CN109565945A - 导热部件和移动终端 - Google Patents
导热部件和移动终端 Download PDFInfo
- Publication number
- CN109565945A CN109565945A CN201780047731.3A CN201780047731A CN109565945A CN 109565945 A CN109565945 A CN 109565945A CN 201780047731 A CN201780047731 A CN 201780047731A CN 109565945 A CN109565945 A CN 109565945A
- Authority
- CN
- China
- Prior art keywords
- heat
- conducting
- radiating part
- source device
- mobile terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Abstract
一种导热部件和移动终端,导热部件应用于移动终端,用于为移动终端的热源器件导热,导热部件包括:支撑部(1)和散热部(2),支撑部(1)的内部设置有空腔,散热部(2)设置在空腔中,且散热部(2)具有网状毛细孔;热源器件位于散热部(2)的一端,低温区域位于散热部(2)的另一端,低温区域的温度低于热源器件所在区域的温度;散热部(2)的网状毛细孔中设置有导热工质,导热工质用于当热源器件工作时,将热源器件产生的热量从散热部(2)的一端传导至散热部(2)的另一端。通过该导热部件为移动终端的热源器件导热,从而实现降低热源器件的温度。
Description
PCT国内申请,说明书已公开。
Claims (10)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710121682 | 2017-03-02 | ||
CN2017101216825 | 2017-03-02 | ||
PCT/CN2017/095153 WO2018157545A1 (zh) | 2017-03-02 | 2017-07-31 | 导热部件和移动终端 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109565945A true CN109565945A (zh) | 2019-04-02 |
CN109565945B CN109565945B (zh) | 2020-07-28 |
Family
ID=63371203
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201780047731.3A Active CN109565945B (zh) | 2017-03-02 | 2017-07-31 | 导热部件和移动终端 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10831249B2 (zh) |
EP (1) | EP3579673B1 (zh) |
CN (1) | CN109565945B (zh) |
WO (1) | WO2018157545A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111770222A (zh) * | 2020-07-10 | 2020-10-13 | 北京字节跳动网络技术有限公司 | 终端中板、中框和终端 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2494036Y (zh) * | 2001-07-27 | 2002-05-29 | 王文瑞 | 散热器的组合装置 |
CN104902727A (zh) * | 2015-05-26 | 2015-09-09 | 华为技术有限公司 | 一种移动终端的中框及移动终端 |
CN204669802U (zh) * | 2015-06-12 | 2015-09-23 | 联想(北京)有限公司 | 电子设备 |
CN106052444A (zh) * | 2016-07-13 | 2016-10-26 | 梁才航 | 一种平板热管阵列式散热器 |
US20170055372A1 (en) * | 2015-08-19 | 2017-02-23 | Fujikura Ltd. | Heat spreading module for portable electronic device |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5485671A (en) * | 1993-09-10 | 1996-01-23 | Aavid Laboratories, Inc. | Method of making a two-phase thermal bag component cooler |
US5472043A (en) * | 1994-03-22 | 1995-12-05 | Aavid Laboratories, Inc. | Two-phase component cooler with radioactive initiator |
DE19805930A1 (de) * | 1997-02-13 | 1998-08-20 | Furukawa Electric Co Ltd | Kühlvorrichtung |
US6745825B1 (en) * | 1997-03-13 | 2004-06-08 | Fujitsu Limited | Plate type heat pipe |
US6069791A (en) * | 1997-08-14 | 2000-05-30 | Fujikura Ltd. | Cooling device for notebook personal computer |
TW407455B (en) * | 1997-12-09 | 2000-10-01 | Diamond Electric Mfg | Heat pipe and its processing method |
DE69802659T2 (de) * | 1998-01-27 | 2002-08-22 | Lucent Technologies Inc | Elektronisches Gerät |
US6410982B1 (en) * | 1999-11-12 | 2002-06-25 | Intel Corporation | Heatpipesink having integrated heat pipe and heat sink |
US6418017B1 (en) * | 2000-03-30 | 2002-07-09 | Hewlett-Packard Company | Heat dissipating chassis member |
US6639799B2 (en) * | 2000-12-22 | 2003-10-28 | Intel Corporation | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment |
JP2004037039A (ja) * | 2002-07-05 | 2004-02-05 | Sony Corp | 冷却装置、電子機器装置、表示装置及び冷却装置の製造方法 |
US6880626B2 (en) * | 2002-08-28 | 2005-04-19 | Thermal Corp. | Vapor chamber with sintered grooved wick |
US7007741B2 (en) * | 2002-10-18 | 2006-03-07 | Sun Microsystems, Inc. | Conformal heat spreader |
CN2681341Y (zh) * | 2003-12-03 | 2005-02-23 | 鸿富锦精密工业(深圳)有限公司 | 热管散热装置 |
US7705342B2 (en) * | 2005-09-16 | 2010-04-27 | University Of Cincinnati | Porous semiconductor-based evaporator having porous and non-porous regions, the porous regions having through-holes |
TWI285252B (en) * | 2006-02-14 | 2007-08-11 | Yeh Chiang Technology Corp | Loop type heat conduction device |
US20080068802A1 (en) * | 2006-09-19 | 2008-03-20 | Inventec Corporation | Heatsink device with vapor chamber |
TWI318679B (en) * | 2007-05-16 | 2009-12-21 | Ind Tech Res Inst | Heat dissipation system with an plate evaporator |
CN101472450A (zh) * | 2007-12-29 | 2009-07-01 | 私立淡江大学 | 可增强支撑强度与毛细作用的均热装置 |
JP4399013B2 (ja) * | 2008-02-28 | 2010-01-13 | 株式会社東芝 | 電子機器、およびヒートパイプ |
JP4352091B2 (ja) * | 2008-03-27 | 2009-10-28 | 株式会社東芝 | 電子機器、冷却装置 |
EP2431701B1 (en) * | 2009-06-17 | 2017-04-26 | Huawei Technologies Co., Ltd. | Heat dissipation device and radio frequency module with same |
CN102130080B (zh) * | 2010-11-11 | 2012-12-12 | 华为技术有限公司 | 一种散热装置 |
US9101979B2 (en) | 2011-10-31 | 2015-08-11 | California Institute Of Technology | Methods for fabricating gradient alloy articles with multi-functional properties |
CN103249276A (zh) * | 2012-02-07 | 2013-08-14 | 联想(北京)有限公司 | 散热装置、散热组件和电子设备 |
WO2015139213A1 (zh) * | 2014-03-18 | 2015-09-24 | 华为终端有限公司 | 一种散热组件及电子设备 |
CN108055815B (zh) * | 2014-03-21 | 2020-04-21 | 华为终端有限公司 | 移动终端 |
US9568255B2 (en) * | 2014-04-21 | 2017-02-14 | Htc Corporation | Electronic device |
US9535470B2 (en) * | 2014-07-02 | 2017-01-03 | Asia Vital Components Co., Ltd. | Electronic substrate with heat dissipation structure |
GB2532704B (en) | 2014-08-13 | 2023-06-21 | Gregory Smith Anthony | Ceramic sandwich panel created by additive layer manufacturing, for use in high temperatures |
US9625215B2 (en) * | 2014-09-21 | 2017-04-18 | Htc Corporation | Electronic device and heat dissipation plate |
WO2016171715A1 (en) | 2015-04-24 | 2016-10-27 | Halliburton Energy Services, Inc. | Methods of fabricating ceramic or intermetallic parts |
US9835382B2 (en) * | 2015-09-16 | 2017-12-05 | Acer Incorporated | Thermal dissipation module |
CN105658032B (zh) * | 2016-01-22 | 2019-06-04 | 白鹏飞 | 一种超薄均热板及其制作方法 |
CN107131784B (zh) * | 2017-04-19 | 2019-07-12 | 北京空间飞行器总体设计部 | 基于平板环路热管的均热板 |
CN109219307B (zh) * | 2017-06-30 | 2021-08-17 | 深圳富泰宏精密工业有限公司 | 散热结构及具有该散热结构的电子装置 |
-
2017
- 2017-07-31 US US16/490,822 patent/US10831249B2/en active Active
- 2017-07-31 CN CN201780047731.3A patent/CN109565945B/zh active Active
- 2017-07-31 EP EP17898733.5A patent/EP3579673B1/en active Active
- 2017-07-31 WO PCT/CN2017/095153 patent/WO2018157545A1/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2494036Y (zh) * | 2001-07-27 | 2002-05-29 | 王文瑞 | 散热器的组合装置 |
CN104902727A (zh) * | 2015-05-26 | 2015-09-09 | 华为技术有限公司 | 一种移动终端的中框及移动终端 |
CN204669802U (zh) * | 2015-06-12 | 2015-09-23 | 联想(北京)有限公司 | 电子设备 |
US20170055372A1 (en) * | 2015-08-19 | 2017-02-23 | Fujikura Ltd. | Heat spreading module for portable electronic device |
CN106052444A (zh) * | 2016-07-13 | 2016-10-26 | 梁才航 | 一种平板热管阵列式散热器 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111770222A (zh) * | 2020-07-10 | 2020-10-13 | 北京字节跳动网络技术有限公司 | 终端中板、中框和终端 |
Also Published As
Publication number | Publication date |
---|---|
EP3579673B1 (en) | 2022-01-26 |
US20190391623A1 (en) | 2019-12-26 |
EP3579673A4 (en) | 2020-01-22 |
WO2018157545A1 (zh) | 2018-09-07 |
CN109565945B (zh) | 2020-07-28 |
US10831249B2 (en) | 2020-11-10 |
EP3579673A1 (en) | 2019-12-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN110234216B (zh) | 壳体组件、其制备方法以及电子设备 | |
CN105472940A (zh) | 终端散热装置及移动终端 | |
WO2020259323A1 (zh) | 壳体组件、其制备方法以及电子设备 | |
US20160341486A1 (en) | Mobile terminal | |
CN105338783B (zh) | 一种电子设备以及用于电子设备的散热装置 | |
CN208370081U (zh) | 一种散热构件及智能终端 | |
CN105472941A (zh) | 手机及其制造方法 | |
CN203912443U (zh) | 手持装置散热结构 | |
CN102711416B (zh) | 散热处理装置及移动终端 | |
US9414530B1 (en) | Altering thermal conductivity in devices | |
CN110267499A (zh) | 壳体组件及其制备方法以及电子设备 | |
CN110012643B (zh) | 散热组件、其制备方法以及电子设备 | |
CN105188302A (zh) | 手持电子装置散热结构 | |
CN110191625B (zh) | 散热组件、其制备方法以及电子设备 | |
CN109565945A (zh) | 导热部件和移动终端 | |
CN106852082A (zh) | 一种散热装置及电子设备 | |
WO2021073492A1 (zh) | 具有支撑结构的真空均热板及终端 | |
CN201600071U (zh) | 均温散热器的金属网散热结构 | |
US20210259131A1 (en) | Electronic device | |
CN207720598U (zh) | 电子设备 | |
CN213044012U (zh) | 均温板及电子设备 | |
CN104619147B (zh) | 一种电子设备 | |
CN105828569A (zh) | 一种散热装置和电子设备 | |
CN106455422B (zh) | 手持装置散热结构 | |
CN105188303A (zh) | 手持装置散热结构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |