CN109590816A - A kind of ceramic mobile phone center polishing method - Google Patents
A kind of ceramic mobile phone center polishing method Download PDFInfo
- Publication number
- CN109590816A CN109590816A CN201811591826.4A CN201811591826A CN109590816A CN 109590816 A CN109590816 A CN 109590816A CN 201811591826 A CN201811591826 A CN 201811591826A CN 109590816 A CN109590816 A CN 109590816A
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- China
- Prior art keywords
- polishing
- detent block
- bucket
- capping
- mobile phone
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/02—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving rotary barrels
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention relates to a kind of ceramic mobile phone center polishing methods, comprising the following steps: polished center is put into polishing bucket by S1, the capping for opening polishing bucket；S2, polishing medium is poured into polishing bucket；S3, the capping for covering polishing bucket rotate polishing bucket；The excess polished in bucket is poured into sieve, after rinsing product with clear water, product is taken out by S4, the capping for being again turned on polishing bucket.The invention has the advantages that polished surface is uniform, effect is good, stablize, yield height, easy to operate, clamped one time, polishing in place, saves manpower；And cheap abrasive media is used, being made by dedicated device once can be more with clamping quantity, to solve the problems, such as that production efficiency is low, yield is low, at high cost, is suitble to volume production.
Description
Technical field
The present invention relates to a kind of ceramic mobile phone center polishing methods, with ceramic center product surface polishing field.
Background technique
As the functions such as fingerprint recognition, wireless charging, 5G are gradually popularized, electronic ceramics, structural ceramics, function ceramics just by
Step penetrates into smart phone and intelligence wearing appearance member field.Ceramic material combines the appearance difference of glass, no signal screen
Cover, the features such as hardness is high, while possessing the excellent heat radiation close to metal material, and its unique ceramic texture, it is wear-resistant,
The performances such as skin-friendly are highly suitable to be applied on wearable device and mobile phone backboard and center.Since ceramic mobile phone center is outer
Part is seen, surface effect requires very high.The MIX that millet is released on the market is popular using pottery backboard+ceramics center mobile phone,
There is supply falls short of demand scene.
Ceramic product polishing process and immature at present, especially for this shape of ceramic center more not no good method.
There are two ways to main at present: 1, using single side disk polissoir, upper disk uses major diameter hog hair brush disk, carpet disk etc.,
Lower wall is four minor diameter disks, and product is fixed in lower disk by special fixture, using Liquid diamond, diamond cream, silica solution etc.
Abrasive media；Random motion is done by the way that upper and lower disk is quickly opposite, so that phase mutual friction comes between hairbrush and Liquid diamond and product
Achieve the effect that polishing.Disadvantage: (1) process is various, complicated for operation: mobile phone center four edges, each clamping can only process one
Side, every procedure need clamping four times, at least need three process (carse, medium and small throwing).(2) low efficiency: because process is more, make
Industry is complicated, leads to that large labor intensity, manpower demand are big, whole efficiency is low.(3) yield is low: hairbrush is acted on by polishing medium
Big in the relative friction forces of product, moment calorific value is big, and product surface is easy to cause to have the point and pit of burn；Unbalance stress
It is even, it is easy to appear wedge angle position and throws phenomenon of collapsing；Stock removal polishing yield is lower, unstable.(4) tooling auxiliary material is more, at high cost:
Grinding and polishing medium is used as using expensive diamond cream, Liquid diamond etc.；Mobile phone center is divided into long short side, per pass buffer
Sequence at least needs the fixture of two kinds of different sizes；Every procedure needs different polishing hairbrush, woollen blanket or mill skin, so that cost
It is high.2, using multiaxis automatic polishing machine, relative trajectory route is designed by NC blanking and utilizes emery cloth, sand paper, Liquid diamond and silicon
Colloidal sol polishes product surface.Disadvantage: (1) most 5 flake products low efficiency: can only be processed every time.(2) process is more: needing
It is divided into carse, medium and small three polishing.(3) at high cost: equipment cost is high, needs profession programming and operator；Using brill
Gypsum, Liquid diamond etc. are used as grinding and polishing medium, at high cost.
Summary of the invention
To overcome the shortcomings of existing technologies, the present invention provides a kind of ceramic mobile phone center polishing method, technology of the invention
Scheme is:
A kind of ceramic mobile phone center polishing method, comprising the following steps:
Polished center is put into polishing bucket by S1, the capping for opening polishing bucket；
S2, polishing medium is poured into polishing bucket；
S3, the capping for covering polishing bucket rotate polishing bucket；
The excess polished in bucket is poured into sieve by S4, the capping for being again turned on polishing bucket, will after rinsing product with clear water
Product takes out.
The polishing bucket includes drum and the capping for being mounted on drum opening, is equipped in the inner wall of the drum
First rubber layer, the bottom in drum are equipped with lower detent block, be vertically installed on the lower detent block two it is mutually flat
The positioning column of row setting, forms spacing between two positioning columns, is successively set with along the vertical direction on the positioning column described in two
There is detent block in several piece；The capping includes upper detent block, cover board, spring and the second rubber layer, the upper detent block button
Close the opening in drum, the second rubber layer be installed on inner face of detent block on this, the upper detent block with positioned at upper
It is bolted between cover board on the outside of detent block together, third rubber is installed between the cover board and upper detent block
Layer；Spring is installed, the positioning column passes through the spring between the upper detent block and uppermost middle detent block；Institute
The upper surface for the lower detent block stated is equipped with the 4th rubber layer.
Polishing medium in the step S2 is matched according to the polishing powder, high frequency porcelain, water of mass ratio 1:20~50:10~30
Than forming；Wherein, the silicon carbide micro-powder particle that polishing powder is 20~80 μm of partial size；High frequency porcelain be 1~2mm of diameter and a height of 5~
The cylindric aluminium oxide and diameter of 10mm is 4.0~6.0mm and the cylindric aluminium oxide of a height of 10~20mm is according to mass ratio 1:1
It mixes, the volume ratio of the polishing cavity of the high frequency porcelain and polishing bucket is 1:2~4.
In 30~60rpm, the time was controlled at 12~24 hours for revolving speed control, after having set parameter, starting device processing.
Revolving speed in the step S3 is 30~60rpm, and the time is 12~24 hours.
The invention has the advantages that polished surface is uniform, effect is good, stablize, yield height, easy to operate, clamped one time, polishing
In place, manpower is saved；And cheap abrasive media is used, being made by dedicated device once can be more with clamping quantity, to solve
The certainly problem that production efficiency is low, yield is low, at high cost is suitble to volume production.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of polishing bucket of the invention.
Fig. 2 is enlarged drawing at the A of Fig. 1.
Specific embodiment
The invention will now be further described with reference to specific embodiments, the advantages and features of the present invention will be with description and
It is apparent.But examples are merely exemplary for these, and it is not intended to limit the scope of the present invention in any way.Those skilled in the art
Member it should be understood that without departing from the spirit and scope of the invention can details to technical solution of the present invention and form into
Row modifications or substitutions, but these modifications and replacement are fallen within the protection scope of the present invention.
Referring to Fig. 1 and Fig. 2, the present invention relates to a kind of ceramic mobile phone center polishing methods, comprising the following steps:
Polished center is put into polishing bucket by S1, the capping for opening polishing bucket；
S2, polishing medium is poured into polishing bucket；
S3, the capping for covering polishing bucket rotate polishing bucket；
The excess polished in bucket is poured into sieve by S4, the capping for being again turned on polishing bucket, will after rinsing product with clear water
Product takes out.
The polishing bucket includes drum 3 and the capping for being mounted on 3 opening of drum, is pacified in the inner wall of the drum 3
Equipped with the first rubber layer 11, the bottom in drum 3 is equipped with lower detent block 1, is vertically installed with two on the lower detent block 1
Root positioning column 2 arranged in parallel forms spacing between two positioning columns 2, along vertical side on the positioning column 2 described in two
To being successively set with detent block 5 in several piece；The capping includes upper detent block 9, cover board 15, spring 8 and the second rubber layer 12,
The upper detent block 9 is fastened on the opening of drum 3, is equipped with the second rubber layer 13 on inner face of detent block 9 on this,
The upper detent block 9 and be bolted together between the cover board 15 in 9 outside of upper detent block, the cover board 15 with it is upper
Third rubber layer 12 is installed between detent block 9；Spring 8 is installed between the upper detent block and uppermost middle detent block,
The positioning column 2 passes through the spring 8；The upper surface of the lower detent block 1 is equipped with the 4th rubber layer 4.6 sets of product
On middle detent block.
Polishing medium in the step S2 is matched according to the polishing powder, high frequency porcelain, water of mass ratio 1:20~50:10~30
Than forming；Wherein, the silicon carbide micro-powder particle that polishing powder is 20~80 μm of partial size；High frequency porcelain be 1~2mm of diameter and a height of 5~
The cylindric aluminium oxide and diameter of 10mm is 4.0~6.0mm and the cylindric aluminium oxide of a height of 10~20mm is according to mass ratio 1:1
It mixes, the volume ratio of the polishing cavity of the high frequency porcelain and polishing bucket is 1:2~4.
In 30~60rpm, the time was controlled at 12~24 hours for revolving speed control, after having set parameter, starting device processing.
Revolving speed in the step S3 is 30~60rpm, and the time is 12~24 hours.
Embodiment 1:
By 100 a height of 137*62*6mm of length and width, wall thickness is that the ceramic mobile phone center of 1.2mm assembles；Polishing is prepared again
Medium, it is 0.3kg that wherein polishing powder, which is the SiC mass that average grain diameter is 20 μm,；High frequency porcelain is the circle of diameter 1mm, high 5mm
Column aluminium oxide and the cylindric aluminium oxide 1:1 in mass ratio of diameter 4mm, high 10mm are mixed, quality 6kg；Water quality is
3kg.Drum rotation speed is 30rpm, and process time is 24 hours.It is according to the product first-time qualification rate that the present embodiment technique obtains
99%, surface roughness 2.7nm.
Embodiment 2:
By 100 a height of 137*62*6mm of length and width, wall thickness is that the ceramic mobile phone center of 1.2mm is installed as noted earlier；
It is 0.2kg that wherein polishing powder, which is the SiC weight that average grain diameter is 50 μm,；High frequency porcelain be diameter 1mm, high 5mm it is cylindric
The cylindric aluminium oxide 1:1 in mass ratio of aluminium oxide and diameter 6mm, high 20mm are mixed, quality 10kg；Water quality is 6kg.
Drum rotation speed is 45rpm, and process time is 18 hours.It is 98% according to the product first-time qualification rate that the present embodiment technique obtains,
Surface roughness is 3.3nm.
Embodiment 3:
By 100 a height of 137*62*6mm of length and width, wall thickness is that the ceramic mobile phone center of 1.2mm is installed as noted earlier；
It is 0.15kg that wherein polishing powder, which is the SiC weight that average grain diameter is 80 μm,；High frequency porcelain is the cylinder of diameter 2mm, high 10mm
The cylindric aluminium oxide 1:1 in mass ratio of shape aluminium oxide and diameter 5mm, high 20mm are mixed, quality 6kg；Water quality is
3kg.Drum rotation speed is 60rpm, and process time is 12 hours.It is according to the product first-time qualification rate that the present embodiment technique obtains
97%, surface roughness 3.9nm.
Claims (4)
1. a kind of ceramic mobile phone center polishing method, which comprises the following steps:
Polished center is put into polishing bucket by S1, the capping for opening polishing bucket；
S2, polishing medium is poured into polishing bucket；
S3, the capping for covering polishing bucket rotate polishing bucket；
The excess polished in bucket is poured into sieve, after rinsing product with clear water, by product by S4, the capping for being again turned on polishing bucket
It takes out.
2. a kind of ceramic mobile phone center polishing method according to claim 1, which is characterized in that the polishing bucket includes
Drum and the capping for being mounted on drum opening are equipped with the first rubber layer in the inner wall of the drum, the bottom in drum
Lower detent block is installed, two positioning columns arranged in parallel, two positioning are vertically installed on the lower detent block
Spacing is formed between column, is successively set with detent block in several piece along the vertical direction on the positioning column described in two；The envelope
Lid includes upper detent block, cover board, spring and the second rubber layer, and the upper detent block is fastened on the opening of drum, on this
Second rubber layer is installed on the inner face of detent block, is passed through between the upper detent block and cover board on the outside of upper detent block
It is bolted together, third rubber layer is installed between the cover board and upper detent block；The upper detent block with it is uppermost
Spring is installed, the positioning column passes through the spring between middle detent block；It installs the upper surface of the lower detent block
There is the 4th rubber layer.
3. a kind of ceramic mobile phone center polishing method according to claim 1 or 2, which is characterized in that the step S2
In polishing medium matched according to the polishing powder, high frequency porcelain, water of mass ratio 1:20~50:10~30；Wherein, polishing powder is
20~80 μm of partial size of silicon carbide micro-powder particle；High frequency porcelain be 1~2mm of diameter and the cylindric aluminium oxide of a height of 5~10mm with
Diameter is 4.0~6.0mm and the cylindric aluminium oxide of a height of 10~20mm is mixed according to mass ratio 1:1, the high frequency
The volume ratio of the polishing cavity of porcelain and polishing bucket is 1:2~4.
In 30~60rpm, the time was controlled at 12~24 hours for revolving speed control, after having set parameter, starting device processing.
4. a kind of ceramic mobile phone center polishing method according to claim 1 or 2, which is characterized in that the step S3
In revolving speed be 30~60rpm, the time be 12~24 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811591826.4A CN109590816A (en) | 2018-12-25 | 2018-12-25 | A kind of ceramic mobile phone center polishing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811591826.4A CN109590816A (en) | 2018-12-25 | 2018-12-25 | A kind of ceramic mobile phone center polishing method |
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| Publication Number | Publication Date |
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| CN109590816A true CN109590816A (en) | 2019-04-09 |
Family
ID=65964421
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| CN201811591826.4A Pending CN109590816A (en) | 2018-12-25 | 2018-12-25 | A kind of ceramic mobile phone center polishing method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109938361A (en) * | 2019-04-30 | 2019-06-28 | 广西壮族自治区农业科学院 | The one shell polishing treatment system cultivated peanut |
| CN112008504A (en) * | 2020-08-19 | 2020-12-01 | 广东长盈精密技术有限公司 | Coarse polishing method |
| CN112091802A (en) * | 2020-08-19 | 2020-12-18 | 广东长盈精密技术有限公司 | Fine polishing method |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0816016A1 (en) * | 1996-06-25 | 1998-01-07 | Moriya Iron Works, Co., Ltd. | Surface smoothing system |
| CN203843652U (en) * | 2013-12-31 | 2014-09-24 | 宁波捷胜海洋开发有限公司 | Burnishing barrel |
| CN104708525A (en) * | 2015-03-26 | 2015-06-17 | 蓝思科技股份有限公司 | Polishing method for tiny ceramic product |
| CN204639889U (en) * | 2015-05-19 | 2015-09-16 | 东莞市升耀机械设备有限公司 | Freezing trimmer |
| WO2016133211A1 (en) * | 2015-02-20 | 2016-08-25 | Ntn株式会社 | Silicon nitride roller, method for manufacturing silicon nitride roller, and method for inspecting silicon nitride roller |
| US9504166B2 (en) * | 2010-01-29 | 2016-11-22 | Asahi Glass Company, Limited | Process for producing substrate for mounting element |
| CN206937058U (en) * | 2017-05-26 | 2018-01-30 | 韶关比亚迪电子有限公司 | A kind of burnishing device of mobile phone center |
| CN108188916A (en) * | 2017-11-29 | 2018-06-22 | 东莞华晶粉末冶金有限公司 | Polishing grinding equipment and abrasive polishing method |
| CN108972310A (en) * | 2017-06-01 | 2018-12-11 | 蓝思科技（长沙）有限公司 | Polishing method, the small key of ceramics and the small key product of ceramics of the small key of ceramics |
-
2018
- 2018-12-25 CN CN201811591826.4A patent/CN109590816A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0816016A1 (en) * | 1996-06-25 | 1998-01-07 | Moriya Iron Works, Co., Ltd. | Surface smoothing system |
| US9504166B2 (en) * | 2010-01-29 | 2016-11-22 | Asahi Glass Company, Limited | Process for producing substrate for mounting element |
| CN203843652U (en) * | 2013-12-31 | 2014-09-24 | 宁波捷胜海洋开发有限公司 | Burnishing barrel |
| WO2016133211A1 (en) * | 2015-02-20 | 2016-08-25 | Ntn株式会社 | Silicon nitride roller, method for manufacturing silicon nitride roller, and method for inspecting silicon nitride roller |
| CN104708525A (en) * | 2015-03-26 | 2015-06-17 | 蓝思科技股份有限公司 | Polishing method for tiny ceramic product |
| CN204639889U (en) * | 2015-05-19 | 2015-09-16 | 东莞市升耀机械设备有限公司 | Freezing trimmer |
| CN206937058U (en) * | 2017-05-26 | 2018-01-30 | 韶关比亚迪电子有限公司 | A kind of burnishing device of mobile phone center |
| CN108972310A (en) * | 2017-06-01 | 2018-12-11 | 蓝思科技（长沙）有限公司 | Polishing method, the small key of ceramics and the small key product of ceramics of the small key of ceramics |
| CN108188916A (en) * | 2017-11-29 | 2018-06-22 | 东莞华晶粉末冶金有限公司 | Polishing grinding equipment and abrasive polishing method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109938361A (en) * | 2019-04-30 | 2019-06-28 | 广西壮族自治区农业科学院 | The one shell polishing treatment system cultivated peanut |
| CN112008504A (en) * | 2020-08-19 | 2020-12-01 | 广东长盈精密技术有限公司 | Coarse polishing method |
| CN112091802A (en) * | 2020-08-19 | 2020-12-18 | 广东长盈精密技术有限公司 | Fine polishing method |
| CN112008504B (en) * | 2020-08-19 | 2022-02-08 | 广东长盈精密技术有限公司 | Coarse polishing method |
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Application publication date: 20190409 |
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