CN109631636B

CN109631636B - Thin heat pipe, manufacturing method of thin heat pipe and electronic equipment

Info

Publication number: CN109631636B
Application number: CN201811527567.9A
Authority: CN
Inventors: 张军; 刘用鹿; 靳林芳; 袁志; 杨果
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2018-12-13
Filing date: 2018-12-13
Publication date: 2021-08-20
Anticipated expiration: 2038-12-13
Also published as: CN113686186A; CN109631636A; WO2020119436A1

Abstract

The application provides a thin heat pipe, a manufacturing method of the thin heat pipe and electronic equipment. The thin heat pipe comprises a pipe body with a cavity, wherein two ends of the pipe body comprise a convergence part, the sectional area of the cavity of the convergence part is gradually reduced towards the direction far away from the center of the pipe body, and a sealed opening is formed at the tail end of the pipe body; the cavity is internally provided with a capillary structure and a working medium. From this, the whole body of slim heat pipe is inside all to have the cavity, compares with other heat pipes that have the structure of reducing pipe, and when body length is the same, the cavity volume is bigger, and length is longer, can hold more capillary structure and working medium to the cyclic distance of working medium is longer, is favorable to improving the condensation effect of working medium, improves the heat conductivility of heat pipe, makes slim heat pipe heat dispersion better. When the thin heat pipe is applied to the chip heat dissipation design of electronic products such as mobile phones and tablet computers, the temperature of the chip can be effectively reduced, the phenomenon that the frequency of the chip is reduced at high temperature is avoided, and the performance of the chip is fully exerted.

Description

Thin heat pipe, manufacturing method of thin heat pipe and electronic equipment

Technical Field

The present disclosure relates to heat pipe technologies, and particularly to a thin heat pipe, a method for manufacturing the thin heat pipe, and an electronic device.

Background

In recent years, the chip performance of mobile consumer electronics products such as mobile phones and tablet computers has been rapidly improved, and the chip computing power of the mobile consumer electronics products has been able to drive large 3D games, image processing, and even complex computing in the field of neural networks. Various chips can generate a large amount of heat when processing complex operation or continuously operating under high load, the heat generated by the chips is more along with the improvement of the computing capacity of the chips, and if the heat cannot be diffused out in time, the core temperature of the chips is too high, the phenomena of frequency reduction and the like occur, and the performance of the chips is limited.

In order to ensure the user experience, electronic products such as mobile phones and flat panels generally have a relatively thin body, and the thin body causes the internal space of the body to be limited, which is not favorable for heat dissipation. In order to improve the heat dissipation capability of electronic products, some manufacturers apply Heat Pipe (HP), vacuum Vapor Chamber (VC), Loop Heat Pipe (LHP), and other phase-change heat dissipation technologies to electronic products such as mobile phones and flat panels.

Wherein, the heat pipe or vapor chamber phase change heat radiation structure realizes the thermal cycle through the vaporization and condensation process of the working medium of the inner channel, takes away the heat. However, the heat pipe used at present needs to be subjected to pipe shrinking operation for vacuumizing and sealing, so that pipe shrinking areas with certain lengths are formed at two ends of the heat pipe, channels cannot be formed in the pipe shrinking areas, working media cannot be filled in the pipe shrinking areas, the heat conduction performance is poor, and the inner space of the electronic equipment with the size of earth and the size of gold can be occupied. The soaking plate is large in size and weight, so that the electronic equipment is not easy to reduce weight, the periphery of the soaking plate is usually sealed by adopting a welding process, the current minimum welding edge width is 2.5mm, a channel cannot be formed at the welding edge, and the heat conduction performance is poor; the width of the long side of a vapor chamber applied to a mobile phone is about 12mm at present, and the width of welding edges on two sides reaches 5mm, so that the heat dissipation performance is seriously influenced.

Disclosure of Invention

The application provides a thin heat pipe, a manufacturing method of the thin heat pipe and electronic equipment, and aims to solve the problem that a phase-change heat dissipation structure in the prior art is poor in heat dissipation performance.

In a first aspect, the present application provides a thin heat pipe comprising: the tube body is provided with a cavity, two ends of the tube body comprise convergence parts, the sectional area of the cavity of the convergence parts is gradually reduced towards the direction far away from the center of the tube body, and a sealed seal is formed at the tail end of the tube body; the cavity is internally provided with a capillary structure and a working medium.

According to the thin heat pipe that above-mentioned provided, whole body is inside all to have the cavity, compare with other heat pipes that have the draw structure, when body length is the same, the cavity volume of the thin heat pipe of this application is bigger, and length is longer, can hold more capillary structure and working medium, and the condensation of working medium is longer with the cyclic distance of vaporization, is favorable to improving the condensation effect of working medium, improves the heat conductivility of heat pipe, consequently, the thin heat pipe heat dispersion that this application provided is better. When the thin heat pipe is applied to the chip heat dissipation design of electronic products such as mobile phones and tablet computers, the temperature of the chip can be effectively reduced, the phenomenon that the frequency of the chip is reduced at high temperature is avoided, and the performance of the chip is fully exerted.

In one possible mode, the capillary structure comprises a tow medium, and the tow medium is arranged along the axis direction of the pipe body and divides the cavity into a plurality of cavities.

Therefore, the tow medium divides the cavity into a plurality of cavities, the cavities have a drainage function on the working medium, when the thin heat pipe is used, the working medium absorbs heat at an evaporation section of the heat pipe and is vaporized into steam, and the steam flows to a condensation section of the heat pipe along the cavities under the action of local high pressure generated by vaporization; in the condensation section, the working medium releases heat and condenses into liquid, and returns to the evaporation section under the capillary action of the tow medium to realize phase change circulation. Because the thin heat pipe has the cavity at the convergence part at the two ends, a tow medium can be arranged to the other end of the pipe body from one end of the pipe body, and the formed cavity can penetrate through the whole pipe body, so that the length of the pipe body is fully utilized, the condensation distance of the working medium at the condensation section is longer, the condensation is more sufficient, and the heat dissipation performance of the thin heat pipe is improved.

In a possible mode, the capillary structure further comprises a grid medium, the grid medium is arranged on the inner wall of the pipe body, and the tow medium is attached to the grid medium.

From this, can the synergism through grid medium and silk bundle medium, can improve capillary ability to, because the inner wall of grid medium setting at the body, when working medium is adsorbed on the grid medium, can fully contact with the body, be favorable to the more abundant heat that obtains from the heat source of body of absorption body at the evaporation zone of working medium, and distribute away the heat from the body more thoroughly at the condensation zone, thereby, improve the heat dispersion of slim heat pipe.

In one possible mode, the pipe body comprises a plurality of partition pieces, and the partition pieces partition the cavity into a plurality of cavities.

Wherein, the chamber has the drainage effect to the working medium, can promote the working medium form the phase transition circulation in the cavity to, the partition panel can increase the area of contact of working medium and body, be favorable to in the more abundant heat that obtains from the heat source of body of working medium at the evaporation zone, and distribute away the heat from the body more thoroughly at the condensation zone, thereby, improve the heat dispersion of slim heat pipe.

In one possible approach, the capillary structure includes a tow medium disposed in the channel.

Therefore, the cavity channels provided with the tows form the capillary channel, and the cavity channels without the tows form the steam channel, so that the capillary channel is used for backflow of the liquid working medium, the steam channel is used for transmission of the gaseous working medium, the working medium forms stable phase change circulation, and the heat dissipation performance of the thin heat pipe is improved.

In one possible mode, the capillary structure comprises a grid medium, and the grid medium is supported by the partition piece and arranged on the inner wall of the tube body.

From this, the inner wall of body is hugged closely under the support of partition piece to the grid medium, when working medium adsorbed on the grid medium, can fully contact with the body to, be favorable to the more abundant heat that obtains from the heat source of body of absorption of working medium at the evaporation zone, and distribute away the heat from the body more thoroughly at the condensation zone, thereby, improve the heat dispersion of slim heat pipe.

In one possible form, the converging portion is wedge-shaped.

Wherein, the wedge structure can form through simple wedge anchor clamps cramping pipe body both ends, and the processing cost is low, and simple structure from this, uses the electronic product's of this application manufacturing cost lower.

In one possible approach, the closure is sealed by welding.

Because the seal is positioned at the tail end of the pipe body, the seal area is very small, the seal can be reliably sealed by using a welding mode, and obvious influences (such as deformation, weld defects and the like) on the structure of the thin heat pipe can be avoided. Therefore, compared with the existing heat pipe sealing mode, the thin heat pipe has the advantages that the cavity sealing area is smaller, the sealing mode is simpler, the sealing reliability is higher, and the processing cost of the heat pipe is favorably reduced.

In one possible approach, the capillary structure extends from one end seal of the tube to the other end seal of the tube.

Therefore, the capillary structure is arranged in the whole cavity of the tube body, the length of the tube body is fully utilized, the circulating distance of condensation and vaporization of the working medium is longest, the condensation effect of the working medium is best under the condition that the length of the tube body is fixed, and the heat conducting capacity of the heat pipe is strongest.

In one possible form, the seal includes any one or more of a flat seal, a bevel seal, a stepped seal, and/or a curved seal.

Therefore, the seal can be processed into various shapes according to the space structure and the design requirement of the electronic product, so that the thin heat pipe has stronger space compatibility and more flexible application.

In a second aspect, the present application provides a method for manufacturing a thin heat pipe, including the following steps: and a capillary structure is arranged in the cavity of the tube body. And pressing one end of the pipe body by using a jig to form a convergence part, wherein the sectional area of a cavity of the convergence part is gradually reduced towards the direction far away from the center of the pipe body, and a closed seal is formed at the tail end of the pipe body. And vacuumizing the cavity from the other end of the tube body and injecting working medium. The other end of the tube is pressed by the jig to form a convergent part. The tube is pressed into a flat shape with a press tool. The seal is sealed by welding.

Therefore, the manufacturing method of the thin heat pipe is simple in process flow and high in production yield. In addition, the thin heat pipe manufactured by the method has the advantages that the cavity of the pipe body extends to the tail end of the pipe body, the length of the cavity is longer, the condensation and vaporization circulation distance of the working medium is longer, the effective heat dissipation area capable of being in contact with a heat source is larger, the condensation effect of the working medium is favorably improved, in addition, the size of the cavity is larger, more capillary structures and working media can be accommodated, the heat conduction capability of the heat pipe is favorably improved, and therefore the thin heat pipe manufactured by the method is better in heat dissipation performance. When the thin heat pipe is used in the chip heat dissipation design of electronic products such as mobile phones, tablet computers and the like, the temperature of the chip can be effectively reduced, the phenomenon of frequency reduction of the chip at high temperature is avoided, and the performance of the chip is fully exerted.

In one possible mode, the capillary structure comprises a tow medium, the tow medium is arranged along the axis direction of the tube body, and the tow medium partitions the cavity into a plurality of cavities after the tube body is pressed into a flat shape.

Therefore, the tow medium partitions the cavity into a plurality of cavities after the pipe body is pressed into a flat shape, when the thin heat pipe is used, the working medium absorbs heat and is vaporized at the evaporation section of the heat pipe, and flows to the condensation section of the heat pipe along the cavities under the action of local pressure generated by vaporization; in the condensation section, the working medium releases heat and condenses into liquid, and returns to the evaporation section under the capillary action of the tow medium to realize phase change circulation. Because the convergence parts at the two ends of the thin heat pipe are also provided with the cavities, the tow medium can extend from one end of the heat pipe to the other end of the heat pipe, and the length of the heat pipe is fully utilized, so that the condensation distance of the working medium at the condensation section is longer, the condensation is sufficient, and the heat dissipation performance of the thin heat pipe is improved.

In a possible mode, the capillary structure further comprises a grid medium, the grid medium is arranged on the inner wall of the tube body, and the tow medium is attached to the grid medium after the tube body is pressed into a flat shape.

From this, can the synergism through net medium and silk bundle medium, can improve capillary ability to, the net medium can hug closely the inner wall at the body after the body is pressed into flat shape, when working medium is adsorbed on the net medium, can fully contact with the body, be favorable to the more abundant heat that the body obtained from the heat source of absorption at the evaporation zone of working medium, and distribute away the heat from the body more thoroughly at the condensation zone, thereby, improve the heat dispersion of slim heat pipe.

In one possible mode, the tube body includes a plurality of partition pieces which partition the cavity into a plurality of channels after the tube body is pressed into a flat shape.

In one possible form, the capillary structure includes a tow medium disposed between the partition sheets such that the tow medium is located in the channel after the tubular body is compressed into the flattened shape.

Therefore, after the pipe body is pressed into a flat shape, the tows are fixed in the cavity channel formed by the partition piece to form the capillary channel, and the cavity channel without the tows is formed into the steam channel, so that the capillary channel and the steam channel are clearly divided, and the convergence parts at the two ends of the heat pipe are communicated, so that the working medium forms stable phase change circulation, and the heat dissipation performance of the thin heat pipe is improved.

In one possible form, the capillary structure includes a mesh medium disposed on opposite sides of the partition piece such that the partition piece supports the mesh medium against the inner wall of the tube body after the tube body is pressed into the flat shape.

From this, the inner wall of body is hugged closely under the support of partition piece to the grid medium, when working medium adsorbed on the grid medium, can fully contact with the body to, be favorable to in the more abundant heat that obtains from the heat source of body of working medium absorption body at the evaporation zone, and distribute away the heat from the body more thoroughly at the condensation zone, thereby, improve the heat dispersion of slim heat pipe.

In a third aspect, the present application provides an electronic device including the thin heat pipe provided in the present application, where the thin heat pipe is used for dissipating heat of a chip of an electronic product.

The thin heat pipe may be attached to a Chip having a large heat generation amount, such as a System on a Chip (SoC), a modem Chip (modem), and a Wi-Fi Chip of an electronic device. Because the heat conduction effect of the thin heat pipe provided by the application is better, the heat generated by the chip can be taken away more efficiently, the temperature of the chip is reduced, and therefore the phenomenon of frequency reduction caused by overhigh temperature can be avoided under the condition of long-time high-load operation of the chip, the performance of the chip is fully and stably exerted, the overall performance of electronic equipment is further improved, and the user experience is improved.

Drawings

Fig. 1 is a schematic diagram illustrating an internal structure of an electronic device using heat pipe heat dissipation technology;

FIG. 2 is a schematic diagram of an internal structure of an electronic device using a vapor chamber heat dissipation technique;

FIG. 3 is a schematic structural diagram of a thin heat pipe provided in the present application;

FIG. 4 is a schematic view of the tube body shape of the thin heat pipe shown in the present application;

fig. 5 is a schematic view of an application scenario of the thin heat pipe provided in the present application;

FIG. 6 is a schematic diagram of a phase change cycle of a working fluid provided herein;

FIG. 7 is a schematic view of a capillary structure provided herein;

FIG. 8 is a schematic diagram of a thermal cycle for a thin heat pipe containing a tow medium;

FIG. 9 is a schematic view of another capillary structure provided herein;

FIG. 10 is a schematic view of a tube structure provided herein;

FIG. 11 is a schematic view of another tube structure provided herein;

fig. 12 is a schematic view of another tube structure provided in the present application;

FIG. 13 is a schematic view of another capillary structure provided herein;

FIG. 14 is a schematic view of another capillary structure provided herein;

FIG. 15 is a schematic view of another capillary structure provided herein;

FIG. 16 is a schematic view of another capillary structure provided herein;

FIG. 17 is a schematic view of a sealing structure of a thin heat pipe according to the present application;

FIG. 18 is a schematic view of a converging portion of a thin heat pipe according to the present application;

FIG. 19 is a flow chart of a method for manufacturing a thin heat pipe according to the present application;

FIG. 20 is a schematic operational view illustrating a method for fabricating a thin heat pipe according to the present application;

FIG. 21 is a schematic view of a method of arranging capillary structures according to the present application;

FIG. 22 is a schematic view of another arrangement of capillary structures provided herein;

fig. 23 is a schematic view of a method of manufacturing a tube according to the present application;

FIG. 24 is a schematic view of another arrangement of capillary structures provided herein;

FIG. 25 is a schematic view of another arrangement of capillary structures provided herein;

FIG. 26 is a schematic view of another arrangement of capillary structures provided herein;

FIG. 27 is a schematic view of another arrangement of capillary structures provided herein;

fig. 28 is a schematic structural diagram of an electronic device provided in the present application.

Illustration of the drawings:

the heat pipe comprises a pipe body 10, a convergence part 11, a partition piece 12, a seal 13, a cavity 20, a cavity channel 21, a capillary channel 211, a steam channel 212, a capillary structure 30, a tow medium 31, a grid medium 32, a working medium 40, a main board 50, a chip 60 and a thin heat pipe 100.

Detailed Description

Before describing the technical solution of the embodiment of the present application, first, a technical scenario of the embodiment of the present application is described with reference to the drawings.

In order to improve the heat dissipation capability of electronic products such as mobile phones and tablet computers and reduce the temperature of internal chips of the electronic products during complex operation or continuous high-load operation, some manufacturers apply phase-change heat dissipation technologies such as Heat Pipes (HP), vacuum Vapor Chambers (VC), Loop Heat Pipes (LHP) to the electronic products.

Fig. 1 shows a schematic diagram of an internal structure of an electronic device using a heat pipe heat dissipation technology. As shown in fig. 1, a heat pipe is disposed above a System on a Chip (SoC) of a main board of an electronic device, and the heat pipe implements heat circulation through vaporization and condensation processes of a working medium in an internal channel to dissipate heat of the SoC. However, in the currently used heat pipe, a pipe shrinking operation is required to evacuate and seal an internal channel during manufacturing, so that a pipe shrinking region with a certain length (each end is close to 10mm) is formed at two ends of the heat pipe, and the heat conduction performance is poor because the pipe shrinking region cannot form a channel, therefore, the pipe shrinking region of the chip and the heat pipe should adopt an evasive layout design to avoid contact; moreover, electronic devices such as mobile phones and tablet computers generally seek to be light and thin in design of the machine body, and the internal space of the machine body is very limited, so that the shrinking pipe area occupies the space of the machine body meaninglessly and contradicts with the light and thin design direction of the machine body; in addition, due to the existence of the heat-shrinkable tube region, the length of the effective region of the heat pipe having the internal passage is reduced, which also affects the heat dissipation performance of the heat pipe.

Fig. 2 is a schematic diagram showing an internal structure of an electronic device using a vapor chamber heat dissipation technology. As shown in fig. 2, a soaking plate is covered on the SoC area of the electronic device motherboard, similar to the heat pipe principle shown in fig. 1, the soaking plate realizes thermal circulation through the vaporization and condensation process of the internal working medium to dissipate heat of the SoC. However, when the existing soaking plate is sealed, a sealing edge with the width not less than 2.5mm is formed on the periphery, and a channel cannot be formed in the area where the sealing edge is located, so that the soaking plate occupies the space of the machine body meaninglessly and is inconsistent with the light and thin design direction of the machine body; due to the existence of the sealing edge, the effective heat dissipation area of the soaking plate is reduced, and the heat dissipation performance of the soaking plate is influenced; in addition, the heat spreader has a large amount, which causes the electronic equipment to become heavy and affects the user experience.

In order to solve the above problems, the present application provides a thin heat pipe. Fig. 3 is a schematic structural diagram of a thin heat pipe provided in the present application. As shown in fig. 3, the thin heat pipe includes: the tube body 10 is provided with a cavity 20, two ends of the tube body 10 comprise a convergence part 11, the sectional area of the cavity 20 of the convergence part 11 is gradually reduced towards the direction far away from the center of the tube body 10, and a sealed seal 13 is formed at the tail end of the tube body 10; a capillary structure 30 and a working medium 40 are arranged in the cavity 20.

The tube 10 is made of metal material, such as copper, aluminum, carbon steel, stainless steel, alloy steel, etc., the tube 10 is preferably a flat tube 10, and can be formed by flattening the circular tube 10, so that the thickness is small, the contact area with the chip is larger, and the heat dissipation effect of the chip is improved and the thickness of the electronic device is reduced. In addition, the tube 10 may be a circular tube 10, or other anisotropic tube 10, such as: oval, square, rectangle, ripple shape body 10 etc. this application does not do the specific restriction to the body 10 shape of thin heat pipe.

At the converging portion 11 of the tubular body 10, the wall surface of the tubular body 10 is gradually approached in a direction away from the center of the tubular body 10, so that the cross-sectional area of the cavity 20 of the tubular body 10 is gradually reduced at the converging portion 11 in a direction away from the center of the tubular body 10 until a sealed seal 13 is formed at the end of the tubular body 10 by contact, which seal 13 can be sealed by a welding process, for example: the gas welding, arc welding (such as argon arc welding), resistance welding, laser welding, induction welding and other processes seal the cavity 20 of the pipe body 10 and seal the working medium in the cavity 20. Further, the convergence portion 11 of the pipe 10 can be formed by pressing the two ends of the pipe 10 with a jig having a wedge-shaped clamping opening, so that the convergence portion 11 is in a wedge shape, and in addition, the seal 13 at the tail end of the pipe 10 can be in a structure like a Chinese character 'yi' through the jig pressing, which is beneficial to sealing the seal 13 through a welding process, improves the sealing effect of the seal 13, and ensures the reliability of the sealing of the cavity 20.

In addition, the working medium 40 in the cavity 20 is a liquid with good fluidity under the non-heated condition, and can be vaporized into steam from the liquid state after heat absorption, and the heat generated by the chip is taken away through the phase change between the liquid and the steam and the circulation in the cavity 20, so that the heat is dissipated for the chip. Working fluid 40, for example, may be freon, ammonia, acetone, methanol, ethanol, heptane, water, and combinations thereof.

In addition, the capillary structure 30 can be a tow medium 31 or a grid medium 32, which can enable the working medium 40 to generate an adsorption force and a surface tension on the capillary structure 30, so that the working medium 40 moves along the capillary structure 30 without any external force, thereby promoting the flow of the working medium 40 in the cavity 20.

As shown in fig. 4, the tube shape of the thin heat pipe according to the present invention is schematically illustrated. The corrugated heat pipe body 10 may be a straight pipe or a bent pipe of various shapes according to the layout of the chip on the main board 50 in the electronic device, and the shape of the thin heat pipe body 10 is not particularly limited in the present application.

Fig. 5 is a schematic view of an application scenario of the thin heat pipe provided in the present application.

As shown in fig. 5, the thin heat pipe is pressed on the main board 50 of the electronic device and contacts with the main heat generating chip 60 such as SoC, Wi-Fi chip, modem chip and power management chip on the main board 50, wherein a heat conducting medium such as graphene patch or heat conducting silicone grease may be disposed on the contact surface of the thin heat pipe and the chip 60 to fill the gap between the thin heat pipe and the chip 60, so as to improve the heat conducting effect. Thus, the thin heat pipe becomes an evaporation section including the contraction portion 11 at one end close to the chip 60; at the end far away from the chip 60, including the convergence part 11, a condensation section is formed, and heat is dissipated for the chip 60 through the phase change circulation of the working medium in the evaporation section and the condensation section.

FIG. 6 is a schematic diagram of a phase change cycle of a working fluid provided herein. As shown in fig. 6, when the electronic device is operated, the heat generated by the chip is absorbed by the working medium in the evaporation section through the tube 10, so that the temperature of the working medium is raised and vaporized into steam, the working medium generates local high pressure in the evaporation section at an instant of vaporization to drive the steam to flow rapidly to the condensation section, because the temperature of the condensation section is low, the steam releases heat in the condensation section and condenses into liquid, the heat released by the working medium is radiated to the outside by the tube 10 in the condensation section, and meanwhile, the liquid working medium flows back to the evaporation section by virtue of the capillary action of the capillary structure 30, so that the phase change cycle of the working medium is realized.

According to the technical scheme, the thin heat pipe that this application provided, whole body is inside all to have the cavity, compare with other heat pipes that have a draw structure, when body length is the same, the cavity volume of the thin heat pipe of this application is bigger, length is longer, can hold more capillary structure and working medium, and the condensation of working medium is longer with the cyclic distance of vaporization, be favorable to improving the condensation effect of working medium, improve the heat conductivility of heat pipe, therefore, the thin heat pipe heat dispersion that this application provided is better. When the thin heat pipe is applied to the chip heat dissipation design of electronic products such as mobile phones and tablet computers, the temperature of the chip can be effectively reduced, the phenomenon that the frequency of the chip is reduced at high temperature is avoided, and the performance of the chip is fully exerted.

As further shown in fig. 6, in one possible approach, the capillary structure 30 may extend from one end seal 13 of the tube 10 to the other end seal 13 of the tube. Therefore, the capillary structure 30 is arranged in the whole cavity 20 of the tube body 10, the length of the tube body 10 is fully utilized, the circulating distance of condensation and vaporization of the working medium 40 is long, the condensation effect of the working medium 40 is good under the condition that the length of the tube body 10 is fixed, and the heat conduction capability of the heat pipe is strong.

Fig. 7 is a schematic diagram of a capillary structure provided in the present application.

As shown in fig. 7, in one embodiment, the capillary structure 30 includes a tow medium 31, and the tow medium 31 is disposed along the axial direction of the tube 10 to divide the cavity 20 into a plurality of channels 21. The tow medium 31 may have a porous structure, so that the working medium shuttles through the capillary action of the tow medium 31 in the porous structure to realize flow. One or more tow media 31 may be disposed in the cavity 20 to divide the cavity 20 into different number of channels 21, for example, if one tow medium 31 is disposed in the cavity 20, the cavity 20 may be divided into two channels 21, and if two tow media 31 are disposed in the cavity 20, the cavity 20 may be divided into three channels 21, and so on.

FIG. 8 is a schematic diagram of a thermal cycle for a thin heat pipe containing a tow medium. As shown in fig. 8, in the evaporation section, after the working medium is vaporized into steam, the steam enters the cavity 21 under the driving of local high pressure, and rapidly flows to the condensation section along the cavity 21 under the drainage function of the cavity 21; in the condensation section, the working medium releases heat to condense into liquid, and flows back to the evaporation section under the capillary action of the tow medium 31, so that the phase change circulation of the working medium is realized.

Therefore, each cavity 21 and the adjacent tow medium 31 form an independent circulation loop, so that the steam flow of the working medium is more stable and uniform, and the heat dissipation capability of the thin heat pipe is improved. Moreover, the tow medium 31 can support the structure of the heat pipe, thereby improving the strength of the thin heat pipe. In addition, because the cavity 20 is also arranged at the convergence part 11 at the two ends of the thin heat pipe, the tow medium 31 can be arranged from one end of the pipe body 10 to the other end of the pipe body 10, and the formed cavity 21 can penetrate through the whole pipe body 10, so that the length resource of the pipe body 10 is fully utilized, the condensation distance of the working medium at the condensation section is longer, the condensation is more sufficient, and the heat radiation performance of the thin heat pipe is improved.

Fig. 9 is a schematic view of another capillary structure provided herein.

As shown in fig. 9, in an embodiment, the capillary structure 30 further includes a mesh medium 32 on the basis of the structure shown in fig. 8, the mesh medium 32 is disposed on the inner wall of the tube 10, and the tow medium 31 is attached to the mesh medium 32. The grid medium 32 can be composed of a single layer of grid sheet or a plurality of layers of grid sheets, when the grid medium 32 is composed of a plurality of layers of grid sheets, the grid of the grid sheet far away from the inner wall of the pipe body 10 can be smaller, and can provide stronger capillary capacity, and the grid of the grid sheet close to the inner wall of the pipe body 10 can be larger, and can provide smaller flow resistance, and the working medium is promoted to flow back from the condensation section to the evaporation section. As further shown in fig. 9, when the capillary structure 30 includes a tow medium 31 and a mesh medium 32, there may be several layout designs:

as shown in the layout (a) of fig. 9, the capillary structure 30 is composed of one tow medium 31 and one mesh medium 32. The mesh medium 32 is arranged on the inner wall of the tube body 10, one side of the tow medium 31 is in contact with the mesh medium 32, the other side of the tow medium is in contact with the inner wall of the tube body 10, the cavity 20 is divided into two channels 21, the tow medium 31 is preferably arranged at the center of the cavity 20, the cross sections of the two channels 21 are equal in size, the phase change circulation process of the working medium can be uniformly carried out in the cavity 20, and the heat dissipation performance of the thin heat pipe is improved.

As shown in the layout (b) of fig. 9, the capillary structure 30 is composed of one tow medium 31 and two mesh media 32. The two pieces of mesh media 32 are symmetrically and oppositely arranged on the inner wall of the tube 10, and the tow media 31 are arranged in the cavity 20 between the two pieces of mesh media 32 and are respectively in contact with the two pieces of mesh media 32. Therefore, after the working medium in the steam form is condensed at the condensing section, the working medium can flow back to the evaporating section through the capillary action of the grid medium 32 at the position close to the pipe body 10, and can flow back to the evaporating section through the capillary action of the tow medium 31 at the position far away from the pipe body 10, so that the backflow speed of the working medium can be increased, and the heat dissipation performance of the thin heat pipe is improved.

As shown in the layout (c) of fig. 9, the capillary structure 30 is composed of a plurality of tow media 31 and a sheet of mesh media 32. Compared with the structure of the layout (a), the number of the tow media 31 and the cavity channels 21 is larger, the capillary action is stronger, the return speed of the working medium is faster, and therefore the heat dissipation performance of the thin heat pipe is stronger.

As shown in the layout (d) of fig. 9, the capillary structure 30 is composed of a plurality of tow media 31 and two pieces of mesh media 32. Compared with the structure of the layout (b), the number of the tow media 31 and the cavity channels 21 is more, the distribution of the capillary structures 30 is more dense and uniform, the capillary action is stronger, the reflux speed of the working medium is faster, and therefore the heat dissipation performance of the thin heat pipe is stronger.

From this, can the synergism through grid medium 32 and silk bundle medium 31, can improve capillary ability to, because grid medium 32 sets up the inner wall at body 10, when working medium is adsorbed on grid medium 32, can fully contact with body 10, be favorable to the more abundant heat that the chip produced of absorption at the evaporation zone of working medium, and distribute away from body 10 with the heat more thoroughly at the condensation zone, thereby, improve the heat dispersion of slim heat pipe.

Fig. 10 is a schematic view of a tube structure provided in the present application.

As shown in fig. 10, in one embodiment, the inner wall of the pipe body 10 includes a plurality of partition pieces 12, and the partition pieces 12 partition the cavity 20 into a plurality of channels 21. Wherein, block piece 12 and body 10 can be structure as an organic whole, extend along body 10 axis direction, block piece 12 can only set up the middle section region between the evaporation zone and the condensation zone of body 10, do not set up block piece 12 at the evaporation zone and the condensation zone of body 10 to make the chamber say 21 and communicate each other at the evaporation zone and the condensation zone of body 10, improve the mobility of working medium, and then improve the phase transition circulation efficiency of working medium. As shown in fig. 10, when the thin heat pipe is a flat pipe 10, the partition pieces 12 are arranged in parallel in the width direction of the cross section of the pipe 10 to partition the cavity 20 into a plurality of channels 21 arranged in parallel in the width direction of the cross section of the pipe 10; in addition, the blocking pieces 12 arranged in parallel can support the pipe body 10 and prevent the pipe body 10 from being deformed when being subjected to an external force.

Fig. 11 is a schematic view of another tube structure provided in the present application.

As shown in fig. 11, in an embodiment, on the basis of the structure of the pipe body 10 shown in fig. 11, in order to reduce the weight of the thin heat pipe, the partition pieces 12 may be provided in an intermittent structure, so as to achieve the purpose of reducing the weight of the thin heat pipe.

Fig. 12 is a schematic view of another tube structure provided in the present application.

In one embodiment, if the thin heat pipe is a bent pipe, the thin heat pipe needs to be bent to form a bent section when being manufactured, and if the partition plate 12 is disposed in the bent section, the partition plate 12 may be deformed during the bending of the pipe 10, which may cause deformation of the cavity 21 and structural damage to the pipe 10, and therefore, as shown in fig. 12, the partition plate 12 is disposed only on the straight section of the pipe 10, so that when the pipe 10 is bent, the structural shape of the partition plate 12 is not affected, deformation of the partition plate 12 is prevented, and weight reduction of the thin heat pipe is achieved.

In some embodiments, when the tube body 10 includes the partition sheet 12, the thin heat pipe provided by the present application may further include the following capillary structures 30.

Fig. 13 is a schematic view of another capillary structure provided herein.

As shown in fig. 13, in one embodiment, the tube body 10 includes two partition pieces 12 arranged in parallel and spaced apart to partition the cavity 20 into three channels 21. The capillary structure 30 includes a tow medium 31, and the tow medium 31 is disposed in the channel 21 between the two partition plates 12, so that the channel 21 between the two partition plates 12 forms a capillary channel 211 due to the presence of the tow medium 31, and the remaining two channels 21 form a vapor channel 212. When the thin heat pipe is used, the working medium absorbs heat and is vaporized at the evaporation section of the heat pipe, and is extruded into the steam channel 212 under the action of local pressure generated by vaporization and flows to the condensation section of the heat pipe through the steam channel 212; in the condensation section, the working medium releases heat and condenses into liquid, enters the capillary channel 211 under the capillary action of the tow medium 31, and returns to the evaporation section through the capillary channel 211, so that phase change circulation is realized. Therefore, the path of the working medium phase change circulation is more definite, the phase change circulation is more stable, and the heat dissipation performance of the thin heat pipe is improved.

Fig. 14 is a schematic view of another capillary structure provided herein.

As shown in fig. 14, in one embodiment, the tubular body 10 includes more than two partition panels 12 spaced in parallel to partition the cavity 20 into more than three channels 21. The capillary structure 30 comprises a plurality of tow mediums 31, and the tow mediums 31 are arranged in the cavity 21 formed by the partition plate 12 at intervals to form a structure that the capillary channels 211 and the steam channels 212 are alternately arranged. When the thin heat pipe is used, the working medium absorbs heat and is vaporized at the evaporation section of the heat pipe, and is dispersedly extruded into the plurality of steam channels 212 under the action of local pressure generated by vaporization and flows to the condensation section of the heat pipe through the steam channels 212; in the condensation section, the working medium releases heat and condenses into liquid, and the liquid is adsorbed by the tow medium 31 closest to the working medium, enters the capillary channel 211 closest to the working medium under the capillary action of the tow medium 31, and returns to the evaporation section through the capillary channel 211, so that phase change circulation is realized. Therefore, the working medium generates a plurality of phase change circulation loops in the cavity 20, the phase change circulation efficiency is higher, and particularly when the tube body 10 is flat and the section of the cavity 20 is larger, the capillary structure 30 capable of generating the multiphase phase change circulation loops is designed to enable the working medium to be distributed in the cavity 20 more uniformly, the phase change circulation is more stable, and the heat dissipation performance of the thin heat pipe is improved.

Fig. 15 is a schematic view of another capillary structure provided herein.

As shown in fig. 15, in one embodiment, the tube body 10 includes a plurality of partition plates 12 arranged in parallel and spaced apart to partition the cavity 20 into a plurality of channels 21, and the capillary structure 30 includes a mesh medium 32, and the mesh medium 32 is supported by the partition plates 12 and arranged on the inner wall of the tube body 10. When the thin heat pipe is used, the working medium is adsorbed on the grid medium 32 and fully contacts with the pipe body 10, so that the working medium can efficiently absorb heat generated by the chip at the evaporation section, and after the working medium absorbs the heat and is vaporized, the working medium is dispersedly extruded into each cavity channel 21 under the action of local pressure generated by vaporization and flows to the condensation section of the heat pipe through the cavity channels 21; in the condensation section, the working medium releases heat and condenses into liquid, and is adsorbed by the grid medium 32 and flows back to the evaporation section under the capillary action of the grid medium 32, so that phase change circulation is realized.

Fig. 16 is a schematic view of another capillary structure provided herein.

As shown in fig. 16, in an embodiment, the capillary structure 30 further includes a tow medium 31 in addition to the structure shown in fig. 15, the tow medium 31 is disposed at intervals in the channel 21 formed by the partition 12, and a structure in which the capillary channels 211 and the channel 21 steam channels 212 are alternately arranged is formed. Thus, compared to the capillary structure 30 shown in fig. 14 and 15, the capillary structure 30 shown in fig. 16 has a stronger capillary action, and thus the thin heat pipe has better heat dissipation performance.

It should be added that the capillary structures shown in fig. 7, 9, 13-16 of the present application are only some embodiments, but not all embodiments, and those skilled in the art can reasonably select the number and layout of the tow media and the mesh media according to the factors such as the size of the tube body of the thin-wall heat pipe, the size of the heat generation of the chip, and the cost, etc., under the technical development of the capillary structure shown in the present application, and the design that can be applied here does not exceed the protection scope of the present application.

Fig. 17 is a schematic view of a sealing structure of a thin heat pipe provided in the present application.

As shown in fig. 17, in some embodiments, the seal 13 can be processed into various shapes according to the space structure and design requirement of the electronic product, such as a straight seal (a structure of fig. 17), a bevel seal (b structure of fig. 7), a stepped seal (c structure of fig. 17), a curved seal (d structure of fig. 17), and so on. Therefore, the thin heat pipe has stronger space compatibility and more flexible application.

Fig. 18 is a schematic view of a converging portion of the thin heat pipe according to the present application.

As shown in fig. 18, in some embodiments, the converging portion 11 may include an arc-shaped structure (a structure of fig. 18) or a slope-shaped structure (b structure of fig. 18) in addition to the wedge-shaped structure, and the design and concept of the converging portion 11 capable of forming the cavity 20 are not beyond the protection scope of the present application.

The application also provides a manufacturing method of the thin heat pipe, and the method is used for manufacturing the thin heat pipe shown in the embodiment.

Fig. 19 is a flowchart of a method for manufacturing a thin heat pipe according to the present application.

Fig. 20 is an operation schematic diagram of a method for manufacturing a thin heat pipe according to the present application.

As shown in fig. 19 and 20, the method includes the steps of:

in step a, a capillary structure 30 is disposed in the cavity 20 of the tube 10. The capillary structure 30 may be arranged from one end of the tube 10 to the other end of the tube 10, and when the tube 10 is closed to form the cavity 20, the working medium may be subject to capillary action to generate flow at any position in the cavity 20.

And step B, pressing one end of the pipe body 10 by using a jig to form a convergence part 11, wherein the sectional area of a cavity 20 of the convergence part 11 is gradually reduced towards the direction far away from the center of the pipe body 10, and a sealed seal 13 is formed at the tail end of the pipe body 10. Specifically, the jig may have a wedge-shaped clamp opening, an arc-shaped clamp opening, or a slope-shaped clamp opening, for example, so that the jig is used to press fit one end of the pipe 10 to form the convergence 11 of the pipe 10 into a wedge shape, an arc shape, or a slope shape, and form the sealed seal 13 at the end of the pipe 10.

And step C, vacuumizing the cavity 20 from the other end of the tube body 10 and injecting working medium. Specifically, a vacuum-pumping device is used to perform a vacuum-pumping operation on the cavity 20 of the tube 10 from the other end of the tube 10, which is not pressed, and to inject a working medium into the vacuum cavity 20.

And D, pressing the other end of the tube body 10 by using a jig to form a convergence part 11.

And E, pressing the pipe body 10 into a flat shape by using a pressing tool.

Step F, seal 13 is sealed by welding. Specifically, the seal 13 may be welded using gas welding, arc welding (e.g., argon arc welding), resistance welding, laser welding, induction welding, and the like. Because the seal 13 formed by pressing the jig is simple in structure and the length of the seal 13 is small, the seal 13 can be sealed by a welding method to obtain a good sealing effect, and the sealing reliability of the cavity 20 is ensured.

The pipe body 10 may be a thin-walled metal round pipe, such as copper, aluminum, carbon steel, stainless steel, alloy steel, etc.; the working fluid can be Freon, ammonia, acetone, methanol, ethanol, heptane, water and the like and the combination of the substances; the capillary structure 30 can be a tow medium 31 or a mesh medium 32, and can enable the working medium to generate adsorption force and surface tension on the capillary structure 30.

According to the technical scheme, the manufacturing method of the thin heat pipe is simple in process flow and high in production yield. And, use the slim heat pipe of this application's method preparation, the cavity of body extends to the end of body all the time, the body cavity compares with other heat pipes that have a pipe structure, when body length is the same, the cavity volume of the slim heat pipe of this application is bigger, length is longer, can hold more capillary structure and working medium, and the condensation of working medium is longer with the cyclic distance of vaporization, be favorable to improving the condensation effect of working medium, improve the heat conductivility of heat pipe, therefore, the slim heat pipe heat dispersion that this application provided is better. When the thin heat pipe is applied to the chip heat dissipation design of electronic products such as mobile phones and tablet computers, the temperature of the chip can be effectively reduced, the phenomenon that the frequency of the chip is reduced at high temperature is avoided, and the performance of the chip is fully exerted.

Fig. 21 is a schematic diagram of an arrangement method of a capillary structure provided in the present application.

As shown in fig. 21, in one embodiment, the capillary structure 30 includes at least one tow medium 31 and is disposed along the axial direction of the tube 10, and in step a, the tow medium 31 may be intensively and intermittently fixed on one inner wall of the tube 10, so that when the tube 10 is pressed into a flat shape in step E, the capillary structure 30 contacts with the opposite inner wall of the tube 10 to divide the cavity 20 into a plurality of channels 21.

Fig. 22 is a schematic view of another arrangement of capillary structures provided herein.

As shown in fig. 22, in one embodiment, the capillary structure 30 further includes a mesh medium 32 on the basis of the structure shown in fig. 21, and the mesh medium 32 is fixed on the inner wall of the tube 10 opposite to the position where the tow medium 31 is fixed, so that the tow medium 31 can be attached to the mesh medium 32 after the tube 10 is pressed into a flat shape in step E.

Fig. 23 is a schematic view of a method for manufacturing a tube according to the present application.

As shown in fig. 23, in one embodiment, the pipe body 10 includes a plurality of partition pieces 12, and the partition pieces 12 may be formed by:

first, before step a, a solid circular tube or a hollow circular tube having a constant wall thickness is subjected to a removing process such as drilling or milling by a machining method to obtain a thin-walled tube body 10, and a plurality of partition pieces 12 extending in the axial direction of the tube body 10 are formed at intervals on the tube wall on one side of the tube body 10. Then, in step E, the protruding structure ends are brought into contact with the opposite tube walls by pressing the tube body 10 into a flat shape, thereby partitioning the cavity 20 into a plurality of channels 21.

In some embodiments, when the tube body 10 includes the partition sheet 12, the capillary structure 30 may further include the following arrangement method.

Fig. 24 is a schematic view of another arrangement of capillary structures provided herein.

In one embodiment, the tube 10 is machined to form two partition sheets 12 extending toward the axial center of the tube 10, and the capillary structure 30 includes a tow medium 31, and the tow medium 31 is fixed between the two partition sheets 12, so that the tow medium 31 is located in the channel 21 formed by the partition sheets 12 after the tube 10 is pressed into a flat shape in step E.

Fig. 25 is a schematic view of another arrangement of capillary structures provided herein.

In one embodiment, the tube 10 is machined to form more than two partition sheets 12 extending in the axial direction of the tube 10, and the capillary structure 30 includes a plurality of tow media 31, and the tow media 31 are fixed between the partition sheets 12 at intervals, so that after the tube 10 is pressed into a flat shape in step E, the tow media 31 are arranged in the channels 21 formed by the partition sheets 12 at intervals to form a structure in which the capillary channels 211 and the steam channels 21 are alternately arranged.

Fig. 26 is a schematic view of another arrangement of capillary structures provided herein.

In one embodiment, the tube body 10 is formed by machining more than two partition sheets 12 extending in the axial direction of the tube body 10, and the capillary structure 30 includes a mesh medium 32, and the mesh medium 32 is fixed to opposite sides of the partition sheets 12, so that the partition sheets 12 support the mesh medium 32 on the inner wall of the tube body 10 after the tube body 10 is pressed into a flat shape in step E.

Fig. 27 is a schematic view of another arrangement of capillary structures provided herein.

In one embodiment, the capillary structure 30 further includes a mesh medium 32 on the opposite side of the partition sheet 12 based on the arrangement shown in fig. 25, and the mesh medium 32 is fixed on the partition sheet 12, so that when the tube body 10 is pressed into a flat shape at step E, the partition sheet 12 supports the mesh medium 32 on the inner wall of the tube body 10 and brings the mesh medium 32 into contact with the tow medium 31.

It should be added that the arrangement method of the capillary structure shown in fig. 21, fig. 22, fig. 24 to fig. 26 of the present application is only a partial embodiment that can be realized by the present application, and not all embodiments, and those skilled in the art can reasonably select the number of the tow medium and the mesh medium and other arrangement methods according to the factors such as the size of the tube body of the thin-wall heat pipe, the size of the heat generation amount of the chip, and the cost, and the like, under the technical initiation of the arrangement method of the capillary structure shown in the present application, and the design that can be applied here does not exceed the protection scope of the present application.

The application also provides an electronic device.

As shown in fig. 28, the electronic device includes a thin heat pipe 100 provided in the present application, and the thin heat pipe 100 is used for dissipating heat from a chip 60 of an electronic product.

The electronic device may be a hardware device that employs a heat pipe heat dissipation technology to dissipate heat for a chip, such as a mobile phone, a tablet computer, a portable notebook computer, a desktop personal computer, a mobile workstation, a desktop workstation, a server device, a computer motherboard, and a display card. The thin heat pipe 100 may be attached to a Chip 60 having a large heat generation amount, such as a System on a Chip (SoC), a modem Chip (modem), and a Wi-Fi Chip of an electronic device.

In addition, the thin heat pipe 100 may be bent into a corresponding shape according to a layout manner of the chip 60 on the main board 50 of the electronic device, and the thin heat pipe 100 may be pressed over the chip 60, and a gap between the thin heat pipe 100 and the chip 60 may be filled with a heat conductive medium such as a graphene patch or a heat conductive silicone grease, so as to improve a heat conductive effect.

According to the technical scheme, the electronic equipment provided by the embodiment of the application has the advantages that the heat conducting effect of the thin heat pipe is better, so that the heat generated by the chip can be taken away more efficiently, the temperature of the chip is reduced, the phenomenon of frequency reduction caused by overhigh temperature can be avoided under the condition of long-time high-load operation of the chip, the performance of the chip can be fully and stably exerted, the overall performance of the electronic equipment is improved, and the user experience is improved.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

It will be understood that the present application is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.

Claims

1. A thin heat pipe, comprising: the pipe body comprises a convergence part which is formed at one end of the pipe body in a pressing mode and has a wedge-shaped structure, the sectional area of the cavity of the convergence part is gradually reduced towards the direction far away from the center of the pipe body, and a sealed opening is formed at the tail end of the pipe body; the cavity extends from the seal at one end of the tube to the seal at the other end of the tube; the width of the convergence part in the direction perpendicular to the pressing direction of the jig is greater than or equal to the width of the pipe body in the region outside the convergence part; a capillary structure and a working medium are arranged in the cavity, and the capillary structure extends from one end seal of the tube body to the other end seal of the tube body; the pipe body comprises a plurality of partition pieces, the partition pieces extend along the axis of the pipe body in the pipe body, and the partition pieces are distributed at intervals in the cavity along the direction perpendicular to the pressing direction of the jig to partition the cavity into a plurality of cavities; the capillary structure comprises at least one tow medium, and the at least one tow medium is arranged along the axial direction of the pipe body and is positioned in at least one cavity channel.

2. A thin heat pipe as claimed in claim 1 wherein said pipe body includes two of said partitions to form three of said channels; the capillary structure comprises the tow medium, the tow medium is arranged in the cavity channel between the two partition sheets, so that the cavity channel between the two partition sheets forms a capillary channel, and the rest cavity channels formed by the two partition sheets form a steam channel.

3. A thin heat pipe as claimed in claim 1 wherein said pipe body includes more than two of said partitions to form a plurality of said channels; the capillary structure comprises a plurality of the tow media, the tow media are arranged in the cavities at intervals, the cavities with the tow media form capillary channels, other cavities form steam channels, and the cavities form a structure in which the capillary channels and the steam channels are alternately arranged.

4. A thin heat pipe as claimed in claim 1 wherein the capillary structure further comprises a mesh medium disposed on the inner wall of the tube, the tow medium being attached to the mesh medium.

5. A thin heat pipe as claimed in claim 3 wherein the capillary structure comprises a mesh medium supported by the partition at the inner wall of the pipe body.

6. A thin heat pipe according to any of claims 1 to 5 wherein the seal comprises any one or more of a straight seal, a bevel seal, a stepped seal and/or a curved seal.

7. A method for manufacturing a thin heat pipe is characterized by comprising the following steps:

forming a plurality of partition pieces in the pipe body;

arranging a capillary structure in the cavity of the tube body;

pressing one end of the pipe body by using a jig to form a converging part with a wedge-shaped structure at one end, wherein the sectional area of a cavity of the converging part is gradually reduced towards the direction far away from the center of the pipe body, and a sealed opening is formed at the tail end of the pipe body;

vacuumizing the cavity from the other end of the tube body and injecting working medium;

pressing the other end of the pipe body by using a jig to form the convergence part and the seal of the other end, wherein the capillary structure extends from the seal of one end of the pipe body to the seal of the other end of the pipe body;

pressing the pipe body into a flat shape by using a stamping tool, wherein the partition pieces partition the cavity of the pipe body into a plurality of cavities and channels, the partition pieces are distributed in the cavity at intervals along the direction vertical to the pressing direction of the jig, the capillary structure comprises at least one tow medium, and the at least one tow medium is arranged along the axial direction of the pipe body and is positioned in the at least one cavity and channel;

and sealing the seals at the two ends of the tube body by welding so as to enable the cavity to extend from the seal at one end of the tube body to the seal at the other end of the tube body, wherein the width of the convergence part in the direction vertical to the pressing direction of the jig is greater than or equal to the width of the tube body in the region except the convergence part.

8. The method of claim 7, wherein the tube body comprises two of the partition panels, forming three of the channels; the capillary structure comprises the tow medium, the tow medium is arranged in the cavity channel between the two partition sheets, so that the cavity channel between the two partition sheets forms a capillary channel, and the rest cavity channels formed by the two partition sheets form a steam channel.

9. The method of claim 8, wherein the tube body comprises more than two of the partition panels forming a plurality of the channels; the capillary structure comprises a plurality of tow media, the tow media are arranged in the cavities at intervals, the cavities with the tow media form capillary channels, other cavities form tidy channels, and the cavities form a structure that the capillary channels and the steam channels are alternately arranged.

10. The method of claim 7, wherein the capillary structure further comprises a mesh medium disposed on an inner wall of the tube, the tow medium adhering to the mesh medium after the tube is compressed into a flat shape.

11. The method of claim 10, wherein the capillary structure comprises a mesh media disposed on opposite sides of the partition to support the mesh media against the inner walls of the tube after the tube is compressed into the flattened shape.

12. An electronic device comprising the thin heat pipe of any one of claims 1 to 6, wherein the thin heat pipe is used for dissipating heat from a chip of the electronic device.