CN110776807A - Protective agent for computer circuit board - Google Patents

Protective agent for computer circuit board Download PDF

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Publication number
CN110776807A
CN110776807A CN201911047583.2A CN201911047583A CN110776807A CN 110776807 A CN110776807 A CN 110776807A CN 201911047583 A CN201911047583 A CN 201911047583A CN 110776807 A CN110776807 A CN 110776807A
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CN
China
Prior art keywords
accounts
layer spray
circuit board
resin
spray
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Pending
Application number
CN201911047583.2A
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Chinese (zh)
Inventor
任民宏
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Shaanxi University of Technology
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Shaanxi University of Technology
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Priority to CN201911047583.2A priority Critical patent/CN110776807A/en
Publication of CN110776807A publication Critical patent/CN110776807A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D107/00—Coating compositions based on natural rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
    • C09D161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09D161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K2003/023—Silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/085—Copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C08K2003/3045—Sulfates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C08K2003/3045—Sulfates
    • C08K2003/3054—Ammonium sulfates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention discloses a protective agent for a computer circuit board, which comprises a bonding layer spray, an insulating layer spray, a heat conduction layer spray, an elastic material layer spray and a smooth surface protective layer spray, wherein the bonding layer spray is coated on the computer circuit board to form a bonding layer; compared with the prior art, the anti-dust coating is coated on the circuit board of the computer, so that dust is effectively prevented, in addition, the metal part of the circuit board of the computer can be effectively prevented from being oxidized, the aging degree of the circuit board of the computer is reduced, the service life is prolonged, when a protective agent is not needed, the circuit board can be torn off in a whole piece, the operation such as maintenance and the like is convenient, and the anti-dust coating has popularization and use values.

Description

Protective agent for computer circuit board
Technical Field
The invention relates to a computer auxiliary material, in particular to a protective agent for a computer circuit board.
Background
The application of computers is more and more common in China, after the innovation is opened, the number of Chinese computer users is continuously increased, the application level is continuously improved, and particularly, the application in the fields of Internet, communication, multimedia and the like obtains good results. The computer is basically composed of circuit boards, and in the prior art, the circuit boards of the computer are easy to deposit dust due to long service life, and the dust is conductive once being wet, so that the circuit boards are damaged, and in addition, the circuit boards are oxidized, so that the aging is accelerated, the service life is shortened, and therefore, the improvement space exists.
Disclosure of Invention
The present invention has been made to solve the above problems, and an object of the present invention is to provide a protective agent for a circuit board of a computer.
The invention realizes the purpose through the following technical scheme:
the adhesive layer spray is coated on a computer circuit board to form an adhesive layer, the insulating layer spray is coated on the adhesive layer to form an insulating layer, the heat conduction layer spray is coated on the insulating layer to form a heat conduction layer, the elastic material layer spray is coated on the heat conduction layer to form an elastic material layer, and the smooth surface protection layer spray is coated on the elastic material layer;
the bonding layer spray is prepared by mixing styrene-butadiene rubber, styrene-acrylic emulsion, acrylate, epoxy resin glue, sodium silicate, petroleum resin, hydroxy silicone oil, hexamethyldisilazane, turpentine, nano graphene, hydroxy silicone oil, solid polysulfide rubber and hydroxypropyl methyl cellulose ether;
the insulating layer spray is prepared by mixing solid polysulfide rubber, epoxy resin, silicon dioxide, polyurethane pressure-sensitive adhesive and polyester resin;
the heat conducting layer spray is prepared by mixing silica gel, copper powder, silicon powder, modified acrylic resin, dimethylbenzene, sodium fluosilicate, zinc oxide, ammonium sulfate, ammonium chloride and ferrous sulfate;
the elastic material layer spray is prepared by mixing natural rubber, nitrile rubber, vinyl resin, high-activity polymer polyol, ethylene glycol, triethyldiamine and diphenylmethane diisocyanate;
the smooth surface protective layer spray is prepared by mixing hydroxy acrylic resin, phenolic insulating varnish, ethylene glycol monobutyl ether, rosin modified resin, paint solvent oil and short oil alkyd.
Preferably, in the bonding layer spray, by weight, the styrene-butadiene rubber accounts for 15%, the styrene-acrylic emulsion accounts for 2%, the acrylate accounts for 5%, the epoxy resin glue accounts for 45%, the sodium silicate accounts for 1%, the petroleum resin accounts for 7%, the hydroxyl silicone oil accounts for 5%, the hexamethyldisilazane accounts for 1%, the turpentine accounts for 2%, the nano graphene accounts for 2%, the hydroxyl silicone oil accounts for 6%, the solid polysulfide rubber accounts for 8%, and the hydroxypropyl methyl cellulose ether accounts for 3%.
Preferably, in the insulating layer spray, the solid polysulfide rubber accounts for 25%, the epoxy resin accounts for 35%, the silicon dioxide accounts for 5%, the polyurethane pressure-sensitive adhesive accounts for 25%, and the polyester resin accounts for 10% by weight.
Preferably, in the heat conducting layer spray, by weight, 45% of silica gel, 15% of copper powder, 10% of silicon powder, 18% of modified acrylic resin, 1% of xylene, 2% of sodium fluorosilicate, 2% of zinc oxide, 3% of ammonium sulfate, 1% of ammonium chloride and 3% of ferrous sulfate.
Preferably, in the elastic material layer spray, by weight, 50% of natural rubber, 30% of nitrile rubber, 8% of vinyl resin, 3% of high-activity polymer polyol, 2% of ethylene glycol, 2% of triethyldiamine and 5% of diphenylmethane diisocyanate are used.
Preferably, in the smooth surface protective layer spray, the weight ratio of the hydroxyl acrylic resin is 20%, the weight ratio of the phenolic insulating varnish is 35%, the weight ratio of the ethylene glycol butyl ether is 25%, the weight ratio of the rosin modified resin is 15%, the weight ratio of the paint solvent oil is 3%, and the weight ratio of the short oil alkyd is 2%.
The invention has the beneficial effects that:
compared with the prior art, the protective agent for the computer circuit board is coated on the circuit board of the computer, so that dust is effectively prevented, in addition, the metal part of the computer circuit board can be effectively prevented from being oxidized, the aging degree of the computer circuit board is reduced, the service life is prolonged, when the protective agent is not needed, the protective agent can be torn off in a whole piece, the operation such as maintenance and the like is convenient, and the protective agent has popularization and use values.
Detailed Description
The invention is further illustrated below:
the adhesive layer spray is coated on a computer circuit board to form an adhesive layer, the insulating layer spray is coated on the adhesive layer to form an insulating layer, the heat conduction layer spray is coated on the insulating layer to form a heat conduction layer, the elastic material layer spray is coated on the heat conduction layer to form an elastic material layer, and the smooth surface protection layer spray is coated on the elastic material layer;
the bonding layer spray is prepared by mixing styrene-butadiene rubber, styrene-acrylic emulsion, acrylate, epoxy resin glue, sodium silicate, petroleum resin, hydroxy silicone oil, hexamethyldisilazane, turpentine, nano graphene, hydroxy silicone oil, solid polysulfide rubber and hydroxypropyl methyl cellulose ether;
the insulating layer spray is prepared by mixing solid polysulfide rubber, epoxy resin, silicon dioxide, polyurethane pressure-sensitive adhesive and polyester resin;
the heat conducting layer spray is prepared by mixing silica gel, copper powder, silicon powder, modified acrylic resin, dimethylbenzene, sodium fluosilicate, zinc oxide, ammonium sulfate, ammonium chloride and ferrous sulfate;
the elastic material layer spray is prepared by mixing natural rubber, nitrile rubber, vinyl resin, high-activity polymer polyol, ethylene glycol, triethyldiamine and diphenylmethane diisocyanate;
the smooth surface protective layer spray is prepared by mixing hydroxy acrylic resin, phenolic insulating varnish, ethylene glycol monobutyl ether, rosin modified resin, paint solvent oil and short oil alkyd.
Preferably, in the bonding layer spray, by weight, the styrene-butadiene rubber accounts for 15%, the styrene-acrylic emulsion accounts for 2%, the acrylate accounts for 5%, the epoxy resin glue accounts for 45%, the sodium silicate accounts for 1%, the petroleum resin accounts for 7%, the hydroxyl silicone oil accounts for 5%, the hexamethyldisilazane accounts for 1%, the turpentine accounts for 2%, the nano graphene accounts for 2%, the hydroxyl silicone oil accounts for 6%, the solid polysulfide rubber accounts for 8%, and the hydroxypropyl methyl cellulose ether accounts for 3%.
Preferably, in the insulating layer spray, the solid polysulfide rubber accounts for 25%, the epoxy resin accounts for 35%, the silicon dioxide accounts for 5%, the polyurethane pressure-sensitive adhesive accounts for 25%, and the polyester resin accounts for 10% by weight.
Preferably, in the heat conducting layer spray, by weight, 45% of silica gel, 15% of copper powder, 10% of silicon powder, 18% of modified acrylic resin, 1% of xylene, 2% of sodium fluorosilicate, 2% of zinc oxide, 3% of ammonium sulfate, 1% of ammonium chloride and 3% of ferrous sulfate.
Preferably, in the elastic material layer spray, by weight, 50% of natural rubber, 30% of nitrile rubber, 8% of vinyl resin, 3% of high-activity polymer polyol, 2% of ethylene glycol, 2% of triethyldiamine and 5% of diphenylmethane diisocyanate are used.
Preferably, in the smooth surface protective layer spray, the weight ratio of the hydroxyl acrylic resin is 20%, the weight ratio of the phenolic insulating varnish is 35%, the weight ratio of the ethylene glycol butyl ether is 25%, the weight ratio of the rosin modified resin is 15%, the weight ratio of the paint solvent oil is 3%, and the weight ratio of the short oil alkyd is 2%.
The using method of the invention comprises the following steps: spraying the adhesive layer spray, immediately spraying the insulating layer spray until the adhesive layer spray is fully distributed on the circuit board, after spraying a layer of insulating layer material, naturally air-drying the insulating layer spray, spraying the insulating layer material again until the thickness is 0.2-0.6mm, air-drying, and then spraying the heat conduction layer spray, wherein the heat conduction layer spray is required to be sprayed in multiple layers, is full and is 0.5-0.8mm in thickness, then spraying the elastic material layer for multiple times until the thickness is 0.2-0.4mm, and finally spraying a layer of smooth surface protection layer spray.
The material of the invention is tested, including thermal conductivity, tensile strength, tear strength, volume resistivity and breakdown voltage, and the test and performance data are as follows: thermal conductivity (W/m × k) 2.95; thermal resistance (. degree. C./W) 0.56; tensile strength (MPa) 16; tear strength (MPa) 32; volume resistivity (Ω cm)8 13(ii) a Breakdown voltage (kv/mm) 38.
The foregoing shows and describes the general principles and features of the present invention, together with the advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (6)

1. A computer circuit board protectant, comprising: the adhesive layer spray is coated on a computer circuit board to form an adhesive layer, the insulating layer spray is coated on the adhesive layer to form an insulating layer, the heat conduction layer spray is coated on the insulating layer to form a heat conduction layer, the elastic material layer spray is coated on the heat conduction layer to form an elastic material layer, and the smooth surface protection layer spray is coated on the elastic material layer;
the bonding layer spray is prepared by mixing styrene-butadiene rubber, styrene-acrylic emulsion, acrylate, epoxy resin glue, sodium silicate, petroleum resin, hydroxy silicone oil, hexamethyldisilazane, turpentine, nano graphene, hydroxy silicone oil, solid polysulfide rubber and hydroxypropyl methyl cellulose ether;
the insulating layer spray is prepared by mixing solid polysulfide rubber, epoxy resin, silicon dioxide, polyurethane pressure-sensitive adhesive and polyester resin;
the heat conducting layer spray is prepared by mixing silica gel, copper powder, silicon powder, modified acrylic resin, dimethylbenzene, sodium fluosilicate, zinc oxide, ammonium sulfate, ammonium chloride and ferrous sulfate;
the elastic material layer spray is prepared by mixing natural rubber, nitrile rubber, vinyl resin, high-activity polymer polyol, ethylene glycol, triethyldiamine and diphenylmethane diisocyanate;
the smooth surface protective layer spray is prepared by mixing hydroxy acrylic resin, phenolic insulating varnish, ethylene glycol monobutyl ether, rosin modified resin, paint solvent oil and short oil alkyd.
2. The computer circuit board protective agent according to claim 1, wherein: in the bonding layer spray, by weight, styrene-butadiene rubber accounts for 15%, styrene-acrylic emulsion accounts for 2%, acrylate accounts for 5%, epoxy resin glue accounts for 45%, sodium silicate accounts for 1%, petroleum resin accounts for 7%, hydroxyl silicone oil accounts for 5%, hexamethyldisilazane accounts for 1%, turpentine accounts for 2%, nano graphene accounts for 2%, hydroxyl silicone oil accounts for 6%, solid polysulfide rubber accounts for 8%, and hydroxypropyl methyl cellulose ether accounts for 3%.
3. The computer circuit board protective agent according to claim 1, wherein: in the insulating layer spray, by weight, 25% of solid polysulfide rubber, 35% of epoxy resin, 5% of silicon dioxide, 25% of polyurethane pressure-sensitive adhesive and 10% of polyester resin are used.
4. The computer circuit board protective agent according to claim 1, wherein: in the heat conducting layer spray, 45% of silica gel, 15% of copper powder, 10% of silicon powder, 18% of modified acrylic resin, 1% of dimethylbenzene, 2% of sodium fluosilicate, 2% of zinc oxide, 3% of ammonium sulfate, 1% of ammonium chloride and 3% of ferrous sulfate are mixed according to the weight ratio.
5. The computer circuit board protective agent according to claim 1, wherein: in the elastic material layer spray, by weight, 50% of natural rubber, 30% of nitrile rubber, 8% of vinyl resin, 3% of high-activity polymer polyol, 2% of ethylene glycol, 2% of triethyldiamine and 5% of diphenylmethane diisocyanate.
6. The computer circuit board protective agent according to claim 1, wherein: in the plain surface protective layer spray, the weight ratio of hydroxyl acrylic resin is 20%, phenolic insulating varnish is 35%, ethylene glycol butyl ether is 25%, rosin modified resin is 15%, paint solvent oil is 3%, and short oil alkyd is 2%.
CN201911047583.2A 2019-10-31 2019-10-31 Protective agent for computer circuit board Pending CN110776807A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911047583.2A CN110776807A (en) 2019-10-31 2019-10-31 Protective agent for computer circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911047583.2A CN110776807A (en) 2019-10-31 2019-10-31 Protective agent for computer circuit board

Publications (1)

Publication Number Publication Date
CN110776807A true CN110776807A (en) 2020-02-11

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CN201911047583.2A Pending CN110776807A (en) 2019-10-31 2019-10-31 Protective agent for computer circuit board

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107137862A (en) * 2017-06-11 2017-09-08 商洛学院 A kind of physical training ground cushion
CN107722777A (en) * 2017-11-13 2018-02-23 鹤山市千年化工实业有限公司 Automobile coating
CN109679347A (en) * 2019-01-03 2019-04-26 陕西理工大学 A kind of computer radiator heat-conducting compound and preparation method
CN110343477A (en) * 2019-06-25 2019-10-18 重庆交通大学 A kind of civil engineering adhesive waterproof tape
CN110373117A (en) * 2019-07-01 2019-10-25 重庆财经职业学院 A kind of embedded computer circuit board package material

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107137862A (en) * 2017-06-11 2017-09-08 商洛学院 A kind of physical training ground cushion
CN107722777A (en) * 2017-11-13 2018-02-23 鹤山市千年化工实业有限公司 Automobile coating
CN109679347A (en) * 2019-01-03 2019-04-26 陕西理工大学 A kind of computer radiator heat-conducting compound and preparation method
CN110343477A (en) * 2019-06-25 2019-10-18 重庆交通大学 A kind of civil engineering adhesive waterproof tape
CN110373117A (en) * 2019-07-01 2019-10-25 重庆财经职业学院 A kind of embedded computer circuit board package material

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Application publication date: 20200211

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