CN109551309B - Grinding and polishing processing method of crystal drill - Google Patents
Grinding and polishing processing method of crystal drill Download PDFInfo
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- CN109551309B CN109551309B CN201811502273.0A CN201811502273A CN109551309B CN 109551309 B CN109551309 B CN 109551309B CN 201811502273 A CN201811502273 A CN 201811502273A CN 109551309 B CN109551309 B CN 109551309B
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- placing table
- grinding
- polishing
- crystal drill
- crystal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a grinding and polishing processing method of a crystal drill, which comprises the following steps: 1) sleeving a crystal drill disk provided with a crystal drill on a placing table; 2) controlling a placing table to horizontally move to the position below a grinding and polishing wheel, then controlling a placing table driving device below the grinding and polishing wheel to ascend to drive the placing table to ascend and rotate, enabling a surface to be ground and polished of a crystal drill on a crystal drill disk to be in contact with the grinding and polishing wheel for grinding and polishing, and after grinding and polishing are completed, controlling the placing table driving device to descend and be separated from the placing table; 3) controlling the placing table to horizontally move to the position below the other grinding and polishing wheel, controlling the corresponding placing table driving device to drive the placing table to ascend and rotate, enabling the surface to be ground and polished of the crystal drill on the crystal drill disk to be in contact with the grinding and polishing wheel for fine grinding and polishing, and controlling the placing table driving device to descend and be separated from the placing table after the grinding and polishing are completed; 4) and taking the crystal drilling disk out of the placing table. By adopting the technical scheme, the grinding and polishing operation of the crystal drill can be stably, efficiently and energy-efficiently completed.
Description
Technical Field
The invention relates to crystal drill processing equipment, in particular to a grinding and polishing processing method of a crystal drill.
Background
After the crystal drill is subjected to preliminary semi-forming processing, the crystal drill needs to be collected and distributed on a crystal drill disc and placed on a grinding and polishing device for further grinding and polishing processing in a centralized manner, for example, grinding and polishing forming of end faces is performed. When the grinding and polishing processing method is adopted, the pressure borne by the rotating large-frame disc is large due to the fact that the driving mechanism of the placing table is heavy, the driving force is often large when the placing table is driven to move, energy is consumed very much, the speed of the rotating large-frame disc is slow, flexibility is not high, and processing efficiency is affected to a certain degree.
Disclosure of Invention
In view of the shortcomings of the background art, the invention aims to provide a crystal drill grinding and polishing method which can stably, efficiently and energy-efficiently finish the crystal drill grinding and polishing operation.
Therefore, the invention is realized by adopting the following scheme:
a grinding and polishing processing method of a crystal drill is characterized by comprising the following steps:
1) sleeving a crystal drill disk provided with a crystal drill on a placing table, and enabling the surface to be polished of the crystal drill to be upward;
2) controlling a placing table to horizontally move to the position below a grinding and polishing wheel, controlling a placing table driving device below the grinding and polishing wheel to ascend and be connected with the placing table, then driving the placing table to ascend and rotate, enabling a surface to be ground and polished of a crystal drill on a crystal drill disk to be in contact with the grinding and polishing wheel to carry out grinding and polishing operation, driving the placing table to descend and separate from the grinding and polishing wheel through the placing table driving device after the grinding and polishing are completed, and enabling the placing table to abut against a moving frame after the placing table descends;
3) controlling the placing table to horizontally move to the position below the other grinding and polishing wheel, controlling the other corresponding placing table driving device to ascend to drive the placing table to ascend and rotate, enabling the surface to be ground and polished of the crystal drill on the crystal drill plate to be in contact with the grinding and polishing wheel to carry out fine grinding and polishing operation, driving the placing table to descend and separate from the grinding and polishing wheel through the placing table driving device after the fine grinding and polishing operation is finished, and enabling the placing table to abut against a moving frame after the placing table descends;
4) and after the crystal drill completes all grinding and polishing operations, taking out the crystal drill plate from the placing table.
And repeating the operations of the steps 2 to 3 at least once according to the processing requirement.
The placing table is horizontally moved in a straight path.
The movable frame is provided with a pulley, and the pulley is connected with a guide post on the rack in a sliding fit manner.
The placing table driving mechanism comprises a rotating body, the rotating body is connected with a second rotating shaft, the second rotating shaft is in transmission connection with a second driving motor, and a linkage assembly connected with the placing table is arranged on the rotating body.
The linkage assembly is a suction head with a buckle.
The placing table driving mechanism is arranged on the lifting seat, the lifting seat is fixedly connected with a screw nut, the screw nut is in threaded connection with a driving screw rod, and the driving screw rod is in transmission connection with a third driving motor.
After the technical scheme is adopted, the invention has the advantages that: by sleeving the crystal drill disk provided with the crystal drill on the placing table, adopting a control mode that the placing table is in clutch connection with the placing table driving device and the placing table is controlled to move horizontally independently, after the crystal drill on the placing table is ground and polished on one grinding and polishing station, controlling the placing table driving device of the station to be separated from the placing table, further independently controlling the placing table to drive the crystal drill disk to move to the next grinding and polishing station and be connected with the placing table driving device of the station for carrying out the next grinding and polishing operation, replacing the traditional processing operation mode of controlling the placing table and the placing table driving mechanism to move together, effectively reducing the driving force required for driving the placing table to move, reducing the energy consumption of equipment, and when the placing table is driven to move independently, the action speed of the placing table is higher and more flexible, effectively improving the processing efficiency of the crystal drill, in addition, when different stations are controlled to process the crystal drill on the placing table, the stations are not in absolute connection, so that the grinding and polishing of the stations are not interfered with each other, and the stability of the grinding and polishing is effectively improved.
Drawings
The invention has the following drawings:
FIG. 1 is a plan view of a polishing apparatus used in the present invention;
FIG. 2 is a cross-sectional view of a polishing apparatus used in the present invention;
fig. 3 is a view of fig. 2 showing the stage driving apparatus when it is raised.
Detailed Description
As shown in the figure, the grinding and polishing processing method of the crystal drill, disclosed by the invention, comprises the following steps of:
1) sleeving a crystal drill disk 17 provided with a crystal drill on the placing table 4, and enabling the surface to be polished of the crystal drill to be upward;
2) controlling a placing table 4 to horizontally move to the position below a grinding and polishing wheel 3, controlling a placing table driving device below the grinding and polishing wheel 3 to ascend and be connected with the placing table 4, then driving the placing table 4 to ascend and rotate, enabling a surface to be ground and polished of a crystal drill on a crystal drill disk 17 to be in contact with the grinding and polishing wheel 3 for coarse grinding operation, driving the placing table 4 to descend and separate from the grinding and polishing wheel 3 through the placing table driving device after coarse grinding is completed, and enabling the placing table 4 to abut against a moving frame 7 after descending;
3) controlling the placing table 4 to horizontally move to the position below the other grinding and polishing wheel, controlling the other corresponding placing table driving device to ascend to drive the placing table 4 to ascend and rotate, enabling the surface to be ground and polished of the crystal drill on the crystal drill disk 17 to be in contact with the grinding and polishing wheel to carry out fine grinding and polishing operation, driving the placing table 4 to descend and separate from the grinding and polishing wheel through the placing table driving device after the fine grinding and polishing operation is finished, and enabling the placing table 4 to be abutted to the moving frame 7 after the placing table 4 descends;
4) after the crystal drill finishes all grinding and polishing operations, the crystal drill plate 17 is taken out from the placing table 4.
After the technical scheme is adopted, the crystal drill disk 17 provided with the crystal drill is sleeved on the placing platform, the placing platform 4 is in clutch connection with the placing platform driving device, and the placing platform is controlled to move horizontally independently, after the crystal drill on the placing platform 4 is ground and polished on one grinding and polishing station, the placing platform driving device of the station is controlled to be separated from the placing platform, so that the placing platform 4 can be controlled independently to drive the crystal drill disk 17 to move to the next grinding and polishing station and be connected with the placing platform driving device of the station for the next grinding and polishing operation, the traditional processing operation mode of controlling the placing platform and the placing platform driving mechanism to move together is replaced, the driving force required for driving the placing platform 4 to move is effectively reduced, the energy consumption of equipment is reduced, and when the placing platform 4 is driven to move independently, the action speed of the placing platform 4 is faster and more flexible, in addition, when different stations are controlled to process the crystal drill on the placing table 4, absolute connection relation does not exist among the stations, grinding and polishing of the stations are guaranteed not to interfere with each other, and stability of grinding and polishing is effectively improved. In addition, the operations of steps 2-3 may be repeated at least once according to the processing requirements. The placing table 4 is horizontally moved in a straight path, but the placing table 4 may be designed to be horizontally moved in an arc-shaped path according to the structure and layout of different types of equipment.
Specifically, in order to implement the crystal drill grinding and polishing processing method, the grinding and polishing wheel 3 is connected with the first rotating shaft 2, the first rotating shaft 2 is in transmission connection with the first driving motor 1, for example, the first rotating shaft 2 is in transmission connection with the first driving motor 1 through a belt pulley transmission set, and the grinding and polishing wheel 3 can be driven to rotate by controlling the first driving motor 1; certainly, the grinding and polishing wheel 3, the first rotating shaft 2 and the first driving motor 1 can be arranged on a lifting table, the lifting table can be connected with a first lifting driving cam, the grinding and polishing wheel 3 is driven to lift by controlling the first lifting driving cam, the placing table 4 is positioned below the grinding and polishing wheel 3, the placing table 4 can be horizontally arranged in a movable mode, for example, a movable frame 7 can be arranged, a pulley 9 is arranged on the movable frame 7, the pulley 9 is connected with a guide column 8 on a rack in a sliding fit mode, and the guide column 8 is fixedly arranged on the rack 16; of course, a sliding seat can be arranged on the moving frame 7 and is connected with a sliding rail on the machine frame in a sliding fit manner, the placing table 4 can be placed on the moving frame 7 in a propping manner, and the moving frame 7 is controlled to move, so that the placing table 4 can be driven to move to each polishing station to perform polishing operation of the crystal drill. The placing table driving mechanism is arranged in a lifting manner, when the placing table driving mechanism rises, the placing table driving mechanism is in linkage connection with the placing table 4 and drives the placing table 4 to rotate and rise, when the placing table 4 driving mechanism descends, the placing table driving mechanism is separated from the placing table 4, by adopting the clutch connection mode, when grinding and polishing are needed, the placing table driving mechanism is controlled to rise and is in linkage connection with the placing table 4 and drives the placing table 4 to rotate and rise, the crystal drill is ground and polished by matching with the grinding and polishing wheel 3, and after the grinding and polishing processing is completed at the station, the placing table driving mechanism can descend and be separated from the placing table 4, so that the placing table 4 is controlled to horizontally move to the next grinding and polishing station independently, the next grinding and polishing operation is carried out, the placing table 4 is more stably moved without deviation, deformation and the like, and the grinding and polishing quality of the crystal drill is ensured, in addition, the structure does not need to be provided with a rotating large frame disk, the structure of the device is further simplified, energy consumption is effectively reduced, and meanwhile, the device is more convenient to produce and assemble. It includes rotor 6 to place a actuating mechanism, rotor 6 is connected with second pivot 11, second pivot 11 is connected with second driving motor 10 transmission, for example, realize that second pivot 11 is connected with second driving motor 10's transmission through synchronizing wheel drive group, be equipped with on the rotor 6 with place the linkage subassembly that platform 4 is connected, this linkage subassembly can be for taking buckle suction head 5, when placing a driving mechanism and rise, suction head on the rotor 6 adsorbs and places platform 4 and will place one section distance of platform 4 lifting, later second driving motor 10 moves, drive rotor 6 and place platform 4 and rotate, realize the grinding and throwing operation of crystal drill with grinding and throwing wheel 3 cooperation. Of course, the linkage component may also be a connecting pin, and the placing table 4 is provided with a connecting hole matched with the connecting pin. And the lifting of the placing platform driving mechanism can be realized by the following modes: place a actuating mechanism and set up on lift seat 14, lift seat 14 and lead screw nut 12 fixed connection for lead screw nut 12 can not take place to rotate, and lead screw nut 12 and the spiro union of drive lead screw 13, drive lead screw 13 are connected with the transmission of third driving motor 15, through controlling the action of third driving motor 15, drive lead screw 13 rotates, can drive lead screw nut 12 and go up and down under the direction of drive lead screw 13, finally realize placing a actuating mechanism's lift. Of course, the placing table driving mechanism may also be disposed on the lifting seat 14, the lifting seat 14 is connected to the second lifting driving cam, and the lifting seat 14 and the placing table driving mechanism may be driven to lift by controlling the second lifting driving cam.
Claims (3)
1. A grinding and polishing processing method of a crystal drill is characterized by comprising the following steps:
1) sleeving a crystal drill disk (17) provided with a crystal drill on a placing table (4), enabling the surface to be polished of the crystal drill to be upward, enabling the placing table (4) to be abutted against a moving frame (7), arranging a pulley (9) on the moving frame (7), enabling the pulley (9) to be in sliding fit connection with a guide column (8) on a rack, and enabling the moving frame (7) to drive the placing table (4) to horizontally move in a straight path;
2) the wafer polishing machine is characterized in that a placing table (4) is controlled to horizontally move to the lower part of a polishing wheel (3), a placing table driving mechanism below the polishing wheel (3) is controlled to ascend and is connected with the placing table (4), the placing table (4) is driven to ascend and rotate, the placing table driving mechanism comprises a rotating body (6), the rotating body (6) is connected with a second rotating shaft (11), the second rotating shaft (11) is in transmission connection with a second driving motor (10), a linkage assembly connected with the placing table (4) is arranged on the rotating body (6), the placing table driving mechanism is arranged on a lifting seat (14), the lifting seat (14) is fixedly connected with a screw nut (12), the screw nut (12) is in threaded connection with a driving screw rod (13), the driving screw rod (13) is in transmission connection with a third driving motor (15), so that a polishing surface to be polished of a crystal drill on a crystal drill plate (17) is in contact with the polishing wheel (3) for polishing operation, after the grinding and polishing are finished, the placing table (4) is driven to descend by the lifting seat (14) to be separated from the grinding and polishing wheel (3), and the placing table (4) is placed on the moving frame (7) after descending;
3) the placing table (4) is controlled to horizontally move to the position below the other grinding and polishing wheel, the other corresponding placing table driving mechanism is controlled to ascend to drive the placing table (4) to ascend and rotate, so that the surface to be ground and polished of the crystal drill on the crystal drill plate (17) is in contact with the grinding and polishing wheel to carry out fine grinding and polishing operation, the placing table (4) is driven to descend to be separated from the grinding and polishing wheel through the lifting seat (14) after the fine grinding and polishing operation is finished, and the placing table (4) is abutted to the moving frame (7) after descending;
4) after the crystal drill finishes all grinding and polishing operations, taking out the crystal drill plate (17) from the placing table (4);
the polishing wheel in the steps 2) and 3) is connected with the corresponding first rotating shaft (2), and the first rotating shaft (2) is in transmission connection with the first driving motor (1).
2. The grinding and polishing processing method of the crystal drill according to claim 1, characterized in that: and repeating the operations of the steps 2 to 3 at least once according to the processing requirement.
3. The grinding and polishing processing method of the crystal drill according to claim 1, characterized in that: the linkage component is a suction head (5) with a buckle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811502273.0A CN109551309B (en) | 2018-12-10 | 2018-12-10 | Grinding and polishing processing method of crystal drill |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811502273.0A CN109551309B (en) | 2018-12-10 | 2018-12-10 | Grinding and polishing processing method of crystal drill |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109551309A CN109551309A (en) | 2019-04-02 |
| CN109551309B true CN109551309B (en) | 2021-05-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811502273.0A Active CN109551309B (en) | 2018-12-10 | 2018-12-10 | Grinding and polishing processing method of crystal drill |
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| CN (1) | CN109551309B (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201645316U (en) * | 2010-05-10 | 2010-11-24 | 南京白鹿科技有限公司 | Multi-station automatic metallic phase polishing machine |
| JP5517350B2 (en) * | 2010-06-15 | 2014-06-11 | 東京エレクトロン株式会社 | Mounting table drive device |
| CN205342746U (en) * | 2015-12-03 | 2016-06-29 | 无锡机床股份有限公司 | A compound grinding machine for injector processing |
| CN105500170B (en) * | 2015-12-22 | 2017-11-28 | 林兴豹 | Full-automatic hardware part polishing machine |
| CN108527084B (en) * | 2018-05-08 | 2019-12-10 | 义乌市爱釜义自动化科技有限公司 | Full-automatic iron pan polishing machine |
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2018
- 2018-12-10 CN CN201811502273.0A patent/CN109551309B/en active Active
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| CN109551309A (en) | 2019-04-02 |
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