CN210142657U

CN210142657U - Lens and LED light source device adopting same

Info

Publication number: CN210142657U
Application number: CN201920723544.9U
Authority: CN
Inventors: 汪洋
Original assignee: Ruizhi Technology (shenzhen) Co Ltd
Current assignee: Shenzhen Sunlight Technology Co ltd
Priority date: 2018-12-28
Filing date: 2019-05-20
Publication date: 2020-03-13
Anticipated expiration: 2029-05-20

Abstract

The utility model is suitable for an optics technical field provides a lens, and it has an oval base, ellipsoid upper portion and connects oval base and the main part on ellipsoid upper portion, oval base is equipped with the indent cavity that is used for holding the LED wafer, the minor axis on ellipsoid upper portion is 0.1 ~ 1.0 with the ratio of major axis. Thus, light emitted by the LED wafer is refracted through the top surface of the concave cavity to enter the lens, and then is refracted through the main body and the surface of the upper part of the ellipsoid to the preset illumination area. Stray light around a preset illumination area is greatly reduced, the central effective light intensity is correspondingly enhanced, and the requirements of various LED light source devices, particularly infrared emission tubes, on the brightness and uniformity of light spots are completely met. Furthermore, the embodiment of the utility model provides a LED light source device is in outside bonding by the bonding glue between the bottom surface of LED support and lens, still fill the bonding glue between the side of indent cavity and the side of LED wafer, greatly expand the bonding face between lens and LED support like this, also greatly strengthened the firmness that lens bond in the LED support certainly, greatly reduced is because of the failure rate that lens drop from the LED support.

Description

Lens and LED light source device adopting same

Technical Field

The utility model belongs to the technical field of optics, especially, relate to a lens and adopt LED light source device of this lens.

Background

Nowadays, various LED light source devices have higher and higher requirements for luminous efficiency and brightness, and besides LED chips, lenses are also very important influencing factors. However, the existing primary lens has weak light control capability, causes more stray light, and has low brightness of a light source device, and especially cannot meet the requirements of an infrared emission tube on the brightness and uniformity of light spots. In addition, the light spots emitted from the existing LED light source device have the conditions of strong center and weak edge, are not beneficial to direct use, need to be optimized by software, and are complex and tedious to use.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the utility model is to provide a lens, it is weak to light management and control ability to aim at solving current lens, causes stray light ratio many, the not high problem of light source device luminance.

The embodiment of the utility model provides a realize like this, a lens, it has an oval base, ellipsoid upper portion and connects the main part on oval base and the ellipsoid upper portion, oval base is equipped with the indent cavity that is used for holding the LED wafer, the ratio of the minor axis on ellipsoid upper portion to major axis is 0.1 ~ 1.0; wherein, the ratio of the long axis and the short axis of the oval base is equivalent to the ratio of the long axis and the short axis of the upper part of the oval shape.

Another embodiment of the present invention is achieved as above, in an LED light source device, comprising an LED support, a wafer fixedly mounted on the LED support, and a lens bonded to the LED support and adjusting light emitted from the wafer, wherein the lens has an elliptical base, an ellipsoidal upper portion, and a main body connecting the elliptical base and the ellipsoidal upper portion, the elliptical base has an inwardly concave cavity for accommodating the LED wafer, and a ratio of a minor axis to a major axis of the ellipsoidal upper portion is 0.1 to 1.0; wherein, the ratio of the long axis and the short axis of the oval base is equivalent to the ratio of the long axis and the short axis of the upper part of the oval; and adhesive glue is filled between the side surface of the concave cavity and the side surface of the LED wafer.

The embodiment of the utility model provides a lens has an oval base, ellipsoid upper portion and connects oval base and the main part on ellipsoid upper portion, oval base is equipped with the indent cavity that is used for holding the LED wafer, the ratio of minor axis and major axis on ellipsoid upper portion is 0.1 ~ 1.0; wherein, the ratio of the long axis and the short axis of the oval base is equivalent to the ratio of the long axis and the short axis of the upper part of the oval shape. Thus, light emitted by the LED wafer is refracted through the top surface of the concave cavity to enter the lens, and then is refracted through the main body and the surface of the upper part of the ellipsoid to the preset illumination area. If the ratio of the short axis to the long axis of the upper part of the ellipsoid of the lens is 0.1 to 0.25, light emitted by the LED chip is projected to a preset illumination area through the lens, the angle range of the preset illumination area in the short axis direction of the upper part of the ellipsoid is 50 DEG + -15 DEG, and the angle range in the long axis direction of the upper part of the ellipsoid is 125 DEG + -15 deg. If the ratio of the short axis to the long axis of the upper part of the ellipsoid of the lens is 0.25 to 0.5, light emitted by the LED chip is projected to a preset illumination area through the lens, the angle range of the preset illumination area in the short axis direction of the upper part of the ellipsoid is 30 DEG + -15 DEG, and the angle range in the long axis direction of the upper part of the ellipsoid is 95 DEG + -15 deg. If the ratio of the short axis to the long axis of the upper part of the ellipsoid of the lens is 0.5 to 0.75, the light emitted by the LED chip is projected to a preset illumination area through the lens, the angle range of the preset illumination area in the short axis direction of the upper part of the ellipsoid is 20 DEG + -10 DEG, and the angle range in the long axis direction of the upper part of the ellipsoid is 65 DEG + -15 deg. If the ratio of the short axis to the long axis of the upper part of the ellipsoid of the lens is 0.75 to 1.0, light emitted by the LED chip is projected to a preset illumination area through the lens, the angle range of the preset illumination area in the short axis direction of the upper part of the ellipsoid is 15 DEG + -10 DEG, and the angle range in the long axis direction of the upper part of the ellipsoid is 35 DEG + -15 deg. Stray light around the preset illumination area is greatly reduced, the central effective light intensity is correspondingly enhanced, and the requirements of various LED light source devices, particularly infrared emission tubes, on the brightness and uniformity of light spots are completely met. Furthermore, the embodiment of the utility model provides a LED light source device is in outside bonding by the bonding glue between the bottom surface of LED support and lens, still fill the bonding glue between the side of indent cavity and the side of LED wafer, greatly expand the bonding face between lens and LED support like this, also greatly strengthened the firmness that lens bond in the LED support certainly, greatly reduced is because of the failure rate that lens drop from the LED support. Further, the embodiment of the utility model provides a be provided with the light-transmitting glue that the refracting index is greater than 1.4 at the upper surface of LED wafer, the light of the multiplicable wafer of light-transmitting glue is taken out, and LED light source device luminance promotes about 10%.

Drawings

Fig. 1 is a schematic perspective view of a lens according to a first embodiment of the present invention (the main body is an elliptical table);

FIG. 2 is a top view of the lens shown in FIG. 1;

FIG. 3 is a schematic diagram of the optical path of the lens of FIG. 1 in the direction of the major axis of its elliptical base;

FIG. 4 is a schematic diagram of the optical path of the lens of FIG. 1 in the direction of the minor axis of its elliptical base;

fig. 5 is a schematic perspective view of a lens provided in the second embodiment of the present invention (the main body is an elliptical table);

FIG. 6 is a schematic diagram of the optical path of the lens of FIG. 5 in the direction of the major axis of its elliptical base;

FIG. 7 is a schematic diagram of the optical path of the lens of FIG. 5 in the direction of the minor axis of its elliptical base;

fig. 8 is a top view of a lens provided in the third embodiment of the present invention (both sides are flat surfaces);

FIG. 9 is a schematic diagram of the optical path of the lens of FIG. 8 in the direction of the major axis of its elliptical base;

FIG. 10 is a schematic view of the optical path of the lens of FIG. 8 in the direction of the minor axis of its elliptical base;

fig. 11 is a schematic optical path diagram of a lens provided in the fourth embodiment of the present invention in the long axis direction of the elliptical base;

FIG. 12 is a schematic view of the optical path of the lens of FIG. 11 in the direction of the minor axis of its elliptical base;

fig. 13 is a schematic view of a lens structure provided in the fifth embodiment of the present invention;

fig. 14 is a schematic structural diagram (side view) of an LED light source device provided in an embodiment of the present invention;

fig. 15 is a schematic structural diagram (top view) of an LED light source device provided in an embodiment of the present invention;

fig. 16 is a light intensity distribution diagram of the LED light source device in the major axis direction of the elliptical base after the LED light source device is rotated for die bonding, where the abscissa is the angle and the ordinate is the radiation intensity;

fig. 17 is a schematic perspective view of a lens according to an embodiment of the present invention;

FIG. 18 is a schematic view of the optical path of the lens of FIG. 17 in the direction of the major axis of its ellipsoidal upper part;

FIG. 19 is a schematic view of the optical path of the lens of FIG. 17 in the direction of the minor axis of the upper portion of its ellipsoidal shape;

fig. 20 is a schematic perspective view of a lens according to an embodiment of the present invention;

FIG. 21 is a schematic view of the optical path of the lens of FIG. 20 in the direction of the major axis of its ellipsoidal upper part;

FIG. 22 is a schematic view of the optical path of the lens of FIG. 20 in the direction of the minor axis of the upper portion of its ellipsoidal shape;

fig. 23 is a schematic perspective view of a lens according to an eighth embodiment of the present invention;

FIG. 24 is a schematic view of the optical path of the lens of FIG. 23 in the direction of the major axis of its ellipsoidal upper part;

FIG. 25 is a schematic view of the optical path of the lens of FIG. 23 in the direction of the minor axis of the upper portion of its ellipsoidal shape;

fig. 26 is a schematic perspective view of a lens according to a ninth embodiment of the present invention;

FIG. 27 is a schematic view of the optical path of the lens of FIG. 26 in the direction of the major axis of the upper portion of its ellipsoidal shape;

FIG. 28 is a schematic view of the optical path of the lens of FIG. 26 in the direction of the minor axis of the upper portion of its ellipsoidal shape;

fig. 29 is a schematic perspective view of a lens provided in an embodiment of the present invention;

FIG. 30 is a schematic view of the optical path of the lens of FIG. 29 in the direction of the major axis of its ellipsoidal upper part;

FIG. 31 is a schematic view of the optical path of the lens of FIG. 29 in the direction of the minor axis of the upper portion of its ellipsoidal shape;

fig. 32 is a schematic perspective view of a lens according to an eleventh embodiment of the present invention;

FIG. 33 is a schematic view of the optical path of the lens of FIG. 32 in the direction of the major axis of the upper portion of its ellipsoidal shape;

FIG. 34 is a schematic view of the optical path of the lens of FIG. 32 in the direction of the minor axis of the upper portion of its ellipsoidal shape;

fig. 35 is a schematic structural diagram (top view) of a lens provided by an embodiment of the present invention;

fig. 36 is a schematic structural diagram (side view) of an LED light source device provided in an embodiment of the present invention;

fig. 37 is a schematic structural diagram (top view) of an LED light source device provided in an embodiment of the present invention;

fig. 38 is a light intensity distribution diagram of the LED light source device according to the embodiment of the present invention in the long axis direction of the upper part of the ellipsoid after rotating for die bonding (with an included angle of 0 °), where the abscissa is the angle and the ordinate is the radiation intensity (cartesian view);

fig. 39 is a light intensity distribution diagram of the LED light source device provided in the embodiment of the present invention in the long axis direction of the upper portion of the ellipsoid after rotating for die bonding (with an included angle of 0 °), where the abscissa is the angle and the ordinate is the radiation intensity (polar view);

fig. 40 is a light intensity distribution diagram of the LED light source device provided by the embodiment of the present invention in the major axis direction of the upper part of the ellipsoid after rotating for die bonding (included angle of 20 °), in which the abscissa is angle and the ordinate is radiation intensity (cartesian view);

fig. 41 is a schematic structural diagram of an LED light source device provided in an embodiment of the present invention (after an anti-overflow groove is provided);

fig. 42 is a schematic structural diagram of an LED light source device (after the transparent adhesive is disposed) according to an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The following describes the implementation of the present invention in detail with reference to specific embodiments.

As shown in fig. 1 to 13, the lens 1 according to the first to fifth embodiments of the present invention includes an elliptical base 11, an elliptical upper portion 12 and a main body 13 connecting the elliptical base 11 and the elliptical upper portion 12, wherein the elliptical base 11 is provided with a concave cavity 14 for accommodating an LED chip, and a ratio of a minor axis Y to a major axis X of the elliptical base 11 is 0.5 to 0.75. In the lens shown in fig. 3 and 4, the ratio of the minor axis Y to the major axis X of the elliptical base 11 is 0.5, the ratio of the minor axis Y to the major axis X of the elliptical base 11 in the lens shown in fig. 6 and 7 is 0.75, the ratio of the minor axis Y to the major axis X of the elliptical base 11 in the lens shown in fig. 9 and 10 is 0.5, and the ratio of the minor axis Y to the major axis X of the elliptical base 11 in the lens shown in fig. 11 and 12 is 0.7. Thus, light emitted from the LED chip is refracted through the top surface 15 of the concave cavity 14 and enters the lens, and then is refracted through the surfaces of the main body 13 and the ellipsoidal upper portion 12 to a preset illumination area. Therefore, the angle range of the preset illumination area in the Y direction of the short axis of the elliptical base 11 is 20 degrees +/-10 degrees, the angle range in the X direction of the long axis of the elliptical base 11 is 65 degrees +/-15 degrees, stray light around the preset illumination area is greatly reduced, the central effective light intensity is correspondingly enhanced, and the requirements of various LED light source devices, particularly infrared emission tubes, on the brightness and uniformity of light spots are completely met. It should be noted that the above angle values are angle values at which the light intensity is 50% of the central light intensity.

Preferably, the main body 13 is an elliptical table, and the larger end of the elliptical table 13 is connected with the elliptical base 11, and the smaller end is connected with the elliptical upper portion 12. The lens is small at the top and big at the bottom, and is stable in placement and bonding. The sides of the concave cavity 14 are preferably elliptical surfaces similar to the sides of the elliptical base 11, which facilitates the manufacture of the lens. Further, the side wall of the concave cavity 14 is provided with a step 16 for forming an anti-overflow groove, as shown in fig. 13, which facilitates a firm bonding of the lens to the corresponding component.

In particular, the lens 1 is provided with flat surfaces 17 perpendicular to the bottom surface thereof on both sides in the direction of the minor axis Y of its elliptical base 11; the highest point of the flat surface 17 is lower than the joint point of the main body 13 and the ellipsoidal upper part 12 and higher than the highest point of the elliptical base 11, as shown in fig. 8-13. This reduces the size of the lens 1, which is advantageous for manufacturing small-sized light source products. The light ray outgoing is not influenced, and the lens is also beneficial to taking.

Furthermore, the side wall of the oval base 11 is provided with a ventilation slot communicated with the concave cavity 14. After the lens 1 is adhered to the corresponding component, the internal air pressure of the lens is consistent with the external pressure, and the lens can be prevented from falling off due to overlarge internal pressure.

The following is to take the LED light source device adopted by the infrared transmitting tube as an example, and the utility model discloses another embodiment's detailed description carries out because the infrared transmitting tube requires that the facula is even and higher effective light intensity.

As shown in fig. 1-15, another embodiment of the present invention provides an LED light source device 2 including an LED support 3, a wafer 4 fixed on the LED support 3, and a lens 1 bonded to the LED support 3 and adjusting the light emitted from the wafer 4. The lens 1 has an elliptical base 11, an elliptical upper portion 12, and a main body 13 connecting the elliptical base 11 and the elliptical upper portion 12, wherein the elliptical base 11 has an inner concave cavity 14 for accommodating the LED chip 4, and a ratio of a minor axis Y to a major axis X of the elliptical base 11 is 0.5 to 0.75. Wherein, the bonding glue 5 is filled between the side surface of the concave cavity 14 and the side surface of the LED chip 4. It should be noted that the adhesive 5 may be filled into the side surface of the LED chip 4, as shown in fig. 14; it is also possible to fill somewhere between the side of the concave cavity 14 and the side of the LED chip 4, for example only to the edge of the step 16, as a less preferred embodiment, which is not shown in the drawings. Like this except that bonding glue bonds between the bottom surface of LED support 3 and lens 1, still fill bonding glue between the side of indent cavity 14 and the side of LED wafer 4, greatly expand the bonding surface between lens 1 and LED support 3 like this, also greatly strengthened the firmness that lens 1 bonded in LED support 3 certainly, greatly reduced because of lens 1 follows the failure rate that LED support 3 drops. It should be understood that, because the LED light source device 2 uses the lens 1, the stray light is less, the lighting effect is high, and various requirements can be satisfied.

Preferably, the LED chip 4 is a horizontal structure chip or a vertical structure chip electrically connected to the LED support 3 through a wire 6, and a portion of the wire connected to the LED chip 4 is exposed from the adhesive 5, as shown in fig. 14. Therefore, the internal stress of the bonding glue 5 acting on the lead 6 is smaller and much smaller than the force for breaking the lead 6, so that the risk of breaking the lead 6 is avoided, and the possibility of failure of the LED light source device 2 due to the breakage of the lead 6 in reflow soldering or other high-temperature use environments is completely avoided.

In particular, the sidewall of the concave cavity 14 is provided with a step 16, and the step 16 faces downwards to form an anti-overflow groove which can be completely filled with the adhesive 5 with the LED bracket 3. And the bonding glue outside the anti-overflow groove forms a curved surface with a low middle part and a high periphery due to the action of surface tension. The step 16 is lower than the top surface 15 of the concave cavity 14, higher than or slightly lower than the upper surface of the LED chip 4, or even with the upper surface of the LED chip 4, as shown in fig. 13 and 14. Therefore, the adhesive 5 can be prevented from overflowing to the top surface 15 of the concave cavity, the light emitting of the LED wafer 4 can not be influenced, and the light type is not influenced. Meanwhile, the bonding surface between the lens 1 and the LED support 3 is further expanded, the firmness of the lens 1 bonded to the LED support 3 is further enhanced, and the failure rate of the lens 1 falling off from the LED support 3 is further reduced.

Further, the LED chip 4 has a quadrilateral longitudinal section, and four vertexes thereof are respectively located in the direction of the major axis X or the minor axis Y of the elliptical base 11, as shown in fig. 15. The LED chip 4 is arranged in a rotating mode, and light shape control is facilitated. Fig. 16 is the utility model provides a rotatory solid brilliant back of LED light source device is at the ascending light intensity distribution diagram of oval base major axis side, and the light-emitting light type is M shape, makes the light intensity more even at whole irradiation area. Specifically, an obvious M light type is projected in the X direction of the long axis of the oval base, namely the central light intensity is slightly weak, the light intensity within the angle range of 25-45 degrees is the highest, and the intensity of the M light type is 1.05-1.4 times of the central intensity. This ensures that the light intensity distribution of the light emitted by the light source device projected onto the illuminated area is uniform in a plane over a range of angles (e.g., +/-30 deg.).

In particular, the air inside the concave cavity 14 is thinner than that outside the lens 1 to form a negative pressure; or the inner concave cavity is in a vacuum state. So that the air pressure in said concave cavity 14 no longer increases significantly with increasing temperature, i.e. the air pressure in the lens 1 will not blow the lens 1 open, so that the probability of failure is greatly reduced.

It should be noted that the above examples require the applicant to give priority to the patent application 201822239119.0 filed on 28.12.2018. Other technical features than the range of the ratio of the minor axis to the major axis of the ellipsoidal upper part are applicable to the following embodiments.

As shown in fig. 17 to 35, a lens 1 according to sixth to eleventh embodiments of the present invention includes an elliptical base 11, an elliptical upper portion 12, and a main body 13 connecting the elliptical base 11 and the elliptical upper portion 12, wherein the elliptical base 11 has a concave cavity 14 for accommodating an LED chip; the ratio of the minor axis B to the major axis A of the ellipsoidal upper portion 12 is 0.1 to 0.5, or 0.75 to 1.0. In the lens shown in fig. 17, 18 and 19, the ratio of the minor axis B to the major axis a of the ellipsoidal upper part 12 is 0.1, the ratio of the minor axis B to the major axis a of the ellipsoidal upper part 12 in the lens shown in fig. 20, 21 and 22 is 0.2, the ratio of the minor axis B to the major axis a of the ellipsoidal upper part 12 in the lens shown in fig. 23, 24 and 25 is 0.3, the ratio of the minor axis B to the major axis a of the ellipsoidal upper part 12 in the lens shown in fig. 26, 27 and 28 is 0.4, the ratio of the minor axis B to the major axis a of the ellipsoidal upper part 12 in the lens shown in fig. 29, 30 and 31 is 0.85, and the ratio of the minor axis B to the major axis a of the ellipsoidal upper part 12 in the lens shown in fig. 32, 33 and 34 is 0.95. It should be noted that the ratio of the long and short axes of the oval base in the various embodiments of the present invention is comparable to the ratio of the long and short axes of the upper portion of the oval base, as shown in fig. 35. In order to clearly show the structure of the lens or the LED light source device adopting the lens, the scaling processing is carried out on each figure, and the ratio of the long axis and the short axis of the same lens in the figures is probably not consistent with the ratio. Thus, light emitted from the LED chip is refracted through the top surface 15 of the concave cavity 14 and enters the lens, and then is refracted through the surfaces of the main body 13 and the ellipsoidal upper portion 12 to a preset illumination area. If the ratio of the minor axis B to the major axis a of the ellipsoidal upper portion 12 of the lens is 0.1 to 0.25, light emitted from the LED chip is projected through the lens to a predetermined illumination area, the predetermined illumination area has an angle range of 50 ° ± 15 ° in the direction of the minor axis B of the ellipsoidal upper portion 12, and an angle range of 125 ° ± 15 ° in the direction of the major axis a of the ellipsoidal upper portion 12, as shown in fig. 18, 19, 21, and 22. If the ratio of the minor axis B to the major axis a of the ellipsoidal upper portion 12 of the lens is 0.25 to 0.5, the light emitted from the LED chip is projected through the lens to a predetermined illumination area, the predetermined illumination area has an angle range of 30 ° ± 15 ° in the direction of the minor axis B of the ellipsoidal upper portion 12, and an angle range of 95 ° ± 15 ° in the direction of the major axis a of the ellipsoidal upper portion 12, as shown in fig. 24, 25, 27, and 28. If the ratio of the minor axis B to the major axis a of the ellipsoidal upper portion 12 of the lens is 0.75 to 1.0, the light emitted from the LED chip is projected through the lens to a predetermined illumination area, the predetermined illumination area has an angle range of 15 ° ± 10 ° in the direction of the minor axis B of the ellipsoidal upper portion 12, and an angle range of 35 ° ± 15 ° in the direction of the major axis a of the ellipsoidal upper portion 12, as shown in fig. 30, 31, 33, and 34. Stray light around the preset illumination area is greatly reduced, the central effective light intensity is correspondingly enhanced, and the requirements of various LED light source devices, particularly infrared emission tubes, on the brightness and uniformity of light spots are completely met. It should be noted that the above angle values are angle values at which the light intensity is 50% of the central light intensity.

The following is to take the LED light source device adopted by the infrared transmitting tube as an example, the utility model discloses another embodiment carries out the detailed description because the infrared transmitting tube requires that the facula is even and higher effective light intensity.

As shown in fig. 17-42, another embodiment of the present invention provides an LED light source device 2 including an LED support 3, a wafer 4 fixed on the LED support 3, and a lens 1 bonded to the LED support 3 and adjusting the light emitted from the wafer 4. The lens 1 has an elliptical base 11, an elliptical upper portion 12, and a main body 13 connecting the elliptical base 11 and the elliptical upper portion 12, wherein the elliptical base 11 has an inwardly concave cavity 14 for accommodating the LED chip 4, and a ratio of a minor axis B to a major axis a of the elliptical upper portion 12 is 0.1 to 0.5, or 0.75 to 1.0. In addition, adhesive 5 is filled between the side surface of the concave cavity 14 and the side surface of the LED chip 4. It should be noted that the adhesive 5 may be filled into the side surface of the LED chip 4, as shown in fig. 36; it is also possible to fill somewhere between the side of the concave cavity 14 and the side of the LED chip 4, for example only to the edge of the step 16, as a less preferred embodiment, which is not shown in the drawings. Like this except that bonding glue bonds between the bottom surface of LED support 3 and lens 1, still fill bonding glue between the side of indent cavity 14 and the side of LED wafer 4, greatly expand the bonding surface between lens 1 and LED support 3 like this, also greatly strengthened the firmness that lens 1 bonded in LED support 3 certainly, greatly reduced because of lens 1 follows the failure rate that LED support 3 drops. It should be understood that, because the LED light source device 2 uses the lens 1, the stray light is less, the lighting effect is high, and various requirements can be satisfied.

Furthermore, the longitudinal section of the LED wafer 4 is quadrilateral, and the included angle between the connecting line of two opposite vertexes and the long axis or the short axis of the elliptical base is less than or equal to 20 degrees; and projecting an 'M' -shaped light pattern in the direction of the long axis of the upper part of the ellipsoid. More preferably, four vertices of the quadrangle are located in the direction of the major axis a or the minor axis B of the elliptical base 11, respectively, as shown in fig. 37. The LED chip 4 is arranged in a rotating mode, and light shape control is facilitated. Fig. 38 is the utility model provides a rotatory solid brilliant (the contained angle is 0 °) back light intensity distribution diagram (cartesian view) on oval base major axis direction of LED light source device, fig. 39 is the polar coordinate view of fig. 38, and the light-emitting light type is "M" shape, makes the light intensity more even at whole irradiation area, is predetermineeing the illumination area in practical application promptly and is presenting even illuminance. Specifically, light emitted by the LED light source device forms an approximately oval light spot in a preset lighting area, and energy intensity distribution in the major axis direction of the oval light spot is M-shaped, namely the central light intensity is slightly weak, the light intensity is highest in an angle range of 25-45 degrees, and the intensity of the light is 1.05-1.4 times of the central intensity. It should be noted that the "M" beam pattern will not fail as long as the angle between the line connecting the two opposite vertices of the quadrilateral and the major or minor axis of the elliptical base does not exceed 20 °, fig. 40 shows the light intensity distribution at the angle of 20 °. This ensures that the light intensity distribution of the light emitted by the light source device projected onto the illuminated area is uniform in a plane over a range of angles (e.g., +/-30 deg.).

In particular, the sidewall of the concave cavity 14 is provided with a step 16, and the step 16 faces downwards to form an anti-overflow groove which can be completely filled with the adhesive 5 with the LED bracket 3. In addition, the end of the step is provided with a sharp corner 17 for blocking the adhesive glue from flowing to the top surface of the concave cavity, so that the light emitting of the wafer or the light emitting shape can not be shielded. And the bonding glue outside the anti-overflow groove forms a curved surface with a low middle part and a high periphery due to the action of surface tension. The step 16 is lower than the top surface 15 of the concave cavity 14, higher than or slightly lower than the upper surface of the LED chip 4, or even with the upper surface of the LED chip 4, as shown in fig. 41. Therefore, the adhesive 5 can be prevented from overflowing to the top surface 15 of the concave cavity, the light emitting of the LED wafer 4 can not be influenced, and the light type is not influenced. Meanwhile, the bonding surface between the lens 1 and the LED support 3 is further expanded, the firmness of the lens 1 bonded to the LED support 3 is further enhanced, and the failure rate of the lens 1 falling off from the LED support 3 is further reduced.

Furthermore, the upper surface of the LED wafer is provided with a light-transmitting glue 7 with the refractive index larger than 1.4; the section of the lead 6 connected with the LED chip 4 is covered by the light-transmitting glue 7, the section connected with the LED support 3 is covered by the adhesive glue 5, and the rest is exposed to the air in the concave cavity 14 or in a vacuum state, as shown in fig. 42. So that the air pressure in the concave cavity 14 no longer increases significantly with increasing temperature, i.e. the air pressure in the lens 1 does not blow the lens 1 apart, so that the probability of failure is greatly reduced. In addition, the light-transmitting glue 7 can increase the light extraction of the wafer 4, and the brightness is improved by about 10%; a small amount of light-transmitting glue is coated on the surface of the wafer, the influence of an optical interface is small, the light emitting effect of the lens can be controlled, the light extraction of the wafer is increased, and the absolute radiation intensity/illumination of a device is improved.

It should be noted that the size of the lens is adapted to the size of the bracket of the LED light source device, for example, the bracket may be square or rectangular, and the frame of the lens may be configured into a square or rectangular shape as large as the bracket so as to be bonded to the bracket. It can be understood that the final shape of the lens can be any, and the shape of the lens can be set arbitrarily by ensuring the light-emitting functional area of the lens according to the light path diagram.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. A lens, characterized by: the lens is provided with an oval base, an oval upper part and a main body for connecting the oval base and the oval upper part, the oval base is provided with a concave cavity for accommodating the LED wafer, and the ratio of the minor axis to the major axis of the oval base is 0.5-0.75.

2. The lens of claim 1, wherein: the main part is oval platform, the great end of oval platform is connected with oval base, and less end is connected with ellipsoid upper portion.

3. The lens of claim 1, wherein: the side face of the concave cavity is an elliptical face similar to the side face of the elliptical base, and the side wall of the elliptical base is provided with a ventilating slot hole communicated with the concave cavity.

4. The lens of claim 1, wherein: the two sides of the lens in the minor axis direction of the elliptic base are provided with flat surfaces vertical to the bottom surface of the lens; the highest point of the straight surface is lower than the joint point of the main body and the upper part of the ellipsoid and higher than the highest point of the oval base.

5. The lens of any one of claims 1-4, wherein: the side wall of the concave cavity is provided with a step for forming an anti-overflow groove.

6. The utility model provides a LED light source device, includes the LED support, set firmly in the wafer of LED support and with the lens that the LED support bonds and adjusts the wafer and send out light, its characterized in that: the lens is provided with an oval base, an oval upper part and a main body for connecting the oval base and the oval upper part, the oval base is provided with an inwards concave cavity for containing the LED wafer, the ratio of the minor axis to the major axis of the oval base is 0.5-0.75, and bonding glue is filled between the side face of the inwards concave cavity and the side face of the LED wafer.

7. The LED light source device of claim 6, wherein: the LED wafer is a horizontal structure wafer or a vertical structure wafer which is electrically connected with the LED bracket through a lead, and the lead connected with the LED wafer is exposed out of the bonding glue.

8. The LED light source device of claim 6, wherein: the side wall of the concave cavity is provided with a step, the step faces downwards to form an anti-overflow groove which can be completely filled with adhesive with the LED support, and the step is lower than the top surface of the concave cavity.

9. The LED light source device of claim 6, wherein: the LED wafer is quadrilateral in longitudinal section, and four vertexes of the LED wafer are respectively positioned in the direction of the long axis or the short axis of the oval base.

10. The LED light source device of claim 7, 8 or 9, wherein: the air in the concave cavity is thinner than that outside the lens so as to form negative pressure; or the inner concave cavity is in a vacuum state.

11. A lens, characterized by: the lens is provided with an oval base, an oval upper part and a main body for connecting the oval base and the oval upper part, and the oval base is provided with a concave cavity for accommodating the LED wafer; the ratio of the minor axis to the major axis of the upper part of the ellipsoid is 0.1 to 0.5, alternatively 0.75 to 1.0;

if the ratio of the short axis to the long axis of the upper part of the ellipsoid of the lens is 0.1-0.25, the light emitted by the LED chip is projected to a preset illumination area through the lens, the angle range of the preset illumination area in the short axis direction of the upper part of the ellipsoid is 50 degrees +/-15 degrees, and the angle range in the long axis direction of the upper part of the ellipsoid is 125 degrees +/-15 degrees;

if the ratio of the short axis to the long axis of the upper part of the ellipsoid of the lens is 0.25-0.5, the light emitted by the LED chip is projected to a preset illumination area through the lens, the angle range of the preset illumination area in the short axis direction of the upper part of the ellipsoid is 30 degrees +/-15 degrees, and the angle range in the long axis direction of the upper part of the ellipsoid is 95 degrees +/-15 degrees;

if the ratio of the short axis to the long axis of the upper part of the ellipsoid of the lens is greater than 0.75 and less than 1.0, the light emitted by the LED chip is projected to a preset illumination area through the lens, the angle range of the preset illumination area in the short axis direction of the upper part of the ellipsoid is 15 degrees +/-10 degrees, and the angle range in the long axis direction of the upper part of the ellipsoid is 35 degrees +/-15 degrees.

12. The lens of claim 11, wherein: the main part is oval platform, the great end of oval platform is connected with oval base, and less end is connected with ellipsoid upper portion.

13. The lens of claim 11, wherein: the side face of the concave cavity is an elliptical face similar to the side face of the elliptical base, and the side wall of the elliptical base is provided with a ventilating slot hole communicated with the concave cavity.

14. The lens of claim 11, wherein: the two sides of the lens in the minor axis direction of the elliptic base are provided with flat surfaces vertical to the bottom surface of the lens; the highest point of the straight surface is lower than the joint point of the main body and the upper part of the ellipsoid and higher than the highest point of the oval base.

15. The lens of any of claims 11-14, wherein: the side wall of the concave cavity is provided with a step for forming an anti-overflow groove, and the tail end of the step is provided with a sharp corner for preventing the adhesive from flowing to the top surface of the concave cavity.

16. The utility model provides a LED light source device, includes the LED support, set firmly in the wafer of LED support and with the lens that the LED support bonds and adjusts the wafer and send out light, its characterized in that: the lens is provided with an oval base, an oval upper part and a main body for connecting the oval base and the oval upper part, and the oval base is provided with a concave cavity for accommodating the LED wafer; the ratio of the minor axis to the major axis of the upper part of the ellipsoid is 0.1 to 0.5, alternatively 0.75 to 1.0; bonding glue is filled between the side face of the concave cavity and the side face of the LED wafer;

17. The LED light source device of claim 16, wherein: the LED wafer is a horizontal structure wafer or a vertical structure wafer which is electrically connected with the LED bracket through a lead, and the lead connected with the LED wafer is exposed out of the bonding glue.

18. The LED light source device of claim 16, wherein: the lateral wall of the concave cavity is provided with a step, the step faces downwards to form an anti-overflow groove which can be completely filled with bonding glue with the LED support, the step is lower than the top surface of the concave cavity, and the tail end of the step is provided with a sharp corner for preventing the bonding glue from flowing to the top surface of the concave cavity.

19. The LED light source device of claim 6 or 16, wherein: the longitudinal section of the LED wafer is quadrilateral, and the included angle between the connecting line of two opposite vertexes and the long axis or the short axis of the oval base is less than or equal to 20 degrees; the light emitted by the LED light source device forms an approximately elliptical light spot in a preset lighting area, and the energy intensity distribution in the major axis direction of the elliptical light spot is M-shaped.

20. The LED light source device according to claim 7 or 17, wherein: the upper surface of the LED wafer is provided with a light-transmitting glue with the refractive index larger than 1.4; the section of the lead connected with the LED wafer is coated by the light-transmitting glue, the section of the lead connected with the LED bracket is coated by the bonding glue, and the rest part of the lead is exposed in the air in the concave cavity or in a vacuum state.