CN109530158A - A kind of device and method of the micro high viscosity glue transfer of electric field driven - Google Patents
A kind of device and method of the micro high viscosity glue transfer of electric field driven Download PDFInfo
- Publication number
- CN109530158A CN109530158A CN201811406482.5A CN201811406482A CN109530158A CN 109530158 A CN109530158 A CN 109530158A CN 201811406482 A CN201811406482 A CN 201811406482A CN 109530158 A CN109530158 A CN 109530158A
- Authority
- CN
- China
- Prior art keywords
- glue
- slide unit
- automatic slide
- plastic pin
- syringe needle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
Abstract
The present invention provides a kind of device and method of the micro high viscosity glue transfer of electric field driven, belongs to micro parts and microelectronic component assembly assembling field.The device includes electric field controls part and mechanical part；Electric field controls part includes high voltage power supply, power switch, point plastic pin, storage Jiao Chi and ammeter；Mechanical part includes a point plastic pin, storage Jiao Chi, the first temperature control objective table, the second temperature control objective table, the automatic slide unit of Y-direction, syringe needle fixture, the automatic slide unit of Z-direction, X to automatic slide unit, the first column, the second column, substrate and workpiece to be glued.Single of the invention take glue amount nanoliter~picoliters magnitude, do not need to process very thin syringe needle, can be achieved with the transfer of micro high viscosity glue using the syringe needle of grade diameter.Glue consumption is very small, saves production cost.Without the drive control components such as glue dispensing valve, pressure pump, plunger pump and pipeline, equipment cost is saved.System operatio is simple, and aid in treatment link is few, is easy to industry spot use.
Description
Technical field
The invention belongs to micro parts and microelectronic component to assemble assembling field, and the micro height for being related to a kind of electric field driven is viscous
Spend the device and method of glue transfer.
Background technique
Being glued together multiple milli machine parts or microelectronic component using liquid glue is in millimeter-micro-meter scale dress
Main path with connection, key be by nanoliter~glue of picoliters magnitude is transferred to wait be bonded on part.Currently, injecting type
Dispensing technology is most widely used, however it is only applicable to the lower glue of viscosity.For high viscosity glue (> 1Pas), then
Due to the restriction by viscous drag, need very high pressure that could spray generation nanoliter~picoliters magnitude glue drop, Er Qie
It is easy to appear bubble in syringe and remains rotten glue, needs filler and cleaning treatment, operates relatively complicated.
In the prior art, it has been reported that by taking glue-transfer method to realize the transfer operation to liquid, to avoid jetting type liquid
The intrinsic problem of body transfer." one kind is remaining based on liquid for the patent of invention of the Patent No. such as square group CN201410640394.7
Ultramicron liquid drop control device and method " is realized super to taking the close and distant liquid of liquid probe progress modified using the method for dipping-shifting
Micro liquid drop control controls droplet size by adjusting the area and immersion depth that take liquid probe.Open the Patent No. such as diligent
The patent of invention " ultra-micro glue dispensing device and method " of CN201210471207.8 be it is a kind of by liquid-transfering needle and glass-micropipe it
Between relative motion, realize that the quantitative method of glue, gum spot size mainly pass through syringe needle in liquid-transfering needle front end absorption glue drop
Area control.It is mainly controlled using the compatibility between the geomery of liquid-transfering needle or liquid relief needle surface and liquid with upper type
The amount of liquid processed, it is entirely different with the technical solution of the application patent.
Summary of the invention
The present invention is to solve the transport difficulties of micro high viscosity glue in micro parts glue connection technique, proposes that a kind of electric field drives
The high viscosity glue transfer device and method of dynamic micro (nanoliter~picoliters magnitude).This method is by being applied to storage Jiao Chi and point
Extra electric field between plastic pin, induction glue charge are moved to gas glue interface under polarization, pass through gas glue interface charge institute
By the effect of dragging of electric field force, the tapered rising of glue is driven, until reaching micron-sized point contact with a plastic pin；Pass through electric current
After jump judges that glue is contacted with point plastic pin, driving point plastic pin rises, and the liquid bridge between glue Chi Yudian plastic pin is broken, in dispensing
Micro glue is obtained on needle, and finally by transfer modes, the glue on dispensing needle head is transferred to workpiece surface to be glued.
The technical solution adopted by the present invention:
A kind of device of the micro high viscosity glue transfer of electric field driven, which includes electric field controls part and Machinery Ministry
Point.
The electric field controls part includes high voltage power supply 1, power switch 2, point plastic pin 3, storage glue pond 4 and ammeter 5.It is high
1 anode of voltage source is connected with power switch 2, and power switch 2 is connected with point plastic pin 3, glue surface of the point plastic pin 3 perpendicular to storage glue pond 4.
It stores up 4 bottom surface of glue pond and connects ammeter 5, ammeter 5 is connect with 1 cathode of high voltage power supply, constitutes circuit.
The mechanical part includes point plastic pin 3, storage glue pond 4, the first temperature control objective table 6, the second temperature control objective table 7, Y-direction
Automatic slide unit 8, syringe needle fixture 9, the automatic slide unit 10 of Z-direction, X are to automatic slide unit 11, the first column 12, the second column 13, substrate 14
With workpiece 15 to be glued.First column 12, the second column 13 are respectively arranged at the both ends of substrate 14, and X is arranged to automatic slide unit 11
Between the first column 12 and the second column 13, it is parallel to substrate 14；The automatic slide unit 10 of Z-direction is vertically arranged at X to automatic slide unit
On 11, the automatic slide unit 8 of Y-direction is set on substrate 14；First temperature control objective table 6 and the second temperature control objective table 7 are arranged side by side on Y-direction
On automatic slide unit 8, it is respectively used to the temperature of control glue and the temperature of workpiece to be glued, syringe needle fixture 9 is assemblied in Z-direction and slides automatically
On platform 10, point plastic pin 3 is fixed on syringe needle fixture 9；Storage glue pond 4 is placed on the first temperature control objective table 6, and workpiece 15 to be glued is logical
Pressing plate is crossed to be fixed on the second temperature control objective table 7.
The syringe needle fixture 9 includes insulating sleeve 9a, syringe needle mounting plate 9b, holding screw 9c and binding post lead-out wire
9d；Syringe needle mounting plate 9b is fixed on the automatic slide unit 10 of Z-direction, and insulating sleeve 9a is fixed on syringe needle mounting plate 9b, and point plastic pin 3 fills
In the insulating sleeve 9a with stepped hole, and is realized and fixed by holding screw 9c.The material of the syringe needle fixture 9 is exhausted
Edge material.
A kind of method of the micro high viscosity glue transfer of electric field driven, steps are as follows:
Step 1: workpiece 15 to be glued is fixed on the second temperature control objective table 7 by pressing plate；By the storage glue pond 4 of glue
It is placed on the first temperature control objective table 6, glue and workpiece 15 to be glued is made to be kept at the temperature for being suitble to operation, the thickness of glue
Degree stores up 4 bottom surface of glue pond and connects 1 cathode of high voltage power supply, point plastic pin 3 connects 1 anode of high voltage power supply in millimeter magnitude；
Step 2: the automatic slide unit 8 of driving Y-direction, the automatic slide unit 10 of Z-direction, X are moved to automatic slide unit 11, move a plastic pin 3
To 4 top of storage glue pond, is controlled by carrying out height calibration and the amount of feeding in advance to the automatic slide unit of Z-direction 10, make syringe needle apart from glue
Liquid surface is in the position of 0.2~2mm.
Step 3: adjusting the output valve of high voltage power supply 1 according to glue type, apply between plastic pin 3 and storage glue pond 4 >
The voltage of 800V, glue charge is moved to gas glue interface by polarization at this time, and glue passes through suffered by the charge at gas glue interface
The effect of dragging that electric field force generates is tapered to climb.Pass through 5 real-time monitoring curent change of ammeter during glue climbs, when
Electric current occurs rising mutation, shows that glue is in contact with the end of plastic pin 3, and the automatic slide unit 10 of Z-direction is believed by current break
Number triggering and rapid increase, drive thereon point plastic pin 3 break storage glue pond 4 and put plastic pin 3 between liquid bridge, in plastic pin 3
End obtain micro glue.
Step 4: switch 2 of cutting off the power, the automatic slide unit 8 of driving Y-direction, the automatic slide unit 10 of Z-direction, X are transported to automatic slide unit 11
It is dynamic, so that the glue on a plastic pin 3 is in contact with workpiece 15 to be glued；Automatic 10 rapid increase of slide unit of Z-direction is driven, by micro glue
It is transferred on workpiece 15 to be glued.
The size of glue transfer glue amount is controlled by the trigger value of applied voltage, the syringe needle rate of climb, current break, this
The specific value of parameters and viscosity, dielectric constant, the conductivity of glue etc. are related a bit.
Beneficial effects of the present invention: single of the invention take glue amount nanoliter~picoliters magnitude, do not need processing it is very thin
Syringe needle, can be achieved with the transfer of micro high viscosity glue using the syringe needle of grade diameter.Glue consumption is very small, saves
Production cost.Without the drive control components such as glue dispensing valve, pressure pump, plunger pump and pipeline, equipment cost is saved.System
Easy to operate, aid in treatment link is few, is easy to industry spot use.
Detailed description of the invention
Fig. 1 is the control principle drawing for the device that the micro high viscosity glue of electric field driven shifts.
Fig. 2 is the mechanical structure main view of the micro high viscosity glue transfer device of electric field driven.
Fig. 3 is device for mechanical the structure left view that the micro high viscosity glue of electric field driven shifts.
Fig. 4 is the syringe needle clamp structure figure of insulating materials preparation.
In figure: 1 high voltage power supply；2 power switches；3 plastic pins；4 storage Jiao Chi；5 ammeters；6 first temperature control objective tables；7
Two temperature control objective tables；8Y is to automatic slide unit；9 syringe needle fixtures；9a insulating sleeve；9b syringe needle mounting plate；9c holding screw；9d wiring
Column lead-out wire；10Z is to automatic slide unit；11X is to automatic slide unit；12 first columns；13 second columns；14 substrates；15 works to be glued
Part.
Specific embodiment
Technical solution of the present invention is further detailed below in conjunction with specific embodiments and the drawings.
By taking the transfer of the nanoliter level of the viscosity up to epoxide-resin glue of 70Pa.s as an example, elaborated in conjunction with attached drawing of the invention
Specific embodiment is as follows.
Fig. 1 shows the control principle drawings of micro high viscosity glue transfer device.Electric field controls part include high voltage power supply 1,
Power switch 2, point plastic pin 3, storage glue pond 4, ammeter 5.High voltage power supply 1 anode be connected with power switch 2, power switch 2 and
Point plastic pin 3 is connected, and point plastic pin 3 forms needle to board electrode structure perpendicular to storage 4 glue surface of glue pond.It is received to connection the bottom surface for storing up glue pond 4
Pacify 5 one end of grade ammeter, the other end of na level ammeter 5 connects with the cathode of high voltage power supply 1, constitutes circuit.
Fig. 2 is the device for mechanical structural front view of micro high viscosity glue transfer.Fig. 3 is the micro high viscosity of electric field driven
Device for mechanical the structure left view of glue transfer.The device includes point plastic pin 3, storage glue pond 4, first the 6, second temperature of temperature control objective table
Objective table 7, the automatic slide unit 8 of Y-direction, syringe needle fixture 9, the automatic slide unit 10 of Z-direction, X are controlled to automatic slide unit 11, the first column 12, second
Column 13, substrate 14 and workpiece to be glued 15.
First temperature control objective table 6 and the second temperature control objective table 7 are arranged side by side on the automatic slide unit 8 of Y-direction, are respectively used to control
The temperature of the temperature of glue and workpiece to be glued, syringe needle fixture 9 are assemblied on the automatic slide unit 10 of Z-direction, and point plastic pin 3 is fixed on syringe needle
On fixture 9；Storage glue pond 4 is placed on the first temperature control objective table 6, and workpiece 15 to be glued is fixed on the second temperature control loading by pressing plate
On platform 7.
Fig. 4 is the cross-sectional view of syringe needle fixture 9, and syringe needle fixture 9 includes insulating sleeve 9a, syringe needle mounting plate 9b, holding screw
9c and binding post lead-out wire 9d；Syringe needle mounting plate 9b is fixed on the automatic slide unit 10 of Z-direction, and insulating sleeve 9a is fixed on mounting plate 9b
On, point plastic pin 3 is mounted in the insulating sleeve 9a with stepped hole, and is realized and fixed by holding screw 9c.The material of syringe needle fixture 9
Matter is insulating materials.
A kind of the step of micro high viscosity glue transfer of electric field driven, is as follows:
Step 1: by being fixed on the second temperature control objective table 7 to the workpiece to be glued 15 of glue connection by pressing plate；By glue
Storage glue pond 4 is placed on the first temperature control objective table 6, so that glue is maintained at 20 DEG C of constant temperature, it is negative that storage 4 bottom surface of glue pond connects high voltage power supply 1
Pole, the needle diameter of selected point plastic pin 3 are 1mm, and point 3 binding post lead-out wire 9d of plastic pin is connected with 1 anode of high voltage power supply, and passes through
Holding screw 9c is fixed in syringe needle fixture 9, and syringe needle fixture 9 is mounted on the automatic slide unit 10 of Z-direction by bolt.
Step 2: the automatic slide unit 8 of driving Y-direction, the automatic slide unit 10 of Z-direction, X are moved to automatic slide unit 11, move a plastic pin 3
Make syringe needle apart from glue surface by carrying out height calibration and amount of feeding control to the automatic slide unit of Z-direction to 4 top of storage glue pond
In the position of 0.8mm.
Step 3: the output valve of high voltage power supply 1 is adjusted, in plastic pin 3 for the viscosity up to epoxide-resin glue of 70Pa.s
Apply 1200V voltage between storage glue pond 4, glue charge is migrated under polarization to gas glue interface at this time, and glue passes through gas
The effect of dragging of electric field force suffered by glue interface charge is tapered to climb.During glue climbs 5 indicating value of ammeter 0.1~
0.3nA range, when current break is to 3nA, the automatic slide unit 10 of Z-direction is by the triggering of current break signal with the speed of 5mm/s
Rise, the liquid bridge between plastic pin 3 and glue pond 4 is broken, the epoxy resin adhesive liquid of about 1nL is obtained on plastic pin 3.
Step 4: switch 2 of cutting off the power, the automatic slide unit 8 of driving Y-direction, the automatic slide unit 10 of Z-direction, X are transported to automatic slide unit 11
It is dynamic, so that the glue on a plastic pin 3 is in contact with workpiece 15 to be glued；The automatic slide unit 10 of Z-direction is driven to rise with the speed of 1mm/s,
Epoxy resin adhesive liquid is transferred on workpiece 15 to be glued, glue transfer process is completed.
Claims (3)
1. the device that a kind of micro high viscosity glue of electric field driven shifts, which is characterized in that the device includes electric field controls portion
Point and mechanical part；
The electric field controls part includes high voltage power supply (1), power switch (2), point plastic pin (3), storage Jiao Chi (4) and ammeter
(5)；High voltage power supply (1) anode is connected with power switch (2), and power switch (2) is connected with point plastic pin (3), and point plastic pin (3) is vertical
In the glue surface of storage Jiao Chi (4)；(4) bottom surface Jiao Chi connection ammeter (5) is stored up, ammeter (5) is connect with high voltage power supply (1) cathode,
Constitute circuit；
The mechanical part includes point plastic pin (3), storage Jiao Chi (4), the first temperature control objective table (6), the second temperature control objective table
(7), the automatic slide unit of Y-direction (8), syringe needle fixture (9), the automatic slide unit of Z-direction (10), X to automatic slide unit (11), the first column (12),
Second column (13), substrate (14) and workpiece to be glued (15)；First column (12), the second column (13) are respectively arranged at substrate
(14) both ends, X are set between the first column (12) and the second column (13) to automatic slide unit (11), are parallel to substrate
(14)；The automatic slide unit of Z-direction (10) is vertically arranged at X on automatic slide unit (11), and the automatic slide unit of Y-direction (8) is set to substrate (14)
On；First temperature control objective table (6) and the second temperature control objective table (7) are arranged side by side on the automatic slide unit of Y-direction (8), are respectively used to control
The temperature of the temperature of glue liquid and workpiece to be glued, syringe needle fixture (9) are assemblied on the automatic slide unit of Z-direction (10), and point plastic pin (3) is solid
It is scheduled on syringe needle fixture (9)；Storage Jiao Chi (4) is placed on the first temperature control objective table (6), and workpiece (15) to be glued is solid by pressing plate
It is scheduled on the second temperature control objective table (7).
2. the device that a kind of micro high viscosity glue of electric field driven according to claim 1 shifts, which is characterized in that institute
The syringe needle fixture (9) stated includes insulating sleeve (9a), syringe needle mounting plate (9b), holding screw (9c) and binding post lead-out wire
(9d)；Syringe needle mounting plate (9b) is fixed on the automatic slide unit of Z-direction (10), and insulating sleeve (9a) is fixed on syringe needle mounting plate (9b)
On, point plastic pin (3) is mounted in the insulating sleeve (9a) with stepped hole, and is realized and fixed by holding screw (9c)；Described
The material of syringe needle fixture (9) is insulating materials.
3. the method for the micro high viscosity glue transfer using a kind of any electric field driven of claims 1 or 2, feature
It is, steps are as follows:
Step 1: workpiece (15) to be glued is fixed on the second temperature control objective table (7) by pressing plate；By the storage Jiao Chi of glue
(4) it is placed on the first temperature control objective table (6), glue and workpiece to be glued (15) is made to be kept at the temperature for being suitble to operation,
The thickness of glue stores up Jiao Chi (4) bottom surface and connects high voltage power supply (1) cathode, point plastic pin (3) is connecing high voltage power supply (1) just in millimeter magnitude
Pole；
Step 2: the driving automatic slide unit of Y-direction (8), the automatic slide unit of Z-direction (10), X make a plastic pin (3) to automatic slide unit (11) movement
It moves to above storage Jiao Chi (4), is controlled by carrying out height calibration and the amount of feeding in advance to the automatic slide unit of Z-direction (10), make needle
Head is apart from glue surface in the position of 0.2~2mm；
Step 3: adjusting the output valve of high voltage power supply (1) according to glue type, applied between a plastic pin (3) and storage Jiao Chi (4)
Add > the voltage of 800V, glue charge is moved to gas glue interface by polarization at this time, and glue passes through the charge institute at gas glue interface
It tapered is climbed by the effect of dragging that electric field force generates；Become during glue climbs by ammeter (5) real-time monitoring electric current
Change, is mutated when rising occurs in electric current, shows that glue is in contact with the end of a plastic pin (3), the automatic slide unit of Z-direction (10) passes through electricity
Flow the triggering of jump signal and rapid increase, the point plastic pin (3) for driving thereon are broken storage Jiao Chi (4) and put between plastic pin (3)
Liquid bridge obtains micro glue in the end of a plastic pin (3)；
Step 4: cut off the power switch (2), the driving automatic slide unit of Y-direction (8), the automatic slide unit of Z-direction (10), X are to automatic slide unit (11)
Movement, makes the glue on a plastic pin (3) be in contact with workpiece to be glued (15)；The automatic slide unit of Z-direction (10) rapid increase is driven, it will
Micro glue is transferred on workpiece to be glued (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811406482.5A CN109530158B (en) | 2018-11-23 | 2018-11-23 | Electric field driven trace high-viscosity glue liquid transfer device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811406482.5A CN109530158B (en) | 2018-11-23 | 2018-11-23 | Electric field driven trace high-viscosity glue liquid transfer device and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109530158A true CN109530158A (en) | 2019-03-29 |
| CN109530158B CN109530158B (en) | 2020-11-03 |
Family
ID=65850116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811406482.5A Active CN109530158B (en) | 2018-11-23 | 2018-11-23 | Electric field driven trace high-viscosity glue liquid transfer device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109530158B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109876991A (en) * | 2019-04-10 | 2019-06-14 | 中南大学 | A kind of dispenser system |
| CN110470523A (en) * | 2019-09-20 | 2019-11-19 | 北京理工大学 | A kind of splicing sample making apparatus and method |
| CN110918384A (en) * | 2019-11-21 | 2020-03-27 | 沈阳工业大学 | Ultra-precise dispensing system and method |
| CN112903177A (en) * | 2020-12-23 | 2021-06-04 | 大连理工大学 | Electrostatic transfer printing head integrating micro-force detection and using method thereof |
| CN113262944A (en) * | 2021-05-31 | 2021-08-17 | 商丘师范学院 | Micro-distribution device and method for magnetically-excited magnetic-conduction high-viscosity glue solution |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2921831Y (en) * | 2006-07-14 | 2007-07-11 | 四川大学 | Efficient capillary electrophoresis apparatus |
| CN101678373A (en) * | 2007-05-17 | 2010-03-24 | 玛丽皇后与西田学院 | Electrostatic spraying device and method of electrostatic spraying |
| US20140322451A1 (en) * | 2013-04-26 | 2014-10-30 | The Regents Of The University Of Michigan | Electrohydrodynamic jet printing device with extractor |
| JP2015213905A (en) * | 2015-05-15 | 2015-12-03 | 国立研究開発法人産業技術総合研究所 | Liquid electrospray method and liquid electrospray apparatus |
| CN105483002A (en) * | 2016-01-27 | 2016-04-13 | 河海大学常州校区 | Dosage-controllable microinjection device and operation method thereof |
| WO2016140570A1 (en) * | 2015-03-05 | 2016-09-09 | Technische Universiteit Delft | Tailored micro-particles |
| CN106772991A (en) * | 2016-12-13 | 2017-05-31 | 孙安辰 | A kind of optical microscope system and its detection method based on drop |
| CN106909011A (en) * | 2017-05-10 | 2017-06-30 | 上海天马微电子有限公司 | A kind of electronic paper display panel, driving method and display device of electronic paper |
| CN206577977U (en) * | 2017-03-20 | 2017-10-24 | 庄英才 | A kind of intelligent point gum machine |
| CN107486348A (en) * | 2017-09-11 | 2017-12-19 | 北京工业大学 | Droplet ejection device on demand is combined in a kind of push-and-pull |
| CN108339581A (en) * | 2018-03-30 | 2018-07-31 | 南京理工大学 | Surface microlayer model based on dielectrophoresis allots structure, preparation method and allots method |
-
2018
- 2018-11-23 CN CN201811406482.5A patent/CN109530158B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2921831Y (en) * | 2006-07-14 | 2007-07-11 | 四川大学 | Efficient capillary electrophoresis apparatus |
| CN101678373A (en) * | 2007-05-17 | 2010-03-24 | 玛丽皇后与西田学院 | Electrostatic spraying device and method of electrostatic spraying |
| US20140322451A1 (en) * | 2013-04-26 | 2014-10-30 | The Regents Of The University Of Michigan | Electrohydrodynamic jet printing device with extractor |
| WO2016140570A1 (en) * | 2015-03-05 | 2016-09-09 | Technische Universiteit Delft | Tailored micro-particles |
| JP2015213905A (en) * | 2015-05-15 | 2015-12-03 | 国立研究開発法人産業技術総合研究所 | Liquid electrospray method and liquid electrospray apparatus |
| CN105483002A (en) * | 2016-01-27 | 2016-04-13 | 河海大学常州校区 | Dosage-controllable microinjection device and operation method thereof |
| CN106772991A (en) * | 2016-12-13 | 2017-05-31 | 孙安辰 | A kind of optical microscope system and its detection method based on drop |
| CN206577977U (en) * | 2017-03-20 | 2017-10-24 | 庄英才 | A kind of intelligent point gum machine |
| CN106909011A (en) * | 2017-05-10 | 2017-06-30 | 上海天马微电子有限公司 | A kind of electronic paper display panel, driving method and display device of electronic paper |
| CN107486348A (en) * | 2017-09-11 | 2017-12-19 | 北京工业大学 | Droplet ejection device on demand is combined in a kind of push-and-pull |
| CN108339581A (en) * | 2018-03-30 | 2018-07-31 | 南京理工大学 | Surface microlayer model based on dielectrophoresis allots structure, preparation method and allots method |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109876991A (en) * | 2019-04-10 | 2019-06-14 | 中南大学 | A kind of dispenser system |
| CN110470523A (en) * | 2019-09-20 | 2019-11-19 | 北京理工大学 | A kind of splicing sample making apparatus and method |
| CN110470523B (en) * | 2019-09-20 | 2021-01-29 | 北京理工大学 | Glue joint sample manufacturing device and method |
| CN110918384A (en) * | 2019-11-21 | 2020-03-27 | 沈阳工业大学 | Ultra-precise dispensing system and method |
| CN110918384B (en) * | 2019-11-21 | 2021-05-14 | 沈阳工业大学 | Ultra-precise dispensing system and method |
| CN112903177A (en) * | 2020-12-23 | 2021-06-04 | 大连理工大学 | Electrostatic transfer printing head integrating micro-force detection and using method thereof |
| CN113262944A (en) * | 2021-05-31 | 2021-08-17 | 商丘师范学院 | Micro-distribution device and method for magnetically-excited magnetic-conduction high-viscosity glue solution |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109530158B (en) | 2020-11-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109530158A (en) | A kind of device and method of the micro high viscosity glue transfer of electric field driven | |
| JP5096835B2 (en) | ACF pasting device and flat panel display manufacturing device | |
| CN102101097B (en) | Ultra-micro glue dispensing device and method | |
| CN104051281A (en) | Device and method for conducting plastic package forming and bottom-filling on flip chip through ultrasonic vibration assistance | |
| TW201015147A (en) | Substrate processing apparatus and substrate carrying method | |
| CN108144789B (en) | Injection valve | |
| CN112635336B (en) | High efficiency underfill process | |
| CN107139569B (en) | Online type Maila hot pressing equipment | |
| CN101786068B (en) | Spot gluing valve based on giant magnetostrictive rod drive | |
| CN103203294B (en) | Electromagnetic micro jet device | |
| CN206286136U (en) | A kind of automatic dispensing device | |
| CN205495934U (en) | SMT paster is from moving point machine of gluing | |
| JPH09270442A (en) | Conductive balls mounting apparatus and method for mounting | |
| CN211190788U (en) | Online high-speed jet dispenser | |
| JP2002368395A (en) | Method for fixing component by thermal compression bonding and apparatus therefor | |
| KR101167658B1 (en) | Having glue supply controller semiconductor die bonding apparatus | |
| CN116575098B (en) | Data recording processing device for wafer processing | |
| CN205833558U (en) | A kind of screw control | |
| CN205749418U (en) | A kind of thin layer chromatography spot sample device | |
| CN219943484U (en) | Glue brushing mechanism for PIN diode production | |
| JP2765190B2 (en) | Flip chip bonding equipment | |
| CN219580968U (en) | Supplementary mucilage binding of wafer bonding is put | |
| CN115400912B (en) | Automatic gluing device and method for ceramic wafer of inverter | |
| CN220243617U (en) | Needle cylinder solder paste split charging equipment | |
| CN111174119B (en) | Manufacturing method of LED flexible filament |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |