CN109524530A - A kind of lens and the LED light source component using the lens - Google Patents
A kind of lens and the LED light source component using the lens Download PDFInfo
- Publication number
- CN109524530A CN109524530A CN201811619651.3A CN201811619651A CN109524530A CN 109524530 A CN109524530 A CN 109524530A CN 201811619651 A CN201811619651 A CN 201811619651A CN 109524530 A CN109524530 A CN 109524530A
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- China
- Prior art keywords
- lens
- oval base
- led
- light source
- indent cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 14
- 230000001070 adhesive effect Effects 0.000 claims abstract description 14
- 239000003292 glue Substances 0.000 claims abstract description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 4
- 238000009738 saturating Methods 0.000 claims description 2
- 238000005286 illumination Methods 0.000 abstract description 11
- 230000003287 optical effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The present invention is suitable for optical technical field, provide a kind of lens, it has the main body of an oval base, elliposoidal top and the connection oval base and elliposoidal top, the oval base is equipped with the indent cavity to accommodate LED wafer, and the ratio between the short axle of the oval base and long axis are 0.5~0.75.Top surface of the light first through the indent cavity that LED wafer issues in this way is refracted into lens, then the surface refraction through the main body and elliposoidal top is to default illumination region.Stray light around default illumination region greatly reduces, and center efficient intensity correspondingly enhances, and fully meets requirement of the various LED light source components especially infrared transmitting tube to hot spot.Furthermore, LED light source component provided in an embodiment of the present invention except between LED support and the bottom surface of lens by bonding glue sticking in addition to, also bonded adhesives is filled between the side of the indent cavity and the side of LED wafer, the bonding plane between lens and LED support is greatly extended in this way, certainly the firmness that lens are adhered to LED support is also greatly enhanced, substantially reduces the crash rate to fall off by lens from LED support.
Description
Technical field
The invention belongs to optical technical field more particularly to a kind of lens and using the LED light source component of the lens.
Background technique
Now, requirement of the various LED light source components to light efficiency and brightness is higher and higher, and in addition to LED wafer, lens are also one
A very important influence factor.However, existing lens on light spool control ability is weak, cause stray light relatively more, light source device
Brightness is not high, is especially unable to satisfy requirement of the infrared transmitting tube to hot spot.
Summary of the invention
The embodiment of the present invention is designed to provide a kind of lens, it is intended to and it is weak to solve existing lens on light spool control ability,
Cause stray light relatively more, the not high problem of source device brightness.
The embodiments of the present invention are implemented as follows, a kind of lens, has an oval base, elliposoidal top and company
The main body of the oval base Yu elliposoidal top is connect, the oval base is equipped with the indent sky to accommodate LED wafer
Chamber, the ratio between the short axle of the oval base and long axis are 0.5~0.75.
Another embodiment of the present invention is achieved in that a kind of LED light source component, including LED support, be fixedly arranged on it is described
The chip of LED support and lens that are Nian Jie with the LED support and adjusting chip sending light, the lens have an ellipse
The main body of pedestal, elliposoidal top and the connection oval base and elliposoidal top, the oval base, which is equipped with, to be used
To accommodate the indent cavity of LED wafer, the ratio between the short axle of the oval base and long axis are 0.5~0.75, and the indent is empty
Bonded adhesives is filled between the side of chamber and the side of LED wafer.
Lens provided in an embodiment of the present invention have an oval base, elliposoidal top and the connection oval base
The main body of seat and elliposoidal top, the oval base are equipped with the indent cavity to accommodate LED wafer, the ellipse base
The ratio between the short axle of seat and long axis are 0.5~0.75.Top surface of the light first through the indent cavity that LED wafer issues in this way reflect into
Enter lens, then the surface refraction through the main body and elliposoidal top is to default illumination region.In this way, the default illumination region
Angular range on the short-axis direction of the oval base is 20 ° ± 10 °, on the long axis direction of the oval base
Angular range be 65 ° ± 15 °, it is above preset illumination region around stray light greatly reduce, center efficient intensity phase
Enhance with answering, fully meets requirement of the various LED light source components especially infrared transmitting tube to hot spot.In addition, the present invention is implemented
Example provide LED light source component except between LED support and the bottom surface of lens by bonding glue sticking in addition to, also in the side of the indent cavity
It fills bonded adhesives between face and the side of LED wafer, greatly extends the bonding plane between lens and LED support in this way, certainly also pole
The earth enhances the firmness that lens are adhered to LED support, substantially reduces the crash rate to fall off by lens from LED support.
Detailed description of the invention
Fig. 1 is the schematic perspective view for the lens that the embodiment of the present invention one provides (main body is elliptical table)；
Fig. 2 is the top view of lens shown in Fig. 1；
Fig. 3 is light path schematic diagram of the lens shown in Fig. 1 on its oval base long axis direction；
Fig. 4 is light path schematic diagram of the lens shown in Fig. 1 on its oval base short-axis direction；
Fig. 5 is the schematic perspective view of lens provided by Embodiment 2 of the present invention (main body is elliptical table)；
Fig. 6 is light path schematic diagram of the lens shown in Fig. 5 on its oval base long axis direction；
Fig. 7 is light path schematic diagram of the lens shown in Fig. 5 on its oval base short-axis direction；
Fig. 8 is the top view for the lens that the embodiment of the present invention three provides (two sides are flat face)；
Fig. 9 is light path schematic diagram of the lens shown in Fig. 8 on its oval base long axis direction；
Figure 10 is light path schematic diagram of the lens shown in Fig. 8 on its oval base short-axis direction；
Figure 11 is light path schematic diagram of the lens of the offer of the embodiment of the present invention four on its oval base long axis direction；
Figure 12 is light path schematic diagram of the lens shown in Figure 11 on its oval base short-axis direction；
Figure 13 is the lens arrangement schematic diagram that the embodiment of the present invention five provides；
Figure 14 is the structural schematic diagram (side view) of LED light source component provided in an embodiment of the present invention；
Figure 15 is the structural schematic diagram (vertical view) of LED light source component provided in an embodiment of the present invention；
Figure 16 be after LED light source component provided in an embodiment of the present invention rotation die bond on oval base long axis direction
The surface of intensity distribution, wherein abscissa is angle, and ordinate is light intensity.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Lens provided in an embodiment of the present invention have an oval base, elliposoidal top and the connection oval base
The main body of seat and elliposoidal top, the oval base are equipped with the indent cavity to accommodate LED wafer, the ellipse base
The ratio between the short axle of seat and long axis are 0.5~0.75.Top surface of the light first through the indent cavity that LED wafer issues in this way reflect into
Enter lens, then the surface refraction through the main body and elliposoidal top is to default illumination region.In this way, the default illumination region
Angular range on the short-axis direction of the oval base is 20 ° ± 10 °, on the long axis direction of the oval base
Angular range be 65 ° ± 15 °, it is above preset illumination region around stray light greatly reduce, center efficient intensity phase
Enhance with answering, fully meets requirement of the various LED light source components especially infrared transmitting tube to hot spot.In addition, the present invention is implemented
Example provide LED light source component except between LED support and the bottom surface of lens by bonding glue sticking in addition to, also in the side of the indent cavity
It fills bonded adhesives between face and the side of LED wafer, greatly extends the bonding plane between lens and LED support in this way, certainly also pole
The earth enhances the firmness that lens are adhered to LED support, substantially reduces the crash rate to fall off by lens from LED support.
Realization of the invention is described in detail below in conjunction with specific embodiment.
As shown in figs. 1-13, the lens 1 that each embodiment of the present invention provides are in an oval base 11, elliposoidal
The main body 13 of portion 12 and the connection oval base 11 and elliposoidal top 12, the oval base 11 are equipped with to hold
Receive the indent cavity 14 of LED wafer, the ratio between short axle Y and long axis X of the oval base 11 are 0.5~0.75.Wherein, Fig. 3
It is base oval in lens shown in 0.5, Fig. 6 and Fig. 7 with the ratio between the short axle Y and long axis X of oval base 11 in lens shown in Fig. 4
The ratio between short axle Y and long axis X of seat 11 be oval base 11 in lens shown in 0.75, Fig. 9 and Figure 10 short axle Y and long axis X it
Than being 0.7 for the ratio between the short axle Y and long axis X of oval base 11 in lens shown in 0.5, Figure 11 and Figure 12.LED wafer is sent out in this way
Top surface 15 of the light out first through the indent cavity 14 is refracted into lens, then the table through the main body 13 and elliposoidal top 12
Face refracts to default illumination region.In this way, angle of the default illumination region in the short axle Y-direction of the oval base 11
Spending range is 20 ° ± 10 °, and the angular range in the long axis X-direction of the oval base 11 is 65 ° ± 15 °, above pre-
If the stray light around illumination region greatly reduces, center efficient intensity correspondingly enhances, and fully meets various LED light source devices
Requirement of the part especially infrared transmitting tube to hot spot.It should be noted that above angular values system light intensity is center light intensity
Angular values when 50%.
Preferably, the main body 13 is elliptical table, the relatively big end of the elliptical table 13 is connected with oval base 11,
Small end is connected with elliposoidal top 12.Such lens are up-small and down-big, more reliable when placing and being bonded.Aforementioned indent is empty
The side of chamber 14 is preferably ellipsoid similar with the side of oval base 11, is conducive to manufacture lens in this way.Further, institute
The side wall for stating indent cavity 14 sets a stage 16 to form anti-overflow slot and is conducive in this way lens are secured as shown in figure 13
Ground is bonded on corresponding component.
Particularly, two sides of the lens 1 in the short axle Y-direction along its oval base 11 are equipped with perpendicular to its bottom
The flat face 17 in face；The highest point of the flat face 17 is lower than the junction of main body 13 and elliposoidal top 12, is higher than described ellipse
The highest point of round base 11, as depicted in figures 8-13.The size of lens 1 is reduced in this way, and the light source conducive to production small size produces
Product.Both it will not influence beam projecting, it helps this lens of taking.
Further, the side wall of the oval base 11 is equipped with the ventilative slot being connected with indent cavity 14.In this way
Lens 1 be adhered to corresponding component after, air pressure inside is consistent with ambient pressure, can prevent because internal pressure it is excessive caused by take off
It falls.
It is detailed to the carry out of another embodiment of the present invention for LED light source component used by the infrared transmitting tube below
Description, because infrared transmitting tube requires hot spot uniform and higher efficient intensity.
As shown in Fig. 1~15, another embodiment of the present invention provides LED light source component 2 include LED support 3, be fixedly arranged on institute
State the chip 4 of LED support 3 and lens 1 that are Nian Jie with the LED support 3 and adjusting the sending light of chip 4.Wherein, the lens
1 main body with an oval base 11, elliposoidal top 12 and the connection oval base 11 and elliposoidal top 12
13, the oval base 11 is equipped with to the indent cavity 14 that accommodates LED wafer 4, the short axle Y of the oval base 11 with
The ratio between long axis X is 0.5~0.75.Wherein, bonded adhesives is filled between the side of the indent cavity 14 and the side of LED wafer 4
5.It should be noted that the bonded adhesives 5 can both be filled into the side of LED wafer 4, as shown in figure 14；It can also be filled into
Somewhere between the side of the indent cavity 14 and the side of LED wafer 4, such as it is only filled with the edge of the stage 16,
As a kind of embodiment of suboptimum, Figure of description is not shown.It removes between LED support 3 and the bottom surface of lens 1 by bonded adhesives in this way
Bonding is outer, also fills bonded adhesives between the side of the indent cavity 14 and the side of LED wafer 4, and greatly extension is saturating in this way
Bonding plane between mirror 1 and LED support 3 also greatly enhances the firmness that lens 1 are adhered to LED support 3 certainly, drops significantly
The low crash rate to fall off by the lens 1 from LED support 3.It should be understood that because this LED light source component 2 uses said lens
1, stray light is few, light efficiency is high, can meet various demands.
Preferably, the LED wafer 4 is the horizontal structure chip being electrically connected by conducting wire 6 with LED support 3 or vertical
Structured wafer, that section lead being connected with the LED wafer 4 are exposed to the bonded adhesives 5, as shown in figure 14.Such institute
State bonded adhesives 5 act on conducting wire 6 internal stress it is smaller, much smaller than make conducting wire 6 be broken power, thus evade conducting wire 6 fracture
Risk, the possibility for avoiding LED light source component 2 to fail because conducting wire 6 is broken in Reflow Soldering or other applied at elevated temperature environment completely
Property.
Particularly, the side wall of the indent cavity 14 sets a stage 16, and the stage 16 downward can with the formation of LED support 3
The glued fully filled anti-overflow slot of glue 5.Wherein, the bonded adhesives other than the anti-overflow slot forms centre because of surface tension effects
Curved surface low, surrounding is high.The stage 16 be lower than indent cavity 14 top surface 15, be higher than or the slightly below described LED wafer 4 it is upper
Surface, or it is concordant with the upper surface of the LED wafer 4, as shown in Figure 13,14.5 slime flux of bonded adhesives can be prevented to institute in this way
The top surface 15 for stating indent cavity will not influence the LED wafer 4 and go out light, do not influence on light type.Meanwhile it further expanding
Bonding plane between mirror 1 and LED support 3 further enhances the firmness that lens 1 are adhered to LED support 3, further decreases because of institute
State the crash rate that lens 1 fall off from LED support 3.
Further, the longitudinal section of the LED wafer 4 is quadrangle, and four vertex are located at the ellipse
On the long axis X or short axle Y-direction of pedestal 11, as shown in figure 15.The such rotary setting of the LED wafer 4, is conducive to light type control
System.Figure 16 is the light intensity after LED light source component provided in an embodiment of the present invention rotation die bond on oval base long axis direction
Distribution map, light light type is M shape out, keeps light intensity more uniform in entire irradiation area.Specifically, in the oval base long axis
Apparent M light type is projected in X-direction, i.e. central light strength is slightly weak, and 20~35 ° of angular range light intensity highests, intensity is center
1.05~1.3 times of intensity.So guarantee within the scope of a plane, certain angle (such as ± 30 °), what light source device issued
The light distribution of light projection to irradiation area is uniform.
Particularly, the air in the indent cavity 14 compared with lens 1 outside it is thin, to form negative pressure；Alternatively, the indent
Vacuum state is in cavity.Air pressure in the indent cavity 14 described in this way no longer increases significant raising with temperature, i.e., in lens 1
Air pressure lens 1 will not be washed open, therefore fail probability be greatly reduced.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. a kind of lens, it is characterised in that: the lens have an oval base, elliposoidal top and the connection ellipse
The main body of shape pedestal and elliposoidal top, the oval base are equipped with the indent cavity to accommodate LED wafer, the ellipse
The ratio between the short axle of shape pedestal and long axis are 0.5~0.75.
2. lens as described in claim 1, it is characterised in that: the main body be elliptical table, the relatively big end of the elliptical table with
Oval base is connected, and small end is connected with elliposoidal top.
3. lens as described in claim 1, it is characterised in that: the side of the indent cavity is the side with oval base
Similar ellipsoid, the side wall of the oval base are equipped with the ventilative slot being connected with indent cavity.
4. lens as described in claim 1, it is characterised in that: the lens are on the short-axis direction along its oval base
Two sides are equipped with the flat face perpendicular to its bottom surface；The highest point of the flat face is lower than the engagement of main body and elliposoidal top
Point, higher than the highest point of the oval base.
5. lens as described in any one of claims 1 to 4, it is characterised in that: the side wall of the indent cavity set one to
Form the stage of anti-overflow slot.
6. a kind of LED light source component including LED support, is fixedly arranged on the chip of the LED support and glues with the LED support
Connect and adjust the lens that chip issues light, it is characterised in that: the lens have an oval base, elliposoidal top and company
The main body of the oval base Yu elliposoidal top is connect, the oval base is equipped with the indent sky to accommodate LED wafer
Chamber, the ratio between the short axle of the oval base and long axis are 0.5~0.75, the side of the indent cavity and the side of LED wafer
Bonded adhesives is filled between face.
7. LED light source component as claimed in claim 6, it is characterised in that: the LED wafer is to pass through conducting wire and LED support
The horizontal structure chip or vertical structure chip of electrical connection, that section lead being connected with the LED wafer are exposed to described
Bonded adhesives.
8. LED light source component as claimed in claim 6, it is characterised in that: the side wall of the indent cavity sets a stage, described
Stage downward with LED support formed can the glued fully filled anti-overflow slot of glue, the stage be lower than indent cavity top surface.
9. LED light source component as claimed in claim 6, it is characterised in that: the longitudinal section of the LED wafer is quadrangle,
Four vertex are located on the long axis or short-axis direction of the oval base.
10. the LED light source component as described in claim 7,8 or 9, it is characterised in that: the air in the indent cavity is more saturating
It is thin outside mirror, to form negative pressure；Alternatively, being in vacuum state in the indent cavity.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811619651.3A CN109524530A (en) | 2018-12-28 | 2018-12-28 | A kind of lens and the LED light source component using the lens |
| CN201910419609.5A CN110085726B (en) | 2018-12-28 | 2019-05-20 | Lens and LED light source device adopting same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811619651.3A CN109524530A (en) | 2018-12-28 | 2018-12-28 | A kind of lens and the LED light source component using the lens |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109524530A true CN109524530A (en) | 2019-03-26 |
Family
ID=65797555
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811619651.3A Pending CN109524530A (en) | 2018-12-28 | 2018-12-28 | A kind of lens and the LED light source component using the lens |
| CN201910419609.5A Active CN110085726B (en) | 2018-12-28 | 2019-05-20 | Lens and LED light source device adopting same |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910419609.5A Active CN110085726B (en) | 2018-12-28 | 2019-05-20 | Lens and LED light source device adopting same |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN109524530A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110347051A (en) * | 2019-07-19 | 2019-10-18 | 深圳创维－Rgb电子有限公司 | The Intelligent household system of infrared emission mechanism, infrared remote control equipment and infrared control |
| JP2021015910A (en) * | 2019-07-12 | 2021-02-12 | Ｄｏｗａエレクトロニクス株式会社 | Light emitting element lamp and method for manufacturing the same |
| CN112397487A (en) * | 2019-08-12 | 2021-02-23 | 厦门市三安光电科技有限公司 | Light emitting device, manufacturing method thereof, display screen comprising light emitting device and lighting fixture |
| CN112825414A (en) * | 2019-11-20 | 2021-05-21 | 瑞识科技（深圳）有限公司 | VCSEL laser device and manufacturing method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101471399A (en) * | 2007-12-27 | 2009-07-01 | 富准精密工业(深圳)有限公司 | Led |
| US7918590B1 (en) * | 2009-09-14 | 2011-04-05 | Leotek Electronics Corporation | Composite lens plate |
| CN210142657U (en) * | 2018-12-28 | 2020-03-13 | 瑞识科技（深圳）有限公司 | Lens and LED light source device adopting same |
-
2018
- 2018-12-28 CN CN201811619651.3A patent/CN109524530A/en active Pending
-
2019
- 2019-05-20 CN CN201910419609.5A patent/CN110085726B/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021015910A (en) * | 2019-07-12 | 2021-02-12 | Ｄｏｗａエレクトロニクス株式会社 | Light emitting element lamp and method for manufacturing the same |
| JP7165629B2 (en) | 2019-07-12 | 2022-11-04 | Ｄｏｗａエレクトロニクス株式会社 | Light-emitting element lamp and manufacturing method thereof |
| CN110347051A (en) * | 2019-07-19 | 2019-10-18 | 深圳创维－Rgb电子有限公司 | The Intelligent household system of infrared emission mechanism, infrared remote control equipment and infrared control |
| CN112397487A (en) * | 2019-08-12 | 2021-02-23 | 厦门市三安光电科技有限公司 | Light emitting device, manufacturing method thereof, display screen comprising light emitting device and lighting fixture |
| CN112397487B (en) * | 2019-08-12 | 2024-04-09 | 湖北三安光电有限公司 | Light emitting device, manufacturing method thereof, display screen comprising light emitting device and lighting fixture |
| CN112825414A (en) * | 2019-11-20 | 2021-05-21 | 瑞识科技（深圳）有限公司 | VCSEL laser device and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110085726A (en) | 2019-08-02 |
| CN110085726B (en) | 2024-04-09 |
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Application publication date: 20190326 |