CN111593386A - Electroplating activator and preparation method thereof - Google Patents
Electroplating activator and preparation method thereof Download PDFInfo
- Publication number
- CN111593386A CN111593386A CN202010655957.5A CN202010655957A CN111593386A CN 111593386 A CN111593386 A CN 111593386A CN 202010655957 A CN202010655957 A CN 202010655957A CN 111593386 A CN111593386 A CN 111593386A
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- polyamide
- ether
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- acid
- electroplating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention belongs to the field of metal surface cleaning, and particularly discloses an electroplating activator and a preparation method thereof, the electroplating activator comprises 10-80 parts by weight of organic acid, 0.5-5 parts by weight of inorganic acid, 0.1-2 parts by weight of surfactant, 0.1-2 parts by weight of additive, 0.1-2 parts by weight of polyamide substance and 0.2-1 part by weight of ether substance, wherein the combination of the organic acid and the inorganic acid can effectively remove an oxidation film of a plated part, the polyamide substance (polyamide ether, polyamide sodium and polyamide potassium) contains amide bond which is a functional group with electronegativity and has better hydrophilicity and can effectively remove stains on the surface of the plated part, the ether substance (polyether glycol, halogenated ether and polyamide ether) contains ether bond, and the ether bond is a polar group, helping the adhesion.
Description
Technical Field
The invention belongs to the field of metal surface cleaning, and particularly relates to an electroplating activator and a preparation method thereof.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis, thereby having the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like.
The electroplating activator is generally a process of corroding a part to be plated with acid or alkali solution to dissolve an oxide film on the surface of the part and expose an active metal interface, so as to ensure the bonding force of an electroplated layer and a substrate.
In the prior art, the electroplating activator can effectively remove the oxide film on the surface of the plated part, but the surface of the plated part can be damaged to a certain extent, and the subsequent operation can be influenced.
Disclosure of Invention
In order to solve the problems, the invention provides an electroplating activator and a preparation method thereof, the electroplating activator has better capability of removing an oxide film on the surface of a plated part, can also effectively protect the plated part, and is beneficial to subsequent operation, and the contents of the electroplating activator are as follows:
the invention aims to provide an electroplating activator, which is technically characterized in that: the electroplating activator comprises, by weight, 10-80 parts of organic acid, 0.5-5 parts of inorganic acid, 0.1-2 parts of surfactant, 0.1-2 parts of additive, 0.1-2 parts of polyamide substance and 0.2-1 part of ether substance.
In some embodiments of the invention, the organic acid is at least one of citric acid, oxalic acid and acetic acid.
In some embodiments of the present invention, the inorganic acid is at least one of hydrochloric acid, sulfuric acid and hydrofluoric acid.
In some embodiments of the invention, the surfactant includes polyethylene glycol, ethylenediamine, sodium 2-ethylhexyl sulfonate, polysorbate-80, and polyethylene glycol octylphenyl ether.
In some embodiments of the invention, the additive is at least one of benzene, toluene, xylene, formaldehyde, choline chloride, methanol, ethanol, sodium chloride, potassium chloride, magnesium chloride, manganese chloride, and cerium chloride.
In some embodiments of the present invention, the polyamide-based substance is at least one of polyamide ether, polyamide sodium and polyamide potassium.
In some embodiments of the present invention, the ether substance is at least one of polyether polyol, halogenated ether and polyamide ether.
Another object of the present invention is to provide a plating activator, which comprises: the preparation method of the electroplating activator comprises the following steps:
the method comprises the following steps: adding the organic acid into a reaction kettle A, starting stirring, adding the surfactant, slowly adding the polyamide substances after complete dissolution, then adding the additive until complete dissolution, starting heating, keeping the temperature at 60-70 ℃, keeping the temperature for 30-60min, closing heating, and keeping stirring to obtain a component A;
step two: adding the inorganic acid into a reaction kettle B, slowly adding the ether substance, completely dissolving, and heating to 60-70 ℃ to obtain a component B;
step three: slowly adding the component A in the step one into the component B in the step two, uniformly stirring, keeping the temperature constant for 0.5-2h when the temperature is increased to 110 ℃, closing and heating, stirring and cooling to 40-50 ℃, closing and stirring, naturally cooling to room temperature and packaging to obtain the electroplating activator.
Compared with the prior art, the invention has the beneficial effects that:
when the electroplating activator is used for carrying out surface treatment on a plated part, the used activator comprises an organic acid, an inorganic acid, a surfactant, an additive, a polyamide substance and an ether substance, wherein the combination of the organic acid and the inorganic acid can effectively remove an oxidation film of the plated part, the polyamide substance (polyamide ether, polyamide sodium and polyamide potassium) contains an amido bond, the amido bond is a functional group with electronegativity and has good hydrophilicity, the dirt on the surface of the plated part can be effectively removed, the ether substance (polyether polyol, halogenated ether and polyamide ether) contains an ether bond, and the ether bond is a polar group and contributes to adhesion.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below so that those skilled in the art can better understand the advantages and features of the present invention, and thus the scope of the present invention will be more clearly defined. The embodiments described herein are only a few embodiments of the present invention, rather than all embodiments, and all other embodiments that can be derived by one of ordinary skill in the art without inventive faculty based on the embodiments described herein are intended to fall within the scope of the present invention.
Example 1
The electroplating activator comprises, by weight, 45 parts of organic acid, 2.5 parts of inorganic acid, 1 part of surfactant, 1 part of additive, 1 part of polyamide substance and 0.6 part of ether substance.
Wherein the organic acid is citric acid.
Wherein the inorganic acid is hydrochloric acid.
Wherein the surfactant comprises polyethylene glycol.
Wherein the additive is benzene.
Wherein the polyamide substance is polyamide ether.
Wherein the ether substance is polyether polyol.
According to the formula, the preparation method of the electroplating activator comprises the following steps:
the method comprises the following steps: adding the organic acid into a reaction kettle A, starting stirring, adding the surfactant, slowly adding the polyamide substances after complete dissolution, then adding the additive until complete dissolution, starting heating, keeping the temperature at 65 ℃ for 45min, closing heating, and keeping stirring to obtain a component A;
step two: adding the inorganic acid into a reaction kettle B, slowly adding the ether substance, completely dissolving, and heating to 65 ℃ to obtain a component B;
step three: and (3) slowly adding the component A in the step one into the component B in the step two, uniformly stirring, keeping the temperature constant for 1h when the temperature is raised to 105 ℃, closing and heating, stirring and cooling to 45 ℃, closing and stirring, naturally cooling to room temperature and packaging to obtain the electroplating activator.
Example 2
The electroplating activator comprises, by weight, 80 parts of organic acid, 0.5 part of inorganic acid, 0.1 part of surfactant, 0.1 part of additive, 0.1 part of polyamide substance and 0.2 part of ether substance.
Wherein the organic acid is oxalic acid.
Wherein the inorganic acid is sulfuric acid.
Wherein the surfactant comprises sodium 2-ethylhexyl sulfonate.
Wherein the additive is xylene.
Wherein the polyamide substance is polyamide sodium.
Wherein the ether substance is polyether polyol.
According to the formula, the preparation method of the electroplating activator comprises the following steps:
the method comprises the following steps: adding the organic acid into a reaction kettle A, starting stirring, adding the surfactant, slowly adding the polyamide substances after complete dissolution, then adding the additive until complete dissolution, starting heating, keeping the temperature at 70 ℃, keeping the temperature for 30min, closing heating, and keeping stirring to obtain a component A;
step two: adding the inorganic acid into a reaction kettle B, slowly adding the ether substance, completely dissolving, and heating to 70 ℃ to obtain a component B;
step three: and (3) slowly adding the component A in the step one into the component B in the step two, uniformly stirring, keeping the temperature constant for 0.5h when the temperature is raised to 110 ℃, turning off heating, stirring, cooling to 50 ℃, turning off stirring, naturally cooling to room temperature, and packaging to obtain the electroplating activator.
Example 3
The electroplating activator comprises, by weight, 10 parts of organic acid, 5 parts of inorganic acid, 2 parts of surfactant, 2 parts of additive, 2 parts of polyamide substance and 1 part of ether substance.
Wherein the organic acid is acetic acid.
Wherein the inorganic acid is hydrofluoric acid.
Wherein the surfactant comprises 2-ethylhexyl sodium sulfonate.
Wherein, the additive is choline chloride and cerium chloride.
Wherein the polyamide substance is polyamide potassium.
Wherein the ether substance is polyamide ether.
According to the formula, the preparation method of the electroplating activator comprises the following steps:
the method comprises the following steps: adding the organic acid into a reaction kettle A, starting stirring, adding the surfactant, slowly adding the polyamide substances after complete dissolution, then adding the additive until complete dissolution, starting heating, keeping the temperature at 60 ℃, stopping heating, and keeping stirring to obtain a component A;
step two: adding the inorganic acid into a reaction kettle B, slowly adding the ether substance, completely dissolving, and heating to 60 ℃ to obtain a component B;
step three: and (3) slowly adding the component A in the step one into the component B in the step two, uniformly stirring, keeping the temperature constant for 2 hours when the temperature is raised to 100 ℃, closing and heating, stirring and cooling to 40 ℃, closing and stirring, naturally cooling to room temperature and packaging to obtain the electroplating activator.
Example 4
The electroplating activator comprises, by weight, 20 parts of organic acid, 0.6 part of inorganic acid, 0.2 part of surfactant, 0.2 part of additive, 0.2 part of polyamide substance and 0.4 part of ether substance.
Wherein the organic acid is a mixture of citric acid and oxalic acid.
Wherein the inorganic acid is a mixture of sulfuric acid and hydrofluoric acid.
Wherein the surfactant comprises a mixture of polysorbate-80 and octyl phenyl ether of polyethylene glycol.
Wherein the additive is a mixture of magnesium chloride, manganese chloride and cerium chloride.
Wherein the polyamide substance is a mixture of polyamide sodium and polyamide potassium.
Wherein the ether substance is a mixture of halogenated ether and polyamide ether.
According to the formula, the preparation method of the electroplating activator comprises the following steps:
the method comprises the following steps: adding the organic acid into a reaction kettle A, starting stirring, adding the surfactant, slowly adding the polyamide substances after complete dissolution, then adding the additive until complete dissolution, starting heating, keeping the temperature at 65 ℃ for 45min, closing heating, and keeping stirring to obtain a component A;
step two: adding the inorganic acid into a reaction kettle B, slowly adding the ether substance, completely dissolving, and heating to 65 ℃ to obtain a component B;
step three: and (3) slowly adding the component A in the step one into the component B in the step two, uniformly stirring, keeping the temperature constant for 1h when the temperature is raised to 105 ℃, closing and heating, stirring and cooling to 45 ℃, closing and stirring, naturally cooling to room temperature and packaging to obtain the electroplating activator.
Comparative example 1
In this comparative example, a plating activator of this comparative example was obtained by performing the same operation as in example 1, except that no polyamide-based substance was added.
Comparative example 2
In this comparative example, the plating activator of this comparative example was obtained by performing the same operation as in example 1 without adding any ether substance.
Examples of the experiments
The plating activators obtained in examples 1 to 4 and the plating activators obtained in comparative examples 1 to 2 were used to remove the oxide film on the same copper sheet, and the removal of the surface of the copper sheet was observed as shown in Table 1:
TABLE 1
| Surface condition of plated part after treatment | |
| Practice ofExample 1 | The oxide film on the surface of the plated part is completely removed without damaging the surface |
| Example 2 | The oxide film on the surface of the plated part is completely removed without damaging the surface |
| Example 3 | The oxide film on the surface of the plated part is completely removed without damaging the surface |
| Example 4 | The oxide film on the surface of the plated part is completely removed without damaging the surface |
| Comparative example 1 | The oxide film on the surface of the plated part is completely removed, and the surface is slightly damaged |
| Comparative example 2 | The oxide film on the surface of the plated part is completely removed, and the surface is slightly damaged |
The present invention provides only one electroplating activator and a method for preparing the same, and a plurality of methods and ways for implementing the technical scheme, and the above description is only a preferred embodiment of the present invention, it should be noted that, for a person skilled in the art, a plurality of improvements and modifications can be made without departing from the principle of the present invention, and the improvements and modifications should be regarded as the protection scope of the present invention, and each component not explicitly described in the embodiment can be implemented by the prior art.
Claims (8)
1. An electroplating activator, comprising: the electroplating activator comprises, by weight, 10-80 parts of organic acid, 0.5-5 parts of inorganic acid, 0.1-2 parts of surfactant, 0.1-2 parts of additive, 0.1-2 parts of polyamide substance and 0.2-1 part of ether substance.
2. A plating activator according to claim 1, characterized in that: the organic acid is at least one of citric acid, oxalic acid and acetic acid.
3. A plating activator according to claim 1, characterized in that: the inorganic acid is at least one of hydrochloric acid, sulfuric acid and hydrofluoric acid.
4. A plating activator according to claim 1, characterized in that: the surfactant comprises polyethylene glycol, ethylenediamine, 2-ethylhexyl sodium sulfonate, polysorbate-80 and polyethylene glycol octyl phenyl ether.
5. A plating activator according to claim 1, characterized in that: the additive is at least one of benzene, toluene, xylene, formaldehyde, choline chloride, methanol, ethanol, sodium chloride, potassium chloride, magnesium chloride, manganese chloride and cerium chloride.
6. A plating activator according to claim 1, characterized in that: the polyamide substance is at least one of polyamide ether, polyamide sodium and polyamide potassium.
7. A plating activator according to claim 1, characterized in that: the ether substance is at least one of polyether polyol, halogenated ether and polyamide ether.
8. A plating activator according to any one of claims 1 to 7, characterized in that: the preparation method of the electroplating activator comprises the following steps:
the method comprises the following steps: adding the organic acid into a reaction kettle A, starting stirring, adding the surfactant, slowly adding the polyamide substances after complete dissolution, then adding the additive until complete dissolution, starting heating, keeping the temperature at 60-70 ℃, keeping the temperature for 30-60min, closing heating, and keeping stirring to obtain a component A;
step two: adding the inorganic acid into a reaction kettle B, slowly adding the ether substance, completely dissolving, and heating to 60-70 ℃ to obtain a component B;
step three: slowly adding the component A in the step one into the component B in the step two, uniformly stirring, keeping the temperature constant for 0.5-2h when the temperature is increased to 110 ℃, closing and heating, stirring and cooling to 40-50 ℃, closing and stirring, naturally cooling to room temperature and packaging to obtain the electroplating activator.
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| CN202010655957.5A CN111593386A (en) | 2020-07-09 | 2020-07-09 | Electroplating activator and preparation method thereof |
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| CN202010655957.5A CN111593386A (en) | 2020-07-09 | 2020-07-09 | Electroplating activator and preparation method thereof |
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Application publication date: 20200828 |