CN109623632B - Chemical mechanical polishing system and working process thereof - Google Patents
Chemical mechanical polishing system and working process thereof Download PDFInfo
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- CN109623632B CN109623632B CN201811581768.7A CN201811581768A CN109623632B CN 109623632 B CN109623632 B CN 109623632B CN 201811581768 A CN201811581768 A CN 201811581768A CN 109623632 B CN109623632 B CN 109623632B
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- chemical mechanical
- mechanical polishing
- grinding fluid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
The invention provides a chemical mechanical polishing system, which relates to an integrated circuit production process and comprises the following steps: the chemical mechanical polishing system comprises a grinding fluid supply device, a grinding fluid circulating device and a grinding machine table, wherein the grinding fluid circulating device is positioned in a grinding fluid circulation pipeline which is communicated with the grinding fluid supply device and the grinding machine table, when the chemical mechanical polishing system works normally, the grinding fluid supply device supplies grinding fluid, and the grinding fluid is supplied to the grinding machine table through the grinding fluid circulation pipeline and the grinding fluid circulating device so as to carry out chemical mechanical polishing; when the chemical mechanical polishing system gives out a fault alarm, the grinding fluid supply device stops working, and the grinding fluid circulating device supplies grinding fluid to the grinding machine table for chemical mechanical polishing, so that the yield and the production efficiency of the wafer are improved, and the cost is reduced.
Description
Technical Field
The present invention relates to integrated circuit manufacturing processes, and more particularly to a chemical mechanical polishing system and a process for operating the same.
Background
In the integrated circuit production process, a Chemical Mechanical Polishing (CMP) process is an essential step therein. A Chemical Mechanical Polishing (CMP) process wets a rotatable polishing pad with a chemical slurry containing a polishing abrasive component, and mechanically polishes a front surface of a substrate using the wetted polishing pad. Which is one of the common and critical steps in the integrated circuit production process, the reliability of which directly affects the wafer yield and the production cost of semiconductor devices.
Therefore, it is an objective of the industry to develop a highly reliable chemical mechanical polishing system.
Disclosure of Invention
The invention aims to provide a chemical mechanical polishing system, which is used for improving the yield and the production efficiency of wafers and reducing the cost.
The invention provides a chemical mechanical polishing system, comprising: the chemical mechanical polishing system comprises a grinding fluid supply device, a grinding fluid circulating device and a grinding machine table, wherein the grinding fluid circulating device is positioned in a grinding fluid circulation pipeline which is communicated with the grinding fluid supply device and the grinding machine table, when the chemical mechanical polishing system works normally, the grinding fluid supply device supplies grinding fluid, and the grinding fluid is supplied to the grinding machine table through the grinding fluid circulation pipeline and the grinding fluid circulating device so as to carry out chemical mechanical polishing; and when the chemical mechanical polishing system gives a fault alarm, the grinding fluid supply device stops working, and the grinding fluid circulating device supplies grinding fluid to the grinding machine table for chemical mechanical polishing.
Furthermore, the grinding fluid circulating device is connected in series between the grinding fluid supply device and the grinding machine table.
Furthermore, the grinding fluid circulation pipeline comprises a first section of circulation pipeline and a second section of circulation pipeline, wherein one end of the first section of circulation pipeline is connected with the grinding fluid supply device, the other end of the first section of circulation pipeline is connected with the grinding fluid circulation device, one end of the second section of circulation pipeline is connected with the grinding fluid circulation device, the other end of the second section of circulation pipeline is connected with the grinding machine, when the chemical mechanical polishing system works normally, the grinding fluid supply device provides grinding fluid, and the grinding fluid is transmitted to the grinding fluid circulation device through the first section of circulation pipeline and then transmitted to the grinding machine through the second section of circulation pipeline; and after the chemical mechanical polishing system gives out a fault alarm, the grinding fluid circulating device is transmitted to the grinding machine table through the second section of circulation pipeline.
Further, the slurry circulation device and the slurry circulation pipeline are integrally formed.
Furthermore, the first section of circulation pipeline is connected with the one-way valve of the grinding fluid circulating device, and the grinding fluid circulating device is connected with the normal pipeline of the second section of circulation pipeline.
Furthermore, the capacity of the grinding fluid circulating device is larger than that of the grinding fluid circulation pipeline with the same length.
Further, the capacity of the grinding fluid circulating device is more than 4L.
Furthermore, the chemical mechanical polishing system further comprises a fault detection device, wherein the fault detection device is connected with the grinding fluid supply device and the grinding fluid circulation pipeline and is used for detecting whether the chemical mechanical polishing system has a fault or not, and when the chemical mechanical polishing system has the fault, a fault alarm signal is sent out.
Furthermore, the chemical mechanical polishing system further comprises a control device, the control device is connected with the grinding fluid supply device, the grinding fluid circulating device and the grinding machine table, when the chemical mechanical polishing system normally works, the fault detection device does not send out a fault alarm, the control device controls the grinding fluid supply device to provide the grinding fluid, when the chemical mechanical polishing system breaks down, the fault detection device sends out a fault alarm, the control device controls the grinding fluid supply device to stop working, and the grinding fluid circulating device is controlled to supply the grinding fluid to the grinding machine table.
The invention also provides a working process of the chemical mechanical polishing system, which is characterized by comprising the following steps that when the fault detection device does not detect faults in the working process of the chemical mechanical polishing system, the control device controls the grinding fluid supply device to supply grinding fluid, the grinding fluid is supplied to the grinding machine table through the grinding fluid circulation pipeline and the grinding fluid circulating device so as to carry out chemical mechanical polishing, and the grinding fluid is stored in the grinding fluid circulating device; in the working process of the chemical mechanical polishing system, after the fault detection device detects a fault and gives out a fault alarm, the control device controls the grinding fluid supply device to stop working, and controls the grinding fluid circulating device to supply grinding fluid to the grinding machine table for chemical mechanical polishing.
According to the chemical mechanical polishing system provided by the invention, the grinding fluid circulating device is additionally arranged between the grinding fluid supply device and the grinding machine platform, and when the chemical mechanical polishing system works normally, the grinding fluid circulating device is used as a grinding fluid circulation pipeline and has no influence on the supply of normal grinding fluid; when the chemical mechanical polishing system gives an alarm and the grinding fluid supply device stops supplying the grinding fluid, the grinding fluid circulating device starts to operate independently, the grinding machine is switched to a normal working state from an alarm state, and the grinding machine stops operating after the wafers in the grinding machine are continuously processed, so that related personnel can wait for checking. Therefore, even if the chemical mechanical polishing system gives out a fault alarm, the wafers in the manufacturing process can be continuously processed without the risk of scrapping, so that the yield and the production efficiency of the wafers are improved, and the cost is reduced.
Drawings
FIG. 1 is a schematic diagram of a prior art chemical mechanical polishing system.
FIG. 2 is a schematic view of a chemical mechanical polishing system in accordance with one embodiment of the present invention.
The reference symbols used in the drawings are explained below:
100. a polishing liquid supply device; 200. a grinding machine table; 300. a grinding fluid circulation line; 400. a grinding fluid circulating device; 500. a control device; 600. a fault detection device; 310. a first section of flow line; 320. a second section of flow line.
Detailed Description
The technical solutions in the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
During chemical mechanical polishing, the slurry needs to be transferred to the polishing platen for chemical mechanical polishing through the slurry supply device and the slurry flow pipe between the slurry supply device and the polishing platen. Specifically, referring to fig. 1, fig. 1 is a schematic diagram of a chemical mechanical polishing system of the prior art, as shown in fig. 1, the chemical mechanical polishing system includes a slurry supply device 100, a polishing platen 200, and a slurry circulation pipeline 300 for transporting the slurry between the slurry supply device 100 and the polishing platen 200. In the chemical mechanical polishing process, a slurry detection device is required to detect the concentration or flow rate of the slurry, and when the concentration or flow rate of the slurry exceeds a predetermined range, the detection device will alarm, and then the polishing machine 200 will stop working to wait for the relevant personnel to perform inspection and repair. Also, in a chemical mechanical polishing system, detection device false alarms may occasionally occur due to detection devices or human factors. In both normal and false alarms, once the detection device issues an alarm, the slurry supply device 100 and the polishing platen 200 in the cmp system are all stopped, and the wafer in process is stopped, stopped in the platen, and in the wet and slurry-attached environment, there is a risk of being discarded.
In one embodiment of the present invention, a novel chemical mechanical polishing system is provided, and in particular, referring to fig. 2, fig. 2 is a schematic diagram of a chemical mechanical polishing system according to one embodiment of the present invention, as shown in fig. 2, the chemical mechanical polishing system of the present invention comprises: a slurry supply device 100, a slurry circulation device 400 and a polishing platen 200, wherein the slurry circulation device 400 is located in a slurry circulation pipeline 300 connecting the slurry supply device 100 and the polishing platen 200, wherein when the chemical mechanical polishing system is working normally, the slurry supply device 100 supplies slurry to the polishing platen 200 through the slurry circulation pipeline 300 and the slurry circulation device 400 located in the slurry circulation pipeline 300 for chemical mechanical polishing; when the chemical mechanical polishing system issues a fault alarm, the slurry supply device 100 stops working, and the slurry circulation device 400 supplies slurry to the polishing platen 200 for chemical mechanical polishing.
According to the chemical mechanical polishing system provided by the invention, the grinding fluid circulating device is additionally arranged between the grinding fluid supply device and the grinding machine platform, and when the chemical mechanical polishing system works normally, the grinding fluid circulating device is used as a grinding fluid circulation pipeline and has no influence on the supply of normal grinding fluid; when the chemical mechanical polishing system gives an alarm and the grinding fluid supply device stops supplying the grinding fluid, the grinding fluid circulating device starts to operate independently, the grinding machine is switched to a normal working state from an alarm state, and the grinding machine stops operating after the wafers in the grinding machine are continuously processed, so that related personnel can wait for checking. Thus, even if the CMP system issues a malfunction alarm, the wafers in process can continue to be processed without any risk of being discarded. In the existing slurry supply method, the slurry supply device directly supplies slurry to the polishing machine, and there is no other link in the middle, when the chemical mechanical polishing system gives an alarm, the polishing machine will directly stop working, resulting in the wafer in the process staying in the polishing machine, and in the wet and slurry-attached environment, there is a risk of being scrapped. Therefore, the chemical mechanical polishing system can improve the yield and the production efficiency of the wafer and reduce the cost.
As shown in fig. 2, the slurry circulation device 400 is connected in series between the slurry supply device 100 and the polishing platen 200.
In an embodiment of the invention, the slurry circulation pipeline 300 includes a first section of the circulation pipeline 310 and a second section of the circulation pipeline 320, wherein one end of the first section of the circulation pipeline 310 is connected to the slurry supply device 100, the other end of the first section of the circulation pipeline 310 is connected to the slurry circulation device 400, one end of the second section of the circulation pipeline 320 is connected to the slurry circulation device 400, and the other end of the second section of the circulation pipeline 320 is connected to the polishing machine 200. When the chemical mechanical polishing system is working normally, the slurry supply device 100 provides the slurry, and the slurry is transmitted to the slurry circulation device 400 through the first section of circulation pipeline 310 and then transmitted to the polishing machine 200 through the second section of circulation pipeline 320; after the chemical mechanical polishing system issues a failure alarm, the slurry circulation device 400 is transmitted to the polishing machine 200 through the second section of the circulation pipeline 320.
In one embodiment of the present invention, the slurry circulation device 400 is integrally formed with the slurry circulation pipe 300.
In one embodiment of the present invention, the first section of the circulation pipeline 310 is connected to a check valve of the slurry circulation device 400, and the slurry circulation device 400 is normally connected to the second section of the circulation pipeline 320.
In one embodiment of the present invention, the volume of the slurry circulation device 400 is larger than the volume of the slurry circulation pipeline 300 with the same length, so that when the chemical mechanical polishing system is working normally, the slurry supply device 100 provides the slurry, the slurry is transmitted to the slurry circulation device 400 through the first section of the circulation pipeline 310, and the slurry is stored in the slurry circulation device 400; when the chemical mechanical polishing system issues a fault alarm, the slurry stored in the slurry circulation device 400 is transmitted to the polishing machine 200 through the second section of the circulation pipeline 320, so that the operation is stopped after the wafer in the polishing machine is processed. In one embodiment of the present invention, the slurry circulation device 400 has a capacity greater than 4L to complete the wafer operation in the machine. In one embodiment of the present invention, the shape and structure of the slurry circulation device 400 are not limited as long as it can serve as a slurry circulation line and store the slurry.
In an embodiment of the present invention, the chemical mechanical polishing system further comprises a fault detection device 600, wherein the fault detection device 600 is connected to the slurry supply device 100 and the slurry circulation pipeline 300, and is configured to detect whether the chemical mechanical polishing system is faulty, and send a fault alarm signal when the chemical mechanical polishing system is faulty (e.g., the concentration or flow of the slurry is abnormal or human factors).
In an embodiment of the present invention, the chemical mechanical polishing system further includes a control device 500, the control device 500 is connected to the slurry supply device 100, the slurry circulation device 400 and the polishing platform 200, when the chemical mechanical polishing system is operating normally, i.e. the detection device does not issue a fault alarm, the control device 500 controls the slurry supply device 100 to supply the slurry, and when the chemical mechanical polishing system fails and the fault detection device issues a fault alarm, the control device 500 controls the slurry supply device 100 to stop operating, and controls the slurry circulation device 400 to supply the slurry to the polishing platform 200. Specifically, after the slurry supply device 100 stops working, the check valve connecting the first section of the circulation pipeline 310 and the slurry circulation device 400 is effective and no longer communicates with the slurry supply device 100, and the control device 500 starts the special air pump controlling the slurry circulation device 400 to start working to control the slurry circulation device 400 to supply the slurry to the polishing machine, so that the wafer therein is finished with continuous operation.
In an embodiment of the present invention, the operation of the chemical mechanical polishing system specifically includes that when the detecting device does not detect a fault during the operation of the chemical mechanical polishing system, the control device 500 controls the slurry supply device 100 to supply the slurry to the polishing machine 200 through the slurry circulation line 300 and the slurry circulation device 400 located in the slurry circulation line 300 for chemical mechanical polishing, and stores the slurry in the slurry circulation device 400; in the operation of the chemical mechanical polishing system, when the detection device detects a fault and issues a fault alarm, the control device 500 controls the slurry supply device 100 to stop working, and controls the slurry circulation device 400 to supply the slurry to the polishing platen 200 for chemical mechanical polishing.
In an embodiment of the present invention, after the detecting device detects the failure and issues a failure alarm, the control device 500 immediately controls the slurry supply device 100 to stop working, and controls the slurry circulation device 400 to supply the slurry to the polishing machine 200.
In summary, by adding a slurry circulation device between the slurry supply device and the polishing platen, when the chemical mechanical polishing system is working normally, the slurry circulation device is used as a slurry circulation pipeline, which has no influence on the supply of the normal slurry; when the chemical mechanical polishing system gives an alarm and the grinding fluid supply device stops supplying the grinding fluid, the grinding fluid circulating device starts to operate independently, the grinding machine is switched to a normal working state from an alarm state, and the grinding machine stops operating after the wafers in the grinding machine are continuously processed, so that related personnel can wait for checking. Therefore, even if the chemical mechanical polishing system gives out a fault alarm, the wafers in the manufacturing process can be continuously processed without the risk of scrapping, so that the yield and the production efficiency of the wafers are improved, and the cost is reduced.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A chemical mechanical polishing system, comprising: the chemical mechanical polishing system comprises a grinding fluid supply device, a grinding fluid circulating device and a grinding machine table, wherein the grinding fluid circulating device is positioned in a grinding fluid circulation pipeline which is communicated with the grinding fluid supply device and the grinding machine table, when the chemical mechanical polishing system works normally, the grinding fluid supply device supplies grinding fluid, and the grinding fluid is supplied to the grinding machine table through the grinding fluid circulation pipeline and the grinding fluid circulating device so as to carry out chemical mechanical polishing; and when the chemical mechanical polishing system gives a fault alarm, the grinding fluid supply device stops working, and the grinding fluid circulating device supplies grinding fluid to the grinding machine table for chemical mechanical polishing.
2. The chemical mechanical polishing system of claim 1, wherein the slurry circulation device is connected in series between the slurry supply device and the polishing platen.
3. The chemical mechanical polishing system of claim 1, wherein the slurry circulation pipeline comprises a first section of circulation pipeline and a second section of circulation pipeline, wherein one end of the first section of circulation pipeline is connected to the slurry supply device, the other end of the first section of circulation pipeline is connected to the slurry circulation device, one end of the second section of circulation pipeline is connected to the slurry circulation device, and the other end of the second section of circulation pipeline is connected to the polishing machine, when the chemical mechanical polishing system is in normal operation, the slurry supply device provides slurry, and the slurry is transported to the slurry circulation device through the first section of circulation pipeline and then transported to the polishing machine through the second section of circulation pipeline; and after the chemical mechanical polishing system gives out a fault alarm, the grinding fluid circulating device is transmitted to the grinding machine table through the second section of circulation pipeline.
4. The chemical mechanical polishing system of claim 2 or 3, wherein the slurry circulation means is integrally formed with the slurry circulation line.
5. The chemical mechanical polishing system of claim 3, wherein the first section of flow line is connected to a one-way valve of the slurry circulation device, and the slurry circulation device is normally plumbed to the second section of flow line.
6. The chemical mechanical polishing system of claim 1, wherein the volume of the slurry circulation means is greater than the volume of the slurry circulation line of the same length.
7. The chemical mechanical polishing system of claim 6, wherein the slurry circulation device has a capacity of greater than 4L.
8. The chemical mechanical polishing system of claim 1, further comprising a fault detection device connected to the slurry supply and the slurry flow line for detecting whether the chemical mechanical polishing system is faulty, and for generating a fault alarm signal when the chemical mechanical polishing system is faulty.
9. The chemical mechanical polishing system of claim 8, further comprising a control device, wherein the control device is connected to the slurry supply device, the slurry circulation device and the polishing platen, when the chemical mechanical polishing system is operating normally, the failure detection device does not issue a failure alarm, the control device controls the slurry supply device to supply the slurry, when the chemical mechanical polishing system fails, the failure detection device issues a failure alarm, the control device controls the slurry supply device to stop operating, and the slurry circulation device is controlled to supply the slurry to the polishing platen.
10. The operation of the chemical mechanical polishing system of claim 9, wherein the control device controls the slurry supply device to supply the slurry to the polishing platen through the slurry circulation line and the slurry circulation device for chemical mechanical polishing, and stores the slurry in the slurry circulation device when the fault detection device does not detect a fault during the operation of the chemical mechanical polishing system; in the working process of the chemical mechanical polishing system, after the fault detection device detects a fault and gives out a fault alarm, the control device controls the grinding fluid supply device to stop working, and controls the grinding fluid circulating device to supply grinding fluid to the grinding machine table for chemical mechanical polishing.
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| CN201811581768.7A CN109623632B (en) | 2018-12-24 | 2018-12-24 | Chemical mechanical polishing system and working process thereof |
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| CN201811581768.7A CN109623632B (en) | 2018-12-24 | 2018-12-24 | Chemical mechanical polishing system and working process thereof |
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| CN109623632A CN109623632A (en) | 2019-04-16 |
| CN109623632B true CN109623632B (en) | 2020-02-07 |
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Citations (5)
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| CN101186024A (en) * | 2006-11-15 | 2008-05-28 | 中芯国际集成电路制造(上海)有限公司 | Chemical mechanical grinding system for preventing grinding fluid dilution and work bench thereof |
| CN101209541A (en) * | 2006-12-28 | 2008-07-02 | 中芯国际集成电路制造(上海)有限公司 | Fault alarming device and fault alarm method |
| CN102441839A (en) * | 2011-11-11 | 2012-05-09 | 上海华力微电子有限公司 | Method for improving CMP (chemical mechanical polishing) process stability of polishing materials on polishing pad |
| CN107671732A (en) * | 2016-08-02 | 2018-02-09 | 兆远科技股份有限公司 | Polishing solution supply system |
| KR20180127137A (en) * | 2017-05-18 | 2018-11-28 | 세메스 주식회사 | Substrate polishing apparatus and substrate polishing method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6345489B2 (en) * | 2014-06-02 | 2018-06-20 | 株式会社荏原製作所 | Method and apparatus for determining polishing performance of polishing liquid |
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2018
- 2018-12-24 CN CN201811581768.7A patent/CN109623632B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101186024A (en) * | 2006-11-15 | 2008-05-28 | 中芯国际集成电路制造(上海)有限公司 | Chemical mechanical grinding system for preventing grinding fluid dilution and work bench thereof |
| CN101209541A (en) * | 2006-12-28 | 2008-07-02 | 中芯国际集成电路制造(上海)有限公司 | Fault alarming device and fault alarm method |
| CN102441839A (en) * | 2011-11-11 | 2012-05-09 | 上海华力微电子有限公司 | Method for improving CMP (chemical mechanical polishing) process stability of polishing materials on polishing pad |
| CN107671732A (en) * | 2016-08-02 | 2018-02-09 | 兆远科技股份有限公司 | Polishing solution supply system |
| KR20180127137A (en) * | 2017-05-18 | 2018-11-28 | 세메스 주식회사 | Substrate polishing apparatus and substrate polishing method |
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| CN109623632A (en) | 2019-04-16 |
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