CN109679347A - A kind of computer radiator heat-conducting compound and preparation method - Google Patents
A kind of computer radiator heat-conducting compound and preparation method Download PDFInfo
- Publication number
- CN109679347A CN109679347A CN201910005827.4A CN201910005827A CN109679347A CN 109679347 A CN109679347 A CN 109679347A CN 201910005827 A CN201910005827 A CN 201910005827A CN 109679347 A CN109679347 A CN 109679347A
- Authority
- CN
- China
- Prior art keywords
- computer radiator
- conducting compound
- radiator heat
- prodan
- dimethylbenzene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of computer radiator heat-conducting compound and preparation methods, including heat conductive silica gel, silver powder, acrylic resin modified, dimethylbenzene, prodan, zinc oxide, ammonium sulfate, ammonium chloride, ferrous sulfate, precipitated silica, polyester resin, silicone and polyethylene wax.Compared with prior art, the present invention is by using suitable component and proportion, under the premise of guaranteeing higher thermal coefficient, can obtain higher compactedness and suitable viscosity, so that the paintability and wellability of the thermal conducting agent are preferable, to obtain lower thermal impedance.Therefore, the thermal coefficient of above-mentioned thermal conducting agent is higher, and thermal impedance is lower.
Description
Technical field
The present invention relates to a kind of computer heat dissipation adjuvant more particularly to a kind of computer radiator heat-conducting compound and systems
Preparation Method.
Background technique
High temperature is the formidable enemy of integrated circuit.High temperature not only will lead to system operation shakiness, reduced service life, or even having can
Certain components can be made to burn.The effect of radiator is exactly then these heat absorptions are diffused in cabinet or outside cabinet, protected
The temperature for demonstrate,proving machine element is normal.In the prior art, the thermally conductive of computer radiator is all by radiator fan as radiator,
But the heat transfer efficiency of radiator fan needs the thermal contact conductance rate in conjunction with radiator and euthermic chip, and the heat-conducting cream of the prior art is thermally conductive
Low efficiency, to influence the radiating efficiency of radiator, accordingly, there exist rooms for improvement.
Summary of the invention
The object of the invention is that provide to solve the above-mentioned problems a kind of computer radiator heat-conducting compound and
Preparation method.
The present invention through the following technical solutions to achieve the above objectives:
A kind of computer radiator heat-conducting compound of the present invention, including heat conductive silica gel, silver powder, acrylic resin modified, dimethylbenzene,
Prodan, zinc oxide, ammonium sulfate, ammonium chloride, ferrous sulfate, precipitated silica, polyester resin, silicone and polyethylene wax.
Preferably, by weight, every part containing the heat conductive silica gel 45%, silver powder 15%, described acrylic resin modified
15%, the dimethylbenzene 3%, the prodan 2%, the zinc oxide 2%, the ammonium sulfate 2%, the ammonium chloride 3%, the sulphur
Sour ferrous iron 2%, the precipitated silica 4%, the polyester resin 3%, the silicone 2%, the polyethylene wax 2%.
A kind of computer radiator heat-conducting compound preparation method of the present invention, heat conductive silica gel and silver powder are mixed, obtained
To mixture；By acrylic resin modified, dimethylbenzene, prodan, zinc oxide, ammonium sulfate, ammonium chloride, ferrous sulfate, precipitating
Silica, polyester resin, silicone and polyethylene wax are added in the mixture, carry out heating in vacuum de-bubble after mixing evenly,
Obtain net mixture；The net mixture is subjected to grinding distribution, obtains the computer radiator heat-conducting compound.
The beneficial effects of the present invention are:
The present invention is a kind of computer radiator heat-conducting compound and preparation method, and compared with prior art, the present invention is by adopting
With suitable component and proportion, under the premise of guaranteeing higher thermal coefficient, higher compactedness and suitable can be obtained
Viscosity, so that the paintability and wellability of the thermal conducting agent are preferable, to obtain lower thermal impedance.Therefore, above-mentioned thermal conducting agent
Thermal coefficient it is higher, thermal impedance is lower.
Specific embodiment
The invention will be further described below:
A kind of computer radiator heat-conducting compound of the present invention, including heat conductive silica gel, silver powder, acrylic resin modified, dimethylbenzene,
Prodan, zinc oxide, ammonium sulfate, ammonium chloride, ferrous sulfate, precipitated silica, polyester resin, silicone and polyethylene wax.
Preferably, by weight, every part containing the heat conductive silica gel 45%, silver powder 15%, described acrylic resin modified
15%, the dimethylbenzene 3%, the prodan 2%, the zinc oxide 2%, the ammonium sulfate 2%, the ammonium chloride 3%, the sulphur
Sour ferrous iron 2%, the precipitated silica 4%, the polyester resin 3%, the silicone 2%, the polyethylene wax 2%.
A kind of computer radiator heat-conducting compound preparation method of the present invention, heat conductive silica gel and silver powder are mixed, obtained
To mixture；By acrylic resin modified, dimethylbenzene, prodan, zinc oxide, ammonium sulfate, ammonium chloride, ferrous sulfate, precipitating
Silica, polyester resin, silicone and polyethylene wax are added in the mixture, carry out heating in vacuum de-bubble after mixing evenly,
Obtain net mixture；The net mixture is subjected to grinding distribution, obtains the computer radiator heat-conducting compound.
Basic principles and main features and advantages of the present invention of the invention have been shown and described above.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (3)
1. a kind of computer radiator heat-conducting compound, it is characterised in that: including heat conductive silica gel, silver powder, it is acrylic resin modified,
Dimethylbenzene, prodan, zinc oxide, ammonium sulfate, ammonium chloride, ferrous sulfate, precipitated silica, polyester resin, silicone and poly-
Ethylene waxes.
2. computer radiator heat-conducting compound according to claim 1, it is characterised in that: by weight, every part contains institute
State heat conductive silica gel 45%, the silver powder 15%, the described acrylic resin modified 15%, dimethylbenzene 3%, the prodan 2%,
It is the zinc oxide 2%, the ammonium sulfate 2%, the ammonium chloride 3%, the ferrous sulfate 2%, the precipitated silica 4%, described
Polyester resin 3%, the silicone 2%, the polyethylene wax 2%.
3. a kind of computer radiator heat-conducting compound preparation method, it is characterised in that: heat conductive silica gel and silver powder are mixed,
Obtain mixture；By acrylic resin modified, dimethylbenzene, prodan, zinc oxide, ammonium sulfate, ammonium chloride, ferrous sulfate, sink
Shallow lake silica, polyester resin, silicone and polyethylene wax are added in the mixture, carry out heating in vacuum after mixing evenly and remove
Bubble, obtains net mixture；The net mixture is subjected to grinding distribution, obtains the computer radiator heat-conducting compound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910005827.4A CN109679347A (en) | 2019-01-03 | 2019-01-03 | A kind of computer radiator heat-conducting compound and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910005827.4A CN109679347A (en) | 2019-01-03 | 2019-01-03 | A kind of computer radiator heat-conducting compound and preparation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109679347A true CN109679347A (en) | 2019-04-26 |
Family
ID=66191938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910005827.4A Pending CN109679347A (en) | 2019-01-03 | 2019-01-03 | A kind of computer radiator heat-conducting compound and preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109679347A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110776807A (en) * | 2019-10-31 | 2020-02-11 | 陕西理工大学 | Protective agent for computer circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007066711A1 (en) * | 2005-12-09 | 2007-06-14 | Kaneka Corporation | Thermoplastic resin composition with high thermal conductivity |
| CN106047308A (en) * | 2016-06-28 | 2016-10-26 | 太仓陶氏电气有限公司 | Graphene heat conducting agent of computer CPU (Central Processing Unit) chip heat radiator |
| CN106750819A (en) * | 2017-01-11 | 2017-05-31 | 重庆工业职业技术学院 | A kind of computer radiating heat-conducting cream |
| CN107880561A (en) * | 2017-11-29 | 2018-04-06 | 四川兴龙腾科技有限公司 | Computer heat conductive silica gel material |
-
2019
- 2019-01-03 CN CN201910005827.4A patent/CN109679347A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007066711A1 (en) * | 2005-12-09 | 2007-06-14 | Kaneka Corporation | Thermoplastic resin composition with high thermal conductivity |
| CN106047308A (en) * | 2016-06-28 | 2016-10-26 | 太仓陶氏电气有限公司 | Graphene heat conducting agent of computer CPU (Central Processing Unit) chip heat radiator |
| CN106750819A (en) * | 2017-01-11 | 2017-05-31 | 重庆工业职业技术学院 | A kind of computer radiating heat-conducting cream |
| CN107880561A (en) * | 2017-11-29 | 2018-04-06 | 四川兴龙腾科技有限公司 | Computer heat conductive silica gel material |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110776807A (en) * | 2019-10-31 | 2020-02-11 | 陕西理工大学 | Protective agent for computer circuit board |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190426 |