CN109557630A - Optical array micro lens and preparation method thereof, optics module and display device - Google Patents
Optical array micro lens and preparation method thereof, optics module and display device Download PDFInfo
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- CN109557630A CN109557630A CN201811571464.2A CN201811571464A CN109557630A CN 109557630 A CN109557630 A CN 109557630A CN 201811571464 A CN201811571464 A CN 201811571464A CN 109557630 A CN109557630 A CN 109557630A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 104
- 238000002360 preparation method Methods 0.000 title abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 81
- 238000004519 manufacturing process Methods 0.000 claims description 23
- 230000006698 induction Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 28
- 238000000034 method Methods 0.000 description 6
- 238000009738 saturating Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 235000008429 bread Nutrition 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/006—Filter holders
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Abstract
The embodiment of the present invention provides a kind of optical array micro lens and preparation method thereof, optics module and display device, optical array micro lens, comprising: transparent substrate；First filter layer is located at first face of transparent substrate；Light shield layer, positioned at the second face of the transparent substrate, the second face of the transparent substrate and the first face of the transparent substrate are opposite；Multiple openings are arranged in the light shield layer；Multiple micro lens, the multiple micro lens are arranged in a one-to-one correspondence in the multiple opening of the light shield layer.The embodiment of the present invention provides a kind of optical array micro lens and preparation method thereof, optics module and display device, to realize the thickness for reducing optics module.
Description
Technical field
The present embodiments relate to optical devices technologies more particularly to a kind of optical array micro lens and preparation method thereof,
Optics module and display device.
Background technique
With the development of communication technology, mobile terminal is just being widely used in daily life and work.Mesh
Before, fingerprint identification device is both provided in mobile terminal, be unlocked by fingerprint recognition, password setting etc. all multioperations.?
In fingerprint identification device, capacitance type fingerprint identification device and optical fingerprint identification device are two kinds of more common fingerprint recognitions
Device.
But traditional capacitance type fingerprint identification device penetration capacity is limited, structure is complicated by ID, mould packet size is partially thick, pendulum
It is limited to put position, is unfavorable for the lightening of mobile terminal and miniaturization.Although and current optical fingerprint identification device have wear
Saturating ability is strong, can the features such as any position is put under support screen.Meanwhile each feature point reflection of fingerprint in order to prevent
It may be interfered with each other between light, and prevent the light of non-fingerprint characteristic point reflection to the light of each feature point reflection
Interference is generated, optical channel arraying bread board is set usually above the optical sensor area of optical sensor chip in the prior art, light is logical
Channel array panel includes that multiple vertical optical channels are arranged in light-absorption layer and light-absorption layer.The thickness of optical channel arraying bread board compared with
Greatly, larger so as to cause the thickness of optics module, influence the inside member device of the electronic equipment (such as mobile phone) using optics module
The design and layout of part.
Summary of the invention
The embodiment of the present invention provides a kind of optical array micro lens and preparation method thereof, optics module and display device, with
Realize the thickness for reducing optics module.
In a first aspect, the embodiment of the present invention provides a kind of optical array micro lens, comprising:
Transparent substrate；
First filter layer is located at first face of transparent substrate；
Light shield layer, positioned at the second face of the transparent substrate, the second face and the transparent substrate of the transparent substrate
First face is opposite；Multiple openings are arranged in the light shield layer；
Multiple micro lens, the multiple micro lens are arranged in a one-to-one correspondence in the multiple opening of the light shield layer.
Optionally, further includes:
Second filter layer, between the transparent substrate and the light shield layer.
Optionally, further includes:
Antireflection layer, between the transparent substrate and the light shield layer.
Optionally, further includes:
Second filter layer and antireflection layer, between the transparent substrate and the light shield layer；The antireflection layer is located at institute
It states between the second filter layer and the light shield layer.
Optionally, the shape of the micro lens is hemispherical or semielliptical shape.
Second aspect, the embodiment of the present invention provide a kind of production method of optical array micro lens, comprising:
One transparent substrate is provided；
The first filter layer is formed in the first face of the transparent substrate；
The light shield layer for being provided with multiple openings is formed in the second face of the transparent substrate；The second of the transparent substrate
Face is opposite with the first face of the transparent substrate；
Multiple micro lens are formed correspondingly in the multiple opening of the light shield layer.
Optionally, before the second face of the transparent substrate forms and is provided with the light shield layer of multiple openings, the production
Method further include:
The second light shield layer is formed in the second face of the transparent substrate.
Optionally, before the second face of the transparent substrate forms and is provided with the light shield layer of multiple openings, the production
Method further include:
Antireflection layer is formed in the second face of the transparent substrate.
Optionally, before the second face of the transparent substrate forms and is provided with the light shield layer of multiple openings, the production
Method further include:
The second light shield layer is formed in the second face of the transparent substrate；
Antireflection layer is formed far from the transparent substrate side in second light shield layer.
The third aspect, the embodiment of the present invention provide a kind of optics module, including optical array micro mirror described in first aspect
Head, optical sensor chip and flexible circuit board；
The optical sensor chip is located on the flexible circuit board and is electrically connected with the flexible circuit board；
The sensitive surface of the optical sensor chip deviates from the flexible circuit board；
The sensitive surface of the transparent substrate of the optical array micro lens towards the optical sensor chip is arranged；
The side wall of at least one first support, the first support has bulge-structure；The first end of the first support
It is fixed on the flexible circuit board；
The edge of the transparent substrate of the bright micro lens of optical array is held up by the bulge-structure；
Vertical range between the bulge-structure and the flexible circuit board is greater than the optical sensor chip and deviates from institute
State the vertical range between the surface of flexible circuit board and the flexible circuit board.
Optionally, the distance between second end of the bulge-structure and the first support is greater than the optical array
The thickness of micro lens.
It optionally, further include at least one second support, the second support is located at the optical array micro lens and deviates from
On the side of the flexible circuit board.
Fourth aspect, the embodiment of the present invention provide a kind of display device, including optics module described in the third aspect, with
And display screen；The optics module is located at the non-displaying side of the display screen.
Optical array micro lens provided in an embodiment of the present invention includes multiple micro lens, and multiple micro lens one-to-one correspondence are set
It sets in multiple openings of light shield layer.Since the height of micro lens is smaller, the thickness of optical array micro lens is also smaller, thus
The thickness of optics module can be made smaller.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of optical array micro lens provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of another optical array micro lens provided in an embodiment of the present invention；
Fig. 3 is the structural schematic diagram of another optical array micro lens provided in an embodiment of the present invention；
Fig. 4 is the structural schematic diagram of another optical array micro lens provided in an embodiment of the present invention；
Fig. 5 is a kind of production method flow chart of optical array micro lens provided in an embodiment of the present invention；
Fig. 6 a- Fig. 6 c is a kind of manufacturing process schematic diagram of optical array micro lens provided in an embodiment of the present invention；
Fig. 7 is a kind of structural schematic diagram of optics module provided in an embodiment of the present invention；
Fig. 8 is the structural schematic diagram of another optics module provided in an embodiment of the present invention；
Fig. 9 is the structural schematic diagram of another optics module provided in an embodiment of the present invention；
Figure 10 is the structural schematic diagram of another optics module provided in an embodiment of the present invention；
Figure 11 is the structural schematic diagram of another optics module provided in an embodiment of the present invention；
Figure 12 is the structural schematic diagram of another optics module provided in an embodiment of the present invention；
Figure 13 is the structural schematic diagram of another optics module provided in an embodiment of the present invention；
Figure 14 is the structural schematic diagram of another optics module provided in an embodiment of the present invention；
Figure 15 is a kind of structural schematic diagram of display device provided in an embodiment of the present invention.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limiting the invention.It also should be noted that in order to
Convenient for describing, only the parts related to the present invention are shown rather than entire infrastructure in attached drawing.
Fig. 1 is a kind of structural schematic diagram of optical array micro lens provided in an embodiment of the present invention, with reference to Fig. 1, optics battle array
Column micro lens 10 includes transparent substrate 110, the first filter layer 121, light shield layer 140 and multiple micro lens 150.First filter layer
121 are located at 110 first face 111 of transparent substrate, and the first filter layer 121 has wavelength selectivity, can be selectively over through one
Light in standing wave section, and filter out the light outside the wavelength, the wave band for example can be where the wavelength for the light source of fingerprint recognition
Wave band.Light shield layer 140 is located at the second face 112 of transparent substrate 110, the second face 112 of transparent substrate 110 and transparent substrate 110
The first face 111 it is opposite.Multiple openings are arranged in light shield layer 140, and the part except the opening of light shield layer 140 is opaque.It is multiple
Micro lens 150 is arranged in a one-to-one correspondence in multiple openings of light shield layer 140.Accordingly set in an opening of light shield layer 140
Set a micro lens 150.Illustratively, the light and can be passed through by the reflected light that finger emits that fingerprint recognition light source issues
The opening of micro lens 150 and light shield layer 140 reaches optical sensor chip, to realize fingerprint recognition.Micro lens 150 can prevent
It is interfered with each other between the light of each feature point reflection of fingerprint, and prevents the light of non-fingerprint characteristic point reflection to each
The light of feature point reflection generates interference.
Optical array micro lens provided in an embodiment of the present invention includes multiple micro lens, and multiple micro lens one-to-one correspondence are set
It sets in multiple openings of light shield layer.Since the height of micro lens is smaller, the thickness of optical array micro lens is also smaller, thus
The thickness of optics module can be made smaller.
Fig. 2 is the structural schematic diagram of another optical array micro lens provided in an embodiment of the present invention, with reference to Fig. 2, optics
Array of micromirrors head 10 further includes the second filter layer 122, and the second filter layer 122 is located at the second face 112 of transparent substrate 110, and second
Filter layer 122 is between transparent substrate 110 and light shield layer 140.Second filter layer 122 can be identical as the first filter layer 121
Or it is different.
Fig. 3 is the structural schematic diagram of another optical array micro lens provided in an embodiment of the present invention, with reference to Fig. 3, optics
Array of micromirrors head 10 further includes antireflection layer 130, and antireflection layer 130 is located at the second face 112 of transparent substrate 110, and antireflection layer 130
Between transparent substrate 110 and light shield layer 140.Antireflection layer 130 can reduce light in the reflection on 110 surface of transparent substrate, increase
Transmission of the strong light on 110 surface of transparent substrate.
Fig. 4 is the structural schematic diagram of another optical array micro lens provided in an embodiment of the present invention, with reference to Fig. 4, optics
Array of micromirrors head 10 further includes the second filter layer 122 and antireflection layer 130, and the second filter layer 122 and antireflection layer 130 are located at transparent
Second face 112 of substrate 110, the second filter layer 122 and antireflection layer 130 are between transparent substrate 110 and light shield layer 140.Increase
Permeable layers 130 are between the second filter layer 122 and light shield layer 140.
Optionally, with reference to Fig. 1-Fig. 4, the shape of micro lens 150 is hemispherical or semielliptical shape.Preferably, micro lens
150 shape is hemispherical, and the hemispheric design of micro lens 150 is relatively easy to.
Optionally, with reference to Fig. 1-Fig. 4, transparent substrate 110 is with a thickness of 0.1mm-1.5mm.The thickness of optical array micro lens 10
Degree can be 0.5mm or so, for adapting to the space requirement shielded comprehensively.Light shield layer 140 can be one layer of organic film, can also be with
It is metal film.The technique of production light shield layer 140 can be vapor deposition, silk-screen printing, rotary coating, spraying and semiconductor lithography etc.
Single technique or the compound realization of kinds of processes.Multiple micro lens 150 can be arranged with matrix arrangement or in other forms.It is micro-
The bottom shape of camera lens 150 can be circle, be also possible to rectangular.Since circle is easily worked, shape is easier to control, because
The bottom shape of this micro lens 150 is preferably circular.Micro lens 150 can pass through the photoetching of stamping technique, organic optical materials
Or hot technique of backflow makes.The height of micro lens 150 is 1um-100um, round when the bottom of micro lens 150 is round
Diameter be 5um-1000um, the spacing between micro lens 150 is 10um -10000um it should be noted that specific size
It is defined according to imaging requirements and optical design.
Fig. 5 is a kind of production method flow chart of optical array micro lens provided in an embodiment of the present invention, Fig. 6 a- Fig. 6 c
For a kind of manufacturing process schematic diagram of optical array micro lens provided in an embodiment of the present invention, provided in an embodiment of the present invention one
The production method of kind optical array micro lens can be used for being formed the optical array micro lens in above-described embodiment.With reference to Fig. 1,
Fig. 5 and Fig. 6 a- Fig. 6 c, the production method of optical array micro lens include the following steps:
S110, a transparent substrate 110 is provided.
S120, the first filter layer 121 is formed in the first face 111 of transparent substrate 110.
S130, the light shield layer 140 for being provided with multiple openings is formed in the second face 112 of transparent substrate 110.
Wherein, the second face 112 of transparent substrate 110 is opposite with the first face 111 of transparent substrate 110.
S140, multiple micro lens 150 are formed correspondingly in multiple openings of light shield layer 140.
In the production method of optical array micro lens provided in an embodiment of the present invention, one in multiple openings of light shield layer
One forms multiple micro lens correspondingly.Since the height of micro lens is smaller, the thickness of optical array micro lens is also smaller, thus
The thickness of optics module can be made smaller.
Optionally, it with reference to Fig. 2, Fig. 5 and Fig. 6 a- Fig. 6 c, is formed and is provided in the second face 112 of transparent substrate 110
Before the light shield layer 140 of multiple openings (i.e. before step S120), the production method of optical array micro lens further include: saturating
Second face 112 of bright substrate 110 forms the second light shield layer 122.
Optionally, it with reference to Fig. 3, Fig. 5 and Fig. 6 a- Fig. 6 c, is formed and is provided in the second face 112 of transparent substrate 110
Before the light shield layer 140 of multiple openings (i.e. before step S120), the production method of optical array micro lens further include: saturating
Second face 112 of bright substrate 110 forms antireflection layer 130.
Optionally, it with reference to Fig. 4, Fig. 5 and Fig. 6 a- Fig. 6 c, is formed and is provided in the second face 112 of transparent substrate 110
Before the light shield layer 140 of multiple openings (i.e. before step S120), the production method of optical array micro lens further include: saturating
Second face 112 of bright substrate 110 forms the second light shield layer 122；It is formed in the second light shield layer 122 far from 110 side of transparent substrate
Antireflection layer 130.
Optionally, in some embodiments, multiple optical array micro lens 10 are usually formed on a mother matrix, and
Mother matrix is cut to obtain discrete optical array micro lens 10.Therefore, in multiple openings of light shield layer 140 correspondingly
Formed after multiple micro lens 150 (i.e. after step S140), the production method of optical array micro lens can also include: by
The cutting of transparent substrate 110 for being formed with multiple micro lens 150 forms multiple optical array micro lens 10.
Fig. 7 is a kind of structural schematic diagram of optics module provided in an embodiment of the present invention, with reference to Fig. 1 and Fig. 7, optical mode
Group includes optical array micro lens 10, optical sensor chip 20 and the flexible circuit board 30 in above-described embodiment.Optical sensor core
Piece 20 is located on flexible circuit board 30 and is electrically connected with flexible circuit board 30.Illustratively, optics module further includes metal wire
70, optical sensor chip 20 is electrically connected with flexible circuit board 30 by metal wire 70, in other embodiments, optical sensor
Chip 20 can also be electrically connected with flexible circuit board 30 by tin ball.The sensitive surface 21 of optical sensor chip 20 deviates from flexible electrical
Road plate 30.The sensitive surface 20 of the transparent substrate 110 of optical array micro lens 10 towards optical sensor chip 20 is arranged, optics battle array
The micro lens 150 of column micro lens 10 is arranged away from the sensitive surface 20 of optical sensor chip 20.Optics module further includes at least one
The side wall of a first support 40, first support 40 has bulge-structure 41, and the first end of first support 40 is fixed on flexible circuit
On plate 30.The edge of the transparent substrate 110 of the bright micro lens 10 of optical array is held up by bulge-structure 41.Bulge-structure 41 with it is soft
Property circuit board 30 between vertical range be greater than optical sensor chip 20 away from flexible circuit board 30 surface and flexible circuit board
Vertical range between 30.There are gaps between optical sensor chip 20 and optical array micro lens 10.
Optics module provided in an embodiment of the present invention includes the optical array micro lens in above-described embodiment.Due to optics
The thickness of array of micromirrors head is smaller, so as to so that the thickness of optics module is smaller.
Optionally, with reference to Fig. 7, optics module further includes reinforcing chip 60.Since flexible circuit board 30 is softer, it is located at
Reinforcing chip 60 of the flexible circuit board 30 far from 20 side of optical sensor chip can provide support for flexible circuit board 30.
Optionally, it is greater than optics battle array with reference to Fig. 7, the distance between bulge-structure 41 and the second end of first support 40 H2
The thickness H1 of column micro lens 10.The second end of first support 40 is opposite with the first end of first support 40, and the of first support 40
One end is fixed on flexible circuit board 30.Since the distance between bulge-structure 41 and the second end of first support 40 H2 are greater than
The thickness H1 of optical array micro lens 10, therefore can directly be attached at optics module by the second end of first support 40
The non-displaying side of display screen, it is simple and efficient.
Fig. 8 is the structural schematic diagram of another optics module provided in an embodiment of the present invention, and with reference to Fig. 8, optics module is also
Including at least one second support 50, second support 50 is located at the side that optical array micro lens 10 deviates from flexible circuit board 30
On.Optics module can be attached to the non-displaying side of display screen by second support 50.
Fig. 9 is the structural schematic diagram of another optics module provided in an embodiment of the present invention, different from Fig. 7 with reference to Fig. 9
, optical sensor chip 20 and flexible circuit board 30 are electrically connected by tin ball 80.
Figure 10 is the structural schematic diagram of another optics module provided in an embodiment of the present invention, with reference to Figure 10, not with Fig. 8
With optical sensor chip 20 is electrically connected with flexible circuit board 30 by tin ball 80.
In the optics module provided in above-described embodiment (referring to Fig. 7-Figure 10), the micro lens of optical array micro lens 10
150 be located at optical array micro lens 10 transparent substrate 110 far from 20 side of optical sensor chip, in other embodiments,
The micro lens 150 of optical array micro lens 10 may be located on the transparent substrate 110 and optical sensor of optical array micro lens 10
Between chip 20.Figure 11 is the structural schematic diagram of another optics module provided in an embodiment of the present invention, and Figure 12 is that the present invention is real
The structural schematic diagram of another optics module of example offer is applied, Figure 13 is another optics module provided in an embodiment of the present invention
Structural schematic diagram, Figure 14 is the structural schematic diagram of another optics module provided in an embodiment of the present invention, with reference to Figure 11-figure
14, unlike Fig. 7-Figure 10, the micro lens 150 of optical array micro lens 10 may be located on optical array micro lens 10
Transparent substrate 110 and optical sensor chip 20 between.Figure 15 is a kind of structure of display device provided in an embodiment of the present invention
Schematic diagram, with reference to Figure 15, display device includes optics module and display screen 1 in above-described embodiment.Optics module is located at
The non-displaying side of display screen 1.It is explained for the optics module shown in Fig. 7 in Figure 15, not the present invention is implemented
The restriction of example, in other embodiments, optics module can be Fig. 8, Fig. 9, Figure 10, Figure 11, Figure 12, Figure 13 or Figure 14
Shown in optics module, it is specific to need depending on product demand.Since display device provided in an embodiment of the present invention includes
Optics module in above-described embodiment, therefore the beneficial effect also with the optics module in above-described embodiment.That is, optical mode
The thickness of group is smaller, therefore is conducive to the design and layout of the internal component of display device.
Note that the above is only a better embodiment of the present invention and the applied technical principle.Those skilled in the art can manage
Solution, the invention is not limited to the specific embodiments described herein, is able to carry out various apparent changes for a person skilled in the art
Change, readjust, be combined with each other and substitutes without departing from protection scope of the present invention.Therefore, although passing through above embodiments
The present invention is described in further detail, but the present invention is not limited to the above embodiments only, is not departing from structure of the present invention
It can also include more other equivalent embodiments in the case where think of, and the scope of the present invention is determined by scope of the appended claims
It is fixed.
Claims (13)
1. a kind of optical array micro lens characterized by comprising
Transparent substrate；
First filter layer is located at first face of transparent substrate；
Light shield layer, positioned at the second face of the transparent substrate, the second face of the transparent substrate and the first of the transparent substrate
Face is opposite；Multiple openings are arranged in the light shield layer；
Multiple micro lens, the multiple micro lens are arranged in a one-to-one correspondence in the multiple opening of the light shield layer.
2. optical array micro lens according to claim 1, which is characterized in that further include:
Second filter layer, between the transparent substrate and the light shield layer.
3. optical array micro lens according to claim 1, which is characterized in that further include:
Antireflection layer, between the transparent substrate and the light shield layer.
4. optical array micro lens according to claim 1, which is characterized in that further include:
Second filter layer and antireflection layer, between the transparent substrate and the light shield layer；The antireflection layer is located at described the
Between two filter layers and the light shield layer.
5. optical array micro lens according to claim 1, which is characterized in that the shape of the micro lens be hemispherical or
Person's semielliptical shape.
6. a kind of production method of optical array micro lens characterized by comprising
One transparent substrate is provided；
The first filter layer is formed in the first face of the transparent substrate；
The light shield layer for being provided with multiple openings is formed in the second face of the transparent substrate；Second face of the transparent substrate and institute
The first face for stating transparent substrate is opposite；
Multiple micro lens are formed correspondingly in the multiple opening of the light shield layer.
7. production method according to claim 6, which is characterized in that formed and be provided in the second face of the transparent substrate
Before the light shield layer of multiple openings, the production method further include:
The second light shield layer is formed in the second face of the transparent substrate.
8. production method according to claim 6, which is characterized in that formed and be provided in the second face of the transparent substrate
Before the light shield layer of multiple openings, the production method further include:
Antireflection layer is formed in the second face of the transparent substrate.
9. production method according to claim 6, which is characterized in that formed and be provided in the second face of the transparent substrate
Before the light shield layer of multiple openings, the production method further include:
The second light shield layer is formed in the second face of the transparent substrate；
Antireflection layer is formed far from the transparent substrate side in second light shield layer.
10. a kind of optics module, which is characterized in that including the described in any item optical array micro lens of claim 1-5, optics
Induction chip and flexible circuit board；
The optical sensor chip is located on the flexible circuit board and is electrically connected with the flexible circuit board；
The sensitive surface of the optical sensor chip deviates from the flexible circuit board；
The sensitive surface of the transparent substrate of the optical array micro lens towards the optical sensor chip is arranged；
The side wall of at least one first support, the first support has bulge-structure；The first end of the first support is fixed
On the flexible circuit board；
The edge of the transparent substrate of the bright micro lens of optical array is held up by the bulge-structure；
Vertical range between the bulge-structure and the flexible circuit board is greater than the optical sensor chip away from described soft
Vertical range between the surface and the flexible circuit board of property circuit board.
11. optics module according to claim 10, which is characterized in that the of the bulge-structure and the first support
The distance between two ends are greater than the thickness of the optical array micro lens.
12. optics module according to claim 10, which is characterized in that it further include at least one second support, described
Two brackets are located at the optical array micro lens on the side of the flexible circuit board.
13. a kind of display device, which is characterized in that including the described in any item optics modules of claim 10-12, and display
Screen；The optics module is located at the non-displaying side of the display screen.
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| CN201811571464.2A CN109557630A (en) | 2018-12-21 | 2018-12-21 | Optical array micro lens and preparation method thereof, optics module and display device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110956163A (en) * | 2019-12-27 | 2020-04-03 | 苏州科阳光电科技有限公司 | Fingerprint identification module, terminal equipment and preparation method of fingerprint identification module |
| CN110969148A (en) * | 2019-12-27 | 2020-04-07 | 苏州科阳光电科技有限公司 | Optical module and preparation method thereof |
| CN111095270A (en) * | 2019-06-05 | 2020-05-01 | 深圳市汇顶科技股份有限公司 | Optical image acquisition device and electronic equipment |
| CN111353480A (en) * | 2020-04-26 | 2020-06-30 | 欧菲微电子技术有限公司 | Micro-lens assembly, preparation method, optical fingerprint module and electronic device |
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| CN110969148A (en) * | 2019-12-27 | 2020-04-07 | 苏州科阳光电科技有限公司 | Optical module and preparation method thereof |
| CN111353480A (en) * | 2020-04-26 | 2020-06-30 | 欧菲微电子技术有限公司 | Micro-lens assembly, preparation method, optical fingerprint module and electronic device |
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Application publication date: 20190402 |