CN109632079B - Metal shielding lead cover, piezoelectric sensor and lead method - Google Patents
Metal shielding lead cover, piezoelectric sensor and lead method Download PDFInfo
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- CN109632079B CN109632079B CN201811491762.0A CN201811491762A CN109632079B CN 109632079 B CN109632079 B CN 109632079B CN 201811491762 A CN201811491762 A CN 201811491762A CN 109632079 B CN109632079 B CN 109632079B
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- 239000002184 metal Substances 0.000 title claims abstract description 114
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 114
- 238000000034 method Methods 0.000 title claims abstract description 10
- 238000003466 welding Methods 0.000 claims description 22
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 16
- 230000035939 shock Effects 0.000 claims description 8
- 238000005219 brazing Methods 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 6
- 238000013016 damping Methods 0.000 claims description 5
- 238000009966 trimming Methods 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims 2
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000037237 body shape Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
- G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
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- General Physics & Mathematics (AREA)
- Gyroscopes (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
The invention provides a metal shielding lead cover, a piezoelectric sensor and a lead method, which can seal a piezoelectric component in a shell of the piezoelectric sensor, wherein the metal shielding lead cover is provided with a wiring structure, and a lead of the piezoelectric component of the piezoelectric sensor is fixed through the wiring structure, so that the electromagnetic interference capability of the piezoelectric sensor and the stability of lead fixing and supporting are improved.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to a metal shielding lead cover, a piezoelectric sensor and a lead method.
Background
In recent years, piezoelectric vibration sensors, including charge output type or voltage output type, have obtained quick popularization and application in the novel or newly-developed airborne application field, and common airborne piezoelectric sensors such as central compression type structure or annular shear type are all single metal casing welding encapsulation and realize sealed and electromagnetic shield. Some early American-system piezoelectric vibration sensor products have double-layer shell structures, but are only limited to the structural mechanics effect and cannot play a double-layer shielding anti-interference effect. The charge signal of the piezoelectric vibration sensor, especially a high-temperature or high-stability piezoelectric vibration sensor product, is weak, and is generally 10-20 PC/G.
In the piezoelectric vibration sensor of the conventional structure, the internal piezoelectric component and the housing are assembled in a manner shown in fig. 1a) and 1b), and the internal piezoelectric component and the housing are packaged in a single housing sealing and shielding structure regardless of the presence or absence of a built-in circuit board. With a built-in circuit board, as shown in fig. 1a), the lead wire is a suspended structure from the flying wire of the circuit board to the connector, and all subsequent industrial-grade piezoelectric vibration sensor products in the market mainly use the top outlet wire to reduce the length of the flying wire. Without a built-in circuit board, as shown in fig. 1b), the piezoelectric vibration sensor product flies directly from the piezoelectric assembly to the connector. Besides the introduction of flying lead suspension length, space fixed support and path selection of lead wires, introduced loop interference, structural stability of fixed support, and even fault or interference such as vibration value surge can be introduced.
Disclosure of Invention
Accordingly, to overcome the above-mentioned disadvantages of the prior art, the present invention provides a metal shielded lead cover, a piezoelectric sensor, and a lead method to improve the electromagnetic interference capability of the piezoelectric sensor and the stability of the lead attachment.
In order to achieve the above object, a metal shielding lead cover is provided, which can seal a piezoelectric component inside a housing of a piezoelectric sensor, a wiring structure is disposed on the metal shielding lead cover, and a lead of the piezoelectric component of the piezoelectric sensor is fixed through the wiring structure.
Preferably, the wiring structure is detachably provided on the metal shielding lead cover.
Preferably, the wiring structure includes a main body including a mounting portion and a wiring portion; the main body can be matched with a mounting structure on the metal shielding lead cover so as to mount the wiring structure on the metal shielding lead cover; the wiring portion can fix a lead wire of a piezoelectric component of the piezoelectric sensor.
Preferably, the mounting portion includes a boss provided with a middle through hole, and the mounting structure on the metal shielding lead cover includes a first through hole communicating the inside and the outside of the metal shielding lead cover; the wiring structure is mounted on the metallic shield lead cover by inserting the intermediate through-hole boss into the first through-hole.
Preferably, at least one of the two apertures of the intermediate through hole is provided in a chamfered configuration.
Preferably, the wiring portion includes a flat surface without a boss; a lead on the bumpless plane for securing a piezoelectric assembly of the piezoelectric sensor; the middle through hole penetrates through the plane without the lug boss.
Preferably, when the wiring structure is mounted on the metal shielding lead cover, a center line of the first through hole and a center line of the middle through hole coincide.
Preferably, the mounting portion is a ceramic machined part, and the bumpless plane includes a metal surface.
Preferably, the metal shielding lead cover side wall and the top surface are connected through a fillet surface, and the mounting part is arranged on the fillet surface.
Preferably, the metal shielding lead cover is a semi-closed cylindrical copper cover structure.
The invention also provides a piezoelectric sensor, which comprises a shell, a piezoelectric component and a base, wherein the piezoelectric component is connected with the base and positioned in the shell, the piezoelectric sensor comprises the metal shielding lead cover, an opening at the bottom of the metal shielding lead cover is connected with the base so as to seal the piezoelectric component of the piezoelectric sensor, the shell is positioned on the outer side of the metal shielding lead cover, and the shell and the metal shielding lead cover form double-layer electromagnetic shielding.
Preferably, the metal shielding lead cover is connected with the shell through a shock absorption structure.
Preferably, the shell comprises an end cover, and the metal shielding lead cover and the end cover are connected through a shock absorption structure.
Preferably, two outgoing lines of the piezoelectric component are respectively led out through the metal shielding lead wire cover, wherein one outgoing line is connected to the wiring structure of the metal shielding lead wire cover through a flying line of a built-in circuit, and then is connected to the output socket through a switching lead wire of the wiring structure; the other path is conducted with the metal shielding lead cover through the base of the piezoelectric component and is connected to the output socket through the metal shielding lead cover.
Preferably, the piezoelectric sensor is characterized in that the piezoelectric component is an annular shear type piezoelectric component or a central compression piezoelectric component.
The invention also provides a lead method of the piezoelectric sensor, which comprises the following steps:
1) leading out a piezoelectric assembly lead in the metal shielding lead cover through a wiring structure, welding a first lead and a second lead on a socket of the piezoelectric sensor, respectively sleeving an insulating sleeve on the first lead and the second lead, and assembling the socket of the piezoelectric sensor on the shell;
2) after the metal shielding lead cover is tightly matched and assembled with the base, applying epoxy resin at a joint and curing, and then welding and fixing the piezoelectric assembly lead with a wiring structure after trimming the length;
3) the first wire is fixed with the wiring structure after being trimmed to length to form an electric signal insulated to the ground
4) After the second lead is trimmed to length, the second lead is welded and fixed with the outer wall of the metal shielding lead cover to form a ground loop signal channel;
5) and an end cover of the piezoelectric sensor is lined with a damping rubber ring and then is welded and sealed to form a shell, and the shell and the metal shielding lead cover body form a double-layer electromagnetic shielding structure capable of transmitting single-channel signals.
Preferably, further comprising: and welding brazing filler metal on the outer wall of the metal shielding lead cover, and welding and fixing the second lead after trimming the length of the second lead and the welding brazing filler metal on the outer wall of the metal shielding lead cover.
Compared with the prior art, the sensor forms a double-layer shielding structure of the shielding cover and the shell, improves the electromagnetic interference capability, the stability of lead fixing and supporting, reduces the length of the lead, and improves the operability of lead layout and assembly. And the processing is convenient, the cost is low, and the batch production is favorably realized.
Drawings
Fig. 1a) is a schematic view of a piezoelectric sensor according to the prior art.
Fig. 1b) shows a schematic representation of another prior art arrangement of a piezoelectric sensor.
Fig. 2a) -2c) are schematic views of the metal shielded lead cover of the present invention.
Fig. 3 is a schematic diagram of a wiring structure in a metal shielding lead cover according to the present invention.
Fig. 4 is a schematic cross-sectional view of a wiring structure in a metal-shielded lead cover according to the present invention.
FIGS. 5a) -5c) are schematic wiring diagrams of the metal shielded lead cover of the present invention;
fig. 5d) is a partial enlarged view of fig. 5 b).
Fig. 6 is a cross-sectional view of a metal-shielded lead-cover assembly structure of a piezoelectric sensor according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to specific embodiments and the accompanying drawings.
In one embodiment of the present invention, as shown in fig. 2a) -2c) and fig. 3 and 4, a metal shielding lead cover 1 can enclose a piezoelectric component 11 inside a housing 10 of a piezoelectric sensor, a wiring structure 2 is disposed on the metal shielding lead cover 1, and a lead of the piezoelectric component 11 of the piezoelectric sensor is fixed through the wiring structure 2. The metallic shielded lead cover 1 is arranged substantially circular as shown in fig. 2a) -2 c). In other embodiments, the shape may be square or other shapes, arranged as desired for different types of piezoelectric sensors.
The present invention provides a novel structure capable of forming a double layer of the shield and the housing 10
The metal shielding cover structure is combined with the base 12 of the piezoelectric component 11 to realize an all-metal closed structure, and the metal shielding cover structure and the shell 10 realize a double-layer electromagnetic shielding function together, so that the environmental noise of 10 is effectively reduced, and the signal quality of a product is improved; on the other hand, the stability that the lead wire of traditional piezoelectric sensor flying line is poor, the lead wire is firmly propped up is overcome, lead wire length is reduced, the wire passes through metal shield cover wiring structure fixed, has improved wiring structure's shock-proof reliability, has shortened the unsettled distance of flying line, improves the maneuverability of lead wire overall arrangement assembly.
The metal-shielded lead cover 1 will be described in detail below.
In one embodiment, the wiring structure 2 is detachably disposed on the metal shielded lead cover 1.
The wiring structure 2 is convenient to replace without influencing the structure of the wiring cover or the piezoelectric sensor shell, and interchangeability and reliability are improved. Another benefit of providing the wiring structure 2 is that it is convenient to design the position of the socket 15 as close to the base 12 as possible, so as to lower the center of gravity of the product, improve the structural stability during vibration measurement, and avoid the wire welding inoperability caused by too low socket 15.
As in fig. 2a) -2c) the wiring structure 2 comprises a main body comprising a mounting portion 3 and a wiring portion 4; the main body can be matched with a mounting structure on the metal shielding lead cover 1 to mount the wiring structure 2 on the metal shielding lead cover 1; the wiring portion 4 can fix a lead wire of the piezoelectric element 11 of the piezoelectric sensor. Therefore, through the reasonable arrangement structure, the wiring structure 2 can be conveniently installed and taken down on the metal shielding wiring cover, and the wiring operation and the component replacement are convenient.
As shown in fig. 2a) to 5, the mounting portion 3 includes a boss provided with a middle through hole 5, the mounting structure on the metallic shielding lead cover 1 includes a first through hole 6, and the first through hole 6 communicates the inside and the outside of the metallic shielding lead cover 1; the wiring structure 2 is mounted on the metallic shielded lead cover 1 by inserting the intermediate through-hole 5 into the first through-hole 6.
In another embodiment, the mounting structure on the metal shielding lead cover 1 further comprises a sunken groove 7 matched with the main body shape of the wiring structure 2, and the first through hole 6 is formed in the sunken groove 7, so that when the wiring structure 2 is placed on the metal shielding lead cover, the wiring structure 2 can be better positioned and fixed, and the falling and rotation of the wiring structure 2 caused by vibration can be avoided.
In one embodiment, as shown in fig. 4, the wires of the piezoelectric assembly 11 are led out through the intermediate through hole 5, and at least one of the two apertures of the intermediate through hole 5 is provided in a chamfered structure in order to avoid the edges of the intermediate through hole 5 from wearing the wires.
In another preferred embodiment, two of the two orifices of the intermediate through hole 5 are provided with a chamfered structure, preferably a rounded structure.
In one embodiment, as shown in fig. 5a) and 6, the wire connecting portion 4 includes a flat land-free surface 8; a lead wire on the bumpless plane 8 for fixing a piezoelectric component 11 of the piezoelectric sensor; the intermediate through hole 5 penetrates the boss-free plane 8.
In order to improve the centering degree and prevent the influence of vibration on the lead, when the wiring structure 2 is installed on the metal shielding lead cover 1, the central line of the first through hole 6 and the central line of the middle through hole 5 are overlapped.
In one embodiment, the mounting portion 3 is a ceramic machined piece, which effectively reduces the triboelectric noise.
In order to facilitate the outward lead-out to the metallic shielded lead cover 1, said bumpless plane 8 comprises a metallic face,
in this way, the inner leads are guided onto the metal surface and lead out via the metal surface, thus realizing a lead-out from the inside. The metal surface can be conductive, and internal and external signal conduction is realized.
Next, a mounting form of the wiring structure 2 on the metal-shielded lead cover 1 will be described.
In one embodiment, as shown in fig. 5a) to 5d), the side wall and the top surface of the metal shielding lead cover 1 are connected by a fillet surface 9, and the mounting part is arranged on the fillet surface 9. Such a position ensures that the wiring structure is conveniently arranged on the fillet surface 9, and the lead wiring position does not occupy too much space between the housing 10 and the metal shield case, thereby realizing effective utilization of space.
In one embodiment, the metal shielding lead cover 1 is a semi-closed cylindrical copper cover structure.
The invention also provides a piezoelectric sensor. As shown in fig. 6, in a preferred embodiment, the piezoelectric sensor includes a housing 10, a piezoelectric element 11 and a base 12, the piezoelectric element 11 is connected to the base 12 and located inside the housing 10, and includes the above-mentioned metal shielding lead cover 1, the bottom opening of the metal shielding lead cover 1 is connected to the base 12 to close the piezoelectric element 11 of the piezoelectric sensor, the housing 10 is located outside the metal shielding lead cover 1, and the housing 10 and the metal shielding lead cover 1 form a double-layer electromagnetic shield, thereby improving the electromagnetic interference capability and ensuring the stability of lead fixing.
In one embodiment, the metal shielding lead cover 1 and the shell 10 are connected through a shock absorption structure 13, so that the shock resistance reliability of the wiring structure is improved.
In a preferred embodiment, to facilitate the placement of the shock absorbing structure 13, the metal shielding lead cover 1 is placed
The top of the double-layer shielding structure is of a flat structure, so that the rubber ring can be added and subtracted between double-layer shielding structure materials conveniently, and the anti-seismic stability is improved.
In a preferred embodiment, in order to facilitate the arrangement of the shock absorbing structure 13, the housing 10 comprises an end cap 14, and the metal shielding lead cover 1 and the end cap 14 are connected through the shock absorbing structure 13.
As shown in fig. 6, in one embodiment, two paths of outgoing lines of the piezoelectric component 11 are respectively led out through the metal shielding lead cover 1, wherein one path of outgoing line is connected to the wiring structure of the metal shielding lead cover 1 through a flying line of a built-in circuit, and then is connected to the output socket 15 through a switching lead of the wiring structure; the other path is conducted with the metal shielding lead cover 1 through the base 12 of the piezoelectric component 11, and is connected to the output socket 15 through the lead of the metal shielding lead cover 1. Therefore, the socket 15 can be conveniently designed to be close to the base 12 as far as possible, the center of gravity of a product is reduced, the structural stability during vibration measurement is improved, and the operability of wire welding caused by too low socket 15 is avoided.
The present invention also provides a lead method of the above piezoelectric sensor, in one embodiment, the lead method includes the following steps:
1) leading out the lead of a piezoelectric component 11 in a metal shielding lead cover 1 through a wiring structure 2, welding a first lead 16 and a second lead 17 on a socket 15 of the piezoelectric sensor, respectively sleeving an insulating sleeve on the first lead 16 and the second lead 17, and assembling the socket 15 of the piezoelectric sensor on the shell 10;
2) after the metal shielding lead cover 1 is tightly matched and assembled with the base 12, a ring is applied to the joint
Resin is solidified, and the wires of the piezoelectric components 11 are fixed with the metal wiring surface of the wiring structure 2 by welding after the lengths of the wires are trimmed;
3) the first lead 16 is fixed with the wiring structure 2 by welding after being trimmed to length to form an electric signal channel insulated to the ground;
4) the second lead 17 is fixed with the outer wall of the metal shielding lead cover 1 after being trimmed to length for forming a ground loop signal channel;
5) an end cover 14 of the piezoelectric sensor is lined with a damping rubber ring and then welded and sealed to form a shell 10, and the shell and the metal shielding lead cover 1 form a double-layer electromagnetic shielding structure capable of transmitting single-channel signals.
In a preferred embodiment, further comprising: and welding brazing filler metal on the outer wall of the metal shielding lead cover 1, and welding and fixing the second lead 17 and the welding brazing filler metal on the outer wall of the metal shielding lead cover 1 after trimming the length.
Specifically, wiring structure 2 is the ceramic machined part, and 5 processing chamfers of middle through-hole are used for connecing the wire of inside subassembly, and 5 stands of middle through-hole are used for the hole cooperation assembly with the shield cover, and the assembly connection is fixed with epoxy gluing, and wiring structure 2 does not have stand plane 8 and carries out the metallization, generally plates silver electrode. And plating welding solder at the outer wall of the metal shielding case close to the rounded corner of the wiring structure 2.
The wires of the internal components of the metal shielding lead cover 1 can be led out through the through holes of the wiring structure 2, and the socket 15 is welded with the first wire 16 and the second wire 17 and sleeved with a fluorine rubber sleeve to be assembled on the shell 10.
Then, the metal shielding lead cover 1 is tightly matched and assembled with the base 12 of the piezoelectric component 11, a circle of epoxy resin is poured on the bottom of the metal shielding lead cover and cured, the internal component lead is trimmed to length and then welded and fixed with the metalized pad of the wiring structure 2, the first lead 16 led out of the socket 15 is trimmed to length and then welded and fixed with the metalized pad of the wiring structure 2 to form an electric signal channel insulated to the ground, and the second lead 17 is trimmed to length and then welded and fixed with the position of the outer wall of the metal shielding cover plated with welding solder to form a ground loop signal channel. And finally, lining the end cover 14 with a damping rubber ring, and performing laser welding and sealing to form a double-layer electromagnetic shielding structure capable of transmitting single-channel signals.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention. The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (9)
1. A metal shielding lead cover can seal a piezoelectric component in a shell of a piezoelectric sensor, and is characterized in that a wiring structure is arranged on the metal shielding lead cover, a lead of the piezoelectric component of the piezoelectric sensor is fixed through the wiring structure, the wiring structure comprises a main body, and the main body comprises an installation part and a wiring part; the main body can be matched with a mounting structure on the metal shielding lead cover so as to mount the wiring structure on the metal shielding lead cover, the wiring part can fix a lead of a piezoelectric component of the piezoelectric sensor, and the wiring part comprises a lug-free plane; the lug-free plane is used for fixing a lead of a piezoelectric component of the piezoelectric sensor; the mounting part comprises a boss with a middle through hole, the mounting structure on the metal shielding lead cover comprises a first through hole, and the first through hole is communicated with the inside and the outside of the metal shielding lead cover; mounting the wiring structure on the metallic shield lead cover by inserting the intermediate through-hole boss into the first through-hole; at least one of two orifices of the middle through hole is arranged to be a chamfer structure, the middle through hole penetrates through the boss-free plane, the mounting part is a ceramic machined part, and the boss-free plane comprises a metal surface; connect through the fillet face between metal shield lead wire cover lateral wall and the top surface, the installation department sets up on the fillet face, metal shield lead wire cover is semi-closed cylinder copper sheathing structure.
2. The metal shielded lead cover of claim 1, wherein the wiring structure is removably disposed on the metal shielded lead cover.
3. The metal shielded lead cover of claim 1, wherein a centerline of the first via and a centerline of the middle via coincide when the wiring structure is mounted on the metal shielded lead cover.
4. A piezoelectric sensor comprising a housing, a piezoelectric element and a base, the piezoelectric element being connected to the base and located inside the housing, characterized in that it comprises the metal shielding lead cover of any of claims 1-3, the bottom opening of the metal shielding lead cover being connected to the base to enclose the piezoelectric element of the piezoelectric sensor, the housing being located outside the metal shielding lead cover, the housing and the metal shielding lead cover constituting a double-layer electromagnetic shield.
5. The piezoelectric transducer of claim 4, wherein the metal shielded lead cover and the housing are connected by a shock absorbing structure; the shell comprises an end cover, and the metal shielding lead cover is connected with the end cover through a damping structure.
6. The piezoelectric transducer according to claim 4, wherein two outgoing lines of the piezoelectric element are respectively led out through the metal shielding lead wire cover, wherein one outgoing line is connected to the wiring structure of the metal shielding lead wire cover through a flying line of the built-in circuit, and then is connected to the output socket through a switching lead wire of the wiring structure; the other path is conducted with the metal shielding lead cover through the base of the piezoelectric component and is connected to the output socket through the metal shielding lead cover.
7. The piezoelectric transducer of any of claims 4-6, wherein the piezoelectric element of the piezoelectric transducer is a ring shear type piezoelectric element or a center compression piezoelectric element.
8. A method of wiring a piezoelectric sensor according to any of claims 4 to 6, comprising the steps of:
1) leading out a piezoelectric assembly lead in the metal shielding lead cover through a wiring structure, welding a first lead and a second lead on a socket of the piezoelectric sensor, respectively sleeving an insulating sleeve on the first lead and the second lead, and assembling the socket of the piezoelectric sensor on the shell;
2) after the metal shielding lead cover is tightly matched and assembled with the base, applying epoxy resin at a joint and curing, and then welding and fixing the piezoelectric assembly lead with a wiring structure after trimming the length;
3) after the first lead is trimmed to length, the first lead is welded and fixed with a wiring structure to form an electric signal channel insulated to the ground;
4) after the second lead is trimmed to length, the second lead is welded and fixed with the outer wall of the metal shielding lead cover to form a ground loop signal channel;
5) and an end cover of the piezoelectric sensor is lined with a damping rubber ring and then is welded and sealed to form a shell, and the shell and the metal shielding lead cover body form a double-layer electromagnetic shielding structure capable of transmitting single-channel signals.
9. The method of claim 8, further comprising: and welding brazing filler metal on the outer wall of the metal shielding lead cover, and welding and fixing the second lead after trimming the length of the second lead and the welding brazing filler metal on the outer wall of the metal shielding lead cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201811491762.0A CN109632079B (en) | 2018-12-07 | 2018-12-07 | Metal shielding lead cover, piezoelectric sensor and lead method |
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| CN201811491762.0A CN109632079B (en) | 2018-12-07 | 2018-12-07 | Metal shielding lead cover, piezoelectric sensor and lead method |
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| CN109632079A CN109632079A (en) | 2019-04-16 |
| CN109632079B true CN109632079B (en) | 2022-03-22 |
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Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006308446A (en) * | 2005-04-28 | 2006-11-09 | Matsushita Electric Ind Co Ltd | Terminal connector for pressure sensor |
| CN203164204U (en) * | 2013-04-19 | 2013-08-28 | 厦门乃尔电子有限公司 | Triaxial piezoelectric accelerometer |
| CN203798824U (en) * | 2014-04-04 | 2014-08-27 | 西安陆海地球物理科技有限公司 | Isolation type bending piezoelectric acceleration machine core |
| CN203798447U (en) * | 2014-04-29 | 2014-08-27 | 厦门乃尔电子有限公司 | High-insulation voltage-withstanding vibration sensor |
| CN204269226U (en) * | 2014-12-02 | 2015-04-15 | 苏州长风航空电子有限公司 | A kind of piezoelectric vibration pickup |
| CN205280840U (en) * | 2015-12-21 | 2016-06-01 | 苏州长风航空电子有限公司 | Overproof trouble of sensor insulation resistance arouses and positioner fast |
| CN205691228U (en) * | 2016-05-16 | 2016-11-16 | 湖南科技大学 | Overall machine vibration monitoring full-differential sensor |
| CN106225963A (en) * | 2016-08-30 | 2016-12-14 | 张子青 | A kind of piezoelectric pressure indicator structure |
| CN206292367U (en) * | 2016-12-29 | 2017-06-30 | 天津永盛科技发展有限公司 | A kind of breaker monitors sensor on-line |
| CN207894952U (en) * | 2018-03-14 | 2018-09-21 | 厦门乃尔电子有限公司 | A kind of double shield structure acceleration transducer |
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