CN110085726B - Lens and LED light source device adopting same - Google Patents

Lens and LED light source device adopting same Download PDF

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Publication number
CN110085726B
CN110085726B CN201910419609.5A CN201910419609A CN110085726B CN 110085726 B CN110085726 B CN 110085726B CN 201910419609 A CN201910419609 A CN 201910419609A CN 110085726 B CN110085726 B CN 110085726B
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lens
led
concave cavity
elliptic
base
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CN110085726A (en
Inventor
汪洋
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Shenzhen Sunlight Technology Co ltd
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Shenzhen Sunlight Technology Co ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The invention is suitable for the technical field of optics, and provides a lens which is provided with an elliptic base, an elliptic upper part and a main body for connecting the elliptic base and the elliptic upper part, wherein the elliptic base is provided with a concave cavity for accommodating an LED wafer, and the ratio of the short axis to the long axis of the elliptic upper part is 0.1-1.0. Thus, light emitted by the LED wafer is refracted through the top surface of the concave cavity into the lens, and then is refracted through the surfaces of the main body and the upper part of the ellipsoid to a preset illumination area. The stray light around the preset illumination area is greatly reduced, the central effective light intensity is correspondingly enhanced, and the requirements of various LED light source devices, especially infrared transmitting tubes, on the brightness and uniformity of the light spots are completely met. In addition, the LED light source device provided by the embodiment of the invention is characterized in that the LED support and the bottom surface of the lens are adhered by the adhesive, and the adhesive is filled between the side surface of the concave cavity and the side surface of the LED wafer, so that the adhesive surface between the lens and the LED support is greatly expanded, the firmness of adhering the lens to the LED support is greatly enhanced, and the failure rate of the lens falling off from the LED support is greatly reduced.

Description

Lens and LED light source device adopting same
Technical Field
The invention belongs to the technical field of optics, and particularly relates to a lens and an LED light source device adopting the lens.
Background
Today, the requirements of various LED light source devices on light efficiency and brightness are increasing, and besides LED chips, lenses are also a very important influencing factor. However, the existing primary lens has weak light control capability, causes more stray light, has low brightness of a light source device, and particularly cannot meet the requirements of an infrared emission tube on the brightness and uniformity of light spots. In addition, the light spots emitted from the traditional LED light source device are in the conditions of strong center and weak edges, so that the direct use is not facilitated, software is required to be used for optimizing treatment, and the use is complex and complicated.
Disclosure of Invention
The embodiment of the invention aims to provide a lens and aims to solve the problems that the conventional lens is weak in light management and control capability, causes more stray light and is low in brightness of a light source device.
The embodiment of the invention is realized in such a way that the lens is provided with an elliptic base, an elliptic upper part and a main body for connecting the elliptic base and the elliptic upper part, wherein the elliptic base is provided with a concave cavity for accommodating an LED wafer, and the ratio of the short axis to the long axis of the elliptic upper part is 0.1-1.0; wherein, the ratio of the long axis to the short axis of the elliptic base is equal to the ratio of the long axis to the short axis of the elliptic upper part.
The LED light source device comprises an LED support, a wafer fixedly arranged on the LED support and a lens which is adhered to the LED support and adjusts light emitted by the wafer, wherein the lens is provided with an oval base, an oval upper part and a main body which is connected with the oval base and the oval upper part, the oval base is provided with a concave cavity for accommodating the LED wafer, and the ratio of the short axis to the long axis of the oval upper part is 0.1-1.0; wherein, the ratio of the long axis to the short axis of the elliptic base is equal to the ratio of the long axis to the short axis of the elliptic upper part of the elliptic base; and bonding glue is filled between the side surface of the concave cavity and the side surface of the LED wafer.
The lens provided by the embodiment of the invention is provided with an elliptic base, an elliptic upper part and a main body connected with the elliptic base and the elliptic upper part, wherein the elliptic base is provided with a concave cavity for accommodating an LED wafer, and the ratio of the short axis to the long axis of the elliptic upper part is 0.1-1.0; wherein, the ratio of the long axis to the short axis of the elliptic base is equal to the ratio of the long axis to the short axis of the elliptic upper part. Thus, light emitted by the LED wafer is refracted through the top surface of the concave cavity into the lens, and then is refracted through the surfaces of the main body and the upper part of the ellipsoid to a preset illumination area. If the ratio of the short axis to the long axis of the ellipsoidal upper part of the lens is 0.1-0.25, the light emitted by the LED chip is projected to a preset illumination area through the lens, the angle range of the preset illumination area in the short axis direction of the ellipsoidal upper part is 50 DEG + -15 DEG, and the angle range in the long axis direction of the ellipsoidal upper part is 125 DEG + -15 deg. If the ratio of the short axis to the long axis of the ellipsoidal upper part of the lens is 0.25-0.5, the light emitted by the LED chip is projected to a preset illumination area through the lens, the angle range of the preset illumination area in the short axis direction of the ellipsoidal upper part is 30 DEG + -15 DEG, and the angle range in the long axis direction of the ellipsoidal upper part is 95 DEG + -15 deg. If the ratio of the short axis to the long axis of the ellipsoidal upper part of the lens is 0.5-0.75, the light emitted by the LED chip is projected to a preset illumination area through the lens, the angle range of the preset illumination area in the short axis direction of the ellipsoidal upper part is 20 DEG + -10 DEG, and the angle range in the long axis direction of the ellipsoidal upper part is 65 DEG + -15 deg. If the ratio of the short axis to the long axis of the ellipsoidal upper part of the lens is 0.75-1.0, the light emitted by the LED chip is projected to a preset illumination area through the lens, the angle range of the preset illumination area in the short axis direction of the ellipsoidal upper part is 15 DEG + -10 DEG, and the angle range in the long axis direction of the ellipsoidal upper part is 35 DEG + -15 deg. The stray light around the preset illumination area is greatly reduced, the central effective light intensity is correspondingly enhanced, and the requirements of various LED light source devices, especially infrared emission tubes, on the brightness and uniformity of the light spots are completely met. In addition, the LED light source device provided by the embodiment of the invention is characterized in that the LED support and the bottom surface of the lens are adhered by the adhesive, and the adhesive is filled between the side surface of the concave cavity and the side surface of the LED wafer, so that the adhesive surface between the lens and the LED support is greatly expanded, the firmness of adhering the lens to the LED support is greatly enhanced, and the failure rate of the lens falling off from the LED support is greatly reduced. Furthermore, the embodiment of the invention is provided with the light-transmitting glue with the refractive index larger than 1.4 on the upper surface of the LED wafer, the light-transmitting glue can increase the light extraction of the wafer, and the brightness of the LED light source device is improved by about 10%.
Drawings
Fig. 1 is a schematic perspective view of a lens according to a first embodiment of the present invention (the main body is an elliptical table);
FIG. 2 is a top view of the lens of FIG. 1;
FIG. 3 is a schematic view of the optical path of the lens of FIG. 1 in the direction of the major axis of its elliptical base;
FIG. 4 is a schematic view of the optical path of the lens of FIG. 1 in the direction of the minor axis of its elliptical base;
fig. 5 is a schematic perspective view of a lens (with an elliptical main body) according to a second embodiment of the present invention;
FIG. 6 is a schematic view of the optical path of the lens of FIG. 5 in the direction of the major axis of its elliptical base;
FIG. 7 is a schematic view of the optical path of the lens of FIG. 5 in the direction of the minor axis of its elliptical base;
FIG. 8 is a top view (both sides are flat) of a lens according to a third embodiment of the present invention;
FIG. 9 is a schematic view of the optical path of the lens of FIG. 8 in the direction of the major axis of its elliptical base;
FIG. 10 is a schematic view of the optical path of the lens of FIG. 8 in the direction of the minor axis of its elliptical base;
FIG. 11 is a schematic view of a lens according to a fourth embodiment of the present invention along a major axis of an elliptical base;
FIG. 12 is a schematic view of the optical path of the lens of FIG. 11 in the direction of the minor axis of its elliptical base;
FIG. 13 is a schematic view of a lens structure according to a fifth embodiment of the present invention;
fig. 14 is a schematic structural view (side view) of an LED light source device according to an embodiment of the present invention;
fig. 15 is a schematic structural view (top view) of an LED light source device according to an embodiment of the present invention;
FIG. 16 is a graph showing a light intensity distribution diagram of an LED light source device provided by an embodiment of the present invention in a direction of a major axis of an elliptical base after die bonding by rotation, wherein an abscissa is an angle and an ordinate is radiation intensity;
fig. 17 is a schematic perspective view of a lens according to a sixth embodiment of the present invention;
FIG. 18 is a schematic view of the optical path of the lens of FIG. 17 in the direction of the upper long axis of its ellipsoid;
FIG. 19 is a schematic view of the optical path of the lens of FIG. 17 in the direction of the minor axis of the ellipsoidal upper portion thereof;
FIG. 20 is a schematic perspective view of a seventh lens according to an embodiment of the present invention;
FIG. 21 is a schematic view of the optical path of the lens of FIG. 20 in the direction of the upper long axis of its ellipsoid;
FIG. 22 is a schematic view of the optical path of the lens of FIG. 20 in the direction of the minor axis of the ellipsoidal upper portion thereof;
FIG. 23 is a schematic perspective view of a lens according to an eighth embodiment of the present invention;
FIG. 24 is a schematic view of the optical path of the lens of FIG. 23 in the direction of the upper long axis of its ellipsoid;
FIG. 25 is a schematic view of the optical path of the lens of FIG. 23 in the direction of the minor axis of the ellipsoidal upper portion thereof;
fig. 26 is a schematic perspective view of a lens according to a ninth embodiment of the present invention;
FIG. 27 is a schematic view of the optical path of the lens of FIG. 26 in the direction of the upper long axis of its ellipsoid;
FIG. 28 is a schematic view of the optical path of the lens of FIG. 26 in the direction of the minor axis of the ellipsoidal upper portion thereof;
fig. 29 is a schematic view showing a perspective structure of a lens according to a tenth embodiment of the present invention;
FIG. 30 is a schematic view of the optical path of the lens of FIG. 29 in the direction of the upper long axis of its ellipsoid;
FIG. 31 is a schematic view of the optical path of the lens of FIG. 29 in the direction of the minor axis of the upper portion of its ellipsoid;
fig. 32 is a schematic perspective view of a lens according to an eleventh embodiment of the present invention;
FIG. 33 is a schematic view of the optical path of the lens of FIG. 32 in the direction of the upper long axis of its ellipsoid;
FIG. 34 is a schematic view of the optical path of the lens of FIG. 32 in the direction of the minor axis of the ellipsoidal upper portion thereof;
FIG. 35 is a schematic view (top view) of a lens according to an embodiment of the present invention;
fig. 36 is a schematic structural view (side view) of an LED light source device according to an embodiment of the present invention;
fig. 37 is a schematic view (top view) of an LED light source device according to an embodiment of the present invention;
FIG. 38 is a graph showing a light intensity distribution in a direction of a long axis of an upper portion of an ellipsoid after die bonding (an included angle of 0) is rotated, wherein an abscissa is an angle and an ordinate is a radiation intensity (Cartesian view);
FIG. 39 is a graph showing a light intensity distribution in a direction of a long axis of an upper portion of an ellipsoid after die bonding (an included angle of 0 °) is rotated, wherein an abscissa is an angle and an ordinate is a radiation intensity (a polar view);
FIG. 40 is a graph showing a light intensity distribution diagram of an LED light source device provided in an embodiment of the present invention in a direction of a long axis of an upper portion of an ellipsoid after die bonding (an included angle of 20 °), wherein an abscissa is an angle and an ordinate is a radiation intensity (Cartesian view);
fig. 41 is a schematic structural diagram of an LED light source device according to an embodiment of the present invention (after an overflow preventing groove is provided);
fig. 42 is a schematic structural diagram of an LED light source device according to an embodiment of the present invention (after a light-transmitting adhesive is disposed).
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
The lens provided by the embodiment of the invention is provided with an elliptic base, an elliptic upper part and a main body connected with the elliptic base and the elliptic upper part, wherein the elliptic base is provided with a concave cavity for accommodating an LED wafer, and the ratio of the short axis to the long axis of the elliptic upper part is 0.1-1.0; wherein, the ratio of the long axis to the short axis of the elliptic base is equal to the ratio of the long axis to the short axis of the elliptic upper part. Thus, light emitted by the LED wafer is refracted through the top surface of the concave cavity into the lens, and then is refracted through the surfaces of the main body and the upper part of the ellipsoid to a preset illumination area. If the ratio of the short axis to the long axis of the ellipsoidal upper part of the lens is 0.1-0.25, the light emitted by the LED chip is projected to a preset illumination area through the lens, the angle range of the preset illumination area in the short axis direction of the ellipsoidal upper part is 50 DEG + -15 DEG, and the angle range in the long axis direction of the ellipsoidal upper part is 125 DEG + -15 deg. If the ratio of the short axis to the long axis of the ellipsoidal upper part of the lens is 0.25-0.5, the light emitted by the LED chip is projected to a preset illumination area through the lens, the angle range of the preset illumination area in the short axis direction of the ellipsoidal upper part is 30 DEG + -15 DEG, and the angle range in the long axis direction of the ellipsoidal upper part is 95 DEG + -15 deg. If the ratio of the short axis to the long axis of the ellipsoidal upper part of the lens is 0.5-0.75, the light emitted by the LED chip is projected to a preset illumination area through the lens, the angle range of the preset illumination area in the short axis direction of the ellipsoidal upper part is 20 DEG + -10 DEG, and the angle range in the long axis direction of the ellipsoidal upper part is 65 DEG + -15 deg. If the ratio of the short axis to the long axis of the ellipsoidal upper part of the lens is 0.75-1.0, the light emitted by the LED chip is projected to a preset illumination area through the lens, the angle range of the preset illumination area in the short axis direction of the ellipsoidal upper part is 15 DEG + -10 DEG, and the angle range in the long axis direction of the ellipsoidal upper part is 35 DEG + -15 deg. The stray light around the preset illumination area is greatly reduced, the central effective light intensity is correspondingly enhanced, and the requirements of various LED light source devices, especially infrared emission tubes, on the brightness and uniformity of the light spots are completely met. In addition, the LED light source device provided by the embodiment of the invention is characterized in that the LED support and the bottom surface of the lens are adhered by the adhesive, and the adhesive is filled between the side surface of the concave cavity and the side surface of the LED wafer, so that the adhesive surface between the lens and the LED support is greatly expanded, the firmness of adhering the lens to the LED support is greatly enhanced, and the failure rate of the lens falling off from the LED support is greatly reduced. Furthermore, the embodiment of the invention is provided with the light-transmitting glue with the refractive index larger than 1.4 on the upper surface of the LED wafer, the light-transmitting glue can increase the light extraction of the wafer, and the brightness of the LED light source device is improved by about 10%.
The implementation of the present invention is described in detail below in connection with specific embodiments.
As shown in fig. 1 to 13, the lens 1 according to the first to fifth embodiments of the present invention has an elliptical base 11, an elliptical upper portion 12, and a main body 13 connecting the elliptical base 11 and the elliptical upper portion 12, wherein the elliptical base 11 is provided with a concave cavity 14 for accommodating an LED chip, and a ratio of a short axis Y to a long axis X of the elliptical base 11 is 0.5 to 0.75. Wherein the ratio of the short axis Y to the long axis X of the elliptical base 11 in the lenses shown in fig. 3 and 4 is 0.5, the ratio of the short axis Y to the long axis X of the elliptical base 11 in the lenses shown in fig. 6 and 7 is 0.75, the ratio of the short axis Y to the long axis X of the elliptical base 11 in the lenses shown in fig. 9 and 10 is 0.5, and the ratio of the short axis Y to the long axis X of the elliptical base 11 in the lenses shown in fig. 11 and 12 is 0.7. Thus, the light emitted by the LED chip is refracted through the top surface 15 of the concave cavity 14 and enters the lens, and is refracted through the surfaces of the main body 13 and the ellipsoidal upper part 12 to a preset illumination area. In this way, the angle range of the preset illumination area in the short axis Y direction of the elliptical base 11 is 20 ° ± 10 °, the angle range in the long axis X direction of the elliptical base 11 is 65 ° ± 15 °, stray light around the above preset illumination area is greatly reduced, the central effective light intensity is correspondingly enhanced, and the requirements of various LED light source devices, especially infrared emission tubes, on the brightness and uniformity of the light spots are completely satisfied. It should be noted that the above angle value is an angle value when the light intensity is 50% of the central light intensity.
Preferably, the main body 13 is an elliptical table, and a larger end of the elliptical table 13 is connected to the elliptical base 11, and a smaller end is connected to the elliptical upper portion 12. The lens has small upper part and large lower part, and is stable in placement and bonding. The sides of the concave cavity 14 are preferably elliptical surfaces similar to the sides of the elliptical base 11, which facilitates the manufacture of the lens. Further, the side walls of the hollow cavity 14 are provided with a step 16 for forming a spill-proof groove, as shown in fig. 13, which facilitates the firm adhesion of the lens to the corresponding component.
In particular, the lens 1 is provided with a flat surface 17 perpendicular to its bottom surface on both sides in the direction of the minor axis Y of its elliptical base 11; the highest point of the flat surface 17 is lower than the junction of the body 13 and the ellipsoidal upper part 12 and higher than the highest point of the ellipsoidal base 11, as shown in fig. 8 to 13. This reduces the size of the lens 1, facilitating the manufacture of small-sized light source products. The lens can not influence the light emission, and is also helpful to take the lens.
Further, the sidewall of the oval base 11 is provided with a ventilation slot hole communicated with the concave cavity 14. After the lens 1 is adhered to the corresponding member, the internal air pressure is identical to the external pressure, and the lens can be prevented from falling off due to the excessive internal pressure.
Another embodiment of the present invention will be described in detail below using an LED light source device as an example of an infrared emitting tube, which requires a uniform spot and a higher effective intensity.
As shown in fig. 1 to 15, another embodiment of the present invention provides an LED light source device 2, which includes an LED holder 3, a die 4 fixedly disposed on the LED holder 3, and a lens 1 bonded to the LED holder 3 and adjusting light emitted from the die 4. The lens 1 has an elliptical base 11, an elliptical upper portion 12, and a main body 13 connecting the elliptical base 11 and the elliptical upper portion 12, wherein the elliptical base 11 is provided with a concave cavity 14 for accommodating the LED chip 4, and the ratio of the minor axis Y to the major axis X of the elliptical base 11 is 0.5-0.75. Wherein, the bonding glue 5 is filled between the side surface of the concave cavity 14 and the side surface of the LED wafer 4. It should be noted that the adhesive 5 may be filled in the side surface of the LED chip 4, as shown in fig. 14; it is also possible to fill somewhere between the side of the concave cavity 14 and the side of the LED chip 4, for example only to the edge of the step 16, as a sub-optimal embodiment, not shown in the drawing. In this way, besides the bonding glue bonds between the LED support 3 and the bottom surface of the lens 1, the bonding glue is filled between the side surface of the concave cavity 14 and the side surface of the LED wafer 4, so that the bonding surface between the lens 1 and the LED support 3 is greatly expanded, the firmness of bonding the lens 1 to the LED support 3 is greatly enhanced, and the failure rate of the lens 1 falling from the LED support 3 is greatly reduced. It should be understood that, because the LED light source device 2 adopts the lens 1, the stray light is less, the light efficiency is high, and various requirements can be satisfied.
Preferably, the LED chip 4 is a horizontal structure chip or a vertical structure chip electrically connected to the LED support 3 through a wire 6, and the section of the wire connected to the LED chip 4 is exposed from the adhesive 5, as shown in fig. 14. The internal stress of the bonding adhesive 5 acting on the wire 6 is smaller and is far smaller than the force for breaking the wire 6, so that the risk of breaking the wire 6 is avoided, and the possibility of failure of the LED light source device 2 due to breaking of the wire 6 in reflow soldering or other high-temperature use environments is completely avoided.
In particular, a step 16 is provided on the side wall of the concave cavity 14, and the step 16 and the LED support 3 are downward to form an overflow-preventing groove that can be completely filled with the adhesive 5. Wherein, the bonding glue outside the overflow preventing groove forms a curved surface with low middle and high periphery under the action of surface tension. The steps 16 are below the top surface 15 of the concave cavity 14, above or slightly below the upper surface of the LED chip 4, or flush with the upper surface of the LED chip 4, as shown in fig. 13 and 14. Therefore, the adhesive 5 can be prevented from overflowing to the top surface 15 of the concave cavity, the light emitting of the LED wafer 4 is not affected, and the light emitting is not affected. Meanwhile, the bonding surface between the lens 1 and the LED support 3 is further expanded, the firmness of bonding the lens 1 to the LED support 3 is further enhanced, and the failure rate caused by the fact that the lens 1 falls off from the LED support 3 is further reduced.
Further, the longitudinal section of the LED chip 4 is quadrangular, and four vertices thereof are located in the major axis X or the minor axis Y of the oval-shaped base 11, respectively, as shown in fig. 15. The LED chip 4 is rotatably disposed in such a manner that light type control is facilitated. Fig. 16 is a graph showing a light intensity distribution diagram of an LED light source device according to an embodiment of the present invention in a direction of a major axis of an elliptical base after rotation die bonding, where an outgoing light pattern is M-shaped, so that light intensity is more uniform in the entire irradiation area. Specifically, an obvious M light type is projected on the long axis X direction of the elliptical base, namely the central light intensity is slightly weak, the light intensity in the angle range of 25-45 degrees is the highest, and the intensity is 1.05-1.4 times of the central intensity. This ensures that the light intensity distribution of the light emitted from the light source device projected onto the irradiation region is uniform over a certain angular range (e.g., ±30°).
In particular, the air in the concave cavity 14 is rarer than the air outside the lens 1 to form negative pressure; or the inside of the concave cavity is in a vacuum state. The air pressure in the concave cavity 14 is not increased significantly with the temperature, i.e. the air pressure in the lens 1 does not blow the lens 1, so that the probability of failure is greatly reduced.
It should be noted that the above embodiment claims priority from patent application 201811619651.3 filed by the applicant on day 28 of 12 in 2018. The other technical features are applicable to the following embodiments except for the range of the ratio of the minor axis to the major axis of the ellipsoidal upper portion.
As shown in fig. 17 to 35, the lens 1 according to the sixth to eleventh embodiments of the present invention has an elliptical base 11, an elliptical upper portion 12, and a main body 13 connecting the elliptical base 11 and the elliptical upper portion 12, wherein the elliptical base 11 is provided with a concave cavity 14 for accommodating an LED chip; the ratio of the minor axis B to the major axis a of the ellipsoidal upper portion 12 is 0.1 to 0.5 or 0.75 to 1.0. Wherein the ratio of the minor axis B to the major axis a of the ellipsoidal upper part 12 in the lens shown in fig. 17, 18 and 19 is 0.1, the ratio of the minor axis B to the major axis a of the ellipsoidal upper part 12 in the lens shown in fig. 20, 21 and 22 is 0.2, the ratio of the minor axis B to the major axis a of the ellipsoidal upper part 12 in the lens shown in fig. 23, 24 and 25 is 0.3, the ratio of the minor axis B to the major axis a of the ellipsoidal upper part 12 in the lens shown in fig. 26, 27 and 28 is 0.4, the ratio of the minor axis B to the major axis a of the ellipsoidal upper part 12 in the lens shown in fig. 29, 30 and 31 is 0.85, and the ratio of the minor axis B to the major axis a of the ellipsoidal upper part 12 in the lens shown in fig. 32, 33 and 34 is 0.95. It should be noted that the ratio of the long axis to the short axis of the elliptical base in the embodiments of the present invention is equivalent to the ratio of the long axis to the short axis of the upper part of the ellipse thereof, as shown in fig. 35. In order to clearly show the structure of a lens or an LED light source device employing the lens, each drawing has been subjected to a scaling process, and the ratio of the length and the minor axis of the same lens in the drawing is likely to be inconsistent with the above ratio. Thus, the light emitted by the LED chip is refracted through the top surface 15 of the concave cavity 14 and enters the lens, and is refracted through the surfaces of the main body 13 and the ellipsoidal upper part 12 to a preset illumination area. If the ratio of the minor axis B to the major axis a of the ellipsoidal upper part 12 of the lens is 0.1-0.25, the light emitted from the led chip is projected through the lens to a preset illumination area having an angle range of 50 ° ± 15 ° in the minor axis B direction of the ellipsoidal upper part 12 and an angle range of 125 ° ± 15 ° in the major axis a direction of the ellipsoidal upper part 12, as shown in fig. 18, 19, 21, and 22. If the ratio of the minor axis B to the major axis a of the ellipsoidal upper part 12 of the lens is 0.25-0.5, the light emitted from the led chip is projected through the lens to a preset illumination area having an angle range of 30 ° ± 15 ° in the minor axis B direction of the ellipsoidal upper part 12 and an angle range of 95 ° ± 15 ° in the major axis a direction of the ellipsoidal upper part 12, as shown in fig. 24, 25, 27, 28. If the ratio of the minor axis B to the major axis a of the ellipsoidal upper part 12 of the lens is 0.75-1.0, the light emitted from the led chip is projected through the lens to a preset illumination area having an angle range of 15 ° ± 10 ° in the minor axis B direction of the ellipsoidal upper part 12 and an angle range of 35 ° ± 15 ° in the major axis a direction of the ellipsoidal upper part 12, as shown in fig. 30, 31, 33, and 34. The stray light around the preset illumination area is greatly reduced, the central effective light intensity is correspondingly enhanced, and the requirements of various LED light source devices, especially infrared emission tubes, on the brightness and uniformity of the light spots are completely met. It should be noted that the above angle value is an angle value when the light intensity is 50% of the central light intensity.
Another embodiment of the present invention will be described in detail below using an LED light source device as an example of an infrared emitting tube, because the infrared emitting tube requires a uniform spot and a higher effective intensity.
As shown in fig. 17 to 42, another embodiment of the present invention provides an LED light source device 2, which includes an LED holder 3, a die 4 fixed to the LED holder 3, and a lens 1 bonded to the LED holder 3 and adjusting light emitted from the die 4. The lens 1 has an elliptical base 11, an elliptical upper portion 12, and a main body 13 connecting the elliptical base 11 and the elliptical upper portion 12, wherein the elliptical base 11 is provided with a concave cavity 14 for accommodating the LED chip 4, and the ratio of the minor axis B to the major axis a of the elliptical upper portion 12 is 0.1-0.5, or 0.75-1.0. In addition, an adhesive 5 is filled between the side surface of the concave cavity 14 and the side surface of the LED chip 4. It should be noted that the adhesive 5 may be filled in the side surface of the LED chip 4, as shown in fig. 36; it is also possible to fill somewhere between the side of the concave cavity 14 and the side of the LED chip 4, for example only to the edge of the step 16, as a sub-optimal embodiment, not shown in the drawing. In this way, besides the bonding glue bonds between the LED support 3 and the bottom surface of the lens 1, the bonding glue is filled between the side surface of the concave cavity 14 and the side surface of the LED wafer 4, so that the bonding surface between the lens 1 and the LED support 3 is greatly expanded, the firmness of bonding the lens 1 to the LED support 3 is greatly enhanced, and the failure rate of the lens 1 falling from the LED support 3 is greatly reduced. It should be understood that, because the LED light source device 2 adopts the lens 1, the stray light is less, the light efficiency is high, and various requirements can be satisfied.
Further, the longitudinal section of the LED wafer 4 is quadrilateral, and the included angle between the connecting line of two opposite vertexes and the major axis or the minor axis of the elliptical base is less than or equal to 20 degrees; an "M" -shaped light pattern is projected in the long axis direction of the ellipsoidal upper portion. More preferably, the four vertices of the quadrangle are located in the direction of the major axis a or the minor axis B of the elliptical base 11, respectively, as shown in fig. 37. The LED chip 4 is rotatably disposed in such a manner that light type control is facilitated. Fig. 38 is a graph of a light intensity distribution (cartesian view) in a long axis direction of an elliptical base after rotation die bonding (the included angle is 0 °) of an LED light source device provided in an embodiment of the present invention, and fig. 39 is a polar coordinate view of fig. 38, where the light-emitting pattern is "M" shaped, so that the light intensity is more uniform in the whole irradiation area, that is, in practical application, uniform illuminance is presented in a preset illumination area. Specifically, the light emitted by the LED light source device forms a light spot with a substantially elliptical shape in a preset illumination area, and the energy intensity distribution of the light spot with an elliptical shape in the long axis direction shows an "M" shape, that is, the central light intensity is slightly weaker, the light intensity in the angle range of 25-45 ° is the highest, and the intensity is 1.05-1.4 times of the central intensity. It should be noted that as long as the angle between the line connecting two opposite vertices of the quadrangle and the major axis or the minor axis of the elliptical base is not more than 20 °, no failure of the "M" type will be caused, and the light intensity distribution with the angle of 20 ° is shown in fig. 40. This ensures that the light intensity distribution of the light emitted from the light source device projected onto the irradiation region is uniform over a certain angular range (e.g., ±30°).
In particular, a step 16 is provided on the side wall of the concave cavity 14, and the step 16 and the LED support 3 are downward to form an overflow-preventing groove that can be completely filled with the adhesive 5. In addition, the tail end of the step is provided with a sharp corner 17 for blocking the adhesive from flowing to the top surface of the concave cavity, so that the light-emitting of the wafer is not blocked or the light-emitting type is not changed. Wherein, the bonding glue outside the overflow preventing groove forms a curved surface with low middle and high periphery under the action of surface tension. The steps 16 are below the top surface 15 of the concave cavity 14, above or slightly below the upper surface of the LED chip 4, or flush with the upper surface of the LED chip 4, as shown in fig. 41. Therefore, the adhesive 5 can be prevented from overflowing to the top surface 15 of the concave cavity, the light emitting of the LED wafer 4 is not affected, and the light emitting is not affected. Meanwhile, the bonding surface between the lens 1 and the LED support 3 is further expanded, the firmness of bonding the lens 1 to the LED support 3 is further enhanced, and the failure rate caused by the fact that the lens 1 falls off from the LED support 3 is further reduced.
Further, the upper surface of the LED wafer is provided with a light-transmitting adhesive 7 with a refractive index greater than 1.4; the section of the wire 6 connected with the LED chip 4 is covered by the light-transmitting glue 7, the section connected with the LED support 3 is covered by the adhesive glue 5, and the rest is exposed to the air in the concave cavity 14 or is in a vacuum state, as shown in fig. 42. In this way the air pressure in the hollow cavity 14 no longer increases significantly with increasing temperature, i.e. the air pressure in the lens 1 does not blow the lens 1 away, so that the probability of failure is greatly reduced. In addition, the light-transmitting glue 7 can increase the light extraction of the wafer 4, and the brightness is improved by about 10%; a small amount of light-transmitting glue is coated on the surface of the wafer, the influence of an optical interface is small, the light-emitting effect of the lens can be controlled, the light extraction of the wafer is increased, and the absolute radiation intensity/illumination of the device is improved.
It should be noted that the size of the lens is adapted to the size of the holder of the LED light source device, for example, the holder may be square or rectangular, and the frame of the lens may be arranged to be square or rectangular as large as the holder so as to be adhered to the holder. It can be understood that the final shape of the lens can be arbitrary, and the lens shape can be arbitrarily set by ensuring the light-emitting function area of the lens according to the light path diagram.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.

Claims (12)

1. A lens, characterized in that: the lens is provided with an elliptic base, an elliptic upper part and a main body for connecting the elliptic base and the elliptic upper part, wherein the elliptic base is provided with a concave cavity for accommodating an LED wafer, the opening of the concave cavity faces downwards, and the top surface of the concave cavity is spaced from the top surface of the LED wafer; the ratio of the short axis to the long axis of the elliptical base is 0.5-0.75; light emitted by the LED wafer is refracted through the top surface of the concave cavity into a lens, and then is refracted through the surfaces of the main body and the upper part of the ellipsoid to a preset illumination area; the main body is an elliptical table, the larger end of the elliptical table is connected with the elliptical base, and the smaller end of the elliptical table is connected with the upper part of the elliptical table; the side surface of the concave cavity is an elliptic surface similar to the side surface of the elliptic base, and the side wall of the elliptic base is provided with a ventilation slot hole communicated with the concave cavity; the side wall of the concave cavity is provided with a step for forming an overflow-preventing groove.
2. The lens of claim 1, wherein: the lens is provided with a flat surface vertical to the bottom surface of the lens on two sides along the short axis direction of the elliptical base; the highest point of the flat surface is lower than the junction point of the main body and the upper part of the ellipse, and is higher than the highest point of the ellipse base.
3. The utility model provides a LED light source device, includes the LED support, set firmly in the wafer of LED support and with the lens that the wafer sent out light, its characterized in that is adhered and adjusted to the LED support: the lens is provided with an elliptic base, an elliptic upper part and a main body for connecting the elliptic base and the elliptic upper part, wherein the elliptic base is provided with a concave cavity for accommodating an LED wafer, the opening of the concave cavity faces downwards, and the top surface of the concave cavity is spaced from the top surface of the LED wafer; the ratio of the short axis to the long axis of the elliptical base is 0.5-0.75, and adhesive is filled between the side surface of the concave cavity and the side surface of the LED wafer; light emitted by the LED wafer is refracted through the top surface of the concave cavity into a lens, and then is refracted through the surfaces of the main body and the upper part of the ellipsoid to a preset illumination area; the main body is an elliptical table, the larger end of the elliptical table is connected with the elliptical base, and the smaller end of the elliptical table is connected with the upper part of the elliptical table; the side surface of the concave cavity is an elliptic surface similar to the side surface of the elliptic base, and the side wall of the elliptic base is provided with a ventilation slot hole communicated with the concave cavity; the side wall of the concave cavity is provided with a step, the step downwards forms an anti-overflow groove with the LED bracket, the anti-overflow groove can be completely filled with adhesive, and the step is lower than the top surface of the concave cavity.
4. An LED light source device as recited in claim 3, wherein: the LED wafer is a horizontal structure wafer or a vertical structure wafer which is electrically connected with the LED bracket through a wire, and the section of the wire connected with the LED wafer is exposed out of the adhesive.
5. An LED light source device as recited in claim 3, wherein: the longitudinal section of the LED wafer is quadrilateral, and four vertexes of the LED wafer are respectively positioned in the long axis or short axis direction of the oval base.
6. An LED light source device as recited in claim 4 or 5, wherein: the air in the concave cavity is thinner than the air outside the lens so as to form negative pressure; or the inside of the concave cavity is in a vacuum state.
7. A lens, characterized in that: the lens is provided with an elliptic base, an elliptic upper part and a main body for connecting the elliptic base and the elliptic upper part, wherein the elliptic base is provided with a concave cavity for accommodating an LED wafer, the opening of the concave cavity faces downwards, and the top surface of the concave cavity is spaced from the top surface of the LED wafer; the ratio of the minor axis to the major axis of the ellipsoidal upper part is 0.1-0.5 or 0.75-1.0;
if the ratio of the short axis to the long axis of the ellipsoidal upper part of the lens is 0.1-0.25, the light emitted by the LED chip is projected to a preset illumination area through the lens, the angle range of the preset illumination area in the short axis direction of the ellipsoidal upper part is 50 degrees+/-15 degrees, and the angle range in the long axis direction of the ellipsoidal upper part is 125 degrees+/-15 degrees;
if the ratio of the short axis to the long axis of the ellipsoidal upper part of the lens is 0.25-0.5, the light emitted by the LED chip is projected to a preset illumination area through the lens, the angle range of the preset illumination area in the short axis direction of the ellipsoidal upper part is 30 degrees+/-15 degrees, and the angle range in the long axis direction of the ellipsoidal upper part is 95 degrees+/-15 degrees;
if the ratio of the short axis to the long axis of the ellipsoidal upper part of the lens is more than 0.75 and less than 1.0, the light emitted by the LED chip is projected to a preset illumination area through the lens, the angle range of the preset illumination area in the short axis direction of the ellipsoidal upper part is 15 DEG + -10 DEG, and the angle range in the long axis direction of the ellipsoidal upper part is 35 DEG + -15 DEG;
light emitted by the LED wafer is refracted through the top surface of the concave cavity into the lens, and then is refracted through the surfaces of the main body and the upper part of the ellipsoid to a preset illumination area; the main body is an elliptical table, the larger end of the elliptical table is connected with the elliptical base, and the smaller end of the elliptical table is connected with the upper part of the elliptical table; the side surface of the concave cavity is an elliptic surface similar to the side surface of the elliptic base, and the side wall of the elliptic base is provided with a ventilation slot hole communicated with the concave cavity; the side wall of the concave cavity is provided with a step for forming an overflow-preventing groove, and the tail end of the step is provided with a sharp corner for preventing the adhesive from flowing to the top surface of the concave cavity.
8. The lens of claim 7, wherein: the lens is provided with a flat surface vertical to the bottom surface of the lens on two sides along the short axis direction of the elliptical base; the highest point of the flat surface is lower than the junction point of the main body and the upper part of the ellipse, and is higher than the highest point of the ellipse base.
9. The utility model provides a LED light source device, includes the LED support, set firmly in the wafer of LED support and with the lens that the wafer sent out light, its characterized in that is adhered and adjusted to the LED support: the lens is provided with an elliptic base, an elliptic upper part and a main body for connecting the elliptic base and the elliptic upper part, wherein the elliptic base is provided with a concave cavity for accommodating an LED wafer, the opening of the concave cavity faces downwards, and the top surface of the concave cavity is spaced from the top surface of the LED wafer; the ratio of the minor axis to the major axis of the ellipsoidal upper part is 0.1-0.5 or 0.75-1.0; bonding glue is filled between the side surface of the concave cavity and the side surface of the LED wafer;
if the ratio of the short axis to the long axis of the ellipsoidal upper part of the lens is 0.1-0.25, the light emitted by the LED chip is projected to a preset illumination area through the lens, the angle range of the preset illumination area in the short axis direction of the ellipsoidal upper part is 50 degrees+/-15 degrees, and the angle range in the long axis direction of the ellipsoidal upper part is 125 degrees+/-15 degrees;
if the ratio of the short axis to the long axis of the ellipsoidal upper part of the lens is 0.25-0.5, the light emitted by the LED chip is projected to a preset illumination area through the lens, the angle range of the preset illumination area in the short axis direction of the ellipsoidal upper part is 30 degrees+/-15 degrees, and the angle range in the long axis direction of the ellipsoidal upper part is 95 degrees+/-15 degrees;
if the ratio of the short axis to the long axis of the ellipsoidal upper part of the lens is more than 0.75 and less than 1.0, the light emitted by the LED chip is projected to a preset illumination area through the lens, the angle range of the preset illumination area in the short axis direction of the ellipsoidal upper part is 15 DEG + -10 DEG, and the angle range in the long axis direction of the ellipsoidal upper part is 35 DEG + -15 DEG;
light emitted by the LED wafer is refracted through the top surface of the concave cavity into the lens, and then is refracted through the surfaces of the main body and the upper part of the ellipsoid to a preset illumination area; the main body is an elliptical table, the larger end of the elliptical table is connected with the elliptical base, and the smaller end of the elliptical table is connected with the upper part of the elliptical table; the side surface of the concave cavity is an elliptic surface similar to the side surface of the elliptic base, and the side wall of the elliptic base is provided with a ventilation slot hole communicated with the concave cavity; the side wall of the concave cavity is provided with a step, the step downwards forms an anti-overflow groove with the LED bracket, the anti-overflow groove can be completely filled by adhesive, the step is lower than the top surface of the concave cavity, and the tail end of the step is provided with a sharp corner for blocking the adhesive from flowing to the top surface of the concave cavity.
10. An LED light source device as recited in claim 9, wherein: the LED wafer is a horizontal structure wafer or a vertical structure wafer which is electrically connected with the LED bracket through a wire, and the section of the wire connected with the LED wafer is exposed out of the adhesive.
11. An LED light source device as claimed in claim 3 or 9, characterized in that: the longitudinal section of the LED wafer is quadrilateral, and the included angle between the connecting line of two opposite vertexes and the long axis or the short axis of the oval base is less than or equal to 20 degrees; the light emitted by the LED light source device forms a light spot which is approximately elliptical in a preset illumination area, and the energy intensity distribution of the light spot is in an M shape in the long axis direction of the elliptical light spot.
12. An LED light source device as claimed in claim 4 or 10, characterized in that: the upper surface of the LED wafer is provided with light-transmitting glue with refractive index larger than 1.4; the section of the lead connected with the LED chip is coated by light-transmitting glue, the section connected with the LED bracket is coated by adhesive glue, and the rest part is exposed to the air in the concave cavity or is in a vacuum state.
CN201910419609.5A 2018-12-28 2019-05-20 Lens and LED light source device adopting same Active CN110085726B (en)

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CN210142657U (en) * 2018-12-28 2020-03-13 瑞识科技（深圳）有限公司 Lens and LED light source device adopting same

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