CN111046535A - Laser processing heat distribution calculation method - Google Patents
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- CN111046535A CN111046535A CN201911166561.8A CN201911166561A CN111046535A CN 111046535 A CN111046535 A CN 111046535A CN 201911166561 A CN201911166561 A CN 201911166561A CN 111046535 A CN111046535 A CN 111046535A
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Abstract
The invention relates to the technical field of laser processing, and particularly discloses a laser processing heat distribution calculation method which comprises the steps of (1) selecting a substrate and defining physical parameters of the substrate; (2) setting the initial temperature of the substrate, establishing a three-dimensional coordinate system on the substrate, and determining the initial conditions of the substrate; (3) defining physical parameters of the laser beam, and setting the energy distribution of the laser beam to be loaded in a Gaussian distribution heat flow density mode; (4) and vertically irradiating the laser beam on the surface of the substrate, moving the laser beam to load through the boundary condition of a surface heat source, determining the external condition of laser beam irradiation, and the like. According to the laser processing heat distribution calculation method, the laser beams are loaded on the substrate in the form of Gaussian distribution heat flux density, the three-dimensional thermal conductivity model is established, and the heat distribution condition of the substrate is calculated.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a laser processing heat distribution calculation method.
Background
According to the interaction mechanism of the laser beam and the material, the laser processing can be roughly divided into laser thermal processing and photochemical reaction processing, wherein the laser thermal processing refers to the processing process completed by utilizing the heat effect generated by the laser beam projected on the surface of the material, and the laser thermal processing comprises laser welding, laser engraving and cutting, surface modification, laser marking, laser drilling, micro processing and the like.
In order to simplify the heat source expression of laser irradiation on the material surface, the integral average value of the heat distribution on the heat source irradiation area is usually adopted to replace the real heat source distribution in the area (refer to "advanced laser manufacturing technology and its application", national defense industry press, edited by 2016 yu steel, etc.), which causes model errors, and thus accurate heat source distribution cannot be calculated.
Disclosure of Invention
Aiming at the technical problems in the prior art, the invention provides a laser processing heat distribution calculation method.
A laser processing heat distribution calculation method comprises the following steps:
(1) selecting a substrate and defining physical parameters of the substrate, wherein the physical parameters of the substrate at least comprise thickness X, surface radius R, density rho, specific heat capacity c, thermal conductivity kappa and melting point K;
(2) setting the initial temperature of the substrate to TaAnd establishing a three-dimensional coordinate system on the substrate, wherein the initial conditions of the substrate are as follows: t (x, y, z) & gtnon & gtt＝0＝Ta；
(3) Defining physical parameters of the laser beam including laser power P and beam radius rbSetting the energy distribution of the laser beam to be loaded in the form of Gaussian distribution heat flux density, and meeting the following requirements:
wherein α is the absorption coefficient of the substrate;
(4) the laser beam is vertically irradiated on the surface of the substrate, and is moved to load through the boundary condition of a surface heat source, so that the following conditions are met:
s belongs to omega; the boundary outside the laser irradiation region Ω is in contact with air, and the external conditions of laser beam irradiation are:
where, the thermal conductivity k is D · ρ c, D is the diffusivity, Ω is the laser irradiation region range, and h iscThe heat dissipation coefficient of the substrate surface is used;
(5) determining a three-dimensional thermal conductivity model, and performing conversion calculation on the three-dimensional thermal conductivity model; the three-dimensional thermal conductivity model satisfies the following conditions:
wherein t is the laser beam irradiation time;
(6) and calling Matlab software to perform numerical experiments.
Further, the step (5) of performing conversion calculation on the three-dimensional thermal conductivity model includes:
(501) the expansion is calculated as:
(502) converting the three-dimensional thermal conductivity model into a cylindrical coordinate form model:
further, the step (6) comprises the following steps:
(601) assigning experiment parameters including material, size, physical parameters, absorption coefficient α, and initial temperature T of the substrateaAnd physical parameters of the laser beam;
(602) and filling the numerical values into Matlab software for calculation and outputting a simulation result.
Further, the step (601) further includes setting the laser irradiation time t and the time step Δ t.
Further, in the step (601), the substrate is made of 316 stainless steel, the thickness X of the substrate is 0.3mm, the surface radius R of the substrate is 0.03mm, and the density rho of the substrate is 8 multiplied by 103kg/m3The substrate has a specific heat capacity c of 500J/(kg. K), a thermal conductivity κ of 21.5W/(m. K), a melting point K of 1673K, an absorption coefficient α of 1, and an initial temperature T of 1aIs 20 ℃;
laser power P is 200W, beam radius rbIs 0.5 mm.
Further, the laser irradiation time t is 0.001s, and the time step Δ t is 0.0001 s.
According to the laser processing heat distribution calculation method, the laser beams are loaded on the substrate in the form of Gaussian distribution heat flux density, a three-dimensional heat conduction model is established, cylindrical coordinates are introduced according to the propagation characteristics of the laser beams, the three-dimensional problem is converted into a two-dimensional problem, and the heat distribution condition of the substrate is calculated.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a flow chart of steps of a method of calculating a laser processing thermal profile according to an embodiment of the present invention;
FIG. 2 is a schematic three-dimensional coordinate diagram of a laser processing thermal distribution calculation method according to an embodiment of the present invention;
fig. 3 is an experimental simulation diagram of a laser processing thermal distribution calculation method according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a laser processing heat distribution calculation method, as shown in fig. 1, comprising the following steps:
step S101: selecting a substrate and defining physical parameters of the substrate, wherein the physical parameters of the substrate at least comprise thickness X, surface radius R, density rho, specific heat capacity c, thermal conductivity kappa and melting point K.
The density ρ, the specific heat capacity c, the thermal conductivity κ, and the melting point K are all related to the material selected for the substrate, and the substrate in this embodiment may be made of different materials according to different requirements.
Step S102: setting the initial temperature of the substrate to TaAnd establishing a three-dimensional coordinate system on the substrate, and determining the initial conditions of the substrate as follows: t (x, y, z) & gtnon & gtt＝0＝Ta。
x, y and z respectively represent an x axis, a y axis and a z axis of the three-dimensional coordinate system, and are specifically established as shown in FIG. 2.
Step S103: defining physical parameters of the laser beam including laser power P and beam radius rbSetting the energy distribution of the laser beam to be loaded in the form of Gaussian distribution heat flux density, and meeting the following requirements:
where α is the absorption coefficient of the substrate.
The embodiment of the invention sets the energy distribution of the laser beam as Gaussian distribution, namely, the energy distribution meets the following requirements:
therefore, the energy distribution of the laser beam is loaded in the form of Gaussian distribution heat flux density to meet the requirement
Step S104: the laser beam is vertically irradiated on the surface of the substrate, and is moved to load through the boundary condition of a surface heat source, so that the following conditions are met:
s belongs to omega; the boundary outside the laser irradiation region Ω is in contact with air, and the external conditions of laser beam irradiation are:
where, the thermal conductivity κ is D · ρ c, D is the diffusivity of the substrate, Ω is the laser irradiation region range, and h iscIs the heat dissipation coefficient of the substrate surface.
This step determines the boundary conditions and external conditions of the laser beam loading, respectively
s∈Ω，
Step S105: determining a three-dimensional thermal conductivity model, and performing conversion calculation on the three-dimensional thermal conductivity model; the three-dimensional thermal conductivity model satisfies the following conditions:
where t is the laser beam irradiation time.
With reference to steps S101 to S104, determining a three-dimensional thermal conductivity model by using all the limiting conditions, and performing conversion calculation on the three-dimensional thermal conductivity model, specifically:
step S1051: the expansion is calculated as:
step S1052: converting the three-dimensional thermal conductivity model into a cylindrical coordinate form model:
step S106: and calling Matlab software to perform numerical experiments.
Specifically, step S106 includes:
step S1061: assigning the experimental parametersThe number includes the material, size, physical parameters, absorption coefficient α, and initial temperature T of the substrateaAnd physical parameters of the laser beam;
step S1062: and filling the numerical values into Matlab software for calculation and outputting a simulation result.
Specifically, step S1061 of this embodiment further includes setting the laser irradiation time t and the time step Δ t.
Specifically, in step S1061 of this embodiment, the step of assigning the experimental parameters may be: the substrate is made of 316 stainless steel, the thickness X of the substrate is 0.3mm, the surface radius R of the substrate is 0.03mm, and the density rho of the substrate is 8 multiplied by 103kg/m3The substrate has a specific heat capacity c of 500J/(kg. K), a thermal conductivity κ of 21.5W/(m. K), a melting point K of 1673K, an absorption coefficient α of 1, and an initial temperature T of 1aIs 20 ℃; laser power P is 200W, beam radius rb0.5mm, the laser irradiation time t was 0.001s, and the time step Δ t was 0.0001 s.
As shown in fig. 3, which is a temperature distribution of the substrate after being irradiated by the laser beam according to the embodiment of the present invention, the experimental result shows that the temperature of the 316 stainless steel substrate is significantly changed (purple portion) only in the laser-affected region, i.e., the region near the radius r of 0, while the temperatures of the other regions (blue portions) relatively far away from the laser-affected region are substantially unchanged and maintained as the initial temperature.
According to the laser processing heat distribution calculation method, the laser beams are loaded on the substrate in the form of Gaussian distribution heat flux density, a three-dimensional heat conduction model is established, cylindrical coordinates are introduced according to the propagation characteristics of the laser beams, the three-dimensional problem is converted into a two-dimensional problem, and the heat distribution condition of the substrate is calculated.
The present invention has been further described with reference to specific embodiments, but it should be understood that the detailed description should not be construed as limiting the spirit and scope of the present invention, and various modifications made to the above-described embodiments by those of ordinary skill in the art after reading this specification are within the scope of the present invention.
Claims (6)
1. A laser processing heat distribution calculation method is characterized by comprising the following steps:
(1) selecting a substrate and defining physical parameters of the substrate, wherein the physical parameters of the substrate at least comprise thickness X, surface radius R, density rho, specific heat capacity c, thermal conductivity kappa and melting point K;
(2) setting the initial temperature of the substrate to TaAnd establishing a three-dimensional coordinate system on the substrate, wherein the initial conditions of the substrate are as follows: t (x, y, z) & gtnon & gtt＝0＝Ta；
(3) Defining physical parameters of the laser beam including laser power P and beam radius rbSetting the energy distribution of the laser beam to be loaded in the form of Gaussian distribution heat flux density, and meeting the following requirements:
wherein α is the absorption coefficient of the substrate;
(4) the laser beam is vertically irradiated on the surface of the substrate, and is moved to load through the boundary condition of a surface heat source, so that the following conditions are met:
s belongs to omega; the boundary outside the laser irradiation region Ω is in contact with air, and the external conditions of laser beam irradiation are:
wherein the thermal conductivity κ is D · ρ c, D is the diffusivity, Ω is the laser irradiation region range, and h iscThe heat dissipation coefficient of the substrate surface is used;
(5) determining a three-dimensional thermal conductivity model, and performing conversion calculation on the three-dimensional thermal conductivity model; the three-dimensional thermal conductivity model satisfies:
wherein t is the laser beam irradiation time;
(6) and calling Matlab software to perform numerical experiments.
2. The laser machining heat distribution calculation method according to claim 1, wherein the performing the conversion calculation on the three-dimensional thermal conductivity model in the step (5) includes:
(501) the expansion is calculated as:
(502) converting the three-dimensional thermal conductivity model into a cylindrical coordinate form model:
3. a laser machining heat distribution calculation method according to claim 2, wherein the step (6) includes:
(601) assigning experiment parameters including material, size, physical parameters, absorption coefficient α, and initial temperature T of the substrateaAnd a physical parameter of the laser beam;
(602) and filling the numerical values into Matlab software for calculation and outputting a simulation result.
4. A laser machining thermal distribution calculation method according to claim 3, wherein the step (601) further includes setting a laser irradiation time t and a time step Δ t.
5. The method according to claim 3, wherein the substrate in the step (601) is 316 stainless steel, the thickness X of the substrate is 0.3mm, the surface radius R of the substrate is 0.03mm, and the density p of the substrate is 8X 103kg/m3The substrate has a specific heat capacity c of 500J/(kg. K), a thermal conductivity K of 21.5W/(m. K), a melting point K of 1673K, an absorption coefficient α of 1, and an initial temperature T of 1aIs 20 ℃;
the laser power P is 200W, and the beam radius rbIs 0.5 mm.
6. The method of claim 4, wherein the laser irradiation time t is 0.001s, and the time step Δ t is 0.0001 s.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112032613A (en) * | 2020-08-11 | 2020-12-04 | 南京嘉视信电子有限公司 | Tunnel lamp capable of dissipating heat quickly and design method thereof |
| CN113369694A (en) * | 2021-04-25 | 2021-09-10 | 西安交通大学 | Double-beam coupling laser additive forming method and device |
| CN114248022A (en) * | 2021-11-19 | 2022-03-29 | 深圳市裕展精密科技有限公司 | Laser drilling method for plate, laser control system and storage medium |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101788459A (en) * | 2010-02-08 | 2010-07-28 | 暨南大学 | Quasi-continuous spectroscopic wavelength combination method |
| US20100292965A1 (en) * | 2009-05-18 | 2010-11-18 | Bekir Sami Yilbas | Method of modeling phase changes due to laser pulse heating |
| CN102955881A (en) * | 2012-10-30 | 2013-03-06 | 温州大学 | Method for calculating thermal fatigue failure probability of welding point of integrated circuit chip |
| DE102012015167A1 (en) * | 2012-07-31 | 2013-03-21 | Daimler Ag | Method for detecting faults in mold or thermoformed components, involves performing evaluation of heat distribution on predetermined pattern on surface of component for detecting faults in components |
| EP2754524A1 (en) * | 2013-01-15 | 2014-07-16 | Corning Laser Technologies GmbH | Method and apparatus for laser based processing of flat substrates using a laser beam line |
| CN109530696A (en) * | 2018-12-28 | 2019-03-29 | 天津镭明激光科技有限公司 | A kind of substrate melts manufacturing process as the selective laser of part a part |
| CN109883443A (en) * | 2019-02-19 | 2019-06-14 | 北京工业大学 | A kind of line structure optical sensor spatial attitude scaling method |
| CN110057444A (en) * | 2019-05-29 | 2019-07-26 | 中国人民解放军32027部队 | A kind of laser intensity inversion method based on inverse heat conduction problem |
-
2019
- 2019-11-25 CN CN201911166561.8A patent/CN111046535B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100292965A1 (en) * | 2009-05-18 | 2010-11-18 | Bekir Sami Yilbas | Method of modeling phase changes due to laser pulse heating |
| CN101788459A (en) * | 2010-02-08 | 2010-07-28 | 暨南大学 | Quasi-continuous spectroscopic wavelength combination method |
| DE102012015167A1 (en) * | 2012-07-31 | 2013-03-21 | Daimler Ag | Method for detecting faults in mold or thermoformed components, involves performing evaluation of heat distribution on predetermined pattern on surface of component for detecting faults in components |
| CN102955881A (en) * | 2012-10-30 | 2013-03-06 | 温州大学 | Method for calculating thermal fatigue failure probability of welding point of integrated circuit chip |
| EP2754524A1 (en) * | 2013-01-15 | 2014-07-16 | Corning Laser Technologies GmbH | Method and apparatus for laser based processing of flat substrates using a laser beam line |
| CN109530696A (en) * | 2018-12-28 | 2019-03-29 | 天津镭明激光科技有限公司 | A kind of substrate melts manufacturing process as the selective laser of part a part |
| CN109883443A (en) * | 2019-02-19 | 2019-06-14 | 北京工业大学 | A kind of line structure optical sensor spatial attitude scaling method |
| CN110057444A (en) * | 2019-05-29 | 2019-07-26 | 中国人民解放军32027部队 | A kind of laser intensity inversion method based on inverse heat conduction problem |
Non-Patent Citations (6)
| Title |
|---|
| CHENGHAO YUAN ET AL.: "A three-dimensional unconditionally stable ADI-FDTD method in the cylindrical coordinate system", 《 IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES》 * |
| MIHAIOANE ET AL.: "Mathematical modeling of two-photon thermal fields in laser–solid interaction", 《OPTICS & LASER TECHNOLOGY》 * |
| 丁宇等: "连续波1064nm激光辐照铝金属的热分布研究", 《光电技术应用》 * |
| 朱大伟等: "三维柱坐标ADI-FDTD算法及其CPML实现", 《微波学报》 * |
| 李艳丽等: "激光工艺参数对45钢淬透性能的影响", 《新技术新工艺》 * |
| 王金艳: "空心光泵浦半导体激光器的热特性研究", 《中国优秀博硕士学位论文全文数据库(硕士)信息科技辑》 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112032613A (en) * | 2020-08-11 | 2020-12-04 | 南京嘉视信电子有限公司 | Tunnel lamp capable of dissipating heat quickly and design method thereof |
| CN113369694A (en) * | 2021-04-25 | 2021-09-10 | 西安交通大学 | Double-beam coupling laser additive forming method and device |
| CN113369694B (en) * | 2021-04-25 | 2022-06-07 | 西安交通大学 | Double-beam coupling laser additive forming method and device |
| CN114248022A (en) * | 2021-11-19 | 2022-03-29 | 深圳市裕展精密科技有限公司 | Laser drilling method for plate, laser control system and storage medium |
| CN114248022B (en) * | 2021-11-19 | 2023-11-10 | 富联裕展科技(深圳)有限公司 | Laser drilling method for plate, laser control system and storage medium |
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