CN109664164B - Sweeping processing technology - Google Patents

Sweeping processing technology Download PDF

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Publication number
CN109664164B
CN109664164B CN201811557636.0A CN201811557636A CN109664164B CN 109664164 B CN109664164 B CN 109664164B CN 201811557636 A CN201811557636 A CN 201811557636A CN 109664164 B CN109664164 B CN 109664164B
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rotating speed
disc rotating
small disc
5rpm
stage
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CN109664164A (en
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胡志海
邓敏
叶惠敏
邱欣南
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GANZHOU DPT TECHNOLOGY CO LTD
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GANZHOU DPT TECHNOLOGY CO LTD
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes

Abstract

The invention discloses a scanning processing technology, which comprises the following steps: forward rotation first stage: setting the processing time to be 10s, the upper disc rotating speed to be 80-100rpm, the upper small disc rotating speed to be 80-100rpm, the lower disc rotating speed to be 3-7rpm, the lower small disc rotating speed to be 1-5rpm and the processing pressure to be 90 kg; a forward rotation second stage: setting the processing time as 10s, the upper disc rotating speed of 170-190rpm, the upper small disc rotating speed of 170-190rpm, the lower disc rotating speed of 3-7rpm, the lower small disc rotating speed of 1-5rpm and the processing pressure of 100 kg; reversing the first phase; reversing the second stage; the process omits the procedures of flat grinding and upper-scanning and lower-grinding, and one-step scanning and polishing is carried out, so that the device is smoother and brighter, and the flatness N of the flat crystal is less than or equal to 3.

Description

Sweeping processing technology
Technical Field
The invention relates to a scanning finishing process, and belongs to the technical field of workpiece finish machining.
Background
The grinding and polishing technology is an important technical link in the field of modern workpiece surface processing, and the roughness of the workpiece surface is reduced by grinding and polishing equipment so as to obtain a bright and flat surface; the existing grinding equipment generally utilizes a polishing tool and grinding fluid or other polishing media to modify and process the surface of a workpiece.
The existing light sweeping process aims at polishing the surface of a workpiece, comprises 3 procedures of light sweeping, flat grinding and upper-scanning and lower-grinding, and is processed by 3 processing devices, so that the requirement that the flatness N of a flat crystal is less than or equal to 3 is met. The method has the disadvantages of more process flows, more required equipment and long processing period.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a scanning polishing processing technology which omits the procedures of flat polishing and upper scanning lower polishing and one-step scanning polishing so that a device is smoother and brighter, and the flatness N of a plane crystal is less than or equal to 3.
The purpose of the invention can be achieved by adopting the following technical scheme: a light sweeping processing technology comprises the following steps:
forward rotation first stage: setting the processing time to be 10s, the upper disc rotating speed to be 80-100rpm, the upper small disc rotating speed to be 80-100rpm, the lower disc rotating speed to be 3-7rpm, the lower small disc rotating speed to be 1-5rpm and the processing pressure to be 90 kg;
a forward rotation second stage: setting the processing time as 10s, the upper disc rotating speed of 170-190rpm, the upper small disc rotating speed of 170-190rpm, the lower disc rotating speed of 3-7rpm, the lower small disc rotating speed of 1-5rpm and the processing pressure of 100 kg;
reversing the first stage: setting the processing time to be 10s, the upper disc rotating speed to be 80-100rpm, the upper small disc rotating speed to be 80-100rpm, the lower disc rotating speed to be 3-7rpm, the lower small disc rotating speed to be 1-5rpm and the processing pressure to be 90 kg;
and reversing the second stage: setting the processing time as 10s, the upper disc rotating speed 170-190rpm, the upper small disc rotating speed 170-190rpm, the lower disc rotating speed 3-7rpm, the lower small disc rotating speed 1-5rpm and the processing pressure 100 kg.
Further, the forward rotation first stage: setting the processing time to be 10s, the upper disc rotating speed to be 90rpm, the upper small disc rotating speed to be 90rpm, the lower disc rotating speed to be 5rpm, the lower small disc rotating speed to be 3rpm and the processing pressure to be 90 kg;
a forward rotation second stage: the processing time is set to be 10s, the upper disc rotating speed is 180rpm, the upper small disc rotating speed is 180rpm, the lower disc rotating speed is 5rpm, the lower small disc rotating speed is 3rpm, and the processing pressure is 100 kg.
Further, the first phase is reversed: setting the processing time to be 10s, the upper disc rotating speed to be 90rpm, the upper small disc rotating speed to be 90rpm, the lower disc rotating speed to be 5rpm, the lower small disc rotating speed to be 3rpm and the processing pressure to be 90 kg;
and reversing the second stage: the processing time is set to be 10s, the upper disc rotating speed is 180rpm, the upper small disc rotating speed is 180rpm, the lower disc rotating speed is 5rpm, the lower small disc rotating speed is 3rpm, and the processing pressure is 100 kg.
Further, the method also comprises a third stage of forward rotation: the processing time is set to be 730s, the upper disc rotating speed is 270-290rpm, the upper small disc rotating speed is 270-290rpm, the lower disc rotating speed is 3-7rpm, the lower small disc rotating speed is 1-5rpm, and the processing pressure is 150 kg.
Further, the third stage of forward rotation: the processing time is set to 730s, the upper disc rotating speed is 280rpm, the upper small disc rotating speed is 280rpm, the lower disc rotating speed is 5rpm, the lower small disc rotating speed is 3rpm, and the processing pressure is 150 kg.
Further, a third stage of inversion is also included: the processing time is set to be 730s, the upper disc rotating speed is 270-290rpm, the upper small disc rotating speed is 270-290rpm, the lower disc rotating speed is 3-7rpm, the lower small disc rotating speed is 1-5rpm, and the processing pressure is 150 kg.
Further, the third stage is reversed: the processing time is set to 730s, the upper disc rotating speed is 280rpm, the upper small disc rotating speed is 280rpm, the lower disc rotating speed is 5rpm, the lower small disc rotating speed is 3rpm, and the processing pressure is 150 kg.
Furthermore, a polishing piece is arranged on the upper small disc; the polishing piece is a pig hair brush.
Furthermore, a buffing is arranged on the lower small disc; the end angle of the buffing is provided with a first horizontal extension part.
Further, a second horizontal extension part is arranged at the edge of the short edge of the buffing.
The optical scanner equipment used in the invention is a Seebel optical scanner DM-42-6P, and the upper small plate is arranged in the upper plate, and generally at least two upper small plates are also called as a secondary upper plate; the lower small plates are arranged in the lower plate, and generally at least two lower plates are also called as secondary lower plates; the upper disc and the lower disc are oppositely arranged, and the upper small disc and the lower small disc are oppositely arranged.
Compared with the prior art, the invention has the beneficial effects that:
1. the processing technology of the invention omits the procedures of flat grinding and upper-scanning lower-grinding, and realizes one-step scanning grinding by improving the parameters in the scanning step, so that the device is smoother and brighter, and the flatness N of the flat crystal is less than or equal to 3;
2. according to the processing technology, the upper disc and the upper small disc rotate in the same direction, the lower disc and the lower small disc rotate in the same direction, relative rotating speed is generated, and light sweeping efficiency is higher.
Drawings
FIG. 1 is a buffing configuration according to an embodiment of the present invention;
FIG. 2 is a buffing structure in a comparative example;
in the figure, 1, a first extension part; 2. a second extension portion.
Detailed Description
A light sweeping processing technology comprises the following steps:
forward rotation first stage: setting the processing time to be 10s, the upper disc rotating speed to be 80-100rpm, the upper small disc rotating speed to be 80-100rpm, the lower disc rotating speed to be 3-7rpm, the lower small disc rotating speed to be 1-5rpm and the processing pressure to be 90 kg;
a forward rotation second stage: setting the processing time as 10s, the upper disc rotating speed of 170-190rpm, the upper small disc rotating speed of 170-190rpm, the lower disc rotating speed of 3-7rpm, the lower small disc rotating speed of 1-5rpm and the processing pressure of 100 kg;
a third stage of positive rotation: setting the processing time as 730s, the upper disc rotating speed of 270-290rpm, the upper small disc rotating speed of 270-290rpm, the lower disc rotating speed of 3-7rpm, the lower small disc rotating speed of 1-5rpm and the processing pressure of 150 kg;
reversing the first stage: setting the processing time to be 10s, the upper disc rotating speed to be 80-100rpm, the upper small disc rotating speed to be 80-100rpm, the lower disc rotating speed to be 3-7rpm, the lower small disc rotating speed to be 1-5rpm and the processing pressure to be 90 kg;
and reversing the second stage: setting the processing time as 10s, the upper disc rotating speed of 170-190rpm, the upper small disc rotating speed of 170-190rpm, the lower disc rotating speed of 3-7rpm, the lower small disc rotating speed of 1-5rpm and the processing pressure of 100 kg;
and (3) reversing the third stage: the processing time is set to be 730s, the upper disc rotating speed is 270-290rpm, the upper small disc rotating speed is 270-290rpm, the lower disc rotating speed is 3-7rpm, the lower small disc rotating speed is 1-5rpm, and the processing pressure is 150 kg.
Wherein, the upper small disc is provided with a grinding piece; the polishing piece is a pig hair brush.
Wherein, the lower small disc is provided with a buffing; as shown in fig. 1: the end angle of the buffing is provided with a first horizontal extension part 1, and the short edge of the buffing is provided with a second horizontal extension part 2.
The buffing is less in the conventional design, and the product edge probably surpasss the buffing, and the atress is inhomogeneous when leading to polishing, through the research, the inhomogeneous easy position that appears at end angle and minor face of polishing, weak because of the bearing capacity of end angle and minor face, the minor face edge department of being equipped with first horizontal extension and buffing through the end angle department of buffing is equipped with the horizontal extension of second, can overcome the uneven problem of buffing edge atress of polishing to practice thrift the buffing.
Example (b):
a light scanning processing technology for scanning a 2.5D mobile phone glass cover plate comprises the following steps:
forward rotation first stage: setting the processing time to be 10s, the upper disc rotating speed to be 90rpm, the upper small disc rotating speed to be 90rpm, the lower disc rotating speed to be 5rpm, the lower small disc rotating speed to be 3rpm and the processing pressure to be 90 kg;
a forward rotation second stage: setting the processing time to be 10s, the upper disc rotating speed to be 180rpm, the upper small disc rotating speed to be 180rpm, the lower disc rotating speed to be 5rpm, the lower small disc rotating speed to be 3rpm and the processing pressure to be 100 kg;
a third stage of positive rotation: setting the processing time to 730s, the upper disc rotating speed of 280rpm, the upper small disc rotating speed of 280rpm, the lower disc rotating speed of 5rpm, the lower small disc rotating speed of 3rpm and the processing pressure of 150 kg;
reversing the first stage: setting the processing time to be 10s, the upper disc rotating speed to be 90rpm, the upper small disc rotating speed to be 90rpm, the lower disc rotating speed to be 5rpm, the lower small disc rotating speed to be 3rpm and the processing pressure to be 90 kg;
and reversing the second stage: setting the processing time to be 10s, the upper disc rotating speed to be 180rpm, the upper small disc rotating speed to be 180rpm, the lower disc rotating speed to be 5rpm, the lower small disc rotating speed to be 3rpm and the processing pressure to be 100 kg;
and (3) reversing the third stage: the processing time is set to 730s, the upper disc rotating speed is 280rpm, the upper small disc rotating speed is 280rpm, the lower disc rotating speed is 5rpm, the lower small disc rotating speed is 3rpm, and the processing pressure is 150 kg.
A polishing piece is arranged on the upper small disc; the grinding piece is a hairbrush for pigs;
the lower small disc is provided with a buffing; the end angle of the buffing is provided with a first horizontal extension part, and the short edge of the buffing is provided with a second horizontal extension part.
Comparative example:
the 2.5D mobile phone glass cover plate is processed, and the scanning processing technological parameters are as follows:
1. a light sweeping step:
forward rotation first stage: setting the processing time to be 10s, the upper disc rotating speed to be 90rpm, the upper small disc rotating speed to be 90rpm, the lower disc rotating speed to be 5rpm, the lower small disc rotating speed to be 3rpm and the processing pressure to be 100 kg;
a forward rotation second stage: setting the processing time to be 10s, the upper disc rotating speed to be 180rpm, the upper small disc rotating speed to be 180rpm, the lower disc rotating speed to be 5rpm, the lower small disc rotating speed to be 3rpm and the processing pressure to be 150 kg;
a third stage of positive rotation: setting the processing time to 880s, the upper disc rotating speed of 280rpm, the upper small disc rotating speed of 280rpm, the lower disc rotating speed of 5rpm, the lower small disc rotating speed of 3rpm and the processing pressure of 180 kg;
reversing the first stage: setting the processing time to be 10s, the upper disc rotating speed to be 90rpm, the upper small disc rotating speed to be 90rpm, the lower disc rotating speed to be 5rpm, the lower small disc rotating speed to be 3rpm and the processing pressure to be 100 kg;
and reversing the second stage: setting the processing time to be 10s, the upper disc rotating speed to be 180rpm, the upper small disc rotating speed to be 180rpm, the lower disc rotating speed to be 5rpm, the lower small disc rotating speed to be 3rpm and the processing pressure to be 150 kg;
and (3) reversing the third stage: setting the processing time as 880s, the upper disc rotating speed as 280rpm, the upper small disc rotating speed as 280rpm, the lower disc rotating speed as 5rpm, the lower small disc rotating speed as 3rpm and the processing pressure as 180 kg.
In the comparative example, the abrading article on the upper panel was a carpet; the buffing of the lower small disc is normal R-angle end angle transition.
2. An upper sweeping and lower grinding step: and (4) performing an upper scanning and lower grinding step or obtaining the mobile phone glass cover plate.
The method of the embodiment and the comparative example processes 500 mobile phone glass cover plates, then performs the test of the flat crystal flatness, and counts the flat crystal flatness N, and the test results are shown in table 1:
TABLE 1 test of flatness of the flat crystals of examples and comparative examples
Flatness of flat crystal N is more than or equal to 1 and less than 2 N is more than or equal to 2 and less than or equal to 3
Examples 430 70
Comparative example 260 240
As can be seen from the table, the flatness of the flat crystal of the example is within N < 2 bars of 1 ≦ N; 14 percent of the crystal is within 2 or more and 3 or less, the effect of the flat crystal is better than that of the comparative process, and the data is more stable.
Various other changes and modifications to the above-described embodiments and concepts will become apparent to those skilled in the art from the above description, and all such changes and modifications are intended to be included within the scope of the present invention as defined in the appended claims.

Claims (6)

1. A light sweeping processing technology is characterized by comprising the following steps:
forward rotation first stage: setting the processing time to be 10s, the upper disc rotating speed to be 80-100rpm, the upper small disc rotating speed to be 80-100rpm, the lower disc rotating speed to be 3-7rpm, the lower small disc rotating speed to be 1-5rpm and the processing pressure to be 90 kg;
a forward rotation second stage: setting the processing time as 10s, the upper disc rotating speed of 170-190rpm, the upper small disc rotating speed of 170-190rpm, the lower disc rotating speed of 3-7rpm, the lower small disc rotating speed of 1-5rpm and the processing pressure of 100 kg;
a third stage of positive rotation: setting the processing time as 730s, the upper disc rotating speed of 270-290rpm, the upper small disc rotating speed of 270-290rpm, the lower disc rotating speed of 3-7rpm, the lower small disc rotating speed of 1-5rpm and the processing pressure of 150 kg;
reversing the first stage: setting the processing time to be 10s, the upper disc rotating speed to be 80-100rpm, the upper small disc rotating speed to be 80-100rpm, the lower disc rotating speed to be 3-7rpm, the lower small disc rotating speed to be 1-5rpm and the processing pressure to be 90 kg;
and reversing the second stage: setting the processing time as 10s, the upper disc rotating speed of 170-190rpm, the upper small disc rotating speed of 170-190rpm, the lower disc rotating speed of 3-7rpm, the lower small disc rotating speed of 1-5rpm and the processing pressure of 100 kg; wherein, the lower small disc is provided with a buffing; a first horizontal extension part is arranged at the end corner of the buffing; a second horizontal extension part is arranged at the edge of the short edge of the buffing;
and (3) reversing the third stage: the processing time is set to be 730s, the upper disc rotating speed is 270-290rpm, the upper small disc rotating speed is 270-290rpm, the lower disc rotating speed is 3-7rpm, the lower small disc rotating speed is 1-5rpm, and the processing pressure is 150 kg.
2. The scanning finishing process according to claim 1, characterized in that:
forward rotation first stage: setting the processing time to be 10s, the upper disc rotating speed to be 90rpm, the upper small disc rotating speed to be 90rpm, the lower disc rotating speed to be 5rpm, the lower small disc rotating speed to be 3rpm and the processing pressure to be 90 kg;
a forward rotation second stage: the processing time is set to 10s, the upper disc rotating speed is 180rpm, the upper small disc rotating speed is 180rp m, the lower disc rotating speed is 5rpm, the lower small disc rotating speed is 3rpm, and the processing pressure is 100 kg.
3. The scanning finishing process according to claim 1, characterized in that:
reversing the first stage: setting the processing time to be 10s, the upper disc rotating speed to be 90rpm, the upper small disc rotating speed to be 90rpm, the lower disc rotating speed to be 5rpm, the lower small disc rotating speed to be 3rpm and the processing pressure to be 90 kg;
and reversing the second stage: the processing time is set to 10s, the upper disc rotating speed is 180rpm, the upper small disc rotating speed is 180rp m, the lower disc rotating speed is 5rpm, the lower small disc rotating speed is 3rpm, and the processing pressure is 100 kg.
4. A scanning finishing process according to claim 1, characterized in that the third stage of forward rotation: the processing time is set to 730s, the upper disc rotating speed is 280rpm, the upper small disc rotating speed is 280rpm, the lower disc rotating speed is 5rpm, the lower small disc rotating speed is 3rpm, and the processing pressure is 150 kg.
5. A scanning beam machining process according to claim 1, characterized in that the third stage is reversed: the processing time is set to 730s, the upper disc rotating speed is 280rpm, the upper small disc rotating speed is 280rpm, the lower disc rotating speed is 5rpm, the lower small disc rotating speed is 3rpm, and the processing pressure is 150 kg.
6. The scanning finishing process of claim 1, wherein the upper small disc is provided with a grinding piece; the polishing piece is a pig hair brush.
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Publication number Priority date Publication date Assignee Title
CN112025419A (en) * 2020-08-26 2020-12-04 彩虹集团(邵阳)特种玻璃有限公司 Microcrystalline glass polishing process

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104440413A (en) * 2014-12-08 2015-03-25 蓝思科技股份有限公司 Deformation polishing process and polishing clamp for 2.5D window screen
CN206169873U (en) * 2016-11-16 2017-05-17 东莞市湘华建强光电科技有限公司 Improvement sweep tarry matter skin
CN206185671U (en) * 2016-11-21 2017-05-24 蓝思科技(长沙)有限公司 Burnishing device of 3D glass board
CN106826562A (en) * 2017-03-08 2017-06-13 深圳赛贝尔自动化设备有限公司 The upper dish structure of grinder or polishing machine
CN206519818U (en) * 2017-02-28 2017-09-26 深圳赛贝尔自动化设备有限公司 The driving structure of single side polishing machine
CN207509053U (en) * 2017-09-29 2018-06-19 东莞市骏达触控科技有限公司 One kind clears off mill skin
CN108515434A (en) * 2017-02-28 2018-09-11 深圳赛贝尔自动化设备有限公司 The driving structure of single side polishing machine
CN108857822A (en) * 2017-05-15 2018-11-23 蓝思科技(长沙)有限公司 Polissoir, polishing clamp and its polishing method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5911539A (en) * 1982-07-12 1984-01-21 Matsushita Electric Ind Co Ltd Manufacture of flexible magnetic disc
CN206464930U (en) * 2016-08-16 2017-09-05 东莞华清光学科技有限公司 A kind of 3D glass cover-plates clear off equipment
CN107336099A (en) * 2017-07-31 2017-11-10 东莞华清光学科技有限公司 A kind of glass product clears off equipment and clears off method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104440413A (en) * 2014-12-08 2015-03-25 蓝思科技股份有限公司 Deformation polishing process and polishing clamp for 2.5D window screen
CN206169873U (en) * 2016-11-16 2017-05-17 东莞市湘华建强光电科技有限公司 Improvement sweep tarry matter skin
CN206185671U (en) * 2016-11-21 2017-05-24 蓝思科技(长沙)有限公司 Burnishing device of 3D glass board
CN206519818U (en) * 2017-02-28 2017-09-26 深圳赛贝尔自动化设备有限公司 The driving structure of single side polishing machine
CN108515434A (en) * 2017-02-28 2018-09-11 深圳赛贝尔自动化设备有限公司 The driving structure of single side polishing machine
CN106826562A (en) * 2017-03-08 2017-06-13 深圳赛贝尔自动化设备有限公司 The upper dish structure of grinder or polishing machine
CN108857822A (en) * 2017-05-15 2018-11-23 蓝思科技(长沙)有限公司 Polissoir, polishing clamp and its polishing method
CN207509053U (en) * 2017-09-29 2018-06-19 东莞市骏达触控科技有限公司 One kind clears off mill skin

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