CN201910829484A CN110534539A CN 110534539 A CN110534539 A CN 110534539A CN 201910829484 A CN201910829484 A CN 201910829484A CN 110534539 A CN110534539 A CN 110534539A
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- lens module
- light shield
- shield layer
- end surfaces
- camera lens
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Classifications
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14632—Wafer-level processed structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
Abstract
The present invention provides a kind of lens modules and forming method thereof, comprising: provides camera lens and imaging sensor, the side of described image sensor is configured with circuit substrate, forms the first light shield layer on the surface of the circuit substrate；The camera lens is bonded with the other side of described image sensor, the circuit substrate is the first end surfaces away from the surface of described image sensor, and surface of the camera lens far from described image sensor is the second end surfaces；Form the second light shield layer, the sidewall surfaces of connection first end surfaces and second end surfaces of the second light shield layer covering lens module.The first light shield layer being arranged by the surface of circuit substrate, and the second light shield layer of the sidewall surfaces setting of lens module, light source is stopped to penetrate the sidewall surfaces and the first end surfaces (non-incidence surface) of lens module, it avoids generating background spurious optical phenomenon, improves the image quality of lens module.
Description
Technical field
The present invention relates to camera module field, in particular to a kind of lens module and forming method thereof.
Background technique
Lens module has the characteristics that small in size, powerful, and lens module primary clustering includes camera lens and image sensing
Device.Its main operational principle are as follows: scenery projects image sensor surface by the optical imagery that camera lens generates and switchs to electric signal.
Camera lens is formed by different lens combinations, is the important component of lens module, is played to imaging effect very vital
Effect.Camera lens mainly determines image sharpness (the clear degree of picture, light, far and near scape), image display range, while influencing highest
Pixel.Imaging sensor is the nucleus module of lens module, converts electric signal for light.
Lens module is usually used in medical speculum product, such as medical electronic endoscope insertion body cavity and internal organs inner cavity
Directly to be observed, the usual dull thread in internal organs inner cavity enters, when need to configure light source near lens module for sight glass operation
Illumination, and medical electronic endoscope requires low-profile, therefore lens module in medical electronic endoscope and light source certainly will be away from
Close from relatively, the Qiang Guanghui of light source penetrates the non-incidence surface of lens module, causes lens module that can generate when image receives serious
Background spurious optical phenomenon, seriously affected the image quality of lens module.
Summary of the invention
The purpose of the present invention is to provide a kind of lens modules and forming method thereof, to solve the background spurious of lens module
Optical issue, to promote the image quality of lens module.
In order to solve the above technical problems, the present invention provides a kind of forming method of lens module, comprising:
Camera lens and imaging sensor are provided, the side of described image sensor is configured with circuit substrate, in the circuit base
The surface of plate forms the first light shield layer；
The camera lens is bonded with the other side of described image sensor, the circuit substrate deviates from described image sensor
Surface be the first end surfaces, the camera lens far from described image sensor surface be the second end surfaces；
Form the second light shield layer, connection first end surfaces of the second light shield layer covering lens module and described the
The sidewall surfaces of two end surfaces.
Further, second light shield layer also covers the neighboring area of second end surfaces.
Further, on second end surfaces, the shape of second light shield layer includes Q-RING, outer boundary for just
Shape and inner boundary are circular figure, outer boundary is rectangular and inner boundary be trapezoidal figure and outer boundary be it is rectangular and interior
Boundary is any one in the figure for the closed loop line that straight line and camber line form.
Further, the step of the second light shield layer of formation includes:
Patterned photoresist layer is formed, the patterned photoresist layer covers the light incidence section domain of the camera lens；
Form the second light shield layer, the connection that second light shield layer covers the lens module first end surfaces and institute
State the region in the sidewall surfaces and second end surfaces of the second end surfaces other than the patterned photoresist layer；
The patterned photoresist layer is removed, the light incidence section domain of the camera lens is exposed.
Further, the forming method of lens module, further includes: form third light shield layer, the third light shield layer covering
The neighboring area of first end surfaces.Further, the other side of described image sensor configures matcoveredn, the camera lens
It is bonded with the protective layer.
Further, it is formed before the second light shield layer, further includes:
The first protective layer is formed, first protective layer covers second end surfaces.
Further, the camera lens is bonded with the other side of described image sensor, using the single camera lens and list
The method of a described image sensor bonding.
Further, the camera lens is bonded with the other side of described image sensor, using wafer scale preparation method, tool
Body includes:
Imaging sensor wafer is provided, a side surface of described image sensor wafer is formed with protective layer,
Another side surface of described image sensor wafer is formed with circuit substrate, and described image sensor wafer includes more
A imaging sensor；The first light shield layer is formed on the surface of the circuit substrate；
Camera lens wafer is provided, the camera lens wafer includes a plurality of lenses, and the camera lens is corresponding with described image sensor to be set
It sets；
By described image sensor wafer and the camera lens wafer bonding；
It cuts the described image sensor wafer of bonding and the camera lens wafer to obtain the single lens module.
Further, it is formed before the second light shield layer further include:
The fixed lens module, is fixed on a fixed cell for the lens module, is provided on fixed cell multiple
Aperture, the lens module are arranged in a one-to-one correspondence with the aperture, and the aperture bottom is provided with adhesion layer, the lens module
First end surfaces cover the aperture, be provided with soldered ball on the circuit substrate, the soldered ball is placed in the aperture
In and be fixed on the adhesion layer.
Further, it is formed before the second light shield layer, further includes:
Form the second protective layer, the soldered ball or pad of the second protective layer covering circuit substrate；
It is formed after the second light shield layer, further includes:
The lens module is removed from the fixed cell, and removes second protective layer.
Further, the method for forming the second light shield layer includes: by the material spraying of second light shield layer to the side
Wall surface immerses the sidewall surfaces in the material solution of second light shield layer.
Further, the material of second light shield layer includes any one in carbon dust, dyestuff or metal powder or two
Kind or more combination.
The present invention also provides a kind of lens modules, and the forming method of lens module as described above is made.
Exist compared with prior art it is following the utility model has the advantages that
In lens module provided by the invention and forming method thereof, the first light shield layer is formed on the surface of circuit substrate；Electricity
Base board is the first end surfaces away from the surface of imaging sensor；Surface of the camera lens far from described image sensor is second
End surfaces, the second light shield layer cover the sidewall surfaces of connection the first end surfaces and the second end surfaces of lens module.Pass through circuit
Second light shield layer of the sidewall surfaces setting of first light shield layer and lens module on the surface of substrate, stops light source to penetrate mirror
The sidewall surfaces and the first end surfaces (non-incidence surface) of head mould group avoid generating background spurious optical phenomenon, improve lens module
Image quality.
Detailed description of the invention
Fig. 1 is the flow diagram of the forming method of the lens module of the embodiment of the present invention；
Fig. 2 to Figure 11 b is each step schematic diagram of forming method of the lens module of one embodiment of the invention；
Figure 12 to Figure 19 b is each step schematic diagram of forming method of the lens module of another embodiment of the present invention.
Figure 20 to Figure 26 is each step schematic diagram of forming method of the lens module of further embodiment of this invention.
Description of symbols:
10- camera lens wafer；20- imaging sensor wafer；11- camera lens；211- protective layer；212- imaging sensor；214-
Soldered ball；31- lens module；The first end surfaces of 31a-；The second end surfaces of 31b-；40- fixed cell；41- substrate；42- adhesion layer；
The first light shield layer of 51-；The second light shield layer of 52-；53- third light shield layer；The first protective layer of 61-；The second protective layer of 62-；A- aperture.
Specific embodiment
Lens module proposed by the present invention and forming method thereof is made below in conjunction with the drawings and specific embodiments further detailed
It describes in detail bright.According to following explanation and claims, advantages and features of the invention will be become apparent from.It should be noted that attached drawing is equal
Using very simplified form and using non-accurate ratio, only to facilitate, lucidly aid in illustrating the embodiment of the present invention
Purpose.
Fig. 1 is the flow diagram of the forming method of the lens module of the present embodiment.As shown in Figure 1, a kind of lens module
Forming method, comprising the following steps:
Step S1, camera lens and imaging sensor are provided, the side of described image sensor is configured with circuit substrate, described
The surface of circuit substrate forms the first light shield layer；
Step S2, the camera lens is bonded with the other side of described image sensor, the circuit substrate deviates from the figure
As sensor surface be the first end surfaces, the camera lens far from described image sensor surface be the second end surfaces；
Step S3, the second light shield layer, the connection first end that second light shield layer covers the lens module are formed
The sidewall surfaces on surface and second end surfaces.
Pass through the second shading of the sidewall surfaces setting of first light shield layer and lens module on the surface of circuit substrate
Layer stops light source to penetrate the sidewall surfaces and the first end surfaces (non-incidence surface) of lens module, avoids generation background stray light existing
As improving the image quality of lens module.
It is situated between in more detail below with reference to forming method of the Fig. 2 to Figure 11 b to lens module disclosed in the present embodiment
It continues.
Step S1 and camera lens in step S2 and imaging sensor can be individual devices, can also be wafer scale device
Part.
As shown in Figures 2 and 3, camera lens and imaging sensor can be individual devices, provide camera lens 11 and imaging sensor
212, the side of described image sensor 212 is configured with circuit substrate (not shown), forms the on the surface of the circuit substrate
One light shield layer 51；Specifically, the other side of described image sensor 212 configures matcoveredn 211, it can in imaging sensor 212
Including such as photodiode, electric signal is converted by received optical signal, circuit substrate is used for electric signal amplification, returns
One changes output, EMC electromagnetic interference shield etc..Protective layer 211 covers the surface of described image sensor 212, described for protecting
Imaging sensor 212, prevent damage or dust pollution etc., protective layer 211 be, for example, glassy layer, glassy layer be it is transparent, protecting
While protecting 212 surface of imaging sensor, light-transmissive glassy layer exposes to imaging sensor 212, does not influence image sensing
Device 212 receives light.First light shield layer 51 is, for example, black-out paint, can be green or black, color is with no restrictions.Circuit substrate
Surface can be formed with soldered ball 214, be also possible to pad form.
As shown in figure 4, the other side of described image sensor 212 configures matcoveredn 211, the camera lens 11 and the guarantor
Sheath 211 is bonded.Bonding glue can be used when bonding, glue can be hot-setting adhesive or UV glue.Camera lens 11, protective layer 211 and image
Sensor 212 stacks gradually setting, and circuit substrate is the first end surfaces 31a away from the surface of imaging sensor 212, and camera lens 11 is carried on the back
Surface from protective layer 211 (or far from described image sensor 212) is the second end surfaces 31b.
As shown in Figure 5 and Figure 6, camera lens and imaging sensor can also be wafer scale device.
Imaging sensor wafer 20 is provided, a side surface of described image sensor wafer 20 is formed with protective layer 211, protects
Sheath 211 is, for example, glassy layer；Another side surface of described image sensor wafer 20 is formed with circuit substrate (not shown), In
The first light shield layer 51 is arranged in the surface of the circuit substrate；Described image sensor wafer 20 includes multiple images sensor.
Camera lens wafer 10 is provided, the camera lens wafer 10 includes a plurality of lenses, the camera lens and described image sensor pair
It should be arranged；
As shown in Figure 7 and Figure 8, imaging sensor wafer 20 and camera lens wafer 10 are bonded；By the imaging sensor of bonding
10 scribing of wafer 20 and camera lens wafer, obtains a plurality of lenses mould group 31.Wafer scale device cuts the lens module 31 to be formed and list
The lens module structure having the same that a camera lens and single image sensor bond together to form, details are not described herein.
As shown in Figure 8 and Figure 9, lens module 31 is fixed on a fixed cell, on fixed cell by fixed lens mould group 31
Multiple aperture A are provided with, lens module 31 is arranged in a one-to-one correspondence with aperture, and aperture bottom has an adhesion layer, and the of lens module 31
End surface 31a covers aperture A and soldered ball 214 is placed in aperture A, i.e., the bore size of aperture A is between imaging sensor 21
Bottom outer-edge to outermost soldered ball outer rim, soldered ball 214 is fixed on adhesion layer.It is being adhered to by the way that soldered ball 214 to be adhered fixed
Being fixed temporarily to lens module 31 is realized on layer, in order to subsequent technique.Adhesion layer has certain viscosity, but adhesion is to quilt
On fixture (when external force extracts fixation, above adhesion to fixation such as lens module 31).Pass through camera lens mould
The first end surfaces 31a covering aperture A of group 31 is avoided with protecting the first end surfaces 31a when being subsequently formed the second light shield layer,
The soldered ball 214 that second light shield layer covers the first end surfaces 31a is made troubles to subsequent product welding use.
Specifically, fixed cell 40 may include substrate 41 and the adhesion layer 42 on substrate 41, can be set on adhesion layer 42
Multiple aperture A are set, aperture A can be array distribution, and aperture A is, for example, blind hole, and soldered ball 214 is placed in blind hole and is fixed on blind hole
On the adhesion layer 42 of bottom.
Fixed cell 40 may be that multiple blind holes are arranged on substrate 41, and adhesion layer is arranged in the bottom of each blind hole,
Such as adhesion layer such as colloid can be formed uniformly in each blind via bottom by coating (spraying or submergence).
As shown in Fig. 8 to Figure 10, formed before the second light shield layer 52, further includes:
The first protective layer 61 is formed, the first protective layer 61 covers the second end surfaces 31b.Second end surfaces 31b of camera lens 11
For the incidence surface of lens module 31, light exposes to the second end surfaces 31b, the optical imagery projection that scenery is generated by camera lens 11
Switch to electric signal to imaging sensor 212.Therefore the second end surfaces 31b is covered by the first protective layer 61, avoids subsequent technique
Second light shield layer 52 of middle formation covers the light incidence section domain of the second end surfaces 31b.The light incidence section of second end surfaces 31b of camera lens 11
Domain cannot be sprayed onto the second light shield layer 52, otherwise influence image quality.
Then, the second light shield layer 52 is formed, the second light shield layer 52 covers the first end surfaces of connection and second of lens module
The sidewall surfaces of end surfaces.Specifically, the method for forming the second light shield layer includes: by the material spraying of the second light shield layer to side wall
Surface is immersed sidewall surfaces in the material solution of the second light shield layer.The material of second light shield layer includes carbon dust, dyestuff or gold
Belong to any one in powder or two or more combinations.
Then, as shown in Figure 10, Figure 11 a and 11b, by sidewall surfaces be formed with the lens module 31 of the second light shield layer 52 from
It is removed on fixed cell 40, and removes the first protective layer 61.In the present embodiment, the second light shield layer 52 covers lens module
The sidewall surfaces of the first end surfaces and the second end surfaces are connected, the second light shield layer 52 is not covered with the second end surfaces 31b, accordingly
, the second end surfaces 31b is completely covered in the first protective layer 61 in Figure 10, after removing the first protective layer 61, the of camera lens 11
Two end surfaces 31b are exposed completely as light incidence section domain.
As shown in figure 12, it to protect the first end surfaces 31a, avoids when being subsequently formed the second light shield layer 52, the second shading
The soldered ball 214 that layer 52 covers the first end surfaces 31a is made troubles to subsequent product welding use, can also be in the first end surfaces
31a forms the second protective layer 62 of covering soldered ball 214.
Camera lens and imaging sensor are wafer scale device, form protective layer on wafer scale device.Specifically, such as Figure 12
With imaging sensor wafer 20 shown in Figure 13, is provided, a side surface of described image sensor wafer 20 is formed with protective layer
211, protective layer 211 is, for example, glassy layer；Another side surface of described image sensor wafer 20 is formed with circuit substrate and (does not show
Out), the first light shield layer 51 is set on the surface of the circuit substrate；Described image sensor wafer 20 is sensed including multiple images
Device.Camera lens wafer 10 is provided, camera lens wafer 10 includes a plurality of lenses, and the camera lens is correspondingly arranged with described image sensor.In
The second protective layer 62 of covering soldered ball 214 or pad is formed on first end surfaces 31a.The method for forming the second protective layer 62 can be
Photoetching or silk-screen printing.
The first protective layer 61 of covering camera lens wafer 10, the first protective layer 61 are formed in the second end surfaces 31b (incidence surface)
For example, PET film, the first protective layer 61 can make corresponding shape according to optical demands, and photoetching or silk-screen printing can be used
Method is formed.In order to guarantee the smooth removing of subsequent first protective layer 61, (enter light in the second end surfaces 31b of camera lens wafer 10
Face) plated film of antiadhesion barrier can be carried out in advance, the material with easily peelable characteristic also can be selected.
As shown in Figure 14 and Figure 15, imaging sensor wafer 20 and camera lens wafer 10 are bonded；By the image sensing of bonding
10 scribing of device wafer 20 and camera lens wafer, obtains a plurality of lenses mould group 31 '.It should be appreciated that imaging sensor wafer 20 and camera lens
Wafer 10 is bonded again after can also being first diced into single imaging sensor 212 and single camera lens 11.Each lens module
The second protective layer 62 of covering soldered ball 214 is formed on 31 ' the first end surfaces 31a, and covering camera lens is formed on the second end surfaces 31b
11 the first protective layer 61, wafer scale device cut the lens module 31 ' to be formed and single camera lens and single image sensor key
The lens module structure having the same formed is closed, details are not described herein.
As shown in Figure 16 and Figure 17, lens module 31 ' is fixed on a fixed cell 40 by fixed lens mould group 31 ', fixed
Multiple aperture A are provided on unit, lens module 31 is arranged in a one-to-one correspondence with aperture A, and aperture bottom has adhesion layer, lens module
31 ' the second protective layer 62 is placed in aperture A and is fixed on adhesion layer 42.Then, the second light shield layer 52 is formed, second hides
Photosphere 52 covers the sidewall surfaces of connection the first end surfaces and the second end surfaces of lens module.Specifically, forming the second shading
Layer method include: by the material spraying of the second light shield layer to sidewall surfaces or by sidewall surfaces immersion the second light shield layer material
In solution.The material of second light shield layer includes any one or two or more combinations in carbon dust, dyestuff or metal powder.
As shown in Figure 18 and Figure 19, sidewall surfaces are formed with to the lens module 31 ' of the second light shield layer 52 from fixed cell
It is removed on 40, and removes the first protective layer 61 and the second protective layer 62.It is flat that mechanical forces can be used in first protective layer 61
Passage removes or using laser ablation, the second protective layer 62 can be removed by corresponding stripping agent, later by lens module 31
Cleaning is to remove contamination particle.
Figure 12 to Figure 19 b, which is described, forms lens module 31, in the present embodiment, the second shading using wafer scale preparation method
Layer 52 covers the sidewall surfaces of connection the first end surfaces and the second end surfaces of lens module 31, and the second light shield layer 52 is not covered with
Second end surfaces 31b, correspondingly, the second end surfaces 31b of camera lens wafer 10 is completely covered in the first protective layer 61 in Figure 14, figure
In 19a and Figure 19 b after removing the first protective layer 61, the second end surfaces 31b of camera lens 11 is exposed completely as entering light
Region.
Optionally, second light shield layer can also cover the neighboring area of second end surfaces.Specific forming method knot
Figure 20 to Figure 24 is closed to elaborate.
As shown in figure 20, the first protective layer 61 is formed in the second end surfaces 31b (incidence surface) of camera lens wafer 10, first protects
Sheath 61 is, for example, patterned photoresist layer, and the patterned photoresist layer covers the light incidence section domain of the camera lens wafer 10；The
One protective layer 61 can also be the glue-line of silk-screen printing.
As shown in Figure 20 and Figure 21, by 10 scribing of the imaging sensor wafer 20 of bonding and camera lens wafer, multiple mirrors are obtained
Head mould group 31.
As shown in figure 22, the second light shield layer 52 is formed, second light shield layer 52 covers the connection of the lens module 31
First protection in the sidewall surfaces and the second end surfaces 31b of first end surfaces and second end surfaces
Region other than 61 (such as patterned photoresist layer) of layer.Second light shield layer 52 is, for example, black, but is not limited to black, can be with
For any other color.
As shown in Figure 22 and Figure 23, first protective layer 61 (such as patterned photoresist layer) is removed, is exposed described
The light incidence section domain G of camera lens.
Figure 23 is the schematic diagram of the section structure of the lens module of the present embodiment；Figure 24 is the lens module of the present embodiment from the
The schematic diagram that two end surfaces 31b are looked over.As shown in figure 23 and figure 24, second light shield layer 52 can also cover the second end
The neighboring area of surface 31b, specifically, the concrete shape of second light shield layer 52 is not made on the second end surfaces 31b
Limitation, can be arranged as the case may be, such as second light shield layer 52 shape include Q-RING, outer boundary be it is rectangular and interior
Boundary is circular figure, outer boundary is rectangular and inner boundary is that trapezoidal figure and outer boundary are rectangular and inner boundary is
Straight line and camber line composition closed loop line figure in any one.
Figure 25 is the schematic diagram of the section structure of the lens module of the embodiment of the present invention；Figure 26 is the camera lens of the embodiment of the present invention
The schematic diagram that mould group is looked over from the first end surfaces 31a.As illustrated in figs. 25 and 26, the forming method of lens module, further includes:
Third light shield layer 53 is formed, the third light shield layer 53 covers the neighboring area of the first end surfaces 31a, can also cover and remove
Region (only exposing soldered ball) other than soldered ball 214.On the first end surfaces 31a, the tool of the third light shield layer 53
Shape with no restriction, can be arranged as the case may be, such as the shape of the third light shield layer 53 can be Q-RING.Described
The material of three light shield layers 53 includes any one or two or more combinations in carbon dust, dyestuff or metal powder.
The present invention also provides a kind of lens modules, and the forming method of lens module as described above is made.
To sum up, in lens module provided by the invention and forming method thereof, the second end surfaces 31b of lens module 31 (enters
Smooth surface) for scenery to be generated optical imagery by camera lens 11, there is the protection of the first protective layer 61 not to be applied to the second shading
Layer 52；The first end surfaces 31a (being formed with soldered ball 214 on circuit substrate 212) of lens module 31 is connected for electric signal, and first
End surfaces 31a is because of covering aperture A and/or is formed with the second protective layer 62 so not being applied to the second light shield layer 52；Camera lens mould
The side wall of group 31 is covered by the second light shield layer 52 completely, and the bottom of lens module 31 is due to forming first on the surface of circuit substrate
Light shield layer 51 so that by scenery by camera lens 11 generate optical imagery during it is more not by the side wall of lens module 31 and bottom
The influence of remaining light line solves the background spurious optical issue of lens module 31, to promote the image quality of lens module 31.
It is understood that although the present invention has been disclosed in the preferred embodiments as above, above-described embodiment not to
Limit the present invention.For any person skilled in the art, without departing from the scope of the technical proposal of the invention,
Many possible changes and modifications all are made to technical solution of the present invention using the technology contents of the disclosure above, or are revised as
With the equivalent embodiment of variation.Therefore, anything that does not depart from the technical scheme of the invention are right according to the technical essence of the invention
Any simple modifications, equivalents, and modifications made for any of the above embodiments still fall within the range of technical solution of the present invention protection
It is interior.
Claims (14)
1. a kind of forming method of lens module characterized by comprising
Camera lens and imaging sensor are provided, the side of described image sensor is configured with circuit substrate, in the circuit substrate
Surface forms the first light shield layer；
The camera lens is bonded with the other side of described image sensor, the circuit substrate deviates from the table of described image sensor
Face is the first end surfaces, and surface of the camera lens far from described image sensor is the second end surfaces；
Form the second light shield layer, the connection that second light shield layer covers the lens module first end surfaces and described
The sidewall surfaces of two end surfaces.
2. the forming method of lens module as described in claim 1, which is characterized in that described in second light shield layer also covers
The neighboring area of second end surfaces.
3. the forming method of lens module as claimed in claim 2, which is characterized in that described on second end surfaces
The shape of second light shield layer includes Q-RING, outer boundary is rectangular and inner boundary is circular figure, outer boundary is rectangular and interior
Boundary is that trapezoidal figure and outer boundary are rectangular and inner boundary is appointing in the figure for the closed loop line that straight line and camber line form
It anticipates one kind.
4. the forming method of lens module as claimed in claim 2, which is characterized in that the step of forming the second light shield layer is wrapped
It includes:
Patterned photoresist layer is formed, the patterned photoresist layer covers the light incidence section domain of the camera lens；
Form the second light shield layer, the connection that second light shield layer covers the lens module first end surfaces and described
Region in the sidewall surfaces of two end surfaces and second end surfaces other than the patterned photoresist layer；
The patterned photoresist layer is removed, the light incidence section domain of the camera lens is exposed.
5. the forming method of lens module as described in claim 1, which is characterized in that further include:
Third light shield layer is formed, the third light shield layer covers the neighboring area of first end surfaces.
6. the forming method of the lens module as described in claim 1 to 5 any one, which is characterized in that described image sensing
The other side of device configures matcoveredn, and the camera lens is bonded with the protective layer.
7. the forming method of lens module as described in claim 1, which is characterized in that formed before the second light shield layer, also wrapped
It includes:
The first protective layer is formed, first protective layer covers second end surfaces.
8. the forming method of lens module as described in claim 1, which is characterized in that
The camera lens is bonded with the other side of described image sensor, is sensed using the single camera lens and single described image
The method of device bonding.
9. the forming method of lens module as described in claim 1, which is characterized in that
The camera lens is bonded with the other side of described image sensor, using wafer scale preparation method, is specifically included:
Imaging sensor wafer is provided, a side surface of described image sensor wafer is formed with protective layer, described image sensing
Another side surface of device wafer is formed with circuit substrate, forms the first light shield layer, described image on the surface of the circuit substrate
Sensor wafer includes multiple images sensor；
Camera lens wafer is provided, the camera lens wafer includes a plurality of lenses, and the camera lens is correspondingly arranged with described image sensor；
By described image sensor wafer and the camera lens wafer bonding；
It cuts the described image sensor wafer of bonding and the camera lens wafer to obtain the single lens module.
10. the forming method of lens module as claimed in claim 8 or 9, which is characterized in that formed before the second light shield layer also
Include:
The fixed lens module, is fixed on a fixed cell for the lens module, multiple apertures is provided on fixed cell,
The lens module is arranged in a one-to-one correspondence with the aperture, and the aperture bottom is provided with adhesion layer, the institute of the lens module
State the first end surfaces and cover the aperture, be provided with soldered ball on the circuit substrate, the soldered ball be placed in the aperture and
It is fixed on the adhesion layer.
11. the forming method of lens module as claimed in claim 10, which is characterized in that
It is formed before the second light shield layer, further includes:
Form the second protective layer, the soldered ball or pad of the second protective layer covering circuit substrate；
It is formed after the second light shield layer, further includes:
The lens module is removed from the fixed cell, and removes second protective layer.
12. the forming method of lens module as described in claim 1, which is characterized in that form the method packet of the second light shield layer
It includes: immersing second light shield layer by the material spraying of second light shield layer to the sidewall surfaces or by the sidewall surfaces
Material solution in.
13. the forming method of lens module as described in claim 1, which is characterized in that the material packet of second light shield layer
Include any one in carbon dust, dyestuff or metal powder or two or more combinations.
14. lens module made of a kind of forming method using any one of claim 1-13 lens module.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910829484.3A CN110534539A (en) | 2019-09-03 | 2019-09-03 | Lens module and forming method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910829484.3A CN110534539A (en) | 2019-09-03 | 2019-09-03 | Lens module and forming method thereof |
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| CN110534539A true CN110534539A (en) | 2019-12-03 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112261261A (en) * | 2020-10-21 | 2021-01-22 | 广州立景创新科技有限公司 | Image acquisition module and method of manufacturing the same |
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| CN110026328A (en) * | 2019-04-18 | 2019-07-19 | 豪威光电子科技（上海）有限公司 | The forming method of lens module |
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| CN106653784A (en) * | 2015-11-03 | 2017-05-10 | 豪威科技股份有限公司 | Chip-scale packaged image sensor packages with black masking and associated packaging methods |
| CN109685021A (en) * | 2018-12-27 | 2019-04-26 | 苏州科阳光电科技有限公司 | Shield lower optical sensor chip dimpling lens array mould group, technique and display device |
| CN110026328A (en) * | 2019-04-18 | 2019-07-19 | 豪威光电子科技（上海）有限公司 | The forming method of lens module |
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Application publication date: 20191203 |