CN109554663B - 蒸镀掩模、带框架的蒸镀掩模、及它们的制造方法 - Google Patents
蒸镀掩模、带框架的蒸镀掩模、及它们的制造方法 Download PDFInfo
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- CN109554663B CN109554663B CN201811201328.4A CN201811201328A CN109554663B CN 109554663 B CN109554663 B CN 109554663B CN 201811201328 A CN201811201328 A CN 201811201328A CN 109554663 B CN109554663 B CN 109554663B
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- vapor deposition
- mask
- deposition mask
- metal
- resin
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- 238000007740 vapor deposition Methods 0.000 title claims abstract description 279
- 238000000034 method Methods 0.000 title claims abstract description 78
- 229910052751 metal Inorganic materials 0.000 claims abstract description 266
- 239000002184 metal Substances 0.000 claims abstract description 266
- 229920005989 resin Polymers 0.000 claims abstract description 153
- 239000011347 resin Substances 0.000 claims abstract description 153
- 238000004519 manufacturing process Methods 0.000 claims abstract description 50
- 239000004065 semiconductor Substances 0.000 claims abstract description 20
- 238000002360 preparation method Methods 0.000 claims abstract description 15
- 238000005530 etching Methods 0.000 claims description 23
- 230000008569 process Effects 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims 2
- 230000008020 evaporation Effects 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 33
- 239000010410 layer Substances 0.000 description 17
- 230000000873 masking effect Effects 0.000 description 11
- 230000003014 reinforcing effect Effects 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 229910000831 Steel Inorganic materials 0.000 description 8
- 230000004888 barrier function Effects 0.000 description 8
- 238000003672 processing method Methods 0.000 description 8
- 239000010959 steel Substances 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 239000000696 magnetic material Substances 0.000 description 5
- 239000012044 organic layer Substances 0.000 description 5
- 239000000956 alloy Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 239000010941 cobalt Substances 0.000 description 3
- 229910017052 cobalt Inorganic materials 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- 229910052809 inorganic oxide Inorganic materials 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000013585 weight reducing agent Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 208000010392 Bone Fractures Diseases 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 206010017076 Fracture Diseases 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
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- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000005555 metalworking Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920006350 polyacrylonitrile resin Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Landscapes
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-063295 | 2013-03-26 | ||
| JP2013063295 | 2013-03-26 | ||
| CN201480017634.6A CN105102668B (zh) | 2013-03-26 | 2014-03-24 | 蒸镀掩模、蒸镀掩模准备体、蒸镀掩模的制造方法、及有机半导体元件的制造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480017634.6A Division CN105102668B (zh) | 2013-03-26 | 2014-03-24 | 蒸镀掩模、蒸镀掩模准备体、蒸镀掩模的制造方法、及有机半导体元件的制造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109554663A CN109554663A (zh) | 2019-04-02 |
| CN109554663B true CN109554663B (zh) | 2020-03-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811201328.4A Active CN109554663B (zh) | 2013-03-26 | 2014-03-24 | 蒸镀掩模、带框架的蒸镀掩模、及它们的制造方法 |
| CN201910052563.8A Active CN109913802B (zh) | 2013-03-26 | 2014-03-24 | 蒸镀掩模、带框架的蒸镀掩模、及它们的制造方法 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910052563.8A Active CN109913802B (zh) | 2013-03-26 | 2014-03-24 | 蒸镀掩模、带框架的蒸镀掩模、及它们的制造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (4) | JP6380049B2 (ja) |
| CN (2) | CN109554663B (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5994952B2 (ja) * | 2015-02-03 | 2016-09-21 | 大日本印刷株式会社 | 蒸着マスクの製造方法、蒸着マスク製造装置、レーザー用マスクおよび有機半導体素子の製造方法 |
| JP6465075B2 (ja) * | 2016-05-26 | 2019-02-06 | 大日本印刷株式会社 | 蒸着マスク、フレーム付き蒸着マスク、有機半導体素子の製造方法、及びに有機ｅｌディスプレイの製造方法 |
| JP7180193B2 (ja) * | 2018-08-10 | 2022-11-30 | 大日本印刷株式会社 | 蒸着マスク、薄膜製造装置、薄膜の製造方法、および有機半導体素子の製造方法 |
| CN111485195A (zh) * | 2020-05-18 | 2020-08-04 | 武汉华星光电半导体显示技术有限公司 | 金属掩膜装置 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07300664A (ja) * | 1994-04-28 | 1995-11-14 | Fujitsu Ltd | メタルマスクの製造方法とその再生方法 |
| JP2002175878A (ja) * | 2000-09-28 | 2002-06-21 | Sanyo Electric Co Ltd | 層の形成方法及びカラー発光装置の製造方法 |
| JP4635348B2 (ja) * | 2001-02-08 | 2011-02-23 | 凸版印刷株式会社 | パターン形成用マスクおよびそれを使用したパターン形成装置 |
| KR20030002947A (ko) * | 2001-07-03 | 2003-01-09 | 엘지전자 주식회사 | 풀칼라 유기 ｅｌ 표시소자 및 제조방법 |
| JP2003332057A (ja) * | 2002-05-16 | 2003-11-21 | Dainippon Printing Co Ltd | 有機ｅｌ素子製造に用いる真空蒸着用多面付けマスク装置 |
| JP3775493B2 (ja) * | 2001-09-20 | 2006-05-17 | セイコーエプソン株式会社 | マスクの製造方法 |
| JP2003272838A (ja) * | 2002-03-14 | 2003-09-26 | Dainippon Printing Co Ltd | マスキング部材 |
| JP4104964B2 (ja) * | 2002-12-09 | 2008-06-18 | 日本フイルコン株式会社 | パターニングされたマスク被膜と支持体からなる積層構造の薄膜パターン形成用マスク及びその製造方法 |
| JP2007173107A (ja) * | 2005-12-22 | 2007-07-05 | Kyocera Corp | マスク、マスク固定装置、及びマスクを使用して製造するディスプレイの製造方法 |
| US7767574B2 (en) * | 2006-03-30 | 2010-08-03 | Kabushiki Kaisha Mikuni Kogyo | Method of forming micro metal bump |
| JP2009041054A (ja) * | 2007-08-07 | 2009-02-26 | Sony Corp | 蒸着用マスクおよびその製造方法ならびに表示装置の製造方法 |
| KR20090127288A (ko) * | 2007-11-30 | 2009-12-10 | 캐논 아네르바 가부시키가이샤 | 기판처리장치 및 기판처리방법 |
| JP2013021165A (ja) * | 2011-07-12 | 2013-01-31 | Sony Corp | 蒸着用マスク、蒸着用マスクの製造方法、電子素子および電子素子の製造方法 |
| WO2013039196A1 (ja) * | 2011-09-16 | 2013-03-21 | 株式会社ブイ・テクノロジー | 蒸着マスク、蒸着マスクの製造方法及び薄膜パターン形成方法 |
| JP6142194B2 (ja) * | 2012-11-15 | 2017-06-07 | 株式会社ブイ・テクノロジー | 蒸着マスクの製造方法及び蒸着マスク |
| CN105102668B (zh) * | 2013-03-26 | 2019-02-19 | 大日本印刷株式会社 | 蒸镀掩模、蒸镀掩模准备体、蒸镀掩模的制造方法、及有机半导体元件的制造方法 |
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2014
- 2014-03-24 CN CN201811201328.4A patent/CN109554663B/zh active Active
- 2014-03-24 CN CN201910052563.8A patent/CN109913802B/zh active Active
- 2014-11-27 JP JP2014240433A patent/JP6380049B2/ja active Active
-
2015
- 2015-09-16 JP JP2015183439A patent/JP2016000865A/ja active Pending
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2017
- 2017-12-28 JP JP2017253046A patent/JP6601483B2/ja active Active
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2019
- 2019-09-27 JP JP2019177803A patent/JP6885439B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN109913802A (zh) | 2019-06-21 |
| JP6885439B2 (ja) | 2021-06-16 |
| JP6601483B2 (ja) | 2019-11-06 |
| JP2018059211A (ja) | 2018-04-12 |
| JP2016000865A (ja) | 2016-01-07 |
| CN109913802B (zh) | 2021-12-21 |
| JP2020002471A (ja) | 2020-01-09 |
| CN109554663A (zh) | 2019-04-02 |
| JP2015078441A (ja) | 2015-04-23 |
| JP6380049B2 (ja) | 2018-08-29 |
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