CN109666957A - A kind of configuration method of organic acid pretreating reagent - Google Patents
A kind of configuration method of organic acid pretreating reagent Download PDFInfo
- Publication number
- CN109666957A CN109666957A CN201910076725.1A CN201910076725A CN109666957A CN 109666957 A CN109666957 A CN 109666957A CN 201910076725 A CN201910076725 A CN 201910076725A CN 109666957 A CN109666957 A CN 109666957A
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- China
- Prior art keywords
- organic acid
- pretreating reagent
- configuration method
- acid pretreating
- parts
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
Abstract
The invention discloses a kind of configuration method of organic acid pretreating reagent, the organic acid pretreating reagent includes following raw material: 40~60 parts of organic acid, 10~15 parts of polyethylene glycol, 0.3~0.5 part and 49.5~49.7 parts of pure water of surfactant；Organic acid pretreating reagent of the invention is easy to use, at low cost, solves the problems, such as copper ion contaminant water；Using method of the invention, provide that a kind of manufacturing process is simple, manufacturing cost is low, rapid reaction, the superior environmentally protective tin electroplating technology pre-treatment liquid medicine of product quality；This is environmentally protective using the organic acid pretreating reagent that method of the invention is prepared, can be in 20~40 DEG C of normal buffs, and 1~2 volt of voltage.
Description
Technical field
The present invention relates to the organic acid treatment process of electroplating technology, in particular to a kind of configuration side of organic acid pretreating reagent
Method.
Background technique
Organic acid pre-treatment electroplating technology is widely used in the plating of IC integrated circuit, compared with commonly activation Pure Tin Plating Process,
The features such as corrosivity is low and coating is bright, and solderability is good is the environmentally protective electricity that our times various countries are dedicated to promoting and using
Plating system.Copper ion is to influence the important indicator of environment on the pollution of water.
Currently, the production of tin plating generallys use chemical activation pre-treatment, method mainly adopts sulfuric acid and sulfate pair
Substrate surface is removed oxide, and corrosivity is relatively high.Since corrosivity is relatively high, make the copper dissolution on substrate in liquid
In, cause copper ion concentration in solution high.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of organic acid pretreating reagents that can reduce copper ion pollution
Configuration method.
In order to solve the above-mentioned technical problem, the technical solution of the present invention is as follows:
A kind of configuration method of organic acid pretreating reagent, the organic acid pretreating reagent includes following raw material: being had
40~60 parts of machine acid, 10~15 parts of polyethylene glycol, 0.3~0.5 part and 49.5~49.7 parts of pure water of surfactant；
The configuration method of the organic acid pretreating reagent includes the following steps:
(a) raw material is weighed；
(b) organic acid after weighing, polyethylene glycol, surfactant and pure water are sequentially added, is stirred 3~5 hours, stirring
Temperature is 15~35 DEG C；
(c) solution after stirring in step (b) is filtered through filtration core, obtains the organic acid pretreating reagent.
Preferably, the organic acid is citric acid.
Preferably, the molecular weight of the polyethylene glycol is 1000~2000.Select this molecular weight ranges can be with outstanding
The limpid solution of damp degree.
Preferably, the surfactant is naphthols polyoxyethylene ether.
Preferably, the filtering accuracy of the filter core is 1~5 μm.The solid sundries in solution can be filtered out.
By adopting the above technical scheme, organic acid pretreating reagent of the invention is easy to use, at low cost, solves copper ion dirt
The problem of contaminating water；Using method of the invention, provide that a kind of manufacturing process is simple, manufacturing cost is low, rapid reaction, product matter
Measure superior environmentally protective tin electroplating technology pre-treatment liquid medicine；This organic acid pre-treatment being prepared using method of the invention
Agent is environmentally protective, can be in 20~40 DEG C of normal buffs, and 1~2 volt of voltage.
Specific embodiment
Specific embodiments of the present invention will be further explained below.It should be noted that for these implementations
The explanation of mode is used to help understand the present invention, but and does not constitute a limitation of the invention.In addition, invention described below
Technical characteristic involved in each embodiment can be combined with each other as long as they do not conflict with each other.
Embodiment 1
Weigh 400 grams of organic acid, 100 grams of quality of polyethylene glycol (molecular weight 1000) is added in beaker, example in mass ratio
497 grams of pure water and 3 gram mass surfactants are added, the solution in beaker are heated to 15 DEG C, it is small to be sufficiently stirred 4 with blender
When, the solution being stirred is filtered with 1um filter paper, obtains 1000 grams of organic acid pretreating reagents；
Organic acid pre-treatment electrolysis principle: oxidation reaction occurs for the principle of Applied Electrochemistry, anode, and it is anti-that reduction occurs for cathode
It answers, gold, belongs to ion and be constantly adsorbed to cathode surface:
A) anode: oxidation reaction Cu-2e → Cu2+
B) cathode: reduction reaction Cu2++2e→Cu
The organic acid pretreating reagent that will be obtained, the product for being electrolysed Copper base material see the table below:
| The product substrate for needing to be electrolysed | Copper material |
| Temperature (DEG C) | 20 |
| It handles voltage (volt) | 1.0 |
| It handles time (second) | 10 |
| It is electrolysed rear surface effect (range estimation) | Copper base material surface is vivid smooth |
Embodiment 2
Weigh 500 grams of organic acid quality, 125 grams of quality of polyethylene glycol (molecular weight 1500) is added in beaker, by quality
371 grams of pure water and 4 grams of surfactants are added in ratio, the solution in beaker are heated to 25 DEG C, it is small to be sufficiently stirred 4 with blender
When, the solution being stirred is filtered with 5um filter paper, obtains 1000 grams of organic acid pretreating reagents.
The organic acid pretreating reagent that will be obtained, the product for being electrolysed Copper base material see the table below:
| The product substrate for needing to be electrolysed | Copper material |
| Temperature (DEG C) | 30 |
| It handles voltage (volt) | 1.5 |
| It handles time (second) | 20 |
| It is electrolysed rear surface effect (range estimation) | Copper base material surface is vivid smooth |
Embodiment 3
Weigh 600 grams of organic acid quality, 150 grams of quality of polyethylene glycol (molecular weight 2000) is added in beaker, by quality
245 grams of pure water and 5 grams of surfactants are added in ratio, the solution in beaker are heated to 35 DEG C, it is small to be sufficiently stirred 4 with blender
When, the solution being stirred is filtered with 10um filter paper, obtains 1000 grams of organic acid pretreating reagents.
The organic acid pretreating reagent that will be obtained, the product for being electrolysed Copper base material see the table below:
| The product substrate for needing to be electrolysed | Copper material |
| Temperature (DEG C) | 40 |
| It handles voltage (volt) | 2.0 |
| It handles time (second) | 30 |
| It is electrolysed rear surface effect (range estimation) | Copper base material surface is vivid smooth |
Above the embodiments of the present invention are described in detail, but the present invention is not limited to described embodiments.It is right
For those skilled in the art, in the case where not departing from the principle of the invention and spirit, these embodiments are carried out more
Kind change, modification, replacement and modification, still fall in protection scope of the present invention.
Claims (5)
1. a kind of configuration method of organic acid pretreating reagent, it is characterised in that: the organic acid pretreating reagent includes following weight
Part raw material: 40~60 parts of organic acid, 10~15 parts of polyethylene glycol, 0.3~0.5 part of surfactant and pure water 49.5~49.7
Part；
The configuration method of the organic acid pretreating reagent includes the following steps:
(a) raw material is weighed；
(b) organic acid after weighing, polyethylene glycol, surfactant and pure water are sequentially added, is stirred 3~5 hours, whipping temp
It is 15~35 DEG C；
(c) solution after stirring in step (b) is filtered through filtration core, obtains the organic acid pretreating reagent.
2. the configuration method of organic acid pretreating reagent according to claim 1, it is characterised in that: the organic acid is lemon
Acid.
3. the configuration method of organic acid pretreating reagent according to claim 1, it is characterised in that: point of the polyethylene glycol
Son amount is 1000~2000.
4. the configuration method of organic acid pretreating reagent according to claim 1, it is characterised in that: the surfactant is
Naphthols polyoxyethylene ether.
5. the configuration method of organic acid pretreating reagent according to claim 1, it is characterised in that: the filtering essence of the filter core
Degree is 1~5 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910076725.1A CN109666957A (en) | 2019-01-26 | 2019-01-26 | A kind of configuration method of organic acid pretreating reagent |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910076725.1A CN109666957A (en) | 2019-01-26 | 2019-01-26 | A kind of configuration method of organic acid pretreating reagent |
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| Publication Number | Publication Date |
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| CN109666957A true CN109666957A (en) | 2019-04-23 |
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| CN201910076725.1A Pending CN109666957A (en) | 2019-01-26 | 2019-01-26 | A kind of configuration method of organic acid pretreating reagent |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111593386A (en) * | 2020-07-09 | 2020-08-28 | 惠州市腾达宇科技有限公司 | Electroplating activator and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5861293A (en) * | 1982-08-25 | 1983-04-12 | Masami Kobayashi | Method for plating of stainless steel strip for electronic parts with gold |
| CN101168847A (en) * | 2006-09-04 | 2008-04-30 | 株式会社荏原制作所 | Electrolytic liquid for electrolytic polishing and electrolytic polishing method |
| CN102127801A (en) * | 2011-01-20 | 2011-07-20 | 大连理工大学 | Electrolyte for electrochemical mechanical polishing of copper interconnecting layer and preparation method thereof |
| CN105948212A (en) * | 2016-06-16 | 2016-09-21 | 上海华友金裕微电子有限公司 | Organic acid sinking agent preparing method |
| CN105970230A (en) * | 2016-07-10 | 2016-09-28 | 李金平 | Environment-friendly chemical polishing solution |
| CN106567122A (en) * | 2017-02-17 | 2017-04-19 | 大博医疗科技股份有限公司 | Electrochemical polishing electrolyte and polishing method for titanium and titanium alloy |
-
2019
- 2019-01-26 CN CN201910076725.1A patent/CN109666957A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5861293A (en) * | 1982-08-25 | 1983-04-12 | Masami Kobayashi | Method for plating of stainless steel strip for electronic parts with gold |
| CN101168847A (en) * | 2006-09-04 | 2008-04-30 | 株式会社荏原制作所 | Electrolytic liquid for electrolytic polishing and electrolytic polishing method |
| CN102127801A (en) * | 2011-01-20 | 2011-07-20 | 大连理工大学 | Electrolyte for electrochemical mechanical polishing of copper interconnecting layer and preparation method thereof |
| CN105948212A (en) * | 2016-06-16 | 2016-09-21 | 上海华友金裕微电子有限公司 | Organic acid sinking agent preparing method |
| CN105970230A (en) * | 2016-07-10 | 2016-09-28 | 李金平 | Environment-friendly chemical polishing solution |
| CN106567122A (en) * | 2017-02-17 | 2017-04-19 | 大博医疗科技股份有限公司 | Electrochemical polishing electrolyte and polishing method for titanium and titanium alloy |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111593386A (en) * | 2020-07-09 | 2020-08-28 | 惠州市腾达宇科技有限公司 | Electroplating activator and preparation method thereof |
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Application publication date: 20190423 |