CN109565945A - 导热部件和移动终端 - Google Patents

导热部件和移动终端 Download PDF

Info

Publication number
CN109565945A
CN109565945A CN201780047731.3A CN201780047731A CN109565945A CN 109565945 A CN109565945 A CN 109565945A CN 201780047731 A CN201780047731 A CN 201780047731A CN 109565945 A CN109565945 A CN 109565945A
Authority
CN
China
Prior art keywords
heat
conducting
radiating part
source device
mobile terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201780047731.3A
Other languages
English (en)
Other versions
CN109565945B (zh
Inventor
姜华文
靳林芳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of CN109565945A publication Critical patent/CN109565945A/zh
Application granted granted Critical
Publication of CN109565945B publication Critical patent/CN109565945B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/203Cooling means for portable computers, e.g. for laptops
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating

Abstract

一种导热部件和移动终端,导热部件应用于移动终端,用于为移动终端的热源器件导热,导热部件包括:支撑部(1)和散热部(2),支撑部(1)的内部设置有空腔,散热部(2)设置在空腔中,且散热部(2)具有网状毛细孔;热源器件位于散热部(2)的一端,低温区域位于散热部(2)的另一端,低温区域的温度低于热源器件所在区域的温度;散热部(2)的网状毛细孔中设置有导热工质,导热工质用于当热源器件工作时,将热源器件产生的热量从散热部(2)的一端传导至散热部(2)的另一端。通过该导热部件为移动终端的热源器件导热,从而实现降低热源器件的温度。

Description

PCT国内申请,说明书已公开。

Claims (10)

  1. PCT国内申请,权利要求书已公开。
CN201780047731.3A 2017-03-02 2017-07-31 导热部件和移动终端 Active CN109565945B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201710121682 2017-03-02
CN2017101216825 2017-03-02
PCT/CN2017/095153 WO2018157545A1 (zh) 2017-03-02 2017-07-31 导热部件和移动终端

Publications (2)

Publication Number Publication Date
CN109565945A true CN109565945A (zh) 2019-04-02
CN109565945B CN109565945B (zh) 2020-07-28

Family

ID=63371203

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780047731.3A Active CN109565945B (zh) 2017-03-02 2017-07-31 导热部件和移动终端

Country Status (4)

Country Link
US (1) US10831249B2 (zh)
EP (1) EP3579673B1 (zh)
CN (1) CN109565945B (zh)
WO (1) WO2018157545A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111770222A (zh) * 2020-07-10 2020-10-13 北京字节跳动网络技术有限公司 终端中板、中框和终端

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2494036Y (zh) * 2001-07-27 2002-05-29 王文瑞 散热器的组合装置
CN104902727A (zh) * 2015-05-26 2015-09-09 华为技术有限公司 一种移动终端的中框及移动终端
CN204669802U (zh) * 2015-06-12 2015-09-23 联想(北京)有限公司 电子设备
CN106052444A (zh) * 2016-07-13 2016-10-26 梁才航 一种平板热管阵列式散热器
US20170055372A1 (en) * 2015-08-19 2017-02-23 Fujikura Ltd. Heat spreading module for portable electronic device

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5485671A (en) * 1993-09-10 1996-01-23 Aavid Laboratories, Inc. Method of making a two-phase thermal bag component cooler
US5472043A (en) * 1994-03-22 1995-12-05 Aavid Laboratories, Inc. Two-phase component cooler with radioactive initiator
DE19805930A1 (de) * 1997-02-13 1998-08-20 Furukawa Electric Co Ltd Kühlvorrichtung
US6745825B1 (en) * 1997-03-13 2004-06-08 Fujitsu Limited Plate type heat pipe
US6069791A (en) * 1997-08-14 2000-05-30 Fujikura Ltd. Cooling device for notebook personal computer
TW407455B (en) * 1997-12-09 2000-10-01 Diamond Electric Mfg Heat pipe and its processing method
DE69802659T2 (de) * 1998-01-27 2002-08-22 Lucent Technologies Inc Elektronisches Gerät
US6410982B1 (en) * 1999-11-12 2002-06-25 Intel Corporation Heatpipesink having integrated heat pipe and heat sink
US6418017B1 (en) * 2000-03-30 2002-07-09 Hewlett-Packard Company Heat dissipating chassis member
US6639799B2 (en) * 2000-12-22 2003-10-28 Intel Corporation Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
JP2004037039A (ja) * 2002-07-05 2004-02-05 Sony Corp 冷却装置、電子機器装置、表示装置及び冷却装置の製造方法
US6880626B2 (en) * 2002-08-28 2005-04-19 Thermal Corp. Vapor chamber with sintered grooved wick
US7007741B2 (en) * 2002-10-18 2006-03-07 Sun Microsystems, Inc. Conformal heat spreader
CN2681341Y (zh) * 2003-12-03 2005-02-23 鸿富锦精密工业(深圳)有限公司 热管散热装置
US7705342B2 (en) * 2005-09-16 2010-04-27 University Of Cincinnati Porous semiconductor-based evaporator having porous and non-porous regions, the porous regions having through-holes
TWI285252B (en) * 2006-02-14 2007-08-11 Yeh Chiang Technology Corp Loop type heat conduction device
US20080068802A1 (en) * 2006-09-19 2008-03-20 Inventec Corporation Heatsink device with vapor chamber
TWI318679B (en) * 2007-05-16 2009-12-21 Ind Tech Res Inst Heat dissipation system with an plate evaporator
CN101472450A (zh) * 2007-12-29 2009-07-01 私立淡江大学 可增强支撑强度与毛细作用的均热装置
JP4399013B2 (ja) * 2008-02-28 2010-01-13 株式会社東芝 電子機器、およびヒートパイプ
JP4352091B2 (ja) * 2008-03-27 2009-10-28 株式会社東芝 電子機器、冷却装置
EP2431701B1 (en) * 2009-06-17 2017-04-26 Huawei Technologies Co., Ltd. Heat dissipation device and radio frequency module with same
CN102130080B (zh) * 2010-11-11 2012-12-12 华为技术有限公司 一种散热装置
US9101979B2 (en) 2011-10-31 2015-08-11 California Institute Of Technology Methods for fabricating gradient alloy articles with multi-functional properties
CN103249276A (zh) * 2012-02-07 2013-08-14 联想(北京)有限公司 散热装置、散热组件和电子设备
WO2015139213A1 (zh) * 2014-03-18 2015-09-24 华为终端有限公司 一种散热组件及电子设备
CN108055815B (zh) * 2014-03-21 2020-04-21 华为终端有限公司 移动终端
US9568255B2 (en) * 2014-04-21 2017-02-14 Htc Corporation Electronic device
US9535470B2 (en) * 2014-07-02 2017-01-03 Asia Vital Components Co., Ltd. Electronic substrate with heat dissipation structure
GB2532704B (en) 2014-08-13 2023-06-21 Gregory Smith Anthony Ceramic sandwich panel created by additive layer manufacturing, for use in high temperatures
US9625215B2 (en) * 2014-09-21 2017-04-18 Htc Corporation Electronic device and heat dissipation plate
WO2016171715A1 (en) 2015-04-24 2016-10-27 Halliburton Energy Services, Inc. Methods of fabricating ceramic or intermetallic parts
US9835382B2 (en) * 2015-09-16 2017-12-05 Acer Incorporated Thermal dissipation module
CN105658032B (zh) * 2016-01-22 2019-06-04 白鹏飞 一种超薄均热板及其制作方法
CN107131784B (zh) * 2017-04-19 2019-07-12 北京空间飞行器总体设计部 基于平板环路热管的均热板
CN109219307B (zh) * 2017-06-30 2021-08-17 深圳富泰宏精密工业有限公司 散热结构及具有该散热结构的电子装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2494036Y (zh) * 2001-07-27 2002-05-29 王文瑞 散热器的组合装置
CN104902727A (zh) * 2015-05-26 2015-09-09 华为技术有限公司 一种移动终端的中框及移动终端
CN204669802U (zh) * 2015-06-12 2015-09-23 联想(北京)有限公司 电子设备
US20170055372A1 (en) * 2015-08-19 2017-02-23 Fujikura Ltd. Heat spreading module for portable electronic device
CN106052444A (zh) * 2016-07-13 2016-10-26 梁才航 一种平板热管阵列式散热器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111770222A (zh) * 2020-07-10 2020-10-13 北京字节跳动网络技术有限公司 终端中板、中框和终端

Also Published As

Publication number Publication date
EP3579673B1 (en) 2022-01-26
US20190391623A1 (en) 2019-12-26
EP3579673A4 (en) 2020-01-22
WO2018157545A1 (zh) 2018-09-07
CN109565945B (zh) 2020-07-28
US10831249B2 (en) 2020-11-10
EP3579673A1 (en) 2019-12-11

Similar Documents

Publication Publication Date Title
CN110234216B (zh) 壳体组件、其制备方法以及电子设备
CN105472940A (zh) 终端散热装置及移动终端
WO2020259323A1 (zh) 壳体组件、其制备方法以及电子设备
US20160341486A1 (en) Mobile terminal
CN105338783B (zh) 一种电子设备以及用于电子设备的散热装置
CN208370081U (zh) 一种散热构件及智能终端
CN105472941A (zh) 手机及其制造方法
CN203912443U (zh) 手持装置散热结构
CN102711416B (zh) 散热处理装置及移动终端
US9414530B1 (en) Altering thermal conductivity in devices
CN110267499A (zh) 壳体组件及其制备方法以及电子设备
CN110012643B (zh) 散热组件、其制备方法以及电子设备
CN105188302A (zh) 手持电子装置散热结构
CN110191625B (zh) 散热组件、其制备方法以及电子设备
CN109565945A (zh) 导热部件和移动终端
CN106852082A (zh) 一种散热装置及电子设备
WO2021073492A1 (zh) 具有支撑结构的真空均热板及终端
CN201600071U (zh) 均温散热器的金属网散热结构
US20210259131A1 (en) Electronic device
CN207720598U (zh) 电子设备
CN213044012U (zh) 均温板及电子设备
CN104619147B (zh) 一种电子设备
CN105828569A (zh) 一种散热装置和电子设备
CN106455422B (zh) 手持装置散热结构
CN105188303A (zh) 手持装置散热结构

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant