CN109623676A - Pcb board hub type diamond ultra-thin cutting sheet and its application - Google Patents
Pcb board hub type diamond ultra-thin cutting sheet and its application Download PDFInfo
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- CN109623676A CN109623676A CN201811648885.0A CN201811648885A CN109623676A CN 109623676 A CN109623676 A CN 109623676A CN 201811648885 A CN201811648885 A CN 201811648885A CN 109623676 A CN109623676 A CN 109623676A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/009—Tools not otherwise provided for
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- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses pcb board hub type diamond ultra-thin cutting sheets and its application, and preparation method includes the following steps: ultrasonic disperse after graphite powder, diamond, electroplate liquid are mixed obtains mixed system；Then aluminum substrate is added, carries out electroplating processes, obtains diamond ultra-thin cutting sheet electroplate；By diamond ultra-thin cutting sheet electroplate in 180~250 DEG C of heating 2h, diamond ultra-thin cutting sheet molded article is obtained；Diamond ultra-thin cutting sheet molded article puts the first edge on a knife or a pair of scissors by grinding, machining, alkaline etching, grinding, obtains pcb board hub type diamond ultra-thin cutting sheet.When the present invention prepares hub type diamond ultra-thin cutting sheet, graphite powder has been admixed, the hardness of graphite powder makes product have higher sharpness, improve product and cut quality well below diamond and bonding agent nickel in cutting process；Ratio is especially limited, can achieve excellent cutting effect.
Description
Technical field
The invention belongs to grinding wheel technologies, and in particular to pcb board hub type diamond ultra-thin cutting sheet and its application.
Background technique
Present hub type diamond ultra-thin cutting sheet, since it is mainly made of nickel and diamond, in cutting products
In the process, since nickel is harder, diamond is not easy to fall off, so after cutting pcb board for a period of time, diamond cutting edge mill
Damage, lead to cutting force decrease, the product being finally cut into occur chipping, crackle and it is broken phenomena such as.
Summary of the invention
The invention discloses pcb board hub type diamond ultra-thin cutting sheets and its application, have preferable cutting quality
With higher cutting efficiency.
The present invention adopts the following technical scheme:
Pcb board hub type diamond ultra-thin cutting sheet, preparation method includes the following steps:
(1) ultrasonic disperse after mixing graphite powder, diamond, electroplate liquid, obtains mixed system；Then aluminum substrate is added, carries out
Electroplating processes obtain diamond ultra-thin cutting sheet electroplate；
(2) diamond ultra-thin cutting sheet electroplate is obtained into diamond ultra-thin cutting sheet molded article in 180-250 DEG C of heating 2h；
(3) diamond ultra-thin cutting sheet molded article puts the first edge on a knife or a pair of scissors by grinding, machining, alkaline etching, grinding, obtains pcb board hub type
Diamond ultra-thin cutting sheet.
The preparation method of pcb board hub type diamond ultra-thin cutting sheet, comprising the following steps:
(1) ultrasonic disperse after graphite powder, diamond, electroplate liquid mixing is obtained into mixed system, aluminum substrate is then added, carries out electricity
Plating obtains diamond ultra-thin cutting sheet electroplate；
(2) diamond ultra-thin cutting sheet electroplate is obtained into diamond ultra-thin cutting sheet molded article in 180-250 DEG C of heating 2h；
(3) diamond ultra-thin cutting sheet molded article puts the first edge on a knife or a pair of scissors by grinding, machining, alkaline etching, grinding, obtains pcb board hub type
Diamond ultra-thin cutting sheet.
Pcb board cuts sheet molded article with hub type diamond ultra-thin, and preparation method includes the following steps:
(1) ultrasonic disperse after mixing graphite powder, diamond, electroplate liquid, obtains mixed system；Then aluminum substrate is added, carries out
Electroplating processes obtain diamond ultra-thin cutting sheet electroplate；
(2) diamond ultra-thin cutting sheet electroplate is obtained into pcb board hub type diamond ultra-thin in 180-250 DEG C of heating 2h
Cut sheet molded article.
Pcb board cuts the preparation method of sheet molded article with hub type diamond ultra-thin, comprising the following steps:
(1) ultrasonic disperse after mixing graphite powder, diamond, electroplate liquid, obtains mixed system；Then aluminum substrate is added, carries out
Electroplating processes obtain diamond ultra-thin cutting sheet electroplate；
(2) diamond ultra-thin cutting sheet electroplate is obtained into pcb board hub type diamond ultra-thin in 180-250 DEG C of heating 2h
Cut sheet molded article.
Application the invention also discloses the pcb board with hub type diamond ultra-thin cutting sheet in cutting PCB substrate.
The cutting method of pcb board, comprising the following steps:
(1) ultrasonic disperse after mixing graphite powder, diamond, electroplate liquid, obtains mixed system；Then aluminum substrate is added, carries out
Electroplating processes obtain diamond ultra-thin cutting sheet electroplate；
(2) diamond ultra-thin cutting sheet electroplate is obtained into diamond ultra-thin cutting sheet molded article in 180-250 DEG C of heating 2h；
(3) diamond ultra-thin cutting sheet molded article puts the first edge on a knife or a pair of scissors by grinding, machining, alkaline etching, grinding, obtains ultra-thin cutting slice；
(4) by ultra-thin cutting slice on cutting machine；The pcb board for posting film is placed on cutting machine ceramic disk, vacuum is opened, it will
Pcb board is inhaled on ceramic disk；Then by the Cutting Road of the tool marks alignment pcb board of ultra-thin cutting slice, start to cut.
Preferably, when cutting, feed velocity is the mm/s of 160mm/s~200.The feed velocity one of existing routine cutting sheet
As in the mm/s of 120 mm/s~140, then fastly will lead to cutting burr it is very big, cutting products are all defective products.
In the present invention, diamond ultra-thin cutting sheet molded article puts the first edge on a knife or a pair of scissors by grinding, machining, alkaline etching, grinding, obtains wheel hub
Type diamond ultra-thin cutting sheet；Preferably, single side is carried out to diamond ultra-thin cutting sheet molded article coating face using grinder to grind
Mill processing, the problem for avoiding random knockout bring plating layer flatness poor, machining include aperture processing and Vehicle Processing shaping,
Alkaline etching is to be corroded with sodium hydroxide, to expose back side coating, grinding puts the first edge on a knife or a pair of scissors diamond ultra-thin cutting sheet molded article cutting
Oilstone is carried out grinding to the front and back of blade and put the first edge on a knife or a pair of scissors, expose diamond, avoids the product plane obtained using chemical attack
Inconsistence problems are spent, complete hub type diamond ultra-thin cutting sheet is finally obtained.It is further preferred that the time of grinding is 5-
40min, obtained plating layer flatness are 2 μm, and grinding puts the first edge on a knife or a pair of scissors the time as 1-30min, guarantee the diamond of blade front and back
High consistency makes it all in the same plane, increases effective usage quantity of diamond in cutting process, that is to say, that cut
When cutting while there are more diamonds to participate in cutting, improves cutting efficiency.
In the present invention, the partial size of graphite powder is 0.5-2 μm, the hardness of graphite powder well below diamond and bonding agent nickel,
Make product that there is higher sharpness in cutting process, improves product and cut quality.
In the present invention, using stirring upper sand mode when electroplating processes, stirring includes high-speed stirred and stir at low speed, preferably
, the time of high-speed stirred is 5s-30s, and the time stirred at low speed is 30s-2min, is distributed in graphite powder with diamond uniform
In plating solution；High-speed stirred, to stir at low speed be successively to carry out, and the effect of high-speed stirred is that diamond and graphite powder are stirred to come,
It is evenly distributed in it in plating solution, the effect stirred at low speed is knockout, allows diamond and graphite powder to fall on matrix, with nickel one
It plays electro-deposition to get on, forms coating, while stirring at low speed the coating that can obtain even circumferential.Preferably, high-speed stirred with it is low
The revolving speed of speed stirring is respectively 800rpm, 150rpm.
In the present invention, electroplate liquid includes nickel sulfate, nickel chloride, boric acid, saccharin, butynediols, water, and good to control, plating solution is steady
It is fixed；Preferably, in mixed system, the concentration of nickel sulfate is 390-410g/L, and the concentration of nickel chloride is 38-42g/L, boric acid it is dense
Degree is 30-40g/L, and the concentration of saccharin is 0.3-0.6g/L, and the concentration of Isosorbide-5-Nitrae butynediols is 0.2-0.5g/L, graphite powder it is dense
Degree is 1g/L, and the concentration of diamond is 0.2g/L.
In the present invention, the particle size range of diamond is 10/20-30/40；The temperature of electroplating processes is 35-45 DEG C, when plating
Between be 180min-300min.
Preferably, electroplate liquid further includes sodium acetate, and the concentration of sodium acetate is 0.5g/L, and sodium acetate is in previous chemical plating fluid
Middle is more, and electroplate liquid has not been reported, and effect is usually pH-value instrumentality, and dosage is not Tai Gao still quite a few, this
The less amount of sodium acetate of the addition of innovation and creation adjusts electroplate liquid, it is found that it is pretty good with electroplate liquid other components compatibility, and
And the impact strength of plating cutting sheet can be increased, this is unrelated with plating system pH-value, and a small amount of sodium acetate is to plating system
PH-value have little effect, conjecture be with sodium acetate adjust the deposition of nickel ion it is related, the deposition of nickel ion may be made
More evenly, at the same increase sodium acetate dosage be unfavorable for instead cutting sheet play excellent properties.
Preferably, the blade of hub type diamond ultra-thin cutting sheet is equipped with slot, can increase chip removal effect, improves product and adds
The quantity of work quality, slot is not particularly limited, and slot is prepared using Conventional processing methods.
Advantages of the present invention:
1, when the present invention prepares hub type diamond ultra-thin cutting sheet, graphite powder has been admixed, the hardness of graphite powder is well below gold
Hard rock and bonding agent nickel make in cutting process product have higher sharpness, improve product and cut quality；Especially limit ratio
Example, can achieve excellent cutting effect.
2, when the present invention prepares hub type diamond ultra-thin cutting sheet, the diamond ultra-thin cutting sheet electroplate after plating is put
Enter baking oven, reduces blade internal stress, increase ductility.
3, when the present invention prepares hub type diamond ultra-thin cutting sheet, product is ground using single side after plating, improves knife
The flatness of piece makes product have precision more higher than the prior art, improves cutting quality.
4, when the present invention prepares hub type diamond ultra-thin cutting sheet, the mode for going out sword of electrochemical polish is not used,
Sword is gone out using cutting oilstone, guarantees the diamond high consistency of blade front and back, makes it all in the same plane, increase
The effective usage quantity of diamond in cutting process, that is to say, that there are more diamonds to participate in cutting simultaneously when cutting, mention
Cutting efficiency is risen.
Detailed description of the invention
Fig. 1 is hub type diamond ultra-thin cutting sheet structural schematic diagram of the present invention；
Fig. 2 is hub type diamond ultra-thin cutting sheet partial enlarged view of the present invention；
Wherein, 1 is aluminum substrate, and 2 be diamond knife edge, and 3 be slot；
Fig. 3 be embodiment ultra-thin cutter feed velocity 180mm/s under cut picture；
Fig. 4 be embodiment Ultrathin blade feed velocity 200mm/s under cut picture.
Specific embodiment
Embodiment
1, electroplate liquid, formula are equipped with are as follows: nickel sulfate 400g/L, nickel chloride 40g/L, boric acid 35g/L, saccharin 0.5g/L,
Isosorbide-5-Nitrae butynediols 0.3g/L, remaining is water.
2, the graphite powder that partial size is 0.5-2 μm is chosen, is placed in beaker together with diamond, uses ultrasound after electroplate liquid is added
Wavelength-division dissipates, and obtains mixed system, and wherein the concentration of graphite powder is 1g/L, and the concentration of diamond is 0.2g/L；Then aluminium base is added
Body is electroplated in 40 DEG C, obtains diamond ultra-thin cutting sheet electroplate.
Using upper sand mode is stirred when plating, stirs successively to use high-speed stirred, stirring at low speed, make graphite powder and Buddha's warrior attendant
Stone is uniformly distributed obtains the pearl nickel coating with diamond in the plating solution, is electroplated on the aluminum substrate made；At a high speed
The revolving speed for stirring and stirring at low speed is respectively 800rpm, 150rpm；Diamond grit, mixing time and electroplating time, grinding
Machine milling time, cutting oilstone time are as follows:
3, after being electroplated, the product diamond ultra-thin cutting sheet electroplate after plating is taken out, puts baking oven into, 210 DEG C add
Hot 2h, goes de-stress, obtains diamond ultra-thin cutting sheet molded article.
4, the product after being electroplated, plating knockout are random knockouts, and the present invention is using grinder to diamond ultra-thin cutting sheet
Formed body plates level and carries out single side attrition process, and milling time is as above, and the plating layer flatness after processing is 2 μm；Then machine is used
Aperture and Vehicle Processing Shape correction are processed, then with after sodium hydroxide alkaline etching, exposes back side coating, as cutter.
6, the diamond ultra-thin cutting sheet molded article for exposing back side coating is cut into oilstone, to Buddha's warrior attendant on cutting machine
The front and back of stone ultra-thin cutting slice formed body carries out grinding and puts the first edge on a knife or a pair of scissors, and the time is as above, exposes diamond knife edge, avoids using change
It is inconsistent to learn the product plane degree that corrosion obtains, is finally slotted with wire cutting, obtains complete hub type diamond ultra-thin cutting
Piece.
The hub type diamond ultra-thin cutting sheet structural schematic diagram of above-mentioned preparation is shown in Fig. 1, and wherein partial enlarged view is shown in Fig. 2,
55.63 millimeters of cutting sheet diameter, 19.05 millimeters of inner hole aperture, is equipped with 32 by 4.49 millimeters of thickness, aluminum substrate diameter 56.5mm
Slot, each groove deep 2mm, groove width 1mm.
On the basis of 15/25 model diamond technological parameter, by the change of other conditions, comparative example is obtained, as follows:
On the basis of embodiment, it is added without graphite powder, as other, obtains diamond ultra-thin cutting sheet D1.
It on the basis of embodiment, does not slot, as other, obtains diamond ultra-thin cutting sheet D2.
On the basis of embodiment, stirs as the stirring of 600rpm single speed, as other, obtain diamond ultra-thin cutting sheet D3.
It on the basis of embodiment, is put the first edge on a knife or a pair of scissors using conventional chemical corrosion, as other, obtains diamond ultra-thin cutting sheet D4.
On the basis of embodiment, the concentration of diamond is 0.4g/L, as other, obtains diamond ultra-thin cutting sheet D5.
On the basis of embodiment, the concentration of graphite powder is 2g/L, as other, obtains diamond ultra-thin cutting sheet D6.
The sodium acetate that concentration is 0.5g/L is added on the basis of embodiment, in electroplate liquid, as other, it is super to obtain diamond
Thinly-sliced pitch cutting, impact strength are relatively added without sodium acetate and improve 4.8%, and cutting performance is essentially the same, and especially cutting burr is also in 8 μ
M or so；But if the sodium acetate of 1g/L is added, cutter burr can relatively be added without sodium acetate increase, reach 15 μm.
Conventional pcb board is cut using above-mentioned ultra-thin cutting slice, cutting step is as follows:
Step 1: by cutting sheet on 3350 cutting machine of DISCO；
Step 2: PCB substrate is attached on UV film, jail is pasted with laminator；
Step 3: the pcb board for posting film is placed on cutting machine ceramic disk, vacuum is opened, UV film and pcb board are inhaled in ceramic disk
On；
Step 4: operation machine, finds the enlarged drawing of PCB substrate in touch screen window, with the cutting of tool marks alignment PCB substrate
Road, depth of cut are set as deep into UV film 0.09mm；
Step 5: starting to cut, feed velocity 140mm/s；CH1 is transverse cuts, and CH2 is longitudinally cutting；
Step 6: after having cut CH1 and CH2, check core particles cutting part whether black with it is jagged.
It is respectively 8 μ that the ultra-thin cutter (15/25 model diamond) of embodiment, the knife of Ultrathin blade D1 to D6, which cut burr,
m,57μm,33μm,16μm,39μm,26μm,30μm；It is existing routine cutter burr be 69 μm (under feed velocity 120mm/s, hair
Thorn is 50 μm), cutting part blacks；Cutting rice number is used to test as the index in cutter service life and show that the ultra-thin of embodiment is cut
Cutter, Ultrathin blade D1 to D6, existing conventional cutter cutting rice number respectively reach 1.5 myriametres, 1.02 myriametres, 1.34 ten thousand
Rice, 1.44 myriametres, 1.28 myriametres, 1.39 myriametres, 1.37 myriametres, 1 myriametre；Fig. 3 is the ultra-thin cutter feed velocity of embodiment
Cut picture under 180mm/s, Fig. 4 be embodiment Ultrathin blade feed velocity 200mm/s under cut picture, it can be seen that it is real
Apply that a cut surface is smooth, cutting quality is good, cutter burr is respectively 11 μm, 18 μm, and cutting part does not black.
The present invention uses new electroplating formula and technique, and diamond is electroplated on matrix together with graphite powder, reduces
The volume of a part of nickel bonding agent plays the role of softening bonding agent；So that matrix hardness is relatively low, during the cutting process
It is easier to fall off, is inconjunction with the abrasion of nickel bonding agent, exposes the new diamond with more sharpness, improve cutting quality, may be used also
With thin using graphite powder fineness ratio diamond, only diamond 1/4 or so the advantages of, the work of fine grinding is played in cutting process
With, improve chipping, the ultra-thin cutter chipping of embodiment less than 10 μm, even if using feed velocity 200mm/s, cutter burr
It is 18 μm, complies fully with quality requirements.
Claims (10)
1.PCB plate hub type diamond ultra-thin cutting sheet, which is characterized in that the pcb board is cut with hub type diamond ultra-thin
The preparation method of pitch cutting the following steps are included:
(1) ultrasonic disperse after mixing graphite powder, diamond, electroplate liquid, obtains mixed system；Then aluminum substrate is added, carries out
Electroplating processes obtain diamond ultra-thin cutting sheet electroplate；
(2) diamond ultra-thin cutting sheet electroplate is obtained into diamond ultra-thin cutting sheet molded article in 180~250 DEG C of heating 2h；
(3) diamond ultra-thin cutting sheet molded article puts the first edge on a knife or a pair of scissors by grinding, machining, alkaline etching, grinding, obtains pcb board hub type
Diamond ultra-thin cutting sheet.
2. pcb board hub type diamond ultra-thin cutting sheet according to claim 1, which is characterized in that use grinder pair
Diamond ultra-thin cuts sheet molded article coating face and carries out single side attrition process；Machining includes aperture processing and Vehicle Processing shaping；
Alkaline etching is to be corroded with sodium hydroxide；Grinding puts the first edge on a knife or a pair of scissors diamond ultra-thin cutting sheet molded article cutting oil stone.
3. pcb board hub type diamond ultra-thin cutting sheet according to claim 1, which is characterized in that the time of grinding is 5
~40min；Grinding puts the first edge on a knife or a pair of scissors the time as 1~30min；Using stirring upper sand mode when electroplating processes, stirring include high-speed stirred with
It stirs at low speed, high-speed stirred is stirred at low speed and successively carried out；The temperature of electroplating processes is 35~45 DEG C, electroplating time 180min
~300min.
4. pcb board hub type diamond ultra-thin cutting sheet according to claim 3, which is characterized in that high-speed stirred when
Between be 5s~30s, the time stirred at low speed be 30s~2min；High-speed stirred and the revolving speed stirred at low speed be respectively 800rpm,
150rpm。
5. pcb board hub type diamond ultra-thin cutting sheet according to claim 1, which is characterized in that the partial size of graphite powder
It is 0.5~2 μm；The particle size range of diamond is 10/20~30/40.
6. pcb board hub type diamond ultra-thin cutting sheet according to claim 1, which is characterized in that electroplate liquid includes sulphur
Sour nickel, nickel chloride, boric acid, saccharin, butynediols, water；In mixed system, the concentration of nickel sulfate is 390~410g/L, nickel chloride
Concentration be 38~42g/L, the concentration of boric acid is 30~40g/L, and the concentration of saccharin is 0.3~0.6g/L, Isosorbide-5-Nitrae butynediols
Concentration is 0.2~0.5g/L, and the concentration of graphite powder is 1g/L, and the concentration of diamond is 0.2g/L.
7. pcb board hub type diamond ultra-thin cutting sheet according to claim 6, which is characterized in that electroplate liquid further includes
Sodium acetate, the concentration of sodium acetate are 0.5g/L.
8. pcb board hub type diamond ultra-thin cutting sheet according to claim 1, which is characterized in that the pcb board wheel
The blade of hub type diamond ultra-thin cutting sheet is equipped with slot.
9. application of the pcb board with hub type diamond ultra-thin cutting sheet in cutting PCB substrate according to claim 1.
10. application according to claim 9, which is characterized in that cutting PCB substrate when, feed velocity be 160mm/s~
200 mm/s。
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| CN201811648885.0A CN109623676B (en) | 2018-12-30 | 2018-12-30 | Hub type diamond ultrathin cutting blade for PCB and application thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811648885.0A CN109623676B (en) | 2018-12-30 | 2018-12-30 | Hub type diamond ultrathin cutting blade for PCB and application thereof |
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| CN109623676B CN109623676B (en) | 2020-08-25 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112746304A (en) * | 2020-12-28 | 2021-05-04 | 苏州赛尔科技有限公司 | Hub type scribing cutter, preparation method thereof and application thereof in gallium arsenide material processing |
| CN112831813A (en) * | 2020-12-30 | 2021-05-25 | 苏州赛尔科技有限公司 | Multilayer concentration diamond scribing knife and preparation method thereof |
| CN114378729A (en) * | 2021-12-26 | 2022-04-22 | 赛尔科技(如东)有限公司 | Chamfering grinding wheel for processing touch screen glass and preparation method thereof |
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| CN112831813A (en) * | 2020-12-30 | 2021-05-25 | 苏州赛尔科技有限公司 | Multilayer concentration diamond scribing knife and preparation method thereof |
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| CN114378729A (en) * | 2021-12-26 | 2022-04-22 | 赛尔科技(如东)有限公司 | Chamfering grinding wheel for processing touch screen glass and preparation method thereof |
| CN114378729B (en) * | 2021-12-26 | 2023-10-03 | 赛尔科技(如东)有限公司 | Chamfering grinding wheel for touch screen glass processing and preparation method thereof |
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| CN109623676B (en) | 2020-08-25 |
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