CN109530696A - A kind of substrate melts manufacturing process as the selective laser of part a part - Google Patents
A kind of substrate melts manufacturing process as the selective laser of part a part Download PDFInfo
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- CN109530696A CN109530696A CN201811618559.5A CN201811618559A CN109530696A CN 109530696 A CN109530696 A CN 109530696A CN 201811618559 A CN201811618559 A CN 201811618559A CN 109530696 A CN109530696 A CN 109530696A
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- selective laser
- forming board
- manufacturing process
- laser
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- 239000000758 substrate Substances 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000000155 melt Substances 0.000 title claims description 12
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 15
- 238000002844 melting Methods 0.000 claims abstract description 15
- 230000008018 melting Effects 0.000 claims abstract description 15
- 238000002203 pretreatment Methods 0.000 claims abstract description 7
- 238000005520 cutting process Methods 0.000 claims abstract description 5
- 238000004458 analytical method Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 11
- 230000011218 segmentation Effects 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 238000013461 design Methods 0.000 claims description 6
- 230000032798 delamination Effects 0.000 claims description 3
- 230000008676 import Effects 0.000 claims description 3
- 238000002271 resection Methods 0.000 claims description 3
- 238000000638 solvent extraction Methods 0.000 claims description 2
- 239000000843 powder Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000007493 shaping process Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000011009 performance qualification Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/60—Treatment of workpieces or articles after build-up
- B22F10/66—Treatment of workpieces or articles after build-up by mechanical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/80—Data acquisition or data processing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/32—Process control of the atmosphere, e.g. composition or pressure in a building chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/36—Process control of energy beam parameters
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Abstract
Melt manufacturing process in a kind of selective laser the present invention relates to substrate as part a part, the manufacturing process carries out three-dimensional modeling to the part for needing laser forming first, when model height is higher than Z-direction maximum forming dimension in this equipment, by extra in model and size less than forming board thickness in view of in forming board；Then the part is cut away from master mould, is modeled again；The part that counterweight newly models carries out pre-treatment analysis, and transfers data to selective laser melting unit, carries out laser forming；After having shaped, the formation of parts with forming board is taken out, non-part structure division on forming board is fallen by numerical control machine tool cutting, to obtain the part greater than selective laser melting unit maximum Z axis forming dimension.The present invention can realize that forming Z-direction full-size is slightly above the laser forming of the maximum sized part of equipment Z-direction, economical and effective when being changed without large-scale former.
Description
Technical field
The invention belongs to increases material manufacturing technology fields, the selective laser more particularly to a kind of substrate as part a part
Melt manufacturing process.
Background technique
Selective laser melt (also referred to as increasing material manufacturing or metal 3D printing) technology, be occurred in recent years one kind it is novel
Processing method, the raw material which uses are that tens Dao several hundred microns powder passes through powder supplying mechanism in forming process
Powder is uniformly divided on forming board with powder supply mechanism, recycles the energy sources such as laser by surface geometry in particular region
Powder fusing, generate metallurgical bonding, grow part successively to realize the process of stereo shaping.This kind of equipment at
In shape process, the actual size of equipment forming axis limits the final forming dimension of part.With popularizing for this technology
Using device requirement biggish for forming dimension is more and more vigorous, however, the research and development of large scale equipment need substantial contribution and skill
The investment of art ability, such equipment that can make large-scale breadth at present only has a few company in the world, and the equipment is extremely
Valuableness, easily up to ten million members.
During exploded perspective forming, the forming dimension of equipment Z-direction limits the forming height of part, at present
Existing equipment Z-direction maximum forming dimension is 420mm on the market, in equipment forming Structural Design of Shaft, most due to Z-direction
The every increase certain altitude of big forming dimension, then forming axis needs at least to increase 2 times or more height.Continue to increase Z-direction forming
Size, then the overall structure of equipment and mode of operation will carry out biggish change, need to re-start the research and development and examination of equipment
System directly purchases ultra-large type relevant device, causes great cost input.In addition, needing shaping during part forming
It is successively grown on substrate, and forming board, in order to be used repeatedly, stock size is between 30mm-50mm.
Summary of the invention
In view of the problems of the existing technology, it is molten as the selective laser of part a part that the present invention provides a kind of substrates
Change manufacturing process, using the manufacturing process when being changed without large scale equipment, when formation of parts and shaping substrate material are complete
It is identical, and when formation of parts Z-direction full-size is slightly above equipment Z-direction full-size, it can be by the thickness of forming board
Degree directly on forming board in view of carrying out the above structure formation in the middle part of formation of parts in formation of parts design process；To at
After shape, then part portion on forming board processed by machine tool mechanical, to achieve over equipment Z-direction most
The part forming of big forming dimension.
The invention is realized in this way a kind of substrate melts manufacturing process as the selective laser of part a part, including
Following steps:
1) three-dimensional modeling is carried out to the part for needing laser forming first, when model height is higher than Z-direction in this equipment
When maximum forming dimension, by extra in model and size less than forming board thickness in view of in forming board；
2) then the part is cut away from master mould, is modeled again；
3) part that counterweight newly models carries out pre-treatment analysis, and transfers data to selective laser melting unit, carries out
Laser forming；
4) after having shaped, the formation of parts with forming board is taken out, is fallen by numerical control machine tool cutting non-on forming board
Design of part part, to obtain the part greater than selective laser melting unit maximum Z axis forming dimension.
In the above-mentioned technical solutions, it is preferred that in the step 1), need the part of laser forming in CAD software into
Row models, and the maximum height H of part is considered in modeling, if the maximum height H of part is higher by selective laser melting unit Z axis
Feature bottom H-H0 Partial Height is then designed and is submerged in forming board by the full-size H0 in direction, and will with height H0
Part partitioning is A, B two parts.
In the above-mentioned technical solutions, it is preferred that the part part A height after the segmentation is H0, and part B height is H-
H0。
In the above-mentioned technical solutions, it is further preferred that the part part B height H-H0 after the segmentation is less than forming base
Plate thickness H1.
In the above-mentioned technical solutions, it is preferred that in the step 3), the part modeled again is the part A after dividing
Part is supported addition, the pre-treatments such as slicing delamination work to part part A in pre-processing software, and imports data to
The digital control system of selective laser melting unit, and laser forming is carried out on forming board to part part A in a device.
In the above-mentioned technical solutions, it is further preferred that the part part B after the segmentation submerges forming board completely
In.
In the above-mentioned technical solutions, it is further preferred that being put into the formation of parts with forming board in the step 4)
The model data of part part B is imported in numerically-controlled machine tool, is cut forming board by numerically-controlled machine tool, will be on forming board
It is not the structure complete resection of part part B.
In the above-mentioned technical solutions, it is further preferred that considering that numerical control can be passed through when the part part B structure designs
Machine cut is completed.
In the above-mentioned technical solutions, it is preferred that the material of the forming board is identical as part material.
The advantages and positive effects of the present invention are:
(1) present invention can realize that forming Z-direction full-size is slightly above in the case where being changed without large-scale former
The maximum sized part of equipment Z-direction, and economical and effective；
(2) present invention saves the cost and curring time that use large scale equipment formation of parts, forming efficiency is improved, more
The advantages of combining machining and increasing material manufacturing well.
Detailed description of the invention
Fig. 1 is selective laser fusing forming method flow of the substrate provided in an embodiment of the present invention as part a part
Figure；
Fig. 2 is selective laser fusing forming original state of the substrate provided in an embodiment of the present invention as part a part
Structural schematic diagram；
Fig. 3 is selective laser fusing forming end-state of the substrate provided in an embodiment of the present invention as part a part
Structural schematic diagram；
Fig. 4 is the structural schematic diagram after formation of parts provided in an embodiment of the present invention takes out from the device；
Fig. 5 is that the part provided in an embodiment of the present invention after the non-part portion of over mechanical processing Material removal substrate is final
Shape and structure schematic diagram.
In figure: 1- laser system, 2- part, 3- forming board highest order, 4- forming board lowest order, 5- fixed plate, 6-
Transmission mechanism, 7- forming board, 8- part final shape.
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to embodiments, and cooperate attached
The present invention will be described in further detail for figure.Those skilled in the art should know following specific embodiments or specific implementations
Mode is the set-up mode for the series of optimum that the present invention is enumerated Wei specific summary of the invention is explained further, and these set
Set can be combined with each other between mode or it is interrelated use, unless clearly proposing some of them in the present invention
Or a certain specific embodiment or embodiment can not be associated setting or be used in conjunction with other embodiments or embodiment.
Meanwhile following specific embodiments or embodiment be only as the set-up mode optimized, and not as limiting guarantor of the invention
Protect the understanding of range.
In addition, it will be understood by those skilled in the art that pair come out cited by following specific embodiments and embodiment
In the specific value of parameter setting, it is that explanation for example is used, as an optional embodiment, and is not construed as to this hair
The restriction of bright protection scope；And the setting of each algorithm being directed to and its parameter, it also only explains and uses as an example, and under
State the formal argument of parameter and the Conventional mathematicals of following algorithms derived, be regarded as falling into protection scope of the present invention it
It is interior.
It is the part or slightly above equipment of the dimension limit that former is melted in selective laser for Z-direction full-size
The biggish part of part or base area of dimension limit, can be using substrate as a part of part, by the upper half of part
Part directly selective melting forming, after forming, forming board part is processed.
Referring to Fig. 1, manufacturing process is melted in the selective laser the present embodiment provides a kind of substrate as part a part, wrap
Include following steps:
1) three-dimensional modeling is carried out to the part for needing laser forming first, when model height is higher than Z-direction in this equipment
When maximum forming dimension, by extra in model and size less than forming board thickness in view of in forming board；
2) then the part is cut away from master mould, is modeled again；
3) part that counterweight newly models carries out pre-treatment analysis, and transfers data to selective laser melting unit, carries out
Laser forming；
4) after having shaped, the formation of parts with forming board is taken out, is fallen by numerical control machine tool cutting non-on forming board
Design of part part, to obtain the part greater than selective laser melting unit maximum Z axis forming dimension.
As preferred embodiment, in the step 1), the part of laser forming is needed to be modeled in CAD software,
And the maximum height H of part is considered in modeling, if the maximum height H of part is higher by selective laser melting unit Z-direction
Feature bottom H-H0 Partial Height is then designed and is submerged in forming board by full-size H0, and is divided part with height H0
It is segmented into A, B two parts.
As preferred embodiment, the part part A height after the segmentation is H0, and part B height is H-H0.
As further preferred embodiment, the part part B height H-H0 after the segmentation is less than forming board thickness
H1。
As preferred embodiment, in the step 3), the part modeled again is the part part A after dividing, right
Part part A is supported addition, the pre-treatments such as slicing delamination work in pre-processing software, and imports data to selective laser
The digital control system of melting unit, and laser forming is carried out on forming board to part part A in a device.
As further preferred embodiment, the part part B after the segmentation is submerged in forming board completely.
As further preferred embodiment, in the step 4), the formation of parts with forming board is put into numerical control machine
The model data of part part B is imported in numerically-controlled machine tool, cuts forming board, will not be zero on forming board by bed
The structure complete resection of part part B.
As further preferred embodiment, consider to cut by numerically-controlled machine tool when the part part B structure designs
Cut completion.
As preferred embodiment, the material of the forming board is identical as part material, and selection thickness is suitable for, without inside
The substrate of defect, performance qualification.
Laser forming is carried out on forming board to part part A in a device, as shown in Fig. 2, equipment runs initial shape
Forming board is first moved to forming board highest order 3, then is scanned on forming board by laser system 1 by state；For the first time at
It is repeated several times when being scanned on type substrate.Forming board decline height corresponding with currently thickness degree to be processed, paving
After powder device carries out current layer powdering, laser system is scanned the powder on forming board along respective scanned path, completes
Current layer laser forming process；Parameter setting when forming: equipment 200~350W of laser output power, protection gas are argon gas.With
In fixed plate 5 driving of transmission mechanism 6, forming board successively decline, formation of parts is successively grown in a substrate, such as Fig. 3
It is shown, when forming board drops to forming board lowest order 4, reach the equipment Z-direction maximum forming dimension, Z axis at this time
The maximum sized part forming in direction finishes；As shown in Figures 4 and 5, the part 2 that forming finishes is taken out together with forming board 7,
And part portion non-in forming board 7 is subjected to machining removal, obtain final complete 3 d part.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: it still may be used
To modify to technical solution documented by previous embodiment, or some or all of the technical features are equal
Replacement, and these are modified or replaceed, the model for technical solution of the embodiment of the present invention that it does not separate the essence of the corresponding technical solution
It encloses.
Claims (9)
1. a kind of substrate melts manufacturing process as the selective laser of part a part, characterized by the following steps:
1) three-dimensional modeling is carried out to the part for needing laser forming first, when model height is higher than Z-direction maximum in this equipment
When forming dimension, by extra in model and size less than forming board thickness in view of in forming board；
2) then the part is cut away from master mould, is modeled again；
3) part that counterweight newly models carries out pre-treatment analysis, and transfers data to selective laser melting unit, carries out laser
Forming；
4) after having shaped, the formation of parts with forming board is taken out, non-part on forming board is fallen by numerical control machine tool cutting
Structure division, to obtain the part greater than selective laser melting unit maximum Z axis forming dimension.
2. a kind of substrate according to claim 1 melts manufacturing process, feature as the selective laser of part a part
It is, in the step 1), the part of laser forming is needed to be modeled in CAD software, and considers part in modeling
Maximum height H, if the maximum height H of part is higher by the full-size H0 of selective laser melting unit Z-direction, by part bottom
Portion's H-H0 Partial Height is designed and is submerged in forming board, and is A, B two parts by part partitioning with height H0.
3. a kind of substrate according to claim 2 melts manufacturing process, feature as the selective laser of part a part
It is, the part part A height after the segmentation is H0, and part B height is H-H0.
4. a kind of substrate according to claim 2 or 3 melts manufacturing process as the selective laser of part a part, special
Sign is that the part part B height H-H0 after the segmentation is less than forming board thickness H1.
5. a kind of substrate according to any one of claim 1-3 melts forming side as the selective laser of part a part
Method, which is characterized in that in the step 3), the part modeled again is the part part A after dividing, and is existed to part part A
It is supported addition, the pre-treatments such as slicing delamination work in pre-processing software, and imports data to selective laser melting unit
Digital control system, and laser forming is carried out on forming board to part part A in a device.
6. a kind of substrate according to claim 4 melts manufacturing process, feature as the selective laser of part a part
It is, the part part B after the segmentation is submerged in forming board completely.
7. a kind of substrate according to claim 6 melts manufacturing process, feature as the selective laser of part a part
It is, in the step 4), the formation of parts with forming board is put into numerically-controlled machine tool, the model data of part part B is led
Enter in numerically-controlled machine tool, forming board is cut, will not be the structure complete resection of part part B on forming board.
8. a kind of substrate according to Claims 2 or 3 or 6 or 7 melts forming side as the selective laser of part a part
Method, which is characterized in that consider to complete by numerical control machine tool cutting when the part part B structure designs.
9. a kind of substrate according to claim 1 melts manufacturing process, feature as the selective laser of part a part
It is, the material of the forming board is identical as part material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811618559.5A CN109530696B (en) | 2018-12-28 | 2018-12-28 | Selective laser melting forming method for substrate as part of part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811618559.5A CN109530696B (en) | 2018-12-28 | 2018-12-28 | Selective laser melting forming method for substrate as part of part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109530696A true CN109530696A (en) | 2019-03-29 |
| CN109530696B CN109530696B (en) | 2020-12-22 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111046535A (en) * | 2019-11-25 | 2020-04-21 | 暨南大学 | Laser processing heat distribution calculation method |
| CN116160204A (en) * | 2023-04-17 | 2023-05-26 | 中国空气动力研究与发展中心超高速空气动力研究所 | Optimized manufacturing method of hypersonic high-temperature wind tunnel water-cooling heat insulation device |
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| CN105358270A (en) * | 2013-07-10 | 2016-02-24 | 美铝公司 | Methods for producing forged products and other worked products |
| CN105728731A (en) * | 2016-03-18 | 2016-07-06 | 沈阳飞机工业（集团）有限公司 | Method for enhancing strength of cutting edge of tool through additive manufacturing technology |
| EP3321011A1 (en) * | 2016-11-10 | 2018-05-16 | MTU Aero Engines GmbH | Method for improving the surface quality of components made by additive manufacturing |
| CN108339984A (en) * | 2018-04-28 | 2018-07-31 | 攀钢集团攀枝花钢铁研究院有限公司 | The method of forge piece surface growth labyrinth based on silk material 3D printing |
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| CN103056365A (en) * | 2011-10-21 | 2013-04-24 | 普拉特及惠特尼火箭达因公司 | Additive manufacturing management of large part build mass |
| CN105358270A (en) * | 2013-07-10 | 2016-02-24 | 美铝公司 | Methods for producing forged products and other worked products |
| CN105728731A (en) * | 2016-03-18 | 2016-07-06 | 沈阳飞机工业（集团）有限公司 | Method for enhancing strength of cutting edge of tool through additive manufacturing technology |
| EP3321011A1 (en) * | 2016-11-10 | 2018-05-16 | MTU Aero Engines GmbH | Method for improving the surface quality of components made by additive manufacturing |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111046535A (en) * | 2019-11-25 | 2020-04-21 | 暨南大学 | Laser processing heat distribution calculation method |
| CN111046535B (en) * | 2019-11-25 | 2022-12-09 | 暨南大学 | Laser processing heat distribution calculation method |
| CN116160204A (en) * | 2023-04-17 | 2023-05-26 | 中国空气动力研究与发展中心超高速空气动力研究所 | Optimized manufacturing method of hypersonic high-temperature wind tunnel water-cooling heat insulation device |
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| Publication number | Publication date |
|---|---|
| CN109530696B (en) | 2020-12-22 |
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Denomination of invention: A Laser Selective Melting Forming Method for Substrates as Part of Parts Granted publication date: 20201222 Pledgee: Bank of China Tianjin Heping Branch Pledgor: TIANJIN RADIUM LASER TECHNOLOGY Co.,Ltd. Registration number: Y2024980010582 |