CN109548398B

CN109548398B - SMT patch element loading method

Info

Publication number: CN109548398B
Application number: CN201811646944.0A
Authority: CN
Inventors: 姚慧平; 黄小双
Original assignee: Shenzhen Jiechuang Electronic Technology Co ltd
Current assignee: Shenzhen Jiechuang Electronic Technology Co ltd
Priority date: 2018-12-30
Filing date: 2018-12-30
Publication date: 2021-05-18
Anticipated expiration: 2038-12-30
Also published as: CN109548398A

Abstract

A SMT patch element loading method comprises the steps that different packaging numbers are distributed according to attributes of patch elements in sequence, and the packaging numbers are collected and sorted to form a packaging attribute table; arranging RFID labels on the Fedada discs, installing patch elements to the Fedada discs, binding package numbers corresponding to the patch elements with disc numbers of the Fedada discs to form mapping codes, and forming a plurality of Fedada discs subjected to patch installation; after the mapping coding information is written into the RFID label, the disc number of the booby disc and the packaging number of the patch element are coded according to respective parts based on the mapping coding, then the codes are combined into coding information, finally the coding information is converted into corresponding label information, the coding information is converted into label information in the RFID label, and the like.

Description

SMT patch element loading method

Technical Field

The invention relates to a manufacturing technology of a printed circuit board, in particular to a loading method of an SMT (surface mount technology) patch element.

Background

SMT is a surface mount technology, which is a circuit connection technology in which Surface Mount Components (SMCs) without pins or short leads are mounted on the surface of a printed circuit board PCB or other substrate and then soldered or assembled by flow soldering or dip soldering. The chip mounting production execution control system is an important process system in the current electronic industrial production, can finish the automatic welding of precise chip mounting type electronic elements, and the core equipment of the system is a chip mounting machine with various brands and models, and is matched with a printing machine and various detection equipment to form a complete production control system.

In the production process of the circuit board, a large number of electronic elements are required to be attached to the composite material substrate, and various electronic elements are attached manually at first, so that the working efficiency is extremely low, and mistakes are easy to make; machine pasting is developed later, but only single electronic components can be pasted, batch pasting cannot be realized, and the working efficiency is still not ideal.

With the widespread use of high-speed chip mounters, in the SMT manufacturing technology field, challenges are also posed on the flexibility and compatibility of the SMT production line and its production process, in the prior art, during the SMT chip mounting process, chip components are mounted on a flying disc (i.e., a device for temporarily storing the chip components), then the flying disc is mounted on the SMT chip mounter, then the position of the chip components is set on the chip mounter, then the chip mounting process is started, each device is relatively independent, although the degree of automation is higher today, each device can perform certain intelligent management and control on itself, but each device is not linked, and each device still needs a special operator to perform management and monitoring, and abnormal conditions are discovered in time, in addition, the position setting of the chip components is performed on the chip mounter (from zero), and the preparation of the next operation cannot be performed while the chip mounter is operating in the previous operation, namely, the position of the patch element is set.

In the process of mounting, the quantity of the mounting elements is large, so that the efficiency and the precision can be improved by accurately and quickly grabbing the mounting elements after mounting. However, most of the research in the prior art is focused on a chip mounter, and there are few researches on a method and a system for optimally designing a mounting position, a type and a shape of a chip component in a chip mounting process, and a mounting, a structure, a method and the like of an enclave disk.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provides the SMT patch element loading method which can improve the efficiency, has high patch precision, can be repeatedly used, and has a simple structure and low cost.

The invention provides an SMT patch element loading method, which comprises the following steps in sequence:

(1) distributing different packaging numbers according to the attributes of the patch elements, and summarizing and sorting the packaging numbers to form a packaging attribute table;

(2) mounting the patch element on the Fedada disc, binding a packaging number corresponding to the patch element with a disc number of the Fedada disc to form a mapping code, and forming a plurality of Fedada discs subjected to patch mounting;

(3) setting an RFID label on the Hadamard disc, writing the mapping coding information formed in the step (2) into the RFID label, and converting the mapping coding information into label information in the RFID label;

(4) arranging the feeder disc on a mounting part on the chip mounter, and redefining the mounting position of the feeder disc by the corresponding mounting part according to the shape of the feeder disc;

(5) reading the label information of the RFID label by a card reader arranged on the chip mounter, and generating a corresponding identification number according to the redefined installation position information of the boomerang disc, the label information in the step (3) and mapping coding information corresponding to the label information;

(6) based on the corresponding identification number generated in the step (5), attaching the corresponding patch element to the circuit board;

wherein:

the step (4) is specifically that a laser scanner is correspondingly arranged on the chip mounter, the laser scanner scans the installation positions of the plurality of boomerang discs to form contour diagrams of the plurality of boomerang discs and then generates a plan view, and the central position coordinates of each boomerang disc and the relative rotation angle corresponding to each boomerang disc are determined according to the generated plan view;

and step (6) specifically, according to the operation control program, utilizing an element installation table contained in the operation control program and utilizing a corresponding identification number, and calling a packaging attribute table to capture the target patch element.

Further, the assignment of different package numbers in step (1) is based on the type, packaging manner, parameters and/or size information of the patch element.

Further, the number of the RFID tags is plural.

The SMT patch element loading method of the invention can improve the efficiency, has high patch precision, realizes that the installation of the Fidek disk can be not strict by utilizing the optimized patch element classification and the optimized Fidek disk installation technology, can accurately find the corresponding patch element, realizes the efficient and flexible effect, can know the installation position, the shape and other information of the Fidek disk in the current process by utilizing the identification number, provides the information for the research of the subsequent process flow and the process improvement, is accurate, can still carry out the retrospective query research for a long time after the patch is finished, distributes different package numbers according to the information of the patch elements such as different types, package modes, parameters, sizes and the like, and collects and arranges the package numbers to form the package attribute table, by means of calling, a chip mounter is told that a component with which packaging attribute is pasted at a certain position on a certain boomerang disc, so that mapping of the component is achieved, efficiency is improved, and mapping is performed with the boomerang disc, and positioning is faster and more effective; and adopt RFID technique, wireless measurement and reuse, simple structure and with low costs.

Drawings

Fig. 1 is a flow chart of a SMT patch component loading method.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, the following examples of which are intended to be illustrative only and are not to be construed as limiting the scope of the invention.

The invention provides an SMT patch element loading method, wherein the specific flow of the loading method is shown in figure 1.

Firstly, ordering is carried out according to the requirements of customers, raw materials are sent by the customers or purchased by a processing factory instead, the raw materials are put into a warehouse after the raw materials are purchased, then material ordering and material testing are carried out according to the process requirements, the materials are prepared according to the actual requirements, and after the processes are completed, the early preparation work is completed.

Secondly, the required quantity of the raw materials of the patch elements is prepared according to the order placing requirement of a customer, particularly, the patch elements are installed on the air table, small patch element rolls need to be connected with each other when necessary, so that a longer patch element roll can be formed, the requirement that the patch order is completed at one time can be met, and the air table does not need to be stopped to be installed again.

An important inventive point of the present invention is that the way in which the patch element is mounted on the boomerang plate is optimized. For a patch element, each type of element to be patch may have a different packaging form, called "element package", for example: the transistors may be of different sizes (sizes) and although both are referred to as a three-pin package or a transistor package, for three-pin components of different sizes. Of course, the species are not necessarily the same, and various cases are presented, and different sizes and the like are also possible. Therefore, different package numbers can be allocated according to the information of different types, package modes, parameters, sizes and the like of the patch elements, and the package numbers are collected and sorted to form a package attribute table, and specific package numbers are recorded and stored in the package attribute table. In a specific chip mounting process, a chip mounter is told to mount an element with a "which kind of packaging attribute" at a certain position on a certain boomerang disc in a calling mode, so that the mapping of the element is realized, but the packaging number is not enough only by classifying the chip mounter elements, because the chip mounter elements are required to be mounted on the boomerang disc at a later stage, the positions of the chip mounter elements and the like are influenced by the factors such as the numbers and the positions of the boomerang disc, and therefore accurate positioning is further required to be realized by further combining the attribute parameters of the boomerang disc.

The invention also has an important invention point that when the patch element is installed on the boomerang disk, the 'packaging property table' is defined in advance, the patch element is allocated with a corresponding packaging number, then when the patch element is installed on the boomerang disk, the corresponding packaging number is bound with the disk number of the boomerang disk to form a mapping code, wherein the mapping code comprises the packaging number and the disk number of the boomerang disk, and reverse recognition can be carried out, so that the disk number of the boomerang disk and the packaging number of the patch element are rapidly positioned, and the subsequent analysis processing is obviously rapid and effective.

After the mapping code is formed, namely the patch element and the boomerang disc are connected together, the information that the patch element and the boomerang disc belong to a certain order is mapped, and on the basis, if the mapping code can be accurately identified, the position of the patch element can be accurately found. Therefore, the RFID label is arranged on the flight disk, and after the mapping code is obtained, the mapping code information can be written into the RFID label, and the code information can be converted into the label information in the RFID label. Because the patch elements in the boomerang disc are not one or one, the tag information needs to include code information capable of quickly identifying the disc number of the boomerang disc and the packaging number of the patch element, and in a specific implementation process, the disc number of the boomerang disc and the packaging number of the patch element can be coded according to respective parts, then the codes are combined into coding information, and finally the coding information is converted into corresponding tag information. Therefore, the disc number of the flying disc and the packaging number of the patch element can be identified simultaneously when the label information is identified, and the specific patch element is positioned.

After the patch elements are mounted on the feeder disks, a plurality of feeder disks which are mounted with patches are formed, and when the feeder disks are arranged on the chip mounter, the corresponding mounting parts redefine the mounting positions of the feeder disks according to the shapes of the feeder disks.

Specifically, when the mounting positions of the boomerang discs are redefined, a laser scanner is correspondingly arranged on the chip mounter (specifically, the invention focuses on application of the laser scanner to the chip mounter, the laser scanner is not arranged on the chip mounter in a specific function manner in the prior art, and the principle and how to arrange the laser scanner can be adopted in the prior art, which is not described herein again). Like this, concrete paster in-process again can directly utilize the identification number that corresponds, determines to fly to the position of dish and the position of the paster component that corresponds, and the quick paster of snatching that snatchs, this kind of mode can not be very strict to the installation that flies to the dish to can be accurate find the paster component that corresponds, realized high-efficient nimble effect.

In the above identification number determination process, it is not said how the disc numbers of a plurality of flying discs are identified at the mounter, and it can be implemented in a manner common in the art, but the present invention improves their identification on the basis of the prior art, which will be specifically described below.

After the RFID label is arranged, the coded information is converted into label information which comprises the disc number of the flying disc and the packaging number of the patch element, so that the disc number of the flying disc can be accurately identified only by arranging a corresponding card reader on the chip mounter to read the label information of the RFID label, the patch element can be quickly positioned, and the card reader can be arranged on the chip mounter.

That is, in the process of scanning the installation positions of the plurality of boomerang discs by the laser scanner, the card reader simultaneously reads the tag information of the RFID tag, generates a plan view after forming the outline views of the plurality of boomerang discs, determines the center position coordinates of each boomerang disc and the relative rotation angle corresponding to each boomerang disc according to the generated plan view, and then "binds" the tag information, the center position coordinates, the relative rotation angle corresponding to each boomerang disc, and the mapping code by using the obtained tag information, and finally generates the corresponding identification number. Like this, concrete paster in-process again can directly utilize the identification number that corresponds, determines to fly to the position of dish and the position of the paster component that corresponds, and the quick paster of snatching that snatchs, this kind of mode can not be very strict to the installation that flies to the dish to can be accurate find the paster component that corresponds, realized high-efficient nimble effect.

The operation control program is manufactured on a computer by using (special) software, and the attributes and the positions of the elements are set according to the ordering requirements of a client, so that the elements can be directly read and loaded by a chip mounter in the following process, and then the chip mounter is controlled to carry out chip mounting. Specifically, the step of creating the job program may be performed at any time node, preferably after or simultaneously with the dispensing and testing. Further, the job control program includes a component mounting table (including, for example, the component R, C) inside, and the component mounting table can call a "package attribute table" (which specifies the attribute of the component to be mounted), so that mapping between the component mounting table and the "package attribute table" is realized, and the target patch component is captured.

The specific process of the paster comprises the steps of firstly inspecting a circuit board needing the paster, printing soldering paste or paster glue on a bonding pad of the circuit board according to circuit design requirements when the circuit board meets inspection conditions, then carrying out offset printing and pasting, and pasting and installing a corresponding paster element on the circuit board.

After the mounting is finished, a reflow soldering process is carried out, namely, the reflow soldering process is finished, the reflow soldering Standard Operation Process (SOP) is manufactured and executed, and corresponding reflow soldering operation parameters are set according to conditions such as the attribute of the element, the attribute of the used solder paste and the like.

And finally, inspecting the circuit board after the surface mounting, specifically checking whether the process defects such as missing positions, dislocation and the like exist or not by an image detection method, and carrying out electrical property detection, finishing the manufacture of a finished product after the detection process is finished, and warehousing the circuit board after the surface mounting, and finally finishing the shipment.

In addition, after the inspection, the method also comprises a step of adding an identification number, namely after the inspection is finished, the corresponding identification number is arranged on the corresponding circuit board, so that the circuit board can be identified, which patch element on the boomerang disc is adopted by the circuit board can be determined, and the information such as the installation position, the form and the like of the corresponding boomerang disc can be known in the identification number, so that the technical analysis of the subsequent process flow and the process improvement provide information for being looked up and researched, and the method is accurate and can still carry out the retroactive inquiry research for a long time after the patch is finished.

Although exemplary embodiments of the present invention have been described for illustrative purposes, those skilled in the art will appreciate that various modifications, additions, substitutions and the like can be made in form and detail without departing from the scope and spirit of the invention as disclosed in the accompanying claims, all of which are intended to fall within the scope of the claims, and that various steps in the various sections and methods of the claimed product can be combined together in any combination. Therefore, the description of the embodiments disclosed in the present invention is not intended to limit the scope of the present invention, but to describe the present invention. Accordingly, the scope of the present invention is not limited by the above embodiments, but is defined by the claims or their equivalents.

Claims

1. An SMT chip component loading method is characterized by comprising the following steps of:

(6) mounting the corresponding patch element on the circuit board based on the corresponding identification number generated in the step (5);

wherein:

2. The method of claim 1, wherein: the allocation of different package numbers in step (1) is based on the type, packaging mode, parameters and/or size information of the patch element.

3. The method of claim 1, wherein: the number of the RFID tags is multiple.