CN115400912B - Automatic gluing device and method for ceramic wafer of inverter - Google Patents
Automatic gluing device and method for ceramic wafer of inverter Download PDFInfo
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- CN115400912B CN115400912B CN202211179367.5A CN202211179367A CN115400912B CN 115400912 B CN115400912 B CN 115400912B CN 202211179367 A CN202211179367 A CN 202211179367A CN 115400912 B CN115400912 B CN 115400912B
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- gluing
- inverter
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- 239000000919 ceramic Substances 0.000 title claims abstract description 108
- 238000004026 adhesive bonding Methods 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 12
- 239000003292 glue Substances 0.000 claims abstract description 48
- 239000011248 coating agent Substances 0.000 claims abstract description 16
- 238000000576 coating method Methods 0.000 claims abstract description 16
- 210000001503 joint Anatomy 0.000 claims abstract description 3
- 230000007246 mechanism Effects 0.000 claims description 131
- 238000003825 pressing Methods 0.000 claims description 8
- 230000002572 peristaltic effect Effects 0.000 claims description 4
- 230000007306 turnover Effects 0.000 claims description 4
- 238000003860 storage Methods 0.000 claims description 2
- 238000005086 pumping Methods 0.000 claims 1
- 239000000084 colloidal system Substances 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 description 8
- 238000007790 scraping Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000005002 finish coating Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/002—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the work consisting of separate articles
- B05C5/004—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the work consisting of separate articles the work consisting of separate rectangular flat articles, e.g. flat sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/04—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to opposite sides of the work
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides an automatic gluing device and method for an inverter ceramic wafer. The gluing device comprises a gluing grid plate device, a transfer table device, a positioning frame and a position retainer. Firstly, gluing the first surface of the ceramic wafer through a middle turntable device and a gluing grid plate device; and then the ceramic sheet is transferred to a radiator, and the second surface of the ceramic sheet is glued by using a gluing grid plate device. The positioning frame facilitates the high-precision butt joint of the middle rotary table and the radiator to transfer the ceramic plate, and the position retainer can effectively prevent the ceramic plate from being attached to the lower surface of the grid plate. By adopting the technical scheme of the invention, the glue coating operation can be synchronously carried out on all ceramic plates of the inverter, and the operation efficiency is high; the small interval gap is arranged between the punctiform colloids passing through the hollow holes of the grid plate, so that the colloid can be ensured to have an expansion space after temperature rise; the heat-conducting glue is uniformly distributed on the surface of the ceramic plate, so that high-efficiency heat transfer of all the ceramic plates can be ensured, heat of power components can be timely emitted, and further the reliability of an inverter product is improved.
Description
The application is a divisional application of patent application of which the application date is 2022, 3 and 28, the application number is 202210316972.6, and the invention name is an inverter ceramic wafer gluing device and a gluing method.
Technical Field
The invention relates to the technical field of heat-conducting glue coating, in particular to an automatic gluing device and a gluing method for an inverter ceramic wafer.
Background
In general, an inverter has a plurality of power components, which generate a large amount of heat, and the heat needs to be dissipated in time by a radiator. The heat sink is generally made of conductive metal, and heat is generally transferred between the power device and the heat sink through a ceramic plate in order to ensure electrical safety of the power device. In order to improve the contact bonding degree between the surface of the ceramic plate and the power component and the radiator, the two surfaces of the ceramic plate are required to be coated with heat conducting glue respectively. At present, the coating of the heat-conducting glue is generally carried out by adopting a manual coating or dispensing machine, the manual coating glue quantity is not accurately controlled, the glue coating uniformity is difficult to stably control, and the coating efficiency is low; the dispensing machine coating can control the dispensing amount, but the heat conducting colloid is unevenly distributed on the surface of the heat conducting ceramic plates, the ceramic plates are not in the same plane, and it is difficult to ensure that each ceramic plate can be fully contacted with the power component and the radiator to keep high heat conducting performance.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention aims to provide an inverter ceramic wafer gluing device and an inverter ceramic wafer gluing method.
In order to achieve the above purpose, the technical scheme adopted by the invention for solving the technical problems is as follows: an inverter ceramic wafer glue applicator comprising:
the gluing grid plate device comprises a grid plate, wherein hollow grid areas are arranged on the grid plate, the hollow grid areas are provided with hollow holes distributed in an array, and the number and the positions of the hollow grid areas are consistent with those of the ceramic plates of the inverter;
the transfer table device comprises a transfer table and a pushing plate mechanism, wherein a plurality of ceramic plate regulation grooves are formed in the upper surface of the transfer table, a through ejection hole is formed in a groove body of each ceramic plate regulation groove, the pushing plate mechanism comprises a pushing plate, a reset mechanism and a plurality of ejection rods, the ejection rods are vertically arranged on the pushing plate and are matched with the ejection holes, and the reset mechanism is used for generating driving force for the pushing plate far away from the bottom surface of the transfer table;
the inner frame wall of the positioning frame is matched with the outer contour side wall of the upper surface of the middle rotary table and the outer contour side wall of the upper surface of the inverter radiator;
the position retainer comprises an upper plate body and a plurality of ejector rods, the ejector rods are vertically and downwardly extended from the lower surface of the upper plate body, the number of the ejector rods is at least equal to that of ceramic plates on the inverter, at least one ejector rod corresponds to the position right above each ceramic plate, the lower half part of each ejector rod is conical, and the conical tip is downward.
By adopting the technical scheme of the invention, the glue coating operation can be synchronously carried out on all ceramic plates of the inverter, and the operation efficiency is high; the small interval gap is arranged between the punctiform colloids passing through the hollow holes of the grid plate, so that the colloid can be ensured to have an expansion space after temperature rise; the heat-conducting glue is uniformly distributed on the surface of the ceramic plate, so that high-efficiency heat transfer of all the ceramic plates can be ensured, heat of power components can be timely emitted, and further the reliability of an inverter product is improved.
Further, the gluing grid plate device further comprises a base, a support frame and a clamping mechanism, wherein the support frame is fixedly arranged on the base, the clamping mechanism is arranged on the support frame and comprises a clamping plate and a clamping screw rod, the clamping screw rod is connected onto the clamping plate through threads, and the edge of the grid plate is clamped between the clamping plate and the clamping screw rod.
Further, the clamping mechanism is arranged on the supporting frame in an up-and-down swinging manner.
By adopting the preferable scheme, the operation and the use of the grid plate are convenient.
Further, the gluing grid plate device further comprises an XY position adjusting mechanism and an upper placing platform, wherein the XY position adjusting mechanism is installed on the base, and the upper placing platform is installed on a moving block of the XY position adjusting mechanism.
By adopting the preferable scheme, the gluing position is convenient to adjust.
Further, an X-direction positioning backup plate and a Y-direction positioning backup plate are arranged on the upper placing platform.
By adopting the preferable scheme, the transfer table device or the radiator can be conveniently and rapidly aligned before gluing.
Further, the proportion of the area of the hollowed holes of the hollowed grid area to the area of the hollowed grid area is more than 80%.
By adopting the preferable scheme, the gluing area of the heat conducting glue is ensured.
Further, the height of the transfer table is the same as the height of the inverter radiator.
By adopting the preferable scheme, when the two sides of the ceramic sheet are coated with glue twice, the height position of the grid plate is shared, and the height position of the grid plate is not required to be adjusted.
Further, the reset mechanism is a reset spring sleeved on the periphery of the ejector rod, and two ends of the reset spring respectively lean against the middle rotary table and the push plate.
By adopting the preferable scheme, the device has the advantages of simple structure, reliable performance and low manufacturing cost.
An inverter ceramic wafer gluing method comprises the following steps:
step 1, placing ceramic plates in a ceramic plate regulation groove of a transfer table;
step 2, gluing the first surface, namely moving the transfer table device to the lower part of the grid plate, introducing heat-conducting glue to the upper surface of the grid plate, scraping the heat-conducting glue along the upper surface of the grid plate by using a scraper, pressing the ceramic plate from the upper part of the grid plate by using a position retainer through the hollowed-out holes, and lifting the grid plate to finish gluing the first surface of the ceramic plate;
step 3, transferring the ceramic sheet, sleeving a positioning frame on the periphery of the top of the transfer table, reversely placing a radiator above the transfer table, butting the radiator with the transfer table through the positioning frame, vertically reversing the radiator and the transfer table together, pressing a push plate of a push plate mechanism, pushing the ceramic sheet into a groove on the surface of the radiator, and taking down the transfer table;
step 4, coating the second surface, namely moving a radiator containing ceramic sheets to the lower part of the grid plate, introducing heat-conducting glue to the upper surface of the grid plate, scraping the heat-conducting glue along the upper surface of the grid plate by using a scraper, pressing the ceramic sheets from the upper part of the grid plate by using a position retainer through the hollowed-out holes, and lifting the grid plate to finish coating the second surface of the ceramic sheets;
and 5, installing the inverter assembly, and attaching and installing the radiator with the gluing ceramic plate and the inverter power component.
By adopting the gluing method, all ceramic plates of the inverter can be synchronously and uniformly glued, and the operation efficiency is high.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural view of an inverter;
FIG. 2 is a schematic diagram of a heat sink;
FIG. 3 is a schematic view of the structure of the gumming grid plate device of the present invention;
FIG. 4 is an enlarged view of a portion of FIG. 3 at A;
FIG. 5 is a schematic view of another embodiment of the rubberized mesh panel apparatus of the invention;
FIG. 6 is a schematic diagram of a transfer station apparatus according to the present invention;
FIG. 7 is a cross-sectional view of a transfer station apparatus of the present invention;
FIG. 8 is a schematic view of the structure of the position holder of the present invention;
FIG. 9 is a schematic view of the position holder of the present invention in use;
FIG. 10 is a schematic diagram showing a state of docking a radiator with a transfer station apparatus;
FIG. 11 is a schematic illustration of the transfer of ceramic sheets to a heat sink after the transfer station apparatus is flipped over;
FIG. 12 is a schematic view of a device corresponding to a gluing station in another embodiment of the present invention;
fig. 13 is a schematic structural view of a device corresponding to a turnover working station in another embodiment of the present invention.
Names of the corresponding parts indicated by numerals and letters in the drawings:
1-gluing a grid plate device; 11-grid plates; 111-hollowed-out grid areas; 12-a base; 13-supporting frames; 14-a clamping mechanism; 141-clamping plates; 142-clamping screw; 15-XY position adjusting mechanism; 16-upper placement platform; 161-X direction positioning backup plate; 162-Y direction positioning backup plate; 2-a transfer table device; 21-a middle rotary table; 211-ceramic wafer regulation groove; 212-ejection holes; 22-a pushing sheet mechanism; 221-pushing plate; 222-ejector pins; 223-a reset mechanism; 3-positioning frames; 4-position holder; 41-an upper plate body; 42-ejector rod; 51-a mobile platform; 52-a first translational drive mechanism; 61-a first structural frame; 62-a first lifting drive mechanism; 63-a second lifting drive mechanism; 64-a first scraper; 65-a second scraper; 71-a second structural frame; 72-a third lifting driving mechanism; 73-a first rotary drive mechanism; 74-a first capture mechanism; 75-a second locking mechanism; 76-a fourth lifting drive mechanism; 77-pushing down the push rod; 91-a power component; 92-ceramic plates; 93-heat sink.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1 and 2, the inverter includes a plurality of power components 91 and a heat sink 93, and a ceramic plate 92 is disposed between each power component 91 and the heat sink 93, and in order to improve the heat conductivity between the ceramic plate 92 and the power components 91 and between the ceramic plate 92 and the heat sink 93 during manufacturing of the inverter, it is necessary to uniformly coat heat conductive glue on both sides of the ceramic plate 92.
As shown in fig. 3-11, an inverter ceramic tile glue spreading device includes:
the gluing grid plate device 1 comprises a grid plate 11, wherein a hollowed grid area 111 is arranged on the grid plate 11, the hollowed grid area 111 is provided with hollowed holes distributed in an array, and the number and the positions of the hollowed grid area 111 are consistent with those of the ceramic plates of the inverter;
the middle rotary table device 2 comprises a middle rotary table 21 and a pushing plate mechanism 22, wherein a plurality of ceramic plate regulating grooves 211 are formed in the upper surface of the middle rotary table 21, a through ejection hole 212 is formed in a groove body of the ceramic plate regulating grooves 211, the pushing plate mechanism 22 comprises a pushing plate 221, a reset mechanism 223 and a plurality of ejection rods 222, the ejection rods 222 are vertically arranged on the pushing plate 221, the ejection rods 222 are matched with the ejection holes 212, and the reset mechanism 223 is used for generating driving force for the pushing plate 221 far away from the bottom surface of the middle rotary table 21;
the positioning frame 3, the inner frame wall of which is matched with the outer contour side wall of the upper surface of the intermediate turntable 21 and the outer contour side wall of the upper surface of the inverter radiator 93;
the position retainer 4 comprises an upper plate 41 and a plurality of ejector rods 42, the ejector rods 42 are vertically and downwardly extended from the lower surface of the upper plate 41, the number of the ejector rods 42 is at least equal to that of ceramic plates 92 on the inverter, at least one ejector rod corresponds to the right upper part of each ceramic plate, the lower half part of each ejector rod 42 is conical, and the conical tip is downward.
The beneficial effects of adopting above-mentioned technical scheme are: the glue coating operation can be synchronously carried out on all ceramic plates of the inverter, so that the operation efficiency is high; the small interval gap is arranged between the punctiform colloids passing through the hollow holes of the grid plate, so that the colloid can be ensured to have an expansion space after temperature rise; the heat-conducting glue is uniformly distributed on the surface of the ceramic plate, so that high-efficiency heat transfer of all the ceramic plates can be ensured, heat of power components can be timely emitted, and further the reliability of an inverter product is improved.
As shown in fig. 5, in other embodiments of the present invention, the gumming grid device 1 further includes a base 12, a supporting frame 13, and a clamping mechanism 14, wherein the supporting frame 13 is fixedly mounted on the base 12, the clamping mechanism 14 is mounted on the supporting frame 13, the clamping mechanism 14 includes a clamping plate 141 and a clamping screw 142, the clamping screw 142 is screwed on the clamping plate 141, and an edge portion of the grid 11 is clamped between the clamping plate 141 and the clamping screw 142. The beneficial effects of adopting above-mentioned technical scheme are: and the assembly and the disassembly of the grid plate are convenient.
In other embodiments of the present invention, the clamping mechanism 14 is mounted on the support frame 13 swingably up and down about a rotation shaft. The beneficial effects of adopting above-mentioned technical scheme are: the operation and the use of the grid plate are convenient.
In other embodiments of the invention, as shown in fig. 5, the gumming grid device 1 further comprises an XY position adjustment mechanism 15 and an upper placement platform 16, the XY position adjustment mechanism 15 being mounted on the base, the upper placement platform 16 being mounted on the moving block of the XY position adjustment mechanism 15. The specific structural form of the XY position adjusting mechanism is not limited, and may be selected from the prior art, such as 2 sets of screw mechanisms arranged in the X-direction and the Y-direction. The beneficial effects of adopting above-mentioned technical scheme are: the gluing position is convenient to adjust.
In other embodiments of the present invention, as shown in fig. 5, an X-directional positioning fence 161 and a Y-directional positioning fence 162 are provided on the upper placement platform 16. The beneficial effects of adopting above-mentioned technical scheme are: and the transfer table device or the radiator is conveniently and rapidly placed before gluing.
In other embodiments of the present invention, the ratio of the area of the hollowed-out holes of the hollowed-out grid region 111 of the grid plate 11 to the area of the hollowed-out grid region is 80% or more. The beneficial effects of adopting above-mentioned technical scheme are: ensure the gluing area of the heat-conducting glue.
In other embodiments of the present invention, the height of the intermediate turntable 21 is the same as the height of the inverter heat sink 93. The beneficial effects of adopting above-mentioned technical scheme are: and when the two sides of the ceramic sheet are coated with glue twice, the height positions of the grid plates are shared, and the height positions of the grid plates do not need to be adjusted.
In other embodiments of the present invention, as shown in fig. 7, the return mechanism 223 is a return spring sleeved on the outer periphery of the ejector rod, and two ends of the return spring respectively abut against the middle rotary table 21 and the push plate 221. The beneficial effects of adopting above-mentioned technical scheme are: simple structure, reliable performance and low manufacturing cost.
An inverter ceramic wafer gluing method comprises the following steps:
step 1, placing ceramic plates in a ceramic plate regulation groove of a transfer table;
step 2, gluing the first surface, namely moving the transfer table device to the lower part of the grid plate, introducing heat-conducting glue to the upper surface of the grid plate, scraping the heat-conducting glue along the upper surface of the grid plate by using a scraper, pressing the ceramic plate from the upper part of the grid plate by using a position retainer through the hollowed-out holes, and lifting the grid plate to finish gluing the first surface of the ceramic plate;
step 3, transferring the ceramic sheet, sleeving a positioning frame on the periphery of the top of the transfer table, reversely placing a radiator above the transfer table, butting the radiator with the transfer table through the positioning frame, vertically reversing the radiator and the transfer table together, pressing a push plate of a push plate mechanism, pushing the ceramic sheet into a groove on the surface of the radiator, and taking down the transfer table;
step 4, coating the second surface, namely moving a radiator containing ceramic sheets to the lower part of the grid plate, introducing heat-conducting glue to the upper surface of the grid plate, scraping the heat-conducting glue along the upper surface of the grid plate by using a scraper, pressing the ceramic sheets from the upper part of the grid plate by using a position retainer through the hollowed-out holes, and lifting the grid plate to finish coating the second surface of the ceramic sheets;
and 5, installing the inverter assembly, and attaching and installing the radiator with the gluing ceramic plate and the inverter power component.
By adopting the gluing method, all ceramic plates of the inverter can be synchronously and uniformly glued, and the operation efficiency is high.
In other embodiments of the present invention, as shown in fig. 12 and 13, in order to improve the automation level of the gluing operation, two stations of the gluing operation and the overturning operation are further provided, a moving platform 51 is disposed between the two stations, the moving platform 51 is driven by a first translation driving mechanism 52 to reciprocate between the two stations, the moving platform 51 is used for placing the turntable device 2 or the radiator 93, and a positioning structure may be further disposed on the moving platform 51 to stabilize the turntable device or the radiator. The gluing operation station is provided with a first structure frame 61, a first lifting driving mechanism 62 and a second lifting driving mechanism 63 are arranged on the first structure frame 61, a gluing grid plate device 1 is arranged on a lifting plate of the first lifting driving mechanism 62, the gluing grid plate device 1 comprises a grid plate 11, a first scraper 64 and a second scraper 65 which are arranged on the grid plate 11, the first scraper 64 and the second scraper 65 move along the upper surface of the grid plate 11, a space for storing heat conducting glue is formed between the first scraper 64 and the second scraper 65, a driving mechanism for driving the first scraper and the second scraper to synchronously move is also arranged on the grid plate, the gluing operation station further comprises a heat conducting glue supplying mechanism, the heat conducting glue supplying mechanism comprises a heat conducting glue storage box, a peristaltic pump and a heat conducting pipe, and the peristaltic pump pumps the heat conducting glue to the space between the first scraper and the second scraper through the heat conducting pipe; the lifting plate of the second lifting drive mechanism 63 is mounted with the position holder 4. A second structure frame 71 is arranged at the overturning working station, a third lifting driving mechanism 72 and a fourth lifting driving mechanism 76 are arranged on the second structure frame 71, a positioning frame 3 is rotatably arranged on a lifting plate of the third lifting driving mechanism 72, the positioning frame 3 is driven to overturn by a first rotary driving mechanism 73, and a first locking mechanism 74 for temporarily locking the transfer table device 2 on the positioning frame and a second locking mechanism 75 for temporarily locking the radiator 93 on the positioning frame are also arranged on the positioning frame 3; a push-down rod 77 for pressing the push plate of the turntable device is attached to the lift plate of the fourth lift drive mechanism 76.
In the invention, the specific structural forms of the translation driving mechanism, the lifting driving mechanism, the rotation driving mechanism and the locking mechanism are not limited, and can be selected from the prior art. If the translation driving mechanism can adopt a horizontally arranged screw rod mechanism and a horizontally arranged translation guide rail structure; the lifting driving mechanism can adopt a vertically arranged screw rod mechanism and a vertically arranged lifting guide rail structure; the rotary driving mechanism can adopt a structure of a motor acceleration and deceleration machine; the locking mechanism can adopt an electric telescopic inclined plane spring bolt structure.
An inverter ceramic wafer gluing method comprises the following steps:
step 1, placing ceramic plates in a ceramic plate regulation groove of a transfer platform, and placing a transfer platform device on a mobile platform;
step 2, coating the first surface, wherein the first translation driving mechanism drives the moving platform to move, and the transfer platform device is moved to the position below the grid plate of the coating operation station; the lower surface of the first lifting driving mechanism descends to lean against the upper surface of the ceramic plate of the transfer table; the heat-conducting glue supplying mechanism introduces heat-conducting glue on the upper surface of the grid plate, and the first scraper and the second scraper synchronously move to scrape the heat-conducting glue along the upper surface of the grid plate; the second lifting driving mechanism drives the position retainer to descend, the position retainer presses the ceramic plate from the upper side of the grid plate through the hollowed holes, the first lifting driving mechanism ascends and lifts the grid plate, the second lifting driving mechanism drives the position retainer to ascend, and the first surface of the ceramic plate is glued;
step 3, transferring the ceramic sheet, wherein the first translation driving mechanism drives the moving platform to move, and the transfer platform device is moved to the position below the positioning frame of the overturning working station; the third lifting driving mechanism moves downwards, the positioning frame is sleeved on the periphery of the top of the transfer table, and the transfer table device is locked through the first locking mechanism; reversely placing the radiator on the positioning frame to be in butt joint with the middle rotary table, and locking the radiator through the second locking mechanism; the first rotary driving mechanism turns the radiator and the transfer table device up and down together; the fourth lifting driving mechanism drives the push rod to descend to press the push plate of the push plate mechanism, so that the ceramic plate is pushed into the groove on the surface of the radiator; the fourth lifting driving mechanism ascends, the first locking mechanism unlocks and the transfer platform device is taken down;
step 4, gluing the second surface, descending a third lifting driving mechanism, enabling the radiator to fall onto the mobile platform, unlocking a second locking mechanism, and driving the positioning frame to be lifted by the third lifting driving mechanism; the first translation driving mechanism moves the radiator comprising the ceramic plate to the lower part of the grid plate, and the lower surface of the grid plate is propped against the upper surface of the ceramic plate of the radiator; the first rotary driving mechanism drives the positioning frame to turn up and down for resetting; the heat-conducting glue supplying mechanism introduces heat-conducting glue on the upper surface of the grid plate, and the first scraper and the second scraper synchronously move to scrape the heat-conducting glue along the upper surface of the grid plate; the second lifting driving mechanism drives the position retainer to descend, the position retainer presses the ceramic plate from the upper side of the grid plate through the hollowed holes, the first lifting driving mechanism ascends and lifts the grid plate, the second lifting driving mechanism drives the position retainer to ascend, and the second surface of the ceramic plate is glued;
and 5, installing the inverter assembly, driving the moving platform to move by the first translation driving mechanism, moving the radiator to a turnover operation station, taking away the radiator, and attaching and installing the radiator with the glue-coated ceramic sheet and the inverter power component.
The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement the same, but not limit the scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.
Claims (6)
1. An automatic gluing device for an inverter ceramic wafer, which is characterized by comprising:
the gluing grid plate device comprises a grid plate, wherein hollow grid areas are arranged on the grid plate, the hollow grid areas are provided with hollow holes distributed in an array, and the number and the positions of the hollow grid areas are consistent with those of the ceramic plates of the inverter;
the transfer table device comprises a transfer table and a pushing plate mechanism, wherein a plurality of ceramic plate regulation grooves are formed in the upper surface of the transfer table, a through ejection hole is formed in a groove body of each ceramic plate regulation groove, the pushing plate mechanism comprises a pushing plate, a reset mechanism and a plurality of ejection rods, the ejection rods are vertically arranged on the pushing plate and are matched with the ejection holes, and the reset mechanism is used for generating driving force for the pushing plate far away from the bottom surface of the transfer table;
the inner frame wall of the positioning frame is matched with the outer contour side wall of the upper surface of the middle rotary table and the outer contour side wall of the upper surface of the inverter radiator;
the position retainer comprises an upper plate body and a plurality of ejector rods, the ejector rods are vertically and downwardly extended from the lower surface of the upper plate body, the number of the ejector rods is at least equal to that of ceramic plates on the inverter, at least one ejector rod corresponds to the right upper part of each ceramic plate, the lower half part of each ejector rod is conical, and the conical tip is downward;
the device also comprises two stations for gluing operation and overturning operation, wherein a moving platform is arranged between the two stations, and is driven by a first translation driving mechanism to reciprocate between the two stations;
the gluing operation station is provided with a first structure frame, a first lifting driving mechanism and a second lifting driving mechanism are arranged on the first structure frame, a lifting plate of the first lifting driving mechanism is provided with a gluing grid plate device, the gluing grid plate device further comprises a first scraper and a second scraper which are arranged on the grid plate, the first scraper and the second scraper both move along the upper surface of the grid plate, a space for storing heat-conducting glue is formed between the first scraper and the second scraper, and a driving mechanism for driving the first scraper and the second scraper to synchronously move is further arranged on the grid plate; the lifting plate of the second lifting driving mechanism is provided with the position retainer;
the turnover working station is provided with a second structure frame, a third lifting driving mechanism and a fourth lifting driving mechanism are arranged on the second structure frame, the lifting plate of the third lifting driving mechanism is rotatably provided with the positioning frame, the positioning frame is driven to turn by a first rotary driving mechanism, and the positioning frame is also provided with a first locking mechanism for temporarily locking the transfer table device on the positioning frame and a second locking mechanism for temporarily locking the radiator on the positioning frame; and a push-down push rod for pressing the push plate of the transfer platform device is arranged on the lifting plate of the fourth lifting driving mechanism.
2. The automated glue applicator of claim 1, further comprising a heat transfer glue supply mechanism comprising a heat transfer glue storage tank, a peristaltic pump, and a heat transfer glue tube, the peristaltic pump pumping the heat transfer glue through the glue tube to a space between the first doctor blade and the second doctor blade.
3. The automatic gluing device for the ceramic wafer of the inverter according to claim 1, wherein the proportion of the area of the hollowed-out holes of the hollowed-out grid area to the area of the hollowed-out grid area is more than 80%.
4. The automated gluing device for ceramic chips of an inverter according to claim 1, wherein the height of the transfer table is the same as the height of the inverter heat sink.
5. The automatic gluing device for the ceramic wafer of the inverter according to claim 1, wherein the reset mechanism is a reset spring sleeved on the periphery of the ejector rod, and two ends of the reset spring respectively abut against the middle rotary table and the push plate.
6. An inverter ceramic wafer gluing method adopting the inverter ceramic wafer automatic gluing device as claimed in claim 1, and is characterized by comprising the following steps:
step 1, placing ceramic plates in a ceramic plate regulation groove of a transfer platform, and placing a transfer platform device on a mobile platform;
step 2, coating the first surface, wherein the first translation driving mechanism drives the moving platform to move, and the transfer platform device is moved to the position below the grid plate of the coating operation station; the lower surface of the first lifting driving mechanism descends to lean against the upper surface of the ceramic plate of the transfer table; the first scraper and the second scraper synchronously move to scrape the heat-conducting glue along the upper surface of the grid plate; the second lifting driving mechanism drives the position retainer to descend, the position retainer presses the ceramic plate from the upper side of the grid plate through the hollowed holes, the first lifting driving mechanism ascends and lifts the grid plate, the second lifting driving mechanism drives the position retainer to ascend, and the first surface of the ceramic plate is glued;
step 3, transferring the ceramic sheet, wherein the first translation driving mechanism drives the moving platform to move, and the transfer platform device is moved to the position below the positioning frame of the overturning working station; the third lifting driving mechanism moves downwards, the positioning frame is sleeved on the periphery of the top of the transfer table, and the transfer table device is locked through the first locking mechanism; reversely placing the radiator on the positioning frame to be in butt joint with the middle rotary table, and locking the radiator through the second locking mechanism; the first rotary driving mechanism turns the radiator and the transfer table device up and down together; the fourth lifting driving mechanism drives the push rod to descend to press the push plate of the push plate mechanism, so that the ceramic plate is pushed into the groove on the surface of the radiator; the fourth lifting driving mechanism ascends, the first locking mechanism unlocks and the transfer platform device is taken down;
step 4, gluing the second surface, descending a third lifting driving mechanism, enabling the radiator to fall onto the mobile platform, unlocking a second locking mechanism, and driving the positioning frame to be lifted by the third lifting driving mechanism; the first translation driving mechanism moves the radiator comprising the ceramic plate to the lower part of the grid plate, and the lower surface of the grid plate is propped against the upper surface of the ceramic plate of the radiator; the first rotary driving mechanism drives the positioning frame to turn up and down for resetting; the first scraper and the second scraper synchronously move to scrape the heat-conducting glue along the upper surface of the grid plate; the second lifting driving mechanism drives the position retainer to descend, the position retainer presses the ceramic plate from the upper side of the grid plate through the hollowed holes, the first lifting driving mechanism ascends and lifts the grid plate, the second lifting driving mechanism drives the position retainer to ascend, and the second surface of the ceramic plate is glued;
and 5, installing the inverter assembly, driving the moving platform to move by the first translation driving mechanism, moving the radiator to a turnover operation station, taking away the radiator, and attaching and installing the radiator with the glue-coated ceramic sheet and the inverter power component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211179367.5A CN115400912B (en) | 2022-03-28 | 2022-03-28 | Automatic gluing device and method for ceramic wafer of inverter |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210316972.6A CN114589055B (en) | 2022-03-28 | 2022-03-28 | Gluing device and gluing method for inverter ceramic wafer |
| CN202211179367.5A CN115400912B (en) | 2022-03-28 | 2022-03-28 | Automatic gluing device and method for ceramic wafer of inverter |
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| CN202210316972.6A Division CN114589055B (en) | 2022-03-28 | 2022-03-28 | Gluing device and gluing method for inverter ceramic wafer |
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| GB984495A (en) * | 1963-03-19 | 1965-02-24 | Taiyo Yuden Kk | Improvements in or relating to apparatus for and methods of forming conductive coatings on ceramic pieces |
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| SE0601384L (en) * | 2006-06-21 | 2007-12-22 | Kaehr Ab G | Device and method for surface treatment of objects |
| ITBO20080161A1 (en) * | 2008-03-13 | 2009-09-14 | Sorbini Srl | COMBINED MACHINE, PARTICULARLY FOR THE PAINTING OF GLASS SLABS, CRYSTAL OR OTHER FLAT SURFACES IN GENERAL. |
| CN101823039A (en) * | 2009-03-06 | 2010-09-08 | 鸿骐新技股份有限公司 | Gluing device, use method and products thereof |
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| GB984495A (en) * | 1963-03-19 | 1965-02-24 | Taiyo Yuden Kk | Improvements in or relating to apparatus for and methods of forming conductive coatings on ceramic pieces |
| KR101387955B1 (en) * | 2013-04-05 | 2014-04-22 | 유진디스컴 주식회사 | Adhesive resin applying apparatus for attaching touch display panel |
| WO2020181970A1 (en) * | 2019-03-11 | 2020-09-17 | 广汽本田汽车有限公司 | Adhesive coating system for automobile windscreen |
| WO2021068484A1 (en) * | 2019-10-11 | 2021-04-15 | 佛山市恒力泰机械有限公司 | Intelligent molding complete equipment set for ultra large-sized ceramic plates and molding process |
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| Publication number | Publication date |
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| CN115400912A (en) | 2022-11-29 |
| CN114589055B (en) | 2022-10-18 |
| CN114589055A (en) | 2022-06-07 |
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